ITRS Factory Integration (FI) Update

Gopal Rao July 2010 San Francisco, CA

July 2010 Meeting Attendees: Michio Honma, Shige Kobayashi, Gopal Rao, Andreas Neuber, Terry Francis, James Moyne, Patrick Fernandez, Chris Keith, Daniel Stevens, Les Marshall, Peter Csatary, Richard Oechsner, Bruce Klafter, Jim Jewett, Parris Hawkins, Mark Denome, Michael Mocella, Masazumi Fukushima

ITRS Conference July 2010 , San Francisco, CA

Agenda
1. Factory Integration Scope and Drivers 2. Key Technologies and Mapping of FI agenda 3. Energy Conservation 4. FI Agenda for next 6-9 months 5. Summary

ITRS Conference July 2010 , San Francisco, CA

Factory Integration Scope and Drivers

UI

Factory Operations

Production Equipment

AMHS

Factory Information & Control Systems

Facilities

Si Substrate Mfg Reticle Mfg

Increasing cost & Cycle time implications

Wafer Mfg
FEOL BEOL

Chip Mfg
Probe/Test Singulation

Product Mfg
Packaging Test

Factory is driven by Cost, Quality, Productivity, and Speed

Reduce factory capital and operating costs per function Faster delivery of new and volume products to the end customer Efficient/Effective volume/mix production, high reliability, & high equipment reuse Enable rapid process technology shrinks and wafer size changes

ITRS Conference July 2010 , San Francisco, CA

Distribution
3

Key Technologies that will Impact Factory Design

2010 and future years were targeted to meet productivity and capture technology requirements Key process & device technology intercepts that will impact the factory design are Extreme Ultraviolet Litho (EUVL), New Device Structures, new materials, wafer size conversion & huge productivity improvements, natural resource conservation Economic and business challenges are equal to our manufacturing and process technology challenges in scope and breadth to attain efficiency and effectiveness

FI Scope Mapping For illustratio n purpose only

2014
ITRS Conference July 2010 , San Francisco, CA 4

Regulation

Energy Focus

Research

Modeling & Simulation of energy consumption Carbon Tax Sensor Development Regional Regulations Renewable Energy Generation Incentives Energy Recovery from processes Energy Mapping Factory, Tool and with in Too Utility Costs Energy Storage Metrics

Operations (Fac/FO)

Production Equipment

Semi Standard S23 Next Gen Standard reen Buildings/ Sub Fab Smart Sensors nergy Conservation/Waste Reduction Data Integration & Networking eters Data Visualization ntegration with Smart Grid Fab/Sub fab sync ata Visualization Idle mode ntegration with Renewable Energy Generation Metrics etrics actory Operational Policies Dot size indicates amount of work ITRS Conference July 2010 , San Francisco, CA 5 needed

FI Agenda Next 6-9months

Energy Workshop

Continue discussions on energy, regulation etc and bring to IRC/TWGs key recommendations for integration into roadmap Use workshops to dig deeper into tough issues
AEC/APC

450mm

Comprehend FI issues and challenges for 450mm wafer size conversion

Development of baseline process for generating metrics

Define a generic process flow Benchmarking/data quality Development of 300mm/450 mm fab model for energy and related modeling/simulation

ITRS Conference July 2010 , San Francisco, CA

FI Agenda Next 6-9months

Formal process being developed for communicating research opportunities that evolve from FI new topic discussions to Academia, Suppliers, IRC, TWGs Cost is one of the key parameters for staying on Moores Law

FI will develop a proposal Waste reduction in other TWGs Productivity improvements/metrics

ITRS Conference July 2010 , San Francisco, CA

Factory Integration Summary

All FI technology requirements tables and potential solutions tables updated
Operations, Equipment, AMHS, FICS and Facilities

Identified key focus areas for FI

Technology requirement and potential solutions for 300/450mm Energy Conservation Waste reduction due to intrinsic equipment & factory system losses and better visibility of data AMC solutions for equipment and FOUP

Working with other TWG on cross-cut issues

With FEP, Litho, Metrology, Yield Enhancement and ESH EUVL, energy conservation, etc.

Business strategies, market demands, and process technology changes continue to make factories difficult to integrate Work with other forums/WG to ensure synergy
ISMI 450mm WG, SEMI, etc.

ITRS Conference July 2010 , San Francisco, CA