ANSYS Multiphysics 8 0 Customer 3

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ANSYS Multiphysics 8.0

Technology Overview &
Benefits
Dr. Paul Lethbridge - Product Manager
Multiphysics 8.0
Topics Covered
What is Multiphysics?
Multiphysics Benefits
Educational Products
Market Applications
Market segments by Technology

Market Segments by Industry
Multi Field (Coupled Physics) Capabilities
Direct physics coupling

Sequential physics coupling
Multi-field Solver (New feature at release 8.0)

Other New features
Enhanced non-linear Piezoelectric & piezoresistive element.

Fluid damping elements
Cyclic Symmetry for Magnetostatics
Low Frequency Electromagnetic Contact
Coupled E-B Particle Tracing
Re-meshing for FSI
Selected Multi-Physics Examples

Product Roadmap & Strategy
Transition to Workbench Environment
Product Websites
Multiphysics 8.0
The ANSYS Family of Products

ANSYS Multiphysics
ANSYS University
ANSYS Mechanical
ANSYS FLOTRAN
ANSYS Emag
ANSYS Professional
ANSYS Structural
Extreme functionality
The whole enchilada!
Educational/Non
Commercial Use Products
High performance
mechanical & Thermal
Powerful tools
for the physics specialist
Ease of use &

Entry level capability
ANSYS MCAD & ECAD Connection products

Multiphysics 8.0
Topics Covered
Market Applications



Other New features

Re-meshing for FSI

Product Websites
Multiphysics 8.0
What is ANSYS Multiphysics?

A general purpose analysis tool allowing a user to to combine the
effects of two or more different, yet interrelated physics, within one,
unified simulation environment.
Electromagnetic
Thermal
Magnetic
Fluid
Electrostatic
Electrical
Structural
Multiphysics 8.0
Benefits of Multiphysics
No other analysis tool provides as many physics under one roof!
Seamless integration with ANSYS Probabilistic Design System (PDS).
Greatest breadth and technical depth of physics.

Fully parametric models across physics, geometry, materials, loads.
Perform Design Optimization across physics, geometry, materials and
loads.
Extremely sophisticated analysis capability.
Bottom line benefits:
Analysis closely match reality bringing reality to the desktop

Reduced assumptions that question certainty and compromise
accuracy.
Lower cost: Fewer analysis software tools to purchase,learn &
manage.
Lower cost: R&D process compression
Multiphysics 8.0
Benefits of Multiphysics
The use of Multiphysics allows us to return to the basics

of engineering where a model and the predictive solution
closely approximate reality; this allows the engineer to
design with a high degree of confidence that the answers
are correct.
Dr. Howard Crabb - Ford Motor Company
Multiphysics 8.0
Educational Products Problem Size Limits
Multiphysics 8.0
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Topics Covered
Market Applications



Other New features

Re-meshing for FSI

Product Websites
Multiphysics 8.0
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Market Applications by Technology

Three broad Market segments uniquely identified as being inherently Multiphysics
Sensors & Transducers
Inertial
Actuators
Pressure
Mass
Proximity
Thermal
Acoustic
Fluid systems
Hydraulic
Pneumatic
Fuel
Microfluidics
Induction heating
RF Heating
Heat-exchangers
Electronics
cooling
Electromagnetic
machines
Pumps
Generators
Motors
Solenoids
Click mouse to progress
Processes
Automotive
A/C systems
SEMICON
Ion implanters
PVD / CVD
Multiphysics 8.0
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Market Applications by Industry

Multiphysics is not limited to any specific industry.
There are analysis applications and opportunity across the board.
Electronics
Automotive
Aerospace / Space
Marine
SEMICON
Government / Military
Medical / BioMed
Pharmaceutical
Appliances
Multiphysics 8.0
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Topics Covered
Market Applications



Other New features

Re-meshing for FSI

Product Websites
Multiphysics 8.0
Coupled Physics Capabilities: Methods
There are two methods to couple physics, Direct & Sequential.
There are many confusing terms for the two methods:
Direct - solves all DOFs at the FEA coefficient matrix level.

Sequential - solves DOFs for one physics then passes results as loads &
boundary conditions to the second physics. At least two iterations, one for each
physics, in sequence, are needed to achieve a coupled response.
Coupled Physics Terminology
Preferred ANSYS Inc.
descriptive usage
Strict Mathematical usage
Archaic
Use at your peril!
Direct
Sequential
Matrix
Load vector
LHS
RHS
Monolithic
Staggered
Strong
Weak
Tight
Loose
Full
Partial
Multiphysics 8.0
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Direct Coupled Physics Applications

Coupled Physics
Thermal-Structural
Applications
Anything with a structure!
Gas turbines.
Pressure-Structural (Inviscid FSI)
Acoustics, sonar, SAW
Piezoelectric
Microphones, sensors
Piezoresistive
Pressure sensors, strain gauges, Accelerometers
Circuit coupled electromagnetics:

CIRCUIT124
CIRCUIT125
Electrostatic- Structural:
TRANS126
TRANS109
Electro-thermal-structural -magnetic:
SOLID5, PLANE13
SOLID62, SOLID98
Fluid-thermal
Motors, MEMS
MEMS
IC, PCB electro-thermal stress, MEMS actuators

Piping networks, manifolds
Multiphysics 8.0
Sequential Coupled Physics Applications

Thermal-Structural
16

Gas turbines.
Electromagnetic-thermal
Induction heating, RF heating
Electromagnetic-thermal-structural
Electrostatic-Structural
Electrostatic-Structural-Fluidic
Electrostatic Charged particle
Magnetic - Structural
Fluid-Solid:
FLOTRAN based FSI
MpCCI: Bi-directional FSI
CFX-ANSYS unidirectional interface
Electromagnetic-Solid-Fluid
Thermal-CFD
Multi-field Solver
Sigfit: Unidirectional, Structural Optical
MEMS
Ion Optics, Field Emission Display Technology,
Analytical instruments
Solenoids, electromagnetic machines
Aerospace, automotive fuel, hydraulic systems,
fluid bearing,
MEMS fluid damping, drug delivery pumps, heart
valves.
Fluid handling systems, EFI, hydraulic systems
Electronics cooling
Many! All of the above!
Automotive lighting, astronomy, any optical
instruments
Multiphysics 8.0
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Topics Covered
Market Applications



Other New features

Re-meshing for FSI

Product Websites
Multiphysics 8.0
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Multi-field Solver - Pretext

Situation Prior to Release 8.0:
Significant number of multi-physics problems can be addressed with

sequential coupling using core elements.
Our current tools for sequential coupling require advanced APDL

and domain knowledge to process solution.
We have out-grown custom-command macros that perform

sequential coupling e.g..:
FSSOLV
ESSOLV
Fluid Solid Interaction (FSI) was a first step towards automated
sequential coupling technology
Multiphysics 8.0
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Multi-field Solver Why?

There is Growing Market Requirement to:
Solve multi-physics problems from all industries.

Often need to incorporate more than two physics.
Couple more easily to external codes
Provide an easier to use Multiphysics environment for current
analysts.
In Response:
ANSYS have developed a multi-field solver to automate
sequential coupling, and be general enough in the design for
most multi-field solution requirements
The multi-field solver is an evolution of our successful FSI solver

Multiphysics 8.0
Multi-field Solver Implementation

Model and mesh
Single model of physical parts.

Multiple, separate meshes for each Field, derived from base solid model.
What is a FIELD ?
A FIELD is an Finite Element model set up to perform a single solution
It may solve for a single physics (e.g. a mechanical structure)

It may solve for directly coupled physics (e.g.. piezoelectrics)
A selection of element types is used to define a FIELD

Each FIELD has its own mesh
Loads, boundary conditions, solver selection are all part of the FIELD
definition
A FIELD may be any analysis type (Static, Harmonic, Transient)
Each FIELD creates its own results file
A FIELD may be defined (imported) from an external code via a CDB file.
Multiphysics 8.0
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Interfacing between Fields
Fields talk to one another through surface or volumetric interfaces

Field coupling is realized by mapping loads from one mesh to another
Support similar or dissimilar meshes

Supports 1 order and 2 order elements or mixtures of both
st
nd
Automated mesh morphing of non-structural domains is available for all

non-structural element types.
Multifield Solution
The solver loops through all fields

Supports static, transient and harmonic analysis
Convergence is monitored at the interfaces where loads are transferred.
Multiphysics 8.0
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Time loop:
For transient analysis, refers to solution in time

For static analysis, refers to each load step
For harmonic analysis, refers to harmonic analysis
within time step
Time Loop
Stagger Loop
Field Loop ( i=1,n)
Stagger loop:
Physics Field 1
Implicit coupling of various fields in time loop

Number of stagger iterations determined by
convergence of load transfer or max stagger
iterations
Physics Field 2
Physics Field n
Field loop:
Field solution with specific solution options

Load transfer to a particular field occurs before
solution of the field
Dissimilar mesh across surface/ volume interface
between fields
End Field Loop

End Stagger Loop
End Time Loop
Multiphysics 8.0
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Multi-field Solver- Physics Loads

Physics Loads Transferred in Field Loop
PHYSICS
CFD
SEND
RECEIVE
Heat flux, Forces, Temperatures
Displacement, Velocity, Temperature,

Heat rate, Forces
Temperature, heat flux
Temperature, Heat flux, Heat rate,

Displacement
STRUCTURAL
Displacement, Velocity
Forces, Temperature, Displacement
MAGNETIC
Forces, Heat rate
Temperature, Displacement
ELECTRIC
Forces, Heat rate
High Frequency
ELECTROMAGNETIC
Heat Rate
THERMAL
Multiphysics 8.0
Multi-field Solver Multi-user deployment
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No need for a super user to handle all physics, separate physics can be
processed by individual analysis experts in the company:
CAD Model
Physics 1 Engineer
e.g. CFD
Model pre processing
(loads,
(loads, boundary
boundary conditions
conditions
&
& mesh)
mesh)
Physics 2 Engineer
e.g. Electromagnetics
(loads,
(loads, boundary
boundary conditions
conditions
&
& mesh)
mesh)
Physics 3 Engineer
e.g. Structural
(loads,
(loads, boundary
boundary conditions
conditions
&
& mesh)
mesh)
Physics 4 Consultant
Engineer
e.g. HF electromagnetics
(loads,
(loads, boundary conditions
conditions
&
& mesh)
mesh)
Multi-field
Multi-field
Analysis
Analysis
Intra-Company Resource
Multiphysics 8.0
Multi-field Solver Multi-user deployment
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Each physics has its own CDB and results (*.R*) file.
Solid Model
Physics 1
e.g. CFD
(loads,
(loads, boundary
boundary conditions
conditions
&
& mesh)
mesh)
CFD CDB File
Physics 2
e.g. Electromagnetics
(loads,
(loads, boundary
boundary conditions
&
& mesh)
mesh)
Electromagnetics
CDB file
Physics 3
e.g. Structural
(loads, boundary conditions

&
& mesh)
mesh)
Structural CDB file
Physics 4
e.g. HF electromagnetics
(loads,
(loads, boundary
boundary conditions
conditions
&
& mesh)
mesh)
HF Emag CDB file
Multi-field
Multi-field Solver
Solver
Field1.RFL Results File
Field2.RMG Results file
Field3.RST Results file
Field4.RMG Results file
Multiphysics 8.0
Multi-field Solver - dissimilar mesh interface

Example of dissimilar mesh between physics:
Thermal-mechanical mesh: 15,000

elements
CFD mesh: 600,000 elements

(Fluid region not shown)
Multiphysics 8.0
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Multi-field Solver- Summary
Physics is treated as a "field" with an independent model & mesh

Each field is defined by a group of element types
Load transfer regions are identified by surfaces and/or volumes
Sequential (Load vector) coupling between fields
Each field may have:
Different analysis types

Different solvers and analysis options
Different mesh descretization
Each field can be imported from an external solver (e.g. CFX)

Surface load transfer across fields
Volumetric load transfer across fields
Automated morphing of non-structural elements
Independent results files for each field
Multiphysics 8.0
Multi-field Solver- Physics & Applications

Multi-Field Coupled Solver - Physics
Thermal-Structural
Electromagnetic-thermal
Applications/ Markets
Gas turbines.
Induction heating, RF heating
Electrostatic-Structural - Fluidic:
MEMS
Electrostatic Charged particle
Ion Optics, Field Emission Display Technology,

Analytical instruments
Magnetic Structural - Thermal
Solenoids, electromagnetic machines, Bus

bars
Fluid-Solid:
FLOTRAN based FSI
CFX-ANSYS unidirectional interface
Aerospace, automotive fuel, hydraulic systems,

fluid bearing,
MEMS fluid damping, drug delivery pumps,
heart valves.
Thermal CFD
Electronics cooling, engines
Magnetic - CFD
MR fluids, Ferro-fluidics, automotive
Third Party/External Product coupling:

Sigfit: Unidirectional, Structural Optical
MpCCI: Bi-directional FSI
Automotive lighting, astronomy, any optical

instruments
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Multi-field Solver- Benefits
Provides an easy to use framework to solve coupled field problems in

ANSYS Multiphysics
Ability to sequentially couple any number of physics fields
Applicable across all physics available in ANSYS Multiphysics
Multiple field specification with different solution option for each field
Analysis type (Transient/Static/Harmonic)
Solver options
Material & geometric non-linearity
Automated surface and volume load transfer across dissimilar mesh
Automated Morphing of field elements
Unidirectional coupling between CFX and ANSYS Multiphysics
Unidirectional coupling between third party solvers and ANSYS Multiphysics
Provides analysis opportunities in many new market areas where there
have previously been no solutions.
Multiphysics 8.0
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Multi-field Solver- RF Attenuator Example

RF/microwave energy is attenuated through resistive losses in a Nichrome film
attached to the microstripline waveguide. The energy is lost in the form of heat
which is conducted both through the devices ceramic substrate and top insulating
surface film.
Typical Packaged Device:
Solid Model:
Nichrome
film
Ceramic
substrate
RF waveguide
Image from KDI data sheet.
Multiphysics 8.0

High-Frequency electromagnetic coupled to a steady-state thermal analysis:
Thermal
Thermal
Physics Field 2
HF
HF Emag
Emag
Physics Field 1
Heat generation rate
HF Emag mesh: 98,175 elements
Thermal Mesh: 6,600 elements
Multiphysics 8.0
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Analysis results:
E-field
H-field
Resultant temperature
Multiphysics 8.0
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Multi-field Solver- MEMS RF Switch Example

Transient response of MEMS RF Switch to a pulsed voltage excitation:
Beam support post
Beam electrode
Perforation holes to
control fluid damping
Ground electrode
Substrate
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Each physics model is prepared independently:

CAD
CAD Model
Model
Physics
Physics 1:
1: Mechanical
Mechanical Engineer
Engineer
Physics
Physics 2:
2: Electronics
Electronics Engineer
Engineer
Mesh
Mesh solid
solid model
model of
of switch
switch
Apply
Apply clamped
clamped BCs
BCs
Perform
Perform squeeze-film
squeeze-film damping
damping analysis
analysis
using
using FLUID136,
FLUID136, FLUID138.
FLUID138.
Prepare
Prepare structural
structural dynamics
dynamics analysis
analysis run
run
Create
Create Air
Air mesh
mesh around
around switch
switch
Apply
Apply voltage
voltage BCs
BCs
Prepare
Prepare electrostatics
electrostatics analysis
analysis run
run
Write
Write CDB
CDB file
file
MFIMPORT
MFIMPORT
Multi-field
Multi-field
Analysis
Analysis
Multiphysics 8.0

Transient, dynamic electrostatics coupled to mechanical analysis:
Mechanical
Physics Field 1
Electrostatics
Physics Field 2
Displacement, Forces
Structural mesh: 1894 elements
Electrostic mesh: 16,353 elements
Multiphysics 8.0
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Analysis Results:
Displacement of switch mid-plane

Under pulse voltage excitation
Multiphysics 8.0
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Multi-field Solver Example: CFX Imported field

Gas turbine with internal cooling example:
Unidirectional coupling between CFX and ANSYS
CFX performs conjugate heat transfer fluid solution.
CFX writes an ANSYS CDB file containing surface forces, volumetric
temperatures; defining an external field for the multifield solver
ANSYS interpolates CFX results onto the ANSYS FE mesh
ANSYS solves the thermal-stress analysis
Makes use of Cyclic symmetry (113 blades!)
Multiphysics 8.0
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Details of field stagger loop:
External
External
Physics
Physics Field
Field
ANSYS
ANSYS Internal
Internal Physics Field
Surface
Forces
Interpolated
Surface Forces
CFX
CFX Model
Model
Physics Field 1
Structural
Structural
Physics Field 2
Volumetric
Temperatures
Interpolated
Volumetric Temperature
Multiphysics 8.0
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Imported field process:
Create CFD model in CFX-build,

Pre-process and Solve Conjugate HT problem in CFX-solve.
Use the export utility in CFX-Post create a ANSYS CDB file
CDB file has SUR152/154 elements with force loads and SOLID70 with temperatures
derived from CFX mesh.
Create solid region in ANSYS Multiphysics and mesh for thermal-stress analysis
User defines solid region as "field2" and fluid (CFX) region as "field1"
Apply boundary conditions (Omega loading, cyclic symmetry)

Read in the cdb file from CFX via the MFIMport command
Create the fluid solid (FSIN) interfaces via SF command for the surface Forces
Create the solid-solid volumetric (FVIN) interface via BFE command for the
temperatures
ANSYS 8.0 multi-field stagger loop algorithm is used to transfer loads from "field2 mesh
to "field1 mesh and then solves the thermal-stress analysis."
Multiphysics 8.0
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Field 1: CFD Results
Pressure
Streamlines
Temperature
Multiphysics 8.0
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Field 2: Thermal Mechanical Results
Displacement
Temperature
Equivalent stress (SEQV)
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Multi-field Solver: CFX support
CFX can export the following to ANSYS Multiphysics
At surfaces
Nodal heat flux

Nodal forces
Nodal temperatures
Within Solid volumes
CFX loads can be read only with the ANSYS Multiphysics Multifield Solver
CFX5 export
Stand-alone CFXExport executable available for CFX5.6 customers

ANSYS CDB file created from CFX results files
Works with ANSYS Multiphysics 8.0 and the Multifield solver
Multiphysics 8.0
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Topics Covered
Market Applications



Other New features
Enhanced non-linear Piezoelectric & piezoresistive elements.

Direct coupled piezoresistive elements
Re-meshing for FSI

Product Websites
Multiphysics 8.0
Direct Coupled-Field Elements - Benefits

Series 22X elements bring consistency and ease of use to our direct
coupled physics:
Capabilities
New material models and coupled-field effects
Flexible setting of DOFs and reactions - controlled by KEYOPT(1)
Use existing / enhanced core legacy elements as building blocks
More special features and loads
Consistency
Element shapes and orders - match our 18X solid structural elements
Load labels - CHRG vs AMPS
Large deflection capability - available for ALL analyses with structural DOFs
New code architecture

Inherit the functionality of core elements - material models, loads, special features.
Calculate directly coupled-field effects inside the element.
Facilitates infrastructure to rapidly deploy additional directly coupled physics.
Multiphysics 8.0
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Series 22X Coupled Field Elements
Higher order solid elements for
Applications
Piezoelectric analysis
Piezoresistive analysis
Pressure transducers
Sensors
Accelerometers
Microphones
Elements
PLANE223
SOLID226
SOLID227
R1
R4
R2
2-D 8-Node Quad

3-D 20-Node Brick
3-D 10-Node Tetrahedral
R3
Acceleration
Force
Couples to CIRCU124
Can build Wheatstone bridge etc

Images courtesy Endevco & Fujikura.
Multiphysics 8.0
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Coupled Field Piezoresistive Element

Strain gauge accelerometer principle of operation:
Piezoresistors
Support Frame
R1
R2
R3
R4
Proof mass
piezo-resistor
color key
R1
R1
normal
R1
compression
R1
R4
R2
R3
Acceleration
Force
tension
R3
R4
R1
R2
Force
Acceleration
Multiphysics 8.0

Strain gauge accelerometer analysis example:
Accelerometer uses four piezoresistive sensors per beam in a Wheatstone Bridge configuration.
Objective is to compute Output voltage and sensitivity with 5 V DC excitation.
SOLID95 for mass, frame, and beam
SOLID226 for Piezoresistors
Voltage coupling used to create Wheatstone bridge.
Frame
Detail of beam:
Beam
Proof Mass
Four Piezoresistor elements
Multiphysics 8.0
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Analysis results for 1 G acceleration load:
Stress in beam: 1.6-2.9 MPa

Differential voltage in bridge: 2.79 mV
Sensitivity: 2.84e-4 Vsec2/m
Axial stress contour plots:
Multiphysics 8.0
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Damping Elements for Thin Film Applications
FLUID 136 - 2D 4 or 8 node squeeze film fluid element

FLUID 138 - 3D 2 node viscous fluid link element
FLUID 139 - 2 or more node slide film damper
Applicable to MEMS or macro devices where damping attributed to thin films/ air gaps is
required.
KEYOPTS control the flow regime: Continuum, High Knudsen numbers etc.
The fluid environment is defined by a set of real constants.
For FLUID136 & FLUID138: The elements are added to the structure and a static
analysis is used to determine the damping effects at low frequencies, and a harmonic
analysis is used to determine the stiffening and damping effects at high frequencies.
The DMPEXT command is used to extract frequency dependent damping parameters
for use with the MDAMP, DMPRAT, ALPHAD, and BETAD commands for use in
structural dynamics analysis with correct damping.
Accurately extract ALPHA and BETA Rayleigh damping terms for a transient analysis.
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FLUID 136:
Models viscous fluid flow behavior in small gaps between fixed surfaces and
structures moving perpendicular to the fixed surfaces.
Used to determine the stiffening and damping effects that the fluid exerts on the
moving structure.
Based on the Reynolds squeeze film theory and the theory of rarefied gases.
A static analysis is used to determine the damping effects at low frequencies. A
harmonic analysis is used to determine the stiffening and damping effects at high
frequencies.
The DMPEXT command is used to extract frequency dependent damping
parameters for use with the MDAMP, DMPRAT, ALPHAD, and BETAD commands
for use in structural dynamics analysis with correct damping.
Accurately extract ALPHA and BETA Rayleigh damping terms for a transient
analysis.
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FLUID 138:
Models the viscous fluid flow behavior through short channels (i.e., holes) in
microstructures moving perpendicular to fixed surfaces.
Can be used in conjunction with FLUID136 elements to determine the stiffening
and damping effects that the fluid exerts on the moving perforated microstructure.
Assumes isothermal flow at low Reynolds numbers.
Accounts for gas rarefaction effects and fringe effects due to the short channel
length.
Can be used to model either continuous or high Knudsen number flow regimes.
Applicable to static, harmonic, and transient analyses.
FLUID 139:
139 is a combination of Couette (low frequency) and Stokes flow (inertial effects at
high frequency).
The viscous flow between surfaces is represented by a series connection of massdamper elements whereby each node corresponds to a local fluid layer
Applicable to large deflection.
Multiphysics 8.0
Squeeze & damping constants:
Squeeze or Spring dominant

@ higher frequencies
represents compressible fluid
effects
Damping dominant @ low

frequencies represents
fluid displacement effects
Multiphysics 8.0
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Computing damping parameters for flexible bodies using the Modal Projection
Technique:
Build a structural and thin-film fluid model and mesh.

Perform a modal analysis on the structure.
Extract the desired mode eigenvectors.
Select the desired modes for damping parameter calculations.
Perform a harmonic analysis on the thin-film elements.
Compute the modal squeeze stiffness and damping parameters.
Compute modal damping ratio and squeeze stiffness coefficient.
Display the results: MDPLOT.
Automated using the DMPEXT

command macro
Multiphysics 8.0
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Transient dynamic response of damped MEMS RF Switch:
FEA Model of damping holes:
Viscous
Multiphysics 8.0
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Damping Elements Application Example

Results: Transient dynamic response of the switch to a pulsed voltage excitation.
ALPHA and BETA damping parameters were obtained from a squeeze-film
analysis of the structure
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Damping Elements Application Example

MEMS Accelerometer harmonic response:
Pressure distribution at 100 Hz for
design with matrix of damping
control holes in the plate.
Pressure distribution at 20 Hz for

design with no damping control
holes in the plate.
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Damping Elements - Application Examples
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MEMS Accelerometer harmonic frequency response 0.1 10 kHz

Shows results of four design iterations:
Final design
(honeycomb plate) has
flattest frequency
response
Initial design
(no plate holes)
is overdamped
Multiphysics 8.0
LF Electromagnetic Cyclic Symmetry
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Feature:
Cyclic symmetry (periodicity) for Low Frequency Electromagnetics

Commands: CYCLIC and CYCOPT
Supports: PLANE13, PLANE53, SOLID96, SOLID5, SOLID98, SOLID117
Benefits:
This new feature is applicable to 3D magnetic scalar potential (MSP),

magnetic vector potential (MVP) and edge (SOLID117) formulations .
These commands are also used for cyclic symmetry structural analyses
results greater consistency across physics.
Reduce FEA problem size & faster solution time by making use of
symmetry.
Market applications:
Primarily rotating electromagnetic machines
Electric motors
Alternators
Inductive ignition system sensors
Multiphysics 8.0

Example: 4 pole variable reluctance machine reduced to 90 degree sector:
Bcircumferential
Multiphysics 8.0
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Multiphysics 8.0
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Feature:
Contact for Low Frequency Electromagnetic

Commands: TARGET169, CONTAC171
Supports: PLANE13, PLANE53, SOLID96, SOLID5, SOLID98
Benefits:
This new feature is applicable to 3D magnetic scalar potential (MSP), and

2D magnetic vector potential (MVP).
A lot easier to use than constraint equations!
Market applications:
Electric motors
Alternators
Inductive ignition system sensors
Linear Motion Systems
Non Destructive Testing
Eddy current braking systems
Multiphysics 8.0

Example: In pipe eddy current based sensor. Sensor slides down pipe
detecting flaw in pipe wall.
B-field contours
Sensor
Pipe
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Ion Optics Enhancements

Ion Optics - An important feature for the SEMICON and Analytical
instrument markets:
Particle tracing is a post processing feature.

Can trace charged particle in either a electrostatic field or magnetostatic
field or both.
Particles initial conditions definable are:
Mass
Charge
Starting coordinates (x,y,z)
Velocity vector (Vx,Vy,Vz)
Can define 50 particles per run.

Particle trajectory can be plotted in 2D/3D or listed.
Space charge effects are not accommodated.
No relativistic effects (velocity is much smaller than speed of light).
Multiphysics 8.0
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Example of a particle trace through homogenous magnetic field, with a
changing electric field. Animation is a composite of static cases
Multiphysics 8.0
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Example of a particle trace on a charged particle trace!
PLTRACE command used to slide visualization particles along the charged particle
trajectories.
Multiphysics 8.0
FSI Remeshing Enhancements

Coupled fluid-solid (FSI) meshing capability enhanced to handle applications with
large boundary/domain changes.
This feature opens up a broader range of FSI market applications:
Solid can undergo large deformation or complete rotations. E.g.. Pumps or stirrers.
Detached solid object movement through fluid.
Enhancements:
Moving boundary problem is re-meshed when mesh becomes badly distorted or ALE
mesh morphing scheme fails.
Improved accuracy when the mesh is distorted by ALE mesh moving scheme
Regenerates a new mesh from a selected element group.
All element based loads (e.g. FSI interface) are updated
Body loads on the interior nodes are updated
Nodal values are interpolate from old mesh to new mesh
Redesigned FLOTRAN result files, creates new rfl file for each remesh
Animation is possible across multiple result files (anmres)
Multiphysics 8.0
66

New Commands:
FLDATA39, REMESH, Label, Value

ANMRES, Delay, Min, Max, Inc, Autocntrky, Freq, rfl
Limitations:
Must keep the same topology for surface (boundary) elements.

Applicable to triangle (2D) and tetrahedral (3D) elements
Example: Rigid body rotation, a flap valve in a tube:
Multiphysics 8.0
67

Cylinder passing through a channel:
Multiphysics 8.0
68
69
Topics Covered
Market Applications



Other New features

Re-meshing for FSI

Product Websites
Multiphysics 8.0
70
Selected Multiphysics
Heat
Transfer
Solid
Mechanics
Thermal-structural coupling
Needed for any product subjected to changes in
temperature!
Engines, gas turbines, heat exchangers

Electronic components, package solder joints
Cryogenic components and systems
Test & Measurement Equipment
Multiphysics 8.0
71
Thermal Structural Example

BGA IC Package differential thermal expansion
Image courtesy of MCR.
Multiphysics 8.0
72
Heat
Transfer
Fluid
Mechanics
Thermal-Fluid Coupling (Conjugate heat transfer)
Applications:
Heat is transferred between fluid and solid

Convection effects.
Forced flow.
Heat exchangers
Electronics device/enclosure temperature management
Multiphysics 8.0
Conjugate Heat Transfer Example

Vertical heat sink
Multiphysics 8.0
73
74
Electricity
Heat
Transfer
Solid
Mechanics
Electro- Thermal Coupling
Electro-Thermal-Structural coupling
Needed for many electronic power handling

components and systems.
Resistive (Joule) heating
Resistive (Joule) heating resulting in thermal expansion

Current-carrying conductors, bus bars
Electric motors, generators, transformers
Electronic components and systems
Actuators
Multiphysics 8.0
Electro-Thermal-Structural Example
Detail of Integrated Circuit via & aluminum trace
Current Density
Electrical Power
Images courtesy of Atila Mertol, LSI Logic.
Thermal Stress
Multiphysics 8.0
75
76
Electrostatic
Solid
Mechanics
Electrostatic Structural coupling
Electrostatic-structural-Fluid Coupling
Fluid
Mechanics
Piezoelectric effect
Electrostatic actuated structures incorporating effects of fluid
damping.
The entire MEMS Industry is based on these physics!
Resonators/Actuators
Electro-mechanical band pass filters
Inertial sensors (Accelerometers & gyroscopes)
Inkjet printer heads
Multiphysics 8.0
77
MEMS Micromirror Example
Multiphysics 8.0
78
Electromagnetics
Electromagnetic-Thermal coupling
Applications:
Heat
Transfer
Eddy current losses (LF Emag)

Resistive & dielectric losses (HF Emag)
Required by those that want heat or those that want to minimize it!
Induction heating systems (LF Emag)
Heat treating processes

Pre-heating for metal forming operations
Heaters
Attenuators
RF Microwave systems (HF Emag)
Multiphysics 8.0
79
Induction Heating Example
Solid model meshed

Current in coil
Induced current in plate
Resultant B-Field
Multiphysics 8.0
80
Induction Heating Example
Joule heating
Time averaged joule heating
thermal load
Resultant temperature
Multiphysics 8.0
81
Electromagnetics
Fluid
Mechanics
Electromagnetic - Fluid coupling

Applications
Magneto-Rheological (MR) devices
Active structure vibration damping systems

Automotive & biomedical actuators
Induction furnaces for stirring molten metals

MHD power systems, EHD pumps
Multiphysics 8.0
Electromagnetic - Fluid coupling Example

A.C. Induction furnace:
Electromagnetic field solution to
compute Lorentz forces
CFD analysis performed to determine
stirring pattern within furnace core
Multiphysics 8.0
82
83
Electromagnetics
Solid
Mechanics
Electromagnetic Solid Coupling
Forces due to magnetic field move/interact with mechanical
structures.
Magnetic force (linear systems)
Magnetic torque (rotary systems)
Applications:
Actuators / Solenoids
Rotating machines
Alternators
Motors
Multiphysics 8.0
Moving Magnetic Probe Example

2D Axi-symmetric model using true moving object, sliding mesh boundary
Animation of flux lines when V = 0.4 m/s
Multiphysics 8.0
84
85
Magnetic Levitation Example

Flux lines and levitation coil currents:
Multiphysics 8.0
86
Rotating Machine Examples
Images courtesy of CAD-FEM GmbH.
Multiphysics 8.0
87
Heat
Transfer
Solid
Mechanics
Electromagnetics
Thermal-Solid-Electromagnetic Coupling
Thermal-mechanical dimensional changes coupled into HF

Emag or LF Emag analysis.
Many applications require knowledge of the effects of

temperature on electromagnetic performance.
Multiphysics 8.0
Thermal-Solid-Electromagnetic Coupling Example

Thermal Effects on microwave wave guide
Waveguide Bend
Electric Field
@ 20oC
20 oC : S11 = 0.1901, S12 = 0.9817

60 oC : S11 = 0.1895, S12 = 0.9819
Waveguide
Displacement
from 20- 60oC
Waveguide Bend
Electric Field
@ 60oC
Multiphysics 8.0
88
89
Viscous Fluid
Mechanics
Solid
Mechanics
Coupled Fluid Solid (Fluid Solid Interaction, FSI)
Fluid pressure deforms mechanical structure which in turn

effects fluid flow. May also include heat transfer.
Applications
Aero-elastic problems
Hydraulic / Pneumatic / Fuel systems
Fluid pumps
Biomedical
Blood flow elastic artery

Heart valves
Multiphysics 8.0
90
FSI Example Pressure Limiting Valve
Pressure-limiting valves are used in

anti-lock brake systems
Huge liability ramifications

Per VDO, tiny geometric design
changes cause wide variations in valve
response and performance
Without FSI VDO was guessing on
new valve designs.
FSI analysis significantly reduces
overall time to market and improve
reliability.
4.5 mm
4.0 mm
55
0.25
mm
2.4 mm
10.0 mm
Courtesy : Siemens VDO
Multiphysics 8.0
FSI Example Pressure Limiting Valve

Mesh detail & dissimilar mesh for solid & fluid
Multiphysics 8.0
91
92
FSI Example Results
Multiphysics 8.0
93
FSI Example Results

Ball displacement time history, f 875 Hz
Multiphysics 8.0
94
Inviscid Fluid
Mechanics
Solid
Mechanics
Inviscid fluid-structural coupling (FSI)
Longitudinal pressure wave travels through fluid causing

displacement of solid structure.
Applications (Primarily acoustics):
Loudspeaker design
Microphone
Sonar / ultrasonics
Multiphysics 8.0
95
Acoustics Example
Response of axisymmetric disc in tube to plane wave.
Multiphysics 8.0
96
Topics Covered
Market Applications



Other New features

Re-meshing for FSI

Product Websites
Multiphysics 8.0
97
Product Roadmap - Overview
Target markets:
Actuator and Sensors

Low Frequency (Actuators and electric machines)
MEMS
High Frequency (RF) devices
Biomedical - FSI
Short/Medium Term (< 2 years):
Release 8.1/9.0
ROM140 (Damping counterpart to ROM144)
LinkCAD for ANSYS Process Emulator module
Publish ROM database format & provide additional ports on ROM144 for drive
variable
CFX ANSYS integration
Longer Term (2 - 3 years):
Products and technology migrated to ANSYS Workbench Environment.

CFX will take FLOTRANs place in the ANSYS Workbench Environment.
MEMS coupled analysis capability in Workbench Environment.
Multiphysics 8.0
Roadmap Transition to Workbench
Objective is to migrate ALL physics technology to Workbench
Strategy is to migrate and expose technology into the ANSYS Workbench

Environment creating a general purpose product applicable to a broad
range of markets.
Order of physics exposure is:
We will not to develop standalone physics products.Products and

physics will instead be more modular and controlled through licensing.
LF Emag
CFD (CFX technology)
HF Emag
Advanced Physics
Multiphysics 8.0
98
99
Topics Covered
Market Applications



Other New features

Re-meshing for FSI

Product Websites
Multiphysics 8.0
10
0
Product Websites
Multiphysics 8.0
10
1
Product Websites FSI & MEMS
Multiphysics 8.0
10
2
The End!
Acknowledgements:
Dale Ostergaard
Barry Christenson
Deepak Ganjoo
Ray Browell
Bill Bulat
Achuth Rao
Stephen Scampoli
Daniel Shaw
Mark Troscinski
Miklos Gyimesi
CAD-FEM GmbH
Multiphysics 8.0

ANSYS Multiphysics 8 0 Customer 3

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ANSYS Multiphysics 8.0

Dr. Paul Lethbridge - Product Manager

Market segments by Technology

Multi Field (Coupled Physics) Capabilities

Direct physics coupling

Multi-field Solver (New feature at release 8.0)

Enhanced non-linear Piezoelectric & piezoresistive element.

Selected Multi-Physics Examples

Transition to Workbench Environment

The ANSYS Family of Products

Ease of use &

ANSYS MCAD & ECAD Connection products

Market segments by Technology

Multi Field (Coupled Physics) Capabilities

Direct physics coupling

Multi-field Solver (New feature at release 8.0)

Enhanced non-linear Piezoelectric & piezoresistive element.

Selected Multi-Physics Examples

Transition to Workbench Environment

What is ANSYS Multiphysics?

No other analysis tool provides as many physics under one roof!

Seamless integration with ANSYS Probabilistic Design System (PDS).

Greatest breadth and technical depth of physics.

Analysis closely match reality bringing reality to the desktop

The use of Multiphysics allows us to return to the basics

Dr. Howard Crabb - Ford Motor Company

Educational Products Problem Size Limits

Market segments by Technology

Multi Field (Coupled Physics) Capabilities

Direct physics coupling

Multi-field Solver (New feature at release 8.0)

Enhanced non-linear Piezoelectric & piezoresistive element.

Selected Multi-Physics Examples

Transition to Workbench Environment

Market Applications by Technology

Market Applications by Industry

Market segments by Technology

Multi Field (Coupled Physics) Capabilities

Direct physics coupling

Multi-field Solver (New feature at release 8.0)

Enhanced non-linear Piezoelectric & piezoresistive element.

Selected Multi-Physics Examples

Transition to Workbench Environment

Coupled Physics Capabilities: Methods

There are two methods to couple physics, Direct & Sequential.

There are many confusing terms for the two methods:

Direct - solves all DOFs at the FEA coefficient matrix level.

Strict Mathematical usage

Direct Coupled Physics Applications

Pressure-Structural (Inviscid FSI)

Acoustics, sonar, SAW

Pressure sensors, strain gauges, Accelerometers

Circuit coupled electromagnetics:

IC, PCB electro-thermal stress, MEMS actuators

Sequential Coupled Physics Applications

Anything with a structure!

Market segments by Technology

Multi Field (Coupled Physics) Capabilities

Direct physics coupling

Multi-field Solver (New feature at release 8.0)

Enhanced non-linear Piezoelectric & piezoresistive element.

Selected Multi-Physics Examples