MANUFACTURING PROCESS OF MULTI-CRYSTALLINE PHOTOVOLTAIC SILICON SOLAR CELL

INTRODUCTION TO SOLAR CELL BASICS

A solar cell (also called photovoltaic cell or photoelectric cell) is a solid state electrical device that converts the energy of light directly into electricity by the photo voltaic effect. Assemblies of solar cells are used to make solar modules which are used to capture energy from sunlight. When multiple modules are assembled together, the resulting integrated group of modules all oriented in one plane is referred to in the solar industry as a solar panel. The electrical energy generated from solar modules, referred to as solar power, is an example of solar energy.

SOLAR CELL MANUFACTURING PROCESS

1. 2. 3. 4. 5. 6. 7. 8. 9. 10.

11.
12.

LCL (Load Cell Line) Acid Texturing P-Doper (Phosphorous Doper) Diffusion Furnace PSG & EI PECVD Screen Printing Dryers & Firing Furnace LIP (Light Induced Platting) Cell Sorter Buffer & Flex-Buffer Conveyer & Cross-Conveyer

MANUFACTURING LINE

1. LCL (Load cell line)

FUNCTION:The basic function of Load Cell Line is to feed the raw wafers to the line. DESCRIPTION:It guarantees loading of cell line with high-quality undamaged wafers. The wafers are inspected for damages by various detection systems and subsequently fed into cell production line. It is available in various versions according to required degree of automation & inspection.

OPERATION:

A set of 50-100 wafers are manually feeded by operator to each five blister boxes & further each single wafer is picked up by each gripper arms which places these raw wafers to conveyer belt. First, raw wafers are passed through IFM camera & proximity sensor which checks for outer dimension & double wafers detection. Further, Geometry Camera System detects for outer defects. After this, raw wafer goes through micro-cracks detection by microcrack camera system. Finally, in a group of 5 rows, raw wafers are supplied to line with output of 3000wafers/hr. by LCL.

2. Acid texturisation

It is applied mainly with multi-crystalline wafers. With this process, the soiling & damages incurred during sawing process are removed. Also the surface of wafer is enlarged. The isotropic surface texture reduces reflection of suns rays on subsequent surface of cell.

PROCESS

M1: Input module M2: Isotropic etching (HF and Nitric acid bath to remove dirt or slurry of silicon carbide and to remove saw marks)

M3: Rinsing ( to remove the excess chemical on the surface of silicon .It is done after treatment with any chemical)
M4: KOH process (it reacts with silicon dioxide to form random pyramids on the surface and reduces the overall reflectance. Also it stops the etching process of the previous module)

M5: Rinsing M6: HCl treatment (to remove metallic contamination like NaCl) M7: Rinse M8. 01 :HF treatment (to make surface hydrophobic as it helps in cleaning) 02: Rinsing M9: Clean process ( HCl + DI water, to remove oxides)

M10: Rinsing
M11. 01:HF treatment 02: Rinsing M12: Dryer (UV lamps dryer are used as they make the surface hydrophilic)

3. P-DOPER (PHOSPHOROUS DOPER)

FUNCTION:

Its function is to apply N-type phosphoric fumes deposition in a uniform way to P-type silicon wafers in order to generate a p-n junction.
Phosphoric acid from an acid tank and de-ionized water from a storage tank are mixed to give 27% phosphoric acid and mixture is temperature controlled at 37.C. A selective control of supply air and adjustable atomizer capacity regulates amount of acid applied to wafer and guarantee a homogenous application on all tracks.

OPERATION:

WAFER(AFTER DOPING)

4. DIFFUSION FURNACE
FUNCTION:

In diffusion furnace, the phosphorous atom which were deposited in upstream process, are now embedded in surface of wafer. This releases mobile electrons in wafer, which are later responsible for transporting charge. An even distribution of temperature in diffusion furnace ensures a homogenous layer of resistance.

FUNCTION:

In diffusion furnace, the phosphorous atom which were deposited in upstream process, are now embedded in surface of wafer. This releases mobile electrons in wafer, which are later responsible for transporting charge. An even distribution of temperature in diffusion furnace ensures a homogenous layer of resistance.

5. PSG & EI (Phosphor Silicate Glass & Edge Isolation)

FUNCTION: In this process, the one-sided edge isolation is combined with the removal of the phosphor-silicate glass layer. The emitter layer created on the underside of the wafer during the diffusion process is isolated on one side in order to prevent short-circuit of the p-n junction so formed and also to remove the phosphor silicate glass so formed during the diffusion. In the following process which is integrated in the machine the phosphorous glass is removed from the surface of the wafer. DESCRIPTION: The edge isolation process removes the phosphorous diffusion around the edge of the cell so that the front emitter is electrically isolated from the cell rear. A common way to achieve this is to stack the wafers on top of each other then plasma etch using CF4 and O2 . The complete interruption of the electrical n-emitter contact between front and backside.

The complete removal of phosphorus silicate glass is important so as to stabilize the anti reflection coating (ARC). First of all edges are isolated with the help of HNO3 & HF in 3:1 ratio temperature of the bath is 10-16 C Si + 4HNO3 SiO2 + 4NO2 + 2H2O SiO2 + 6 HF H2SiF6 + 2 H2O After this wafer is rinsed with de-ionized water and then treated with KOH to neutralize the acid effect. After this phosphorus silicate glass is removed from the upper portion of the wafer with 49% HF solution .and finally wafer is treated with hydrogen peroxide. The process of formation of PSG is given by the following chemical equations: H3PO4 P2O5+H2O Si+P2O5SiO2+P (deposits as PSG)

6. PECVD

In PECVD (Plasma Enhanced Chemical Vapor Deposition) coating system, the wafer is coated with an anti-reflection layer consisting of silicon nitride. This technology uses a direct plasma reactor which achieves considerably improved cell efficiency in comparison to remote plasma reactor. The PECVD system is base

PROCESS: Precursor gases of silane (SiH4) and ammonia (NH3) are fed into a chamber and break down due to a plasma enhancement (PECVD) takes place. Other systems use microwaves to cause the silane /ammonia reaction to take place. The complete reaction is:

3SiH4 + 4NH3 Si3N4 + 12H2 SiH4+2N2OSiO2+2N2+2H2

Solar cell quality dependants upon PECVD are

Cell efficiency Short circuit current

Open circuit voltage

Fill factor Shunt resistance Series resistance Since the reaction is highly exothermic so increasing the temperature of the system lowers the deposition of the plasma layer. Also low pressure (around 75-100 pa) favors good deposition

DESCRIPTION(PECVD-LOADER/UNLOADER)

In PECVD Loader/Un-loader, the PECVD-processed wafers in tray are exchanged for unprocessed wafer in a one step process. By dint of a system consisting of eight Bernoulli grippers, the processed wafers are removed from tray, inspected for breakage and placed on two out feed conveyers. At the same time, two in feed conveyers supply unprocessed wafers to the transfer position. Here, they are placed by gripper system into vacant tray positions. This process is repeated until tray is completely refilled with unprocessed wafer.

WAFER AFTER PECVD:

7. SCREEN PRINTING

During this process, once the cell is positioned properly in the print station, the process starts. Using the units operating software, it is possible to set up the various printing options. During printing, solar cell is held in place with vacuum plate. The upper part of unit is used as receptacle for screen frame and can be moved to corresponding positions for set-up, cleaning or printing. During printing, the unit is completely closed with a hinged cover. Additionally, any solvent vapors from screen print materials produced during process are removed from unit by means of vacuum unit.

8. DRYERS & FIRING FURNACE

In firing furnace, the applied metal conducting tracks are first dried & then fired, to produce an electric contact on the front and rear sides of solar cell. A new heating lamp technology, together with belt guidance and cooling technology, ensures an optimum distribution of temperature which provides excellent contact characteristics and thus an optimal filling factor.

9. LIP (Light Induced Plating)

PRINCIPLE:

In L.I.P. process, solar cell is placed in an electroplating bath, electron-hole pairs are created under irradiation, the emitter is on a negative potential and attracts positively charged metal ions out of the bath; the existing metal layer is thickened by the plating process.

Fig: Light Induced Plating Process

OPERATION OF MODULES :-

M1 Detection of incoming cells Cell surface by Miyako soft rollers between Sensor detects incoming cells Pulse generator measures transport velocity Due to this information the PLC knows the position of the cells in the machine M1 M7 Transport of Cells Cells run on transport rollers Gearing rollers guarantee immersion in the baths Centering rollers at regular distances keep the cells in track M2 M6 Exhaust of atmosphere in the modules Evacuation of evolving gases and vapours Exhaust directly above the bath, in the tanks and the interior of the process modules Important factor of bath consumption optimum adjustement is recommendable Normal operation exhaust air not contaminated during cleaning with HNO3 exhaust air contaminated M2 Rinsing of Cells Cleaning of incoming cells Spray bars flood cells with DI water Rinsing cascade: Pre- rinsing with slightly contaminated water from the main rinsing to economize water consumption Blowing off of the remaining rinsing water from the cells by blowing- off installation

M3 M4 Making of an Ag Plating Bath

Cooling by heat exchanger, heating by flow heater Connection of the backsurface field to negative voltage (rectifiers) by titan rollers Stripping: Regular cleaning of the titan rollers because of silver deposition Periodical cleaning with nitric acid HNO3 to remove silver deposits in trays and tubes No cleaning with hydrogen peroxide H2O2 because of intense reaction with silver Blowing- off of remaining Ag - solution from the cells at leaving the bath by blowing-off installation to minimize drag out

M5 Rinsing of Cells

Cleaning of cells from silver residua Spray bars flood cells with DI water Rinsing cascade: Pre- rinsing with slightly contaminated water from the main rinsing to economize water consumption Enlight 605 (sulfonic acid) can be added to enhance the cleaning, dosing crontrolled by conductivity meter Removing of rinsing water from the the rinsing steps and at the end Blowing Off of the remaining rinsing Water from the cells by blowing- off installation Separation of rinsing waste water into silver contaminated and sulphonic

M6 Drying of Cells

Dry jets blow high volumes of filtered and heated air at a low pressure on the cells
Coarse filter before the blower and fine filter afterwards respectively before the dry- jets

Blower: 2 units at 3 kW nominal power each

Air is heated by passage of filters Control of cell breakage Sensors detect outgoing cells By the difference between in- and outgoing cells the PLC calculates the number of broken cells

M7 Detection of outgoing Cells

In case the set up tolerance for the number of broken cells is exceeded the machine runs empty automatically

10. CELL SORTER

There are two main functions of cell sorter. They are:

Measurement Sorting

In the first module, the incoming cells to the cell sorter get measured through Halm Unit & here they classifies into various classes. In the second module, the classified cells get sorted into different cases according to the criteria classified by the Halm at the measuring part of machine. DESCRIPTION: The Cell Sorter is based on state-of-the-art measurement technology and automation and works highly efficiently on a small footprint of only 16.3 m. With ultimate precision and at ultrahigh-speed the Cell Sorter measures and sorts cells even as thin as 160 m. Each cell passes through two inspection stations in the measuring unit (sun simulation and inspection of the front side with Blue Eye). According to the results of these measurements, the cells are sorted into respective categories, whereby the parameters of classification can be freely determined. The system is available in two different versions, depending on the required throughput. The Cell Sorter 3000 achieves a throughput of 3,000 cells per hour and has 24 boxes. The Cell Sorter 5000 has 48 boxes and achieves a throughput of 5,000 cells per hour.

OPERATIONAL PROCESS:The operational process of the Cell Sorter/C Sort 5000 is as follows: (1)The upstream module transfers 5 cells to the feed belt. A positioning camera above the supply belt records the cells, checks them for breaks and selects them in 5 tracks. Tracks 1, 5 and half of 3 are handled by Flex Picker 1 (robot 1). Tracks 2, 4 and half of 3 are handled by Flex Picker 2 (robot 2). Damaged cells remain on the feed belt and pass to the rejects box.

SOLAR CELL