Professional Documents
Culture Documents
EMT 251
Objectives
To discussed the fundamentals of
CMOS fabrication steps.
To examined the major steps of the
process flow.
To overview the cross section view of
a circuit
Chip making Process
Introduction
MOSFET
Gate
Drain Source
P-type substrate
P-type substrate
N-type substrate
N-type substrate
ISOLATION FORMATION
TRANSISTOR MAKING
INTERCONNECTION
PASSIVATION
CMOS FABRICATION PROCESS
well formation
Si02
P-substrate Photoresist coating (C)
UV light
Resist clean
P-substrate
Desired pattern formed
CMOS FABRICATION PROCESS
well formation
Phosphorus ion
Thick oxide
Gate oxide
polisilicon
gate
photoresist
VDD
source drain contact
Boron ion
photoresist
GND
contact Pmoss Pmos
drain source
SiO2
contact
Metal 1
Metal 1
oxide
n+ n+ p+ p+ n+
N-well
p-substrate
Assignment
B
B
GLOSSARY
Photolithography (photo)
Process of transferring pattern on mask to photoresist layer on wafer
surface (pre-pattern the chip)
Etching
Process of permanently removed the unwanted part of design on wafer
surface to get the desired pattern
Diffusion
Process of introducing dophant layer by movement of dophant atoms
from high concentration to low concentration area at high temperature
Ion implantation
Process of introducing dophant layer by bombardment of high energy
dophant ion in high electric field chamber
Oxidation
Process of growing thick or thin SiO2 layer depend on oxide application
CMP
Process to physically grind flat to have a planar surface for better
exposure at photo process.
THE END