Advanced Computer Architecture-II - CS704 Power Point Slides Lecture 02

CS 704 Advanced Computer Architecture
Lecture 2
Quantitative Principles
Detailed discussion on the computer Performance the key to quantitative design and analysis
MAC/VU-Advanced Computer Architecture
Lecture 2 - Performance
Todays Topics
Recap of Lecture 1 Growth in processor performance Price-performance design CPU performance metrics CPU benchmarks suites Summary
Recap of Lecture 1
Computer Systems:
Architecture refers to those attributes of a computer visible to a programmer or compiler writer; e.g. instruction set, addressing techniques, I/O mechanisms etc.
Organization refers to how the features of a computer are implemented? i.e., control signals are generated using the principles of finite state machine (FSM) or microprogramming
Recap of Lecture 1
Computer Development: Academically, modern computer developments have their infancy in 1944-49
Commercially, the first machine was built by EckertMauchly Computer Corporation in 1949 Technological developments, from vacuum tubes to VLSI circuits, dynamic memory and network technology gave birth to four different generations of computers.
MAC/VU-Advanced Microprocessor and PCs - were introduced in 1971 Computer Architecture Lecture 2 Performance 4
Recap of Lecture 1 Design Perspectives: Processor ISA, ILP and Cache Memory hierarchy: Multilevel cache and Virtual memory input/output and storages multiprocessor and networks
5
Recap of Lecture 1
Computer Design Cycle:
The computer design and development has been under the influence of
-Technology
-performance and
-cost;
the decisive factors for rapid changes in the computer development have been the performance enhancements, price reduction and functional improvements.
Growth in Processor Performance Insert Slide 9 here

The supercomputers and mainframes, costing millions of dollars and occupying excessively large space, prevailing form of computing in 1960s were replaced with relatively low-cost and smaller-sized minicomputers in 1970s In 1980s, very low-cost microprocessor-based desktop computing machines in the form of personal computer (PC) and workstation were introduced.
Growth in Processor Performance Insert Slide 9 here

The growth in processor performance since mid-1980s has been substantially high than in earlier years Prior to the mid-1980s microprocessor performance growth was averaged about 35% per year
By 2001 the growth raised to about 1.58 per year

Growth in Processor Performance

1600
Performance relative to MIPS
Intel P-III HP 9000
1400 1200 1000 800 600 400 200 0

DEC Alpha IBM HP 9000 DEC MIPS Power1 Alpha R2000
1984 1986 1988 1990 1992 1994 1996 1998 200 0
Year
Price-Performance Design
Technology improvements are used to lower the cost and increase performance. The relationship between cost and price is complex one The cost is the total amount spends to produce a product The price is the amount for which a finished good is sold.
10
The cost passes through different stages before it becomes price.

A small change in cost may have a big impact on price
11
Price vs. Cost .. Insert Slide 14 here

Manufacturing Costs: Total amount spent to
produce a component - Component Cost: Cost at which the components are available to the designer. - It ranges from 40% to 50% of the list price of the product. - Recurring costs: Labor, purchasing scrap, warranty 4% - 16 % of list price - Gross margin Non-recurring cost: R&D, marketing, sales, equipment, rental, maintenance, financing cost, pre-tax profits, taxes Lecture 2 - Performance
12
Price vs. Cost .. Insert Slide 14
here
List Price:
Amount for which the finished good is sold; it includes Average Discount of 15% to 35% of the as volume discounts and/or retailer markup
13
Price vs. Cost .. Price-Performance Design Contd
100% 80% 60% 40% 20% 0% Mini

Average Discount Gross Margin Direct Costs Component Costs
W/S
PC
14
Cost-effective IC Design:
Yield: Percentage of manufactured

components surviving testing
Volume: increases manufacturing hence

decreases the list price and improves the purchasing efficiency
Feature Size:
the minimum size of a transistor or wire in either x or y direction
15
Cost-effective IC Design:
Reduction in feature size from 10 microns in 1971 and 0.18 in 2001has resulted in:
- Quadratic rise in transistor count

Linear increase in performance 4-bit to 64-bit microprocessor Desktops have replaced time-sharing machines
16
Cost of Integrated Circuits

Manufacturing Stages:
The Integrated circuit manufacturing passes through many stage: Wafer growth and testing Wafer chopping it into dies Packaging the dies to chips Testing a chip.
17
Cost of Integrated Circuits

Insert Slide 19 here
Die: is the square area of the wafer containing the integrated circuit
See that while fitting dies on the wafer the small wafer area around the periphery goes waist
Cost of a die: The cost of a die is determined from cost of a wafer; the number of dies fit on a wafer and the percentage of dies that work, i.e., the yield of the die.
18
Dies of Integrated Circuits
19
Cost of Integrated Circuits Insert Slide 21 here

The
cost of integrated circuit can be determined as ratio of the total cost; i.e., the sum of the costs of die, cost of testing die, cost of packaging and the cost of final testing a chip; to the final test yield.
20
Calculating Integrated Circuits Costs

Cost of IC
=
die cost + die testing cost + packaging cost + final testing cost
final test yield
21

The
cost of die is the ratio of the cost of the wafer to the product of the dies per wafer and die yield
22

Cost of IC
=
final test yield Cost of die

=
Cost of wafer dies per wafer x die yield
23

The
number of dies per wafer is determined by the dividing the wafer area (minus the waist wafer area near the round periphery) by the die area
24

Cost of IC
=
final test yield Cost of die

=
Cost of wafer dies per wafer x die yield
Dies per wafer = (wafer diameter/2)2 die area

(wafer diameter) 2 x die area
25
Example Calculating Number of Dies

For die of 0.7 Cm on a side, find the number of dies per wafer of 30 cm diameter
Answer: [Wafer area / Die Area] - Wafer Waist area
= (30/2)2 / 0.49 - (30) / (2 x 0.49)

= 1347 dies
26
Example
For die of 0.7 Cm on a side, find the number of dies per wafer of 30 cm diameter
Answer: [Wafer area / Die Area] - Wafer Waist area
= (30/2)2 / 0.49 - (30) / (2 x 0.49)

= 1347 dies
27
Calculating Die Yield Insert Slide 29 here

Die yield is the fraction or percentage of good dies on a wafer number Wafer yield accounts for completely bad wafers so need not be tested Wafer yield corresponds to on defect density by which depends on number of masking levels good estimate for CMOS is 4.0 and
28

Die yield =
Wafer yield x (1 + defects per unit area x die area) -

Example:
The yield of a die, 0.7cm on a side, with defect density of 0.6/cm2 = (1+[0.6x0.47]/4.0) -4 = 0.75
29
Time to run the task: Execution time, response time, latency Throughput or bandwidth: Tasks per day, hour, week, sec, ns
30
Price-Performance Design Insert Slid 32

Example: To carry 2400 passengers from Lahore to Islamabad
Train completes the task in 4:00 hrs while airplane completes the same task in 6.00 hrs.; .e., 66.67% of the task in same time throughput and hence performance of train is 50% more than airplane
31
Price-Performance Design: Example

Vehicle Time Lah to Isb
Passenge rs/ trip Time to complete job
Execution time /person
Cost / person
Cost-performance
Train
4.0 hours
2400
4.0 hours
6.0 sec
300 Rs.
300x6=1,800 Rs-sec/person
Plane
45 min.
300
45x8 min. = 6.0 Hr
9.0 sec.
3000 Rs.
3000x9=27,000 Rs-sec/person
Plane 10 time faster but takes 50% more time to complete the job; i.e., lesser throughput thus performance of train is MAC/VU-Advanced 50%better than plane Computer Architecture
The time per person and cost person of train is less than that of plane Thus the cost-performance of plane
is 1:15
32
Metrics of Performance Insert Slide 33

Application
Programming Language Answers per month Operations per second
Compiler
MIPS: Millions of Instructions per second MFLOPS: millions of FP operations per sec.
Instruction Set Architecture

Datapat hControl Function Units Transistors Pins/ Wire I/O
Megabytes per second
Cycles per second (clock rate)
33
Aspects of CPU Performance

CPU time =
Seconds = Instructions x Cycles x Seconds
Program
Program
Instruction
Cycle
Inst Count
Program
CPI
Clock Rate
Compiler
Inst. Set. Organization Technology

34
Cycles Per Instruction

Cycles
per Instruction CPI = CPU Clock Cycles for program / Instruction Count
= (CPU Time * Clock Rate) / Instruction Count
Instruction
Frequency
For instruction mix, the relative frequency of occurrence of different types of instructions is given as:
FICi = IC of ith instruction / Total Instruction count Average Cycles per Instruction
n i=1
n i=1
35
CPI = [1/Instruction count] ICi x CPIi = FICi x CPIi

Example: Calculating average CPI

Base Machine (Reg / Reg)
Op ALU Load Store Branch Freq 50% 20% 10% 20% Cycles 1 2 2 2 CPI (i) 0.5 0.4 0.2 0.4 (% Time) (33%) (27%) (13%) (27%)
1.5
36
Cycles Per Instruction

n
Arithmetic mean time:

n
1/n Time i i=1
Weighted arithmetic mean time: w i x Time i

i=1
Geometric mean time:

n __________________
/ n / Execution time ratio i I =1

37
Summary: Price-Performance Design

Computer cost:
The total cost of manufacturing a computer is distributed among different parts of the system such as the cost of cabinet, processor board and I/O devices.
Performance Time is the key measurement of performance Comparing performance of two designs: the ratio,
= Execution time Y / Execution time X determines how much lower execution time machine Y takes as compared to X ; as performance is inverse of execution time, i.e., = Performance X / Performance Y
38
Instruction Execution Rate - MIPS

MIPS specify performance inversely to execution time;
For a given program:
MIPS = (instruction count) / (execution time x 106)

MIPS could not be calculated from the instruction mix Relative MIPS for a machine M is defined based on some reference machine as: RMIPS = [Performance M / Performance reference] x MIPS reference or = [Time reference / Time M] x MIPS reference
MFLOPS defined for Floating-point-intensive programs as millions of floating-point operations per second
39
CPU Benchmark Suites

Performance Comparison: the execution time of
the same workload running on two machines without running the actual programs Benchmarks: the programs specifically chosen to measure the performance. Five levels of programs: in the decreasing order of accuracy Real Applications Modified Applications Kernels Toy benchmarks Synthetic benchmarks
40
SPEC:
SPECmarks
System Performance Evaluation Cooperative
First Round 1989: 10 programs yielding a single number
Second Round 1992: SPECInt92 (6 integer programs) and

SPECfp92 (14 floating point programs)
Third Round 1995

new set of programs: SPECint95 (8 integer programs) and SPECfp95 (10 floating point) benchmarks useful for 3 years Single flag setting for all programs: SPECint_base95, SPECfp_base95
41
Summary: Designing and performance comparison

Designing to Last through Trends Capacity
Logic
DRAM Disk
Speed
2x in 3 years
2x in 10 years 2x in 10 years
2x in 3 years
4x in 3 years 4x in 3 years
6yrs to graduate => 16X CPU speed, DRAM/Disk size Execution time, response time, latency
Time to run the task

Tasks per day, hour, week, sec, ns,
Throughput, bandwidth
X is n times faster than Y means

ExTime(Y) =
Performance(X) Performance(Y)
42
ExTime(X)
Summary .. Contd
CPI Law:
CPU time = Seconds = Instructions x Cycles x Seconds
Program
Program
Instruction
Cycle
Execution time is the REAL measure of computer performance! Good products created when have: Good benchmarks, good ways to summarize performance Die Cost goes roughly with die area4
43
Summary
.. Contd
For better or worse, benchmarks shape a field Good products created when have: Good benchmarks Good ways to summarize performance Given sales is a function in part of performance relative to competition, investment in improving product as reported by performance summary If benchmarks/summary inadequate, then choose between improving product for real programs vs. improving product to get more sales; Sales almost always wins! Execution time is the measure of computer performance!
44

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CS 704 Advanced Computer Architecture

MAC/VU-Advanced Computer Architecture

Growth in Processor Performance Insert Slide 9 here

Growth in Processor Performance Insert Slide 9 here

By 2001 the growth raised to about 1.58 per year

Growth in Processor Performance

Intel P-III HP 9000

1400 1200 1000 800 600 400 200 0

DEC Alpha IBM HP 9000 DEC MIPS Power1 Alpha R2000

1984 1986 1988 1990 1992 1994 1996 1998 200 0

MAC/VU-Advanced Computer Architecture

The cost passes through different stages before it becomes price.

Price vs. Cost .. Insert Slide 14 here

Price vs. Cost .. Insert Slide 14

Price vs. Cost .. Price-Performance Design Contd

100% 80% 60% 40% 20% 0% Mini

Average Discount Gross Margin Direct Costs Component Costs

Yield: Percentage of manufactured

Volume: increases manufacturing hence

the minimum size of a transistor or wire in either x or y direction

MAC/VU-Advanced Computer Architecture

- Quadratic rise in transistor count

MAC/VU-Advanced Computer Architecture

Cost of Integrated Circuits

Cost of Integrated Circuits

Dies of Integrated Circuits

MAC/VU-Advanced Computer Architecture

Cost of Integrated Circuits Insert Slide 21 here

Calculating Integrated Circuits Costs

final test yield

MAC/VU-Advanced Computer Architecture

Cost of Integrated Circuits Insert Slide 23 here

MAC/VU-Advanced Computer Architecture

Calculating Integrated Circuits Costs

final test yield Cost of die

Cost of wafer dies per wafer x die yield

MAC/VU-Advanced Computer Architecture

Cost of Integrated Circuits Insert Slide 25 here

MAC/VU-Advanced Computer Architecture

Calculating Integrated Circuits Costs

final test yield Cost of die

Cost of wafer dies per wafer x die yield

Dies per wafer = (wafer diameter/2)2 die area

(wafer diameter) 2 x die area

Example Calculating Number of Dies

Answer: [Wafer area / Die Area] - Wafer Waist area

= (30/2)2 / 0.49 - (30) / (2 x 0.49)

Answer: [Wafer area / Die Area] - Wafer Waist area

= (30/2)2 / 0.49 - (30) / (2 x 0.49)

Calculating Die Yield Insert Slide 29 here

Calculating Integrated Circuits Costs

Wafer yield x (1 + defects per unit area x die area) -

MAC/VU-Advanced Computer Architecture

Price-Performance Design Insert Slid 32

MAC/VU-Advanced Computer Architecture

Price-Performance Design: Example

Execution time /person

45x8 min. = 6.0 Hr

Metrics of Performance Insert Slide 33

Instruction Set Architecture

Megabytes per second

Cycles per second (clock rate)

Aspects of CPU Performance