A Project By: ARUN.A (16) DINU.PK (59) SREEJITH.

B (48) TOM THOMAS (50)

Guided By:

Dr. RAG R L Prof. ABDUL JALEEL

DEPARTMENT OF MECHANICAL ENGINEERING TRAVANCORE ENGINEERING COLLEGE

INTRODUCTION
Thermo electric effect Seebeck effect Thermo power Peltier effect Figure of merit Device efficiency

METHODS OF REFRIGERATION

Air Refrigeration
Vapour compression Refrigeration Vapour absorption refrigeration Thermo electric Refrigeration

PRINCIPLE OF THERMO ELETRIC REFRIGERATION

THERMO ELECTRIC MODULE

WORKING OF T E M

MATERIAL SELECTION CRITERIA

Figure of merit Nature of semiconductors * Thermal conductivity * Electrical conductivity * State density

MATERIALS FOR T E R
Bismuth chalcogenides Lead telluride Inorganic clathrates Magnesium group 4 compounds Silicides Oxide thermo electrics Electrically conducting organic materials

DESIGN PROCEDURE
SPECIFICATION OF MODULE

Code

Qmax

Imax

Vmax

ISATI B8 L

33

3.8

14.4

40

40

40

2.2

CONSTRUCTION OF MODULE

Design improvements

CALCULATION OF MASS

Q = m Cp T
Where Q = Maximum amount of heat that can be absorbed m = Mass to be cooled or heated Cp = Specific heat at constant pressure T = Difference in temperature

CALCULATION OF MASS ( Cont.)

M
From steam table Cp T

= Q / Cp T
= 4.18 KJ / Kg K = 30 15 = 15 K

Q From the specification = 33 W

Then M = 0.5263 Kg

CALCULATION OF VOLUME
We have
V= m Vf Where Vf =Specific volume in M^3 / Kg

So
V = 0.5261 0.0010009 = 5.2657 10^-4 M^3

ADVANTAGES OF TER

No Moving Parts: A TE module works electrically without any moving parts so they are virtually maintenance free. Small Size and Weight: The overall thermoelectric cooling system is much smaller and lighter than a comparable mechanical system. In addition, a variety of standard and special sizes and configurations are available to meet strict application requirements.

Ability to Cool Below Ambient: Unlike a conventional heat sink whose temperature necessarily must rise above ambient, a TE cooler attached to that same heat sink has the ability to reduce the temperature below the ambient value.
Ability to Heat and Cool With the Same module: Thermoelectric coolers will either heat or cool depending upon the polarity of the applied DC power. This feature eliminates the necessity of providing separate heating and cooling functions within a given system.

ADVANTAGES(Cont.)

Precise Temperature Control: With an appropriate closed-loop temperature control circuit, TE coolers can control temperatures to better than +/- 0.1C. High Reliability: Thermoelectric modules exhibit very high reliability due to their solid state construction. Although reliability is somewhat application dependent, the life of typical TE coolers is greater than 200,000 hours. Electrically "Quiet" Operation: Unlike a mechanical refrigeration system, TE modules generate virtually no electrical noise and can be used in conjunction with sensitive electronic sensors. They are also acoustically silent.

Operation in any Orientation: TEs can be used in any orientation and in zero gravity environments. Thus they are popular in many aerospace applications.

ADVANTAGES(Cont.)

Convenient Power Supply: TE modules operate directly from a DC power source. Modules having a wide range of input voltages and currents are available. Pulse Width Modulation (PWM) may be used in many applications Spot Cooling: With a TE cooler it is possible to cool one specific component or area only, thereby often making it unnecessary to cool an entire package or enclosure. Ability to Generate Electrical Power: When used "in reverse" by applying a temperature differential across the faces of a TE cooler, it is possible to generate a small amount of DC power. Environmentally Friendly: Conventional refrigeration systems can not be fabricated without using chlorofluorocarbons or other chemicals that may be harmful to the environment. Thermoelectric devices do not use or generate gases of any kind.

DISADVANTAGES
Able to dissipate limited amount of heat flux. Lower coefficient of performance than vapor-compression systems. Relegated to low heat flux applications. More total heat to remove than without a TEC.

VARIOUS INDUSTRIES USING TE COOLING

Electronic Medical Aerospace

Telecommunications

APPLICATIONS OF TER
Electronic

enclosures Laser diodes Laboratory instruments Temperature baths Refrigerators

APPLICATIONS(Cont.)
Telecommunications

equipment Temperature control in missiles and space systems Heat transport ranges vary from a few milliwatts to several thousand watts, however, since the efficiency of TE devices are low, smaller heat transfer applications are more practical.

Improving performance.

More exotic TE devices are being researched that could result in better performance such as, superlattice structures, quantum wires and quantum wells, thin films using SiGe/Si, and thermionic cooling. However, research in these are preliminary and are not in widespread use.

Improving performance(cont.)
Various methods have been used to improve the performance of TE coolers which are its major drawback. Examples: thin film coolers or multistage (bulk) coolers.

T E COOLING OF ELECTRONICS

Typical TE cooling schemes have a TE device attached to a heat source (the cold side) that transports heat to a heat sink (the warm side).

ASSEMBLY

ASSEMBLY(Cont.)

ASSEMBLY(Cont.)

COMPARISON OF FEATURES OF REFRIGERATION SYSTEMS

Compactness Weight Portability Price Safety Reliability Ease of service and maintanance

REFERENCES

Bar-Cohen, A., Solbrekken G. L., and Yazawa, K. (2005). Thermoelectric Powered Convective Cooling of Microprocessors. IEEE Transactions of Advanced Packaging, 28(2). Chein, R. and Huang, G. (2004). Thermoelectric cooler application in electronic cooling. Applied Thermal Engineering, 24 (14-15), pp. 22072217. Goldsmid H. (1986). Electronic Refrigeration.London:Pion. Goldsmid H.(1964). Thermoelectric Refrigeration. New York:Plenum. Lasance, C.J.M., and Simmons, R.E. (2005) Advances In HighPerformance Cooling For Electronics. Electronics Cooling. Retrieved May2006. http://www.electronicscooling.com/html/2005_nov_article2.html Mollar(2003). Themoelectric Cooler Selection Procedure. Retieved June 2006. http://www.marlow.com/TechnicalInfo/themoelectric_cooler_selection_p .htm Nagy, J. (1997). The Effectiveness of Water Vapor Sealing Agents When Used in Application With Thermoelectric Cooling Modules. 16th International Conference on Thermoelectrics. Nolas, G.S. Goldsmid H., and Sharp J. (2001). Thermoelectrics : basic principles and new materials developments. New York: Springer.

REFERENCES(Cont.)

Rowe, D.M. (1995). CRC Handbook of Thermoelectrics. Boca Raton, FL: CRC Press. Sales, Brian. (February 2002). Thermoelectric Materials: Smaller is Cooler.. Science (Vol. 295. no. 5558, pp. 1248 1249). Retrieved April 2006. http://www.sciencemag.org/cgi/content/full/295/5558/1248 . Simons, R. E. and Chu, R. C. (2000) Application of thermoelectric cooling to electronic equipment: A review and analysis. Annual IEEE Semiconductor Thermal Measurement and Management Symposium, pp1-9. Snyder, J. The Science and Materials behind Thermoelectrics. CaltechJPL Thermoelectrics Website. Retrieved April 2006. Tellurex. (2002). Retrieved May 2006. http://www.tellurex.com Tellurex. (2002). The 12 Most Frequently Asked Questions About Themoelectric Cooling. Retrieved May 2006. http://www.tellurex.com/12most.html TE Technology, Inc. (2005) Cold Plate/Solid. Free Design Service. Retrieved June 2006. http://www.tetech.com/design/3081.shtml TE Technology, Inc. Retrieved May 2006. http://www.tetech.com/techinfo/ E Technology, Inc. (2005). Thermoelectric Modules. Retrieved April 2006. Thttp://www.tetech.com/module

QUESTIONS ????