Zaven Kalfayan

Lindsay Hunting
Phyllis Xu
Joy Perkinson
Presentation Outline
Motivation of project
Project goals
Processing and materials
Results
Cost analysis
TechWatch and future work
What is a Metamaterial?
A periodic material that derives its
properties from its structure rather
than its components.

*Taken From 3.042 handout & Physics Worlds 2005 Sound Ideas
Project Motivation
Developing field of research

Applications in wide range of sectors,

such as communications, optics,
energy

Currently used for wave manipulation

Project Goals
Design a process using lithography to
fabricate a 3D structure
Create macroscale models of 2D
structure, phase mask, and 3D
structure
Create a 3D metamaterial and image
using SEM
Process Design

Interference
lithography
Phase mask 3-D pattern
2-D
photoresist
pattern
Titania structure
Sol-gel infiltration
2D Structure Fabrication
Coat
plain Si coat with HMDS to coat with SU-8 20xx soft bake @95
wafer promote adhesion photoresist using to evaporate
spin coater solvent and cut
into pieces

post bake at first

Exposure 65 then 95 to
promote crosslink
UV exposure for flip 90 and formation
xx seconds expose again

submerge in PM submerge in
Develop acetate to dissolve isopropanol to
unexposed wash away all
photoresist (20 mi remnantsfinal
n structure
Phase Mask Fabrication
Step 1 Vacuum sample with open bottle of
fluorosilane so that it evaporates onto
sample.

Step 2 Layer with PDMS and heat at 65to 75for

at least three hours.

Step 3 Gently peel off PDMS layer as phase

mask.
3D Structure Fabrication
Coat
plain glass coat with HMDS to coat with SU-8 2005 soft bake @95
slide promote adhesion photoresist using to evaporate
spin coater solvent and cut
into pieces

post bake at first

Exposure 65 then 95 to
promote crosslink
Place phase
Expose for xx formation
mask on top of
seconds and
slide
remove phase mask

submerge in PM submerge in
Develop acetate to dissolve isopropanol to
unexposed wash away all
photoresist (5-10 min) remnantsfinal
structure
Process Tuning
Exposure times (contact lithography):
SU8-2002: 0.5-25 seconds
SU8-2005: 5-40 seconds
SU8-2015: 1-45 seconds

Exposure times (interference lithography):

3-20 seconds for all samples
 Prototype Functionality
Problems for 2D & 3D patterns 15s SU-8 2015 Top

1. Overexposure

2. Unwashed monomer

3. Adhesion problems 15s SU-8 2015 Cross

4. Inconsistent results
Design Functionality
2-D Patterns 5s exposure of SU-8 2015
Coated with HMDS
Broadband laser filtered at 365nm
Top down
Hole spacing - 3.38 um
Hole length ~1.5um

5s SU-8 2015 Cross 5s SU-8 2015 Top

Design Functionality
Phase mask PDMS on SU-8 2015 2D pattern
Coated with flourosilane
Baked overnight 65C
Column
Spacing ~ 4 um
Height ~15 um

PM of 10s SU-8 2015 PDMS on 10s SU-8 2015

Design Functionality
3-D Patterns
3s SU-8 2005Top

3s exposure of SU-8 2005 355 YAG pulse laser

Coated with HMDS Used in continues mode
Thickness ~ 5um
 2-D Pattern Phase Mask 3-D Pattern

CAD Model

3-D Printing Model

Actual Sample
 Cost Analysis
Fixed cost:
Spin coater, lasers, SEM
General lab equipment, facilities
Variable cost:
SU-8 20xx and HMDS ($300/1L $30/500mL )
Trifluoroacetic acid and TiO2 ($60/100mL, $117/50mL)
Si wafers ($15/piece)
Glass wafers ($240/2500 slides)
Total costs/sample: $6/sample
Future Work
Optimize process
Explore new thicknesses and exposure
times
Adhesion promoters
Create more complicated 3D structures
Characterize 3D structure properties
TechWatch
2004:
Miniaturized antennas based on negative
permittivity materialsLucent Technologies
Metamaterial scanning lens antenna systems
and methodsThe Boeing Company

2003:
Metamaterials employing photonic crystalMIT
Methods of fabricating electromagnetic
metamaterialsThe Boeing Company

2002:
Resonant antennasLucent Technologies
Questions?
Design Functionality
Thick Film Photoresist

Calculation:
Sin (70) = 58 / t
Thickness (t) ~ 61 microns
Success!

45s SU-8 2050

Design Functionality
Problems in 2-D patterns
1. Un-washed monomer

2. Over exposure
15s SU-8 2015 Top

3. Non-uniform columns
Width of top ~ 1.81 um
Width of bottom ~ 1.00 um

15s SU-8 2015 Cross

TiO2 Sol Gel Infiltration
Step 1 Dip sample in TiO2 solution (trifluoroacetic
acid, titanium oxide, and deionized water) for
about 30 seconds.

Step 2 Dry the sample for at least 2 hours.

Step 3 Heat sample up to 600C in 8 hours and

cool down to room temperature in 6 hours
to evaporate photoresist.