1115.

168mvc

iPhone 6S FINGERPRINT SENSOR

A. Sapphire Cover
B. Capacitive Sensor Die
• TSV to route to underside
• Bonded to sapphire cover
• Wire bond to flex circuit
C. Controller Die
D G
– Mounted on sensor die
– Wire bond to flex circuit
D. 2L Flex Circuit
– Mounted on sensor die E
– Wire bonds to controller die and sensor die
– 4 SMT passives (E); more on protruding flex tail
– Mechanical switch
• Flex/Die assembly glued to metal plate (F)
• Flex bent around metal plate (switch (G) on bottom)
• Assembly glued into metal ring (H)

A
B H
D
F
G
© Prismark Partners LLC 1
 1115.168mvc
iPhone 6S FINGERPRINT SENSOR

C
A

D B
G

E F

A
B
C D
F
D

© Prismark Partners LLC 2

 1115.168mvc
iPhone 6S FINGERPRINT SENSOR
A
B
D

B
D

E
F

D
© Prismark Partners LLC 3
 1215.6/011mvc
SAMSUNG GALAXY S6 FINGERPRINT SENSOR
• 1.6x0.7cm, 2.5mm Thick Home Button/Fingerprint Sensor
A. 1-2-1 PCB with capacitive sensor
C
B. Sensor ASIC
C. Flex-rigid tail
D. Bezel C
E. Stiffener

A
D
B

Photos source: Prismark/Binghamton University

© Prismark Partners LLC 4
 1215.6/011mvc
SAMSUNG GALAXY S6 FINGERPRINT SENSOR
• Home Button/Fingerprint Sensor
– 1.6x0.7cm, 2.5mm thick
A
A. 1-2-1 PCB, 300µm thick
• Top 2 layers are capacitive sensor
• Dielectric coating on top
B
• 4 SMT passives
B. Sensor ASIC, 150µm thick
• Analyzes change in capacitance
• 80µm pitch copper pillars to PCB
C. Flex-rigid tail C
• With connector to host system
• Connects to sensor PCB with solder balls
D. Metal bezel
E. Metal stiffener
A D

E
Photos source: Prismark/Binghamton University
© Prismark Partners LLC 5