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Seminar on
M.Tech. Project (1st Stage)
by
Rajarshi Guha
Roll No. 07302009
Chemical Engineering
Department
IIT Bombay
WHAT IS SUPER CRITICAL FLUID (SCF) ?
CO2 has its critical point at 31.1˚C and 73.8 bar (7.48 MPa).
Polymer Semiconductor
Particle Applications
Production
DIFFERENT PROCESSES - NON SAS
(SUPERCRITICAL ANTI-SOLVENT)
NON SAS
RESS PGSS
Rapid Expansion of
Particles from Gas Saturated Solutions
Supercritical solutions
BASIC NON SAS PROCESS
Two vessels are used,
SAS
PROCESSES
Fast SC CO2 diffusion into and out of the droplet - rapid droplet saturation.
The balloon bursts into small viscous droplets containing particles and
polymer (solute).
1. Temperature
2. Operating pressure
3. Solute concentration
6. Nozzle Diameter
7. Nature of solvent
9. Presence of surfactant
TEMPERATURE INCREASES PARTICLE SIZE
Particle size
increases
Temperature
increases
In polymer
Encapsulation Particle
Particles Sphericity
Get increases
Agglomerated
Particle
size
decreases
Pressure
increases
Plasticization Particles
Of polymer Deviate
Increases From
And Spherical
Agglomeration shape
Nucleation
decreases
Concentration
increases
Mean
Particle
Particle
Growth
Size
increases
Increases
- Agglomeration during
encapsulation
- Encapsulation Efficiency (EE)
increases
Nature of solvent
- Affects liquid mass transfer
coefficients.
Surfactants
- reduces interfacial tension
- reduces initial drop diameter
- increases agglomeration.
Intensity v/s Diameter for (R2,5%) Number v/s Diameter for (R2,5%)
Intensity v/s Diameter for (R2,2%) Number v/s Diameter for (R2,2%)
Intensity v/s Diameter for (R2,1%) Number v/s Diameter for (R2,1%)
CONCLUSIONS