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EDA Introduction

Professor: Sci.D., Professor


Vazgen Melikyan

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Course Overview

 Introduction
 1 lecture
 IC Design Data Formats and Tools
 4 lectures
 Electronic Design Methodology
 4 lectures
 IC Synthesis
 2 lectures
 Databases for EDA
 3 lectures
 IC Design Approaches and Flows
 3 lectures
 EDA Tools
 3 lectures
 Overview of Synopsys EDA Tools
 3 lectures

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IC Design Approaches and
Flows

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IC Design Levels

 Levels of abstraction: System

 System Level Design


Module
 Architecture / Algorithm Level Design
 Digital System Level Design
Gate
 Logical Level Design
 Electrical Level Design
Circuit
 Layout Level Design
 Semiconductor Level Design (more …)
Device
 EDA tools are used to help these and
Interconnect
n+ p n+

transformations.
 Technology advances give rise to new problems
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Abstraction Levels in IC Design

Idea for New IC


CAD/Subproblem Level
Generic EDA Tools

Architectural Design Logic Design Physical Design


Behavioral/Architectural Level Register Transfer/Logic Level Cell/Mask Level
Behavioral Level and Logic Minimization and Layout Editing, Partitioning
Simulation Tools Simulation Tools Placement and Routing Tools

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Architectural Design

 Carried out by experts Architectural Design


Behavioral/
 Decisions affect cost and Architectural Level
Behavioral Level and
performance Simulation Tools
 e.g. Architectural design of
microprocessor
 EDA programs aid
system architect
 Once architecture
defined, 2 tasks

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Logic Design

 Data and control paths


Logic Design
contain logic blocks such Register Transfer/Logic Level
Logic Minimization and
as shift registers, Simulation Tools
multiplexors, buffers, ALU
 Implemented as PCB, IC
 In either case,
components placed on
layout surface and wired
together

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Physical Design

 Refers to all synthesis steps which succeed


logic design but precede fabrication. Physical Design
 e.g. partitioning, placement, routing. Cell/Mask Level
Layout Editing, Partitioning
 Physical layout is crucial in determining Placement and Routing Tools
circuit performance, area, catastrophic yield,
reliability.
 Circuit performance: timing delays, crosstalk
metal, poly interconnect have finite
impedance. Long lines have large
impedance, longer delays, crosstalk.
Contacts, vias slow signals down.
 Area: functional and wiring affect yield
(number of defect free chips)
 Large chip area = low catastrophic yield

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Design Options

Design Options

Custom Semicustom

Cell-based Array-based

Standard cells Pre-diffused Pre-wired


Compiled cells Macro cells (gate arrays) (FPGA's)

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Full Custom Design Cycle
Structural/RTL Description

Ctrl

Memory Register Component


File Unit Component Design

Place and Route


PLA

comp I/O

RAM
... A/D

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Full Custom Layout
Pad Metal1 Via Metal2
 Full control to the artwork designer in
placing and interconnecting circuit
blocks
 An expert can achieve high degree of Data
optimization in area and circuit path
PLA I/O
performance
 Difficult and expensive - many person
months to layout IC - only used in
ROM/
mass production cases
RAM
 Requires powerful EDA tools - layout
editor with DRC, compaction,
extraction Random
A/D
 Not for low production volume ASICs converter logic
 Standard layout architectures to cut
design time

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Semi Custom Design Cycle
Structural/ HDL Programming
RTL Description
P_Inp: process (Reset, Clock)
Ctrl begin
if (Reset = '1') then
sum <= ( others => '0'
);
input_nums_read <= '0';

Mem Reg Comp. sum_ready <= '0';

File Unit
add82 : kadd8 port map (
a => add_i1, b => add_i2,
ci => carry, s => sum_o);
Mult_i1 <= sum_o(7 downto 0);

D C C B

A C C

D C D B Cell library
A B
C C C B
C D

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Cell Based Design Cycle

Standard Macros O/I cell


cell

Design library
IP

Floorplanning

IP
IP

Routing Placement

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Cell Based Design

process begin
Process wait until not
Design CLOCK'stable
and CLOCK=1; RTL / Logic
if(ENABLE='1') then
Rules TOGGLE<= not
TOGGLE;
end if;
end process;

Cell Library

EDA Tools

Design

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Standard Cell Layout

 Standard cell - logic block performing specific


function
 e.g. NAND, XOR, NOR, D flip-flop

 Cell library - data on standard cells (function,


pin structure, layout in given technology)
 Cells have the same height

 Develop a floorplan for layout


 Select library cells, place in Si, interconnect
 Place and route simplified by dividing layout
into rows separated by horizontal routing
channels
 Very flexible gate array, wiring space not pre-
assigned, cell size can vary
 Fabrication more complex than gate array

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Design Flow of Digital Standard Cell
Libraries
Databook Creation
is Required Specificatio
n Review
Databook
Generation Databook
MS Word; PDF;
Creation
is Not Required
Circuits Design
Simulation Results Do
Not
Schematic or Layout
comply Databook
Simulation Correction Required
results review
Simulations Results
comply Databook
Physical Layout

DRC, ERC, LVS Library Characterization


Errors reported No errors
reported
RC Parasitic
Characterization Results
Simulations Extraction Comply to Data
Results in Databook no
comply to Data
in Databook
Simulations
yes
Extracted Netlist Simulation Results Library Final Database Creation
with RCL Parasitics comply to Data
in Databook Deliverable views/files

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Characterization Flow of Digital
Standard Cells
Input Data
Circuit RC
extracted netlists
Functional files

Timing
Characterization
Transition delay setup hold
recovery removal times

Power
Characterization
Internal power
leakager power

Model Building
(*.LIB,*.V,*.VHD,
*TLF,*.ALF)

Datasheet
Generation (*HTML)

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Gate Array Layout

 Mask programmable gate array or field


programmable
 2/3D array of unconnected transistors
 Connections placed by either masking
(MPGA) or applied voltage (FPGA)
 2 types of personalization: intra-cell or inter-
cell
 Cell library maintained, intercell wiring by
layout software
 After personalization, wafer diced, chips
packaged
 Foundries stock large numbers of pre-
fabrication wafers
 Quick to fabricate
 Few processing steps, high catastrophic
yield, cheap

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FPGAs

 Array of cells:
 Each cell performs a logic function
 Personalization:
 Soft: memory cell (e.g. Synopsys
HASP)
 Hard: anti-fuse (e.g. Actel)
 Immediate turn-around (for
low volumes)
 Inferior performances and
density
 Good for prototyping and re-
customization

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Physical Design Cycle

The list of circuits turns to geometrical description called layout


 Refers to all synthesis steps which succeed logic design but precede fabrication, e.g.
partitioning, placement, routing.
 Physical layout crucial in determining circuit performance, area, yield, reliability.
1.Circuit Performance: timing, delays, crosstalk.
Metal, poly interconnect have finite impedance. Long lines have large impedance,
longer delays, crosstalk. Contacts, vias slow signals down.
2.Area: functional and wiring
affects yield (number of defect free chips)
large chip area = low catastrophic yield.

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Physical Design Cycle (2)
Circuit design Fabrication

Compaction
Partitioning

Floorplanning and Placement


Routing

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Simplified Cycle of Physical IC
Design
Circuit design

Physical design

Partitioning

Floorplanning and Placement

Routing

Compaction

No
Extraction and verification
Yes

Fabrication

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Physical Design Strategies

3 main approaches differing in 2 ways


1. Layout surface
2.Structural constraints imposed on layout elements

FPGA Standard Cell Design


Full Custom
Implement a circuit by placing
Implementation using
Layout editing to generate metal connections between
transistors prefabrication on predefined logic blocks or cells
physical description of a circuit wafer in 3D array stored in the library

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Design Approaches
Semi-custom

Cell-based Array-based

Macro Cells Pre-diffused


Standard Cells Generators:
Gate arrays Pre-wired
Memory
Hierarchical PLA Sea of gates Anti-fuse based
cells Sparse Logic Compacted Memory-based
Gate Matrix arrays

Custom Cell-based Pre-diffused Pre-wired


Density Very High High High Medium

Performance Very High High High Medium

Flexibility Very High High Medium Low

Design time Very Long Short Short Very Short


Manufacturing
time Medium Medium Short Very Short
Cost (low
volume) Very High High High Low
Cost (high
volume) Low Low Low High

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Digital EDA Tools

 Digital design leverages highly on automation


 Binary logic abstraction
 Similar constraints and goals for each circuit

DRC Logic Timing


LVS ERC Verification Verification

Gate-Level FU-Level
Schematic HDL Synthesis Synthesis

Time

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Analog EDA Tools

 Analog circuits are mostly custom designed


 Wide range of functionalities
 Implicit goals and constraints
 Different checks and objective for each circuit

DRC LVS

Multi-Variable
Optimization
SPICE Schematic

Time

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IC Design Flow. Participants

 Digital design engineers


 Test engineers
 Layout engineers
 EDA engineers
 Semiconductor manufacturers

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Digital IC Simple Design Flow

 Formation of digital IC specification


 Circuit obtained by gate level
 Functional verification of a gate-level circuit
 Layout automatic generation
 Layout verification
 Test creation
 IC fabrication

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Simplified Chip Design Flow
process begin
wait until not
CLOCK'stable Register
and CLOCK=1;
if(ENABLE='1') then
TOGGLE<= not
Transfer
TOGGLE;
end if; Language
end process;

Synthesis
Netlist

Floorplanning
Placed
Netlist

Place and Route


Layout

Test Courtesy of IBM Sign Off


Masks

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Digital IC Simple Design Flow

1. Formation of digital IC specification


 Description of digital IC functionality

 With the help of Verilog or VHDL in the specification

 An example of specification line:

 If incoming_call AND line_is_available then RING;

 The specifications of contemporary digital IC can contain millions of


lines, can be created by a collective of numerous participants within
a few months
 There exist ready specification libraries (example: DesignWare
Library, (V)HDL Compiler)

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Digital IC Simple Design Flow (2)

2. Circuit obtained by gate level


 Automatic synthesis is implemented with the help of VHDL or
Verilog specification (example: Design Compiler, DesignWare
Library)

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Digital IC Simple Design Flow (3)

3. Functional verification of a gate-level circuit


 Verifying functionality and timing through Simulation, Timing Analysis,
Testbench Generation (example: VCS-MX, PrimeTime, VERA)
 Optimization of Digital circuits (example: Design Compiler, Power Compiler,
IC Compiler / IC Compiler II)
 Formal Verification (example: Formality)
0 0
1 1
0 0
1 1
1 1

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Digital IC Simple Design Flow (4)

4. Layout automatic generation


 Place and Route (example: IC Compiler)

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Digital IC Simple Design Flow (5)

5. Layout verification
 Post layout verification through
simulation (example: VCS-MX,
NanoSim, HSPICE)
 Layout versus Schematic
(LVS) and Design Rule
Checks (DRC) verification
(example: StarRC, IC
Validator)

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Digital IC Simple Design Flow (6)

6. Test creation
 Test Synthesis and Automatic Test Program Generation (example:
DFT Compiler, TetraMAX)

applying signals measuring response

+ +

expected response checking against expectations

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Digital IC Simple Design Flow (7)

7. IC fabrication
 Automated creation of GDSII file (example: IC Compiler / IC Compiler II)

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Digital IC Simple Design Flow (8)

7. IC fabrication
 Image correction (example: Proteus, Progen, IC Workbench, CATS)
 Yield Management (example: Yield Explorer, Odyssey )

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Digital IC Simple Design Flow (9)

 An example of GDSII file


STRNAME EXAMPLE
BOUNDARY
LAYER 02000200 60000201 1C000300 02000600 ...........`.... 000000

1 01000E00 02000200 60002500 01000E00 .....%.`........ 000010


DATATYPE 42494C45 4C504D41 58450602 12002500 .%....EXAMPLELIB 000020
0 413E0503 14000300 02220600 59524152 RARY..".......>A 000030
XY 1C00545A 9BA02FB8 4439EFA7 C64B3789 .7K...9D./..ZT.. 00004
-10000
60000000 01000E00 02000200 60000205 ...`...........` 000050
10000
20000
10000
OR 58450606 0C001100 01000E00 02000200 ..............EX 000060
0100020D 06000008 04000045 4C504D41 AMPLE........... 000070
20000 0000F0D8 FFFF0310 2C000000 020E0600 .......,........ 000080
-10000 FFFF204E 00001027 0000204E 00001027 '...N ..'...N .. 000090
-10000 0000F0D8 FFFFF0D8 FFFFF0D8 FFFFF0D8 ................ 0000A0
-10000
00000004 04000007 04000011 04001027 '............... 0000B0
-10000
00000000 00000000 00000000 00000000 ................ 0000C0
10000
ENDEL
ENDSTR

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IC Design Steps
High-level Functional
Specifications Description
Description

Behavioral Structural
VHDL, C VHDL

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IC Design Steps (2)

High-level Functional
Specifications
Description Description

Placed Gate-level Logic


and Routed Design Description
Design

X=(AB*CD)+
(A+D)+(A(B+C))
Y = (A(B+C)+AC+
D+A(BC+D))

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IC Design Methods

Design Cost / Quality Number of


Methods Development Companies
Time involved

Full Custom

Standard Cell
Library Design

ASIC – Standard
Cell Design

RTL-Level Design

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Optimization: Levels of Abstraction

 Algorithmic
 Encoding data, computation scheduling, balancing delays of
components, etc.
 Gate-level

Level of detail
Effectiveness
 Reduce fan-out, capacitance
 Gate duplication, buffer insertion
 Layout / Physical-Design
 Move cells/gates around to shorten wires on critical paths
 Abut rows to share power / ground lines

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IC Design Flow.
Detailed Digital Design IC Flow
Design Implementation
Blah blah blah
yada yada
Blahblah
Blah blah blah blah
yada yada
yidie yadie Blahblah
blah blah
So on and Blah blah
so forth yada yada
on andyidie yadie
on Blah

Specification
So on and blah blah
so forth
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on andyidie
just jawing on yadie
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jabber so forth
jibber

System
Yackety on and on
just jawing

Technology
Ya'll com back
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backjawing
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Analysis Process
Select Scripts
Architecture
TestbenchBlah blah blah
Initial constraints
Blah blah blah
yada yada yada yada
Blahblah
Blah blah blah blah Blahblah
Blah blah blah blah
yada yada
yidie yadie yada yada
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blah blah blah
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on Blah blah blah
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on yadie

RTL
just jawing
So on and so forth just jawing
So on and so forth

Gates Models / IP
Jibberyack
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just on and on
jawing just on and on
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RTL Verification
Synthesis

Links-to-Layout
Verification Design Planning

Gate-level Design
ATPG netlist Constraints

Gate-level Design for Manufacturing


verification
Post-Route
Verification Place & Route
Blah blah blah
yada yada
Blahblah
Blah blah blah blah
yada yada
yidie yadie
Blah Blahblah
blah blah blah
So on and so forth

GDSII
yada yada
on andyidie yadie
on Blah blah blah

Physical Design
So on and so forth

Physical Data
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backjawing
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Yackety jabber jibber
just jawing

Checks
Ya'll com back

Creation Yackety yack


Ya'll com back

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