BGA Routing / Layout Guidelines

1 mm .8 mm .5 mm

South Bay Circuits

E.Rocha BGA0204 (480) 940-3125 x122 eddier@sbcinc.com

South Bay Circuits 1 mm BGA (External Layer)

.020 dia. mounting pad

.012 drilled hole Teardrop .022 dia. via pad .024 dia. Soldermask clearance pad

.039

.039

.005

South Bay Circuits .8 mm BGA (External layer)

.016 dia. mounting pad

.010 drilled hole Teardrop .018 dia. via pad .020 dia. Soldermask clearance pad

.005

.0315

.0315

South Bay Circuits .5mm BGA (External Layer)

.010 dia. mounting pad

.003

Via-in-pad .004 laser ablated hole Blind via to layer 2. Maximum depth of via .0035 The blind vias allow for larger and more manufacturable trace widths to be used on the internal layers beneath the BGA.

.014 dia. Soldermask clearance pad

.0196

.0196

South Bay Circuits 1 mm BGA (Internal Signal Layer)

.012 drilled hole .022 in. dia. Via pad

.006 Pad to trace .011 Edge of hole to trace

.005 Trace width

These values are gerber values and not values of the finished product. The finished product will yield .004 in. traces

South Bay Circuits .8 mm BGA (Internal Signal layer)

.010 drilled hole .018 in. dia. Via pad

.00425 Pad to trace .00825 Edge of hole to trace

.005 Trace width

These values are gerber values and not values of the finished product. The finished product will yield .004 in. traces

South Bay Circuits

1 mm BGA Internal plane layer

Plane connection, Thermal relief pads arent feasible .007

.032 dia. Internal relief pad

.012 drilled hole

.039

.039

.004

.0275 dia. Internal relief pad

.010 drilled hole

.8 mm BGA Internal plane layer

.0315

.0315

South Bay Circuits

BGA Via Soldermask Coverage Guidelines HASL Finish
Via plug, plugged from BGA mounting side

ENIG Finish

Soldermask covering via pad

.014

Bottom side of the via remains open. Via plugging is accomplished by screen printing SR1000 soldermask into the via. This should be done from only one side of a hole to prevent any plug from bursting during any subsequent thermal operation. The standard process should not be expected to fill the entire barrel of the hole. HASL Finish The via plug must be done from the BGA mounting side. A standard via plug will not completely fill the entire barrel of the via. The bottom side of the via (opposite side from the plugging side) will be covered with soldermask also but I will not be tented / plugged. ENIG Finish The via plugging process is performed after the soldermask is applied. The primary soldermask coat will leave the barrel of the via free of soldermask. This is important for the ENIG plating process. Only after the ENIG plating is completed shall the vias be plugged. Although the bottom side of the via is left open, there is sufficient soldermask up on the pad to act as a dam and prevent solder bridging.