Guided by: Dr.

Sharifuddin Mondal

Presented by: Shivam Choudaha

M.Tech in Manufacturing Tech. En.Roll:- 112604 Jaypee University Of Engineeing & Technology, Guna

CONTANTS OF PRESENTATION
Introduction
Why use MEMS ? Basic processes Deposition process

Patterning process
Etching process Material used in MEMS Applications

References

INTRODUCTION
Microelectromechanical systems (MEMS) is the technology of

manufacturing very small devices.

MEMS are made up of components between 1 to 100 micrometers in

size (i.e. 0.001 to 0.1 mm), and MEMS devices generally range in size from 20 micrometers to a millimeter (i.e. 0.02 to 1.0 mm).
Richard Feynman was theoretically introduce MEMS technology in

1959, but came in practices in 1980s.

WHY USE MEMS ?

Fabricate tiny part (0.001 to 0.1 mm)
Less power consumption Cheaper in batch production Less complex method of fabrication

MEMS BASIC PROCESS

1. 2. 3.

Deposition processes Patterning Etching processes

Wafers

Device

Deposition

Patterning

Etching

DEPOSITION PROCESSES
One of the basic building blocks in MEMS processing is the ability to

deposit thin films of material with a thickness anywhere between a few nanometers to about 100 micrometers.
There are 2 types of deposition process

Physical vapor deposition (PVD) Chemical vapor deposition (CVD)

PHYSICAL VAPOR DEPOSITION (PVD)

PVD covers a number of deposition technologies in which material is released from a source and transferred to the substrate. The most important technology is: Evaporation In evaporation the substrate is placed inside a vacuum chamber, in which a block (source) of the material to be deposited is also located. The source material is then heated to the point where it starts to boil and evaporate. The vacuum is required to allow the molecules to evaporate freely in the chamber, and they subsequently condense on all surfaces. E-Beam evaporation Using e-beam for evaporation (Figure) Resistive evaporation Using high electricity for evaporation (Figure)

E-BEAM EVAPORATION

RESISTIVE EVAPORATION

CHEMICAL VAPOR DEPOSITION (CVD)

In this process, the substrate is placed inside a reactor to which a number of gases are supplied. The fundamental principle of the process is that a chemical reaction takes place between the source gases. The product of that reaction is a solid material with condenses on all surfaces inside the reactor.

PATTERNING
Patterning in MEMS is the transfer of a pattern into a material. Method of patterning Lithography

Lithography in the MEMS context is typically the transfer of a pattern to a photosensitive material by selective exposure to a radiation source such as light. A photosensitive material is a material that experiences a change in its physical properties when exposed to a radiation source. (Figure)

PHOTOLITHOGRAPHY

PATTERN TRANSFER BY DEPOSITION

Photolithography

Deposition

Strip resist

ETCHING PROCESS
Etching is used in micro fabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module, and every wafer undergoes many etching steps before it is complete. (Figure) Type of Etching
Wet etching

Where the material is dissolved when immersed in a chemical solution.

Dry etching

Where the material is sputtered or dissolved using reactive ions or a vapor phase etchant

ETCHING PROCESS
Photolithography

Etching

Strip resist

MATERIAL USED IN MEMS

Silicon
Used in manufacturing of Instigated circuits (IC) in electronic industry Easy available and cheap Very reliable material for the small device Suffers very little fatigue and gives long service

Polymers
Used in manufacturing of disposable blood testing cartridges Polymers used in the place of crystalline silicon

Metals
Metal is more reliable as compare to silicon and polymers

Gold, nickel, aluminum, copper, chromium, titanium and tungsten

Ceramics
Used in manufacturing of biosensors

APPLICATION
Sensor fabrication
Micro sensor fabrication, which is used in precision measurement

Micro chip fabrication

Microprocessor fabrication

Automobile industry
MEMS accelerometer

Electronics industry
IC fabrication Electronic circuit fabrication

LIMITATIONS
Effect on mechanical properties of material
Low strength of MEMS device Skill training require for manufacturing High initial cost

REFERENCES
http://en.wikipedia.org/wiki/Microelectromechanical_systems

(Accessed January 2103 )

http://www.memsnet.org (Accessed January 2103 ) www.mems-exchange.org (Accessed January 2103 ) Raza jafari and Wajid hasaan, MEMS fabrication process, Journal of

engineering & science, 2008,vol 2, no 1, pp 54-58

Ioan Raicu, MEMS Technology: Overview and Limitations, 2004