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Filler Cell
Tie cell Spare cell
Decap cell
Decap cells are on-chip decoupling capacitors that
are attached to the power network to decrease noise effects Decap cells are most effective when placed closest to the flops After power planning we add the decap cell
design between power and ground rails to counter functional failures due to dynamic IR drop. when Sequential and Digital elements are switched at that time Dynamic I .R. drop happens . Due to this simultaneous switching a high current is drawn from the power grid for a small duration. If the power source is far away from a flop the chances are that this flop can go into a metastable state due to IR Drop. To overcome this decap cells are added. During the switching of elements at that time the current requirement is high , these decap cell discharge and provide boost to the power grid.
power or ground connections to wells of the substrate. taps are traditionally used so that your VDD and GND are connected to substrate and n-wells respectively. This is to help tie them to VDD and GND levels so that they don't drift too much (especially towards the middle of the chip) and cause latchup.
are required to meet certain design rules They are placed at the right or left most ends of the site rows, and are used in some technology for power distribution End cap does not allowed to routing comeout side beyond endcap
End cap cell is used at the every standard cell row
Filler Cell
Filler cells should be included in standard cell library
filler cells provide continuity for VDD/GND rails, as well as for n-well
2) Std. Filler cell
For PAD ring continuity, we use IO filler cells Std. Filler cells are also used in the std cell region(inside
core area). The reason is to fulfill the continuity of N-Well thought the std cell area.
connection (substrate connection) because of their small size. In those cases, the abutment of cells through inserting filler cells can connect those substrates of small cells to the power/ground nets
After the std. cell placement we use the Filler cell
Tie cells
Tie-high and Tie-Low cells are used to connect the
gate of the transistor to either power or ground. These cells are part of standard-cell library
The cells which require Vdd (Typically constant signals
Spare Cell
Spare cells are extra cells placed at regular interval in
the chip. This cells are placed in a group of functional cells like(and, or, nor, mux, flop, inverter, buffer)
Once the chip is taped out and if any functional issue
is found or any feature enhancement is required, these pre-placed cells can be used to add functionality without redoing the entire design
cells I/O filler cell Tap Cell End Cap Cell Decap cell Std. Filler Cell
When Put? floorplanning In Macro placement before std. cell placement After Power planning Placement
why For I/O pad continuity To prevent latch Up Power ditribution To prevent IR drop & voltage flactuation For continutity between cell
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