G2100 Maintenance Manual Basic Version V1

G2100 Maintenance Manual Basic Version V1.
0
(Maintenance of the basic version)
Prepared by Reviewed by Approved by
Maintenance Documentation Support Team
Date Date Date
2010-07-21
Huawei Technologies Co., Ltd.
All rights reserved
G2100 Maintenance Manual Basic Version V1.0
Internal
Revision Record
Date
Revision Version
Revision Reason
Section Number
Change Description
Author Maintenance Documentation Support Team
2010-07-21
V1.0
2010-7-26
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Internal
Contents
1 PRODUCT INTRODUCTION ................................................................................................................................. 5 1.1 1.2 2 PRODUCT VIEW ................................................................................................................................................... 5 PRODUCT FEATURES ........................................................................................................................................... 6
MAINTENANCE INSTRUCTIONS........................................................................................................................ 7 2.1 2.2 2.3 DOCUMENT APPLICATION .................................................................................................................................. 7 MAINTENANCE PRECAUTIONS............................................................................................................................ 7 OBTAINING MAINTENANCE INFORMATION ........................................................................................................ 7
3 4 5
EXPLODED VIEW OF THE WHOLE UNIT ........................................................................................................ 8 LOCATION OF COMPONENTS ON THE MAIN BOARD............................................................................... 10 SOFTWARE UPGRADE ........................................................................................................................................ 11 5.1 5.2 5.3 5.4 PREPARATIONS BEFORE UPGRADE ................................................................................................................... 11 HARDWARE CONNECTION ................................................................................................................................. 11 UPGRADE PROCEDURE ..................................................................................................................................... 11 EXCEPTION HANDLING ..................................................................................................................................... 23
6 7 8 9
MAINTENANCE TOOLS ...................................................................................................................................... 24 DISASSEMBLY PROCEDURE ............................................................................................................................. 25 ASSEMBLY PROCEDURE.................................................................................................................................... 28 TROUBLESHOOTING FOR COMMON FAULTS............................................................................................. 31 9.1 9.2 PRINCIPLE SUMMARY ....................................................................................................................................... 31 PHONE CAN NOT BE POWERED ON .................................................................................................................... 32 Phone can not be powered on-High Current ........................................................................................ 32
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9.2.1
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9.2.2
9.3 9.4 9.5 9.6 9.7 9.8 9.9 9.10 9.11 9.12 10
Phone can not be powered on-Small Current ...................................................................................... 33
CHARGE FAILURE ............................................................................................................................................. 35 KEYPAD FAILURE .............................................................................................................................................. 36 DISPLAY FAILURE .............................................................................................................................................. 37 SPEAKER AND RECEIVER FAILURE ................................................................................................................... 38 VOICE TRANSMITTING FAILURE ....................................................................................................................... 40 VIBRATION FAILURE ......................................................................................................................................... 40 THE SIM CARD CANT BE IDENTIFIED ............................................................................................................ 41 FM FAILURE...................................................................................................................................................... 41 SIGNAL FAILURE ............................................................................................................................................... 43 RF TRANSMITTING FAILURE ............................................................................................................................ 45
FUNCTIONAL TEST.............................................................................................................................................. 46 10.1 10.2 10.3 INTRODUCTION TO THE KEY AND ICONS .......................................................................................................... 46 MMI TEST......................................................................................................................................................... 46 VOICE CALL TEST ............................................................................................................................................. 47
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1
1.1 Product View
Product Introduction
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1.2 Product Features

Item Technical standard Specifications GSM GSM 900/1800/1900M GSM 900M: 880915 MHz UL / 925960 MHz DL Operating frequency GSM 1900M: 18501910MHz UL / 19301990MHz DL GSM 1800M: 17101785MHz UL / 18051880MHz DL
External interfaces
USB interface: Micro USB/Headset interface SIM card interface: standard 6 PIN SIM card interface
Type: Li Battery Capacity : 3.7V700mAh Typical talk time: 240 minutes Typical standby time: 200hours LCD Function Feature Temperature Humidity Type: 1.47TFT Typical: 128160 65K Support : MP3/FM Operating: -10~+55 Storage: -40~+70 5%~ 95%
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2 Maintenance Instructions
2.1 Document Application
This document provides instructions for the maintenance of Huawei products for the maintenance personnel in senior authorized service sites. This manual is Huawei proprietary and is only permitted to be used by authorized service sites or companies. Mistakes may be found in the document. If you have found any mistake or have any suggestion, please contact our customer service personnel.
2.2 Maintenance Precautions

Maintenance and adjustment can only be conducted by qualified technical personnel. Always wear an antistatic wrist strap during the operation and conduct the maintenance in an antistatic room. Ensure that all the components, screws, and insulators are properly installed after maintenance or adjustment. Ensure that all the cables are properly connected. Ensure that the welder job shall comply with the environmental requirements and is lead-free.
Electrostatic discharges are the major cause for the damage of sensitive electronic components. Each service site should attach great importance to the electrostatic discharges and strictly observe the antistatic measures described in this manual.
2.3 Obtaining Maintenance Information

To obtain related product knowledge and maintenance information, please visit Huawei website at
http://www.huaweidevice.com/worldwide/technicaIndex.do
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3 Exploded View of the Whole Unit

BOM list match the exploded view below: 12 14 13 11 9 6 8 5 3 2 10 4
No. 1 2 3 2010-7-26
Name Description Lens Protection Film Lens Speaker Net
Quantity 1 1 1
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No. 4 5 6 7 8 9 10 11 12 13 14
Name Description Top Cover Sponge Top Cover LCD Sponge Keypad LCD PCBA Speaker Motor Bottom Cover Sponge Bottom Cover Battery Cover
Quantity 1 1 1 1 1 1 1 1 1 1 1
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4 Location of Components on the Main Board

J700 Headset Connector It damaged result: No powered on; No charged J500 IO Connector It damaged result: No powered on; No charged Q500 Transistor-PNP It damaged result: No powered on; No charged Z300 SAW Filter It damaged result: No signal; Weak signal; Cant register network J300 RF Connector It damaged result: No signal; Weak signal; Cant register network U302 RF Multi, Functional Component It damaged result: No signal; Weak signal; Cant register network J501 Power Receptacle It damaged result: No powered on No charged Q501 Dual TransistorNPN It damaged result: No powered on; No charged X400 Crystal-32.768KHz It damaged result: No signal; No powered on U401 CPU It damaged result: No signal; No powered on; Other failures etc U501 FLASH It damaged result: No signal; No powered on; Other failures etc J600 SIM Socket It damaged result: Cant identify SIM card
X300 TCXO-26MHz It damaged result: No powered on; No signal
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5 Software Upgrade
5.1 Preparations before Upgrade
Item Contents PC Upgrade environment Battery G2100 USB Data Cable Upgrade File HUAWEI G2100 V100R001ENGC01B117SEC.fls Mobile Studio-R GH0G2200ML01ULC2MLVer1004 USB drive Upgrade mode PL2303_Prolific_DriverInstaller_10311.exe Upgrade by USB date cable Install automatically Normal The version is only for your reference. Download or use the latest version. BOM: 02450712 Remark Windows 2000 /Windows XP system
Upgrade Software Tool
5.2 Hardware connection
PC
USB Cable
G2100
5.3 Upgrade Procedure

5.3.1 Install USB Driver The G2100 will automatically install USB driver as it is connected to PC. As following figure:
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NOTE: If it cant install automatically, please install USB driver by manually.
303_Prolific_DriverInstaller_10311.exe.
5.3.2 Install Upgrade Software Tools 1 Double click to install Mobile Studio-R
MobileStudio-R.lnk
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2 Select I accept, show as below figure:
3 Input the information, click Next ,show as below figure:
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4 Click Install, show as below figure:
5
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Start installation, show as below figure:

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5.3.3 Install Upgrade Project File 1 Double click icon
GHULC2MLVer1004.exe.lnk
Click Install
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Installation finish
5.3.4
Upgrade Double click Mobile Studio-R, select project.
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Select product type ULC3
Select Others OWM, click Init.
Click Download Type and Files Settings, select download type Batch Upgrade.
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Select upgrade files of safety project version, click Apply
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Connect the phone to the PC by USB cable, click Start Download. Insert the battery according to prompt
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Start to download file
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Upgrade finish
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Remark: The upgrade software supports multi-upgrade.
5.4 Exception Handling

Failure Type Start download failure The phone cannot be connected Open the upgrade file failure Download is intermitted abnormity An error is prompted during the download Ensure that whether the pull out the USB cable when downloading. Solution Ensure Inserting battery time less than 2 minutes, and suggest inserting the SIM card to try. Ensure that the phone is power on and the power of battery enough. Ensure that the USB cable is normal and connect is stably. Ensure that select the upgrade file is correctly. Ensure that the power of battery is enough.
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6 Maintenance Tools
Tool Figure Description Name: constant-temperature gun Application: It is used to heat the components.
Name: Solder the iron Application: It is used for Solder the during maintenance.
Name: DC power Application: It is used to supply power.
Name: Solder the fixture Application: It is used to fix the main board.
Name: lead-free Solder the wire Application: It is used for Solder.
Name: digital multimeter Application: It is used for measuring during maintenance.
Name: Tool kit Application: It is used to assembly and disassembly the PHONE.
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7 Disassembly Procedure
1The G2100 disassemble procedure.
2Make sure the ESD antistatic wrist strap connect to the ground is normal.
3Remove the battery cover by the arrow direction.
4Remove the battery.
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5Screw off three screws.
6. Disassemble the front cover from the back cover.
7. Remove the front cover.
8. Screw off two screws.
9. Turn up and remove the mainboard.
10. Remove the LCD.
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11. Remove the speaker.
12. Remove the motor.
13. Remove the function keys.
14. Remove the antenna.
15. The disassembly procedure is completed.
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8 Assembly Procedure
1Make sure the ESD antistatic wrist strap connect to the ground is normal.
2Install the antenna.
3Install the keypad.
4Install the motor.
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5Install the speaker.
6. Plug the LCD.
7. Install the mainboard to the back cover.
8. Install the two screws.
9. Install the front cover.
10. Assemble the front cover.
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11. Install the six screws.
12. Install the battery.
13. Install the battery cover.
14. Assembly procedure is completed.
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9 Troubleshooting for Common Faults

Before performing the following troubleshooting operations on the hardware, ensure that the software on the PHONE is in good condition and is restored to default settings.
9.1 Principle Summary

The G2100 phone develops basing on INFINEON ULC3, integrates BasebandRF modulePower Management(PM) system. It mostly consists of basebandRF and PM. The part of baseband is divided into RF signal disposal and intelligent interface, the part of RF achieves among phone and base station communications, the power management supports whole power supply for phone. The baseband includes power management clock MCU processor FLASH electroacoustic components vibrationSIM card LCDkeypadFM etc. The PM module controls power input and output. The RF module is divided into receiving channel and transmitting channel, it includes LOreceivertransmitterantenna components etc.
Principle Diagram
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Internal
9.2 Phone can not be powered on 9.2.1 Phone can not be powered on-High Current
AnalysisThe current is above 1A as power supply by DC-power. Short circuit of the VBAT line
causes high current usually. (Reference Figure 1)
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Internal
VBAT3.05V-5.5V VDDTRX=1.4V VRF1=1.8V VRF2=2.5V VDD1V8=1.8V VDDTDC=1.3V VDDXO=1.3V VRCORE=1.2V

J500 Pin1 (VCHG)
VDD1V8/VRF1 Test Point L401 VRCORE Test Point C409 U401 CPU
Q500 U302 U302-VBAT Test Point C324 U501 FLASH VDDTRX Test Point C301
VRF2 Test Point C302 J501 Pin3 (VBAT) VDDTDC/VDDXO Test Point C303
Figure 1
9.2.2
Phone can not be powered on-Small Current
AnalysisThe current is among 10mA-400mA scope as power supply by DC-power. The software or
FLASH damaged cause the failure usually. (Reference Figure 1)
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9.3 Charge Failure

Analysis: The IO Connector damaged causes the failure usually. (Reference Figure 2)
Charge Fault
Insert charger
Measure J500 Pin1 whether voltage is 5V?
No
Replace J500
Yes
Measure R500 whether resistance is 0?
No
Replace R500
Yes
Measure Q500 Pin1 and Pin4 whether voltage is different?
No
Replace Q500 or Q501
Yes
Replace U401
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Internal
VBAT3.05V-5.5V VCHG5.0V
Q501
J500 Pin1 (VCHG)
Q500 Pin1 Q500 Pin4
U401 CPU
R500 R=0
J501 Pin3 (VBAT)
Figure 2
9.4 Keypad Failure

Analysis: The DOME of keypad damaged causes the failure usually.
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9.5 Display Failure

Analysis: The LCD module damaged causes the failure usually.
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9.6 Speaker and Receiver Failure

Analysis: Above all, should restore all setting. (Reference Figure 3)
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LB706 R0 LB705 R0 L706 R0 L705 R0
C706 C707 J600 SIM card socket
R607 R4.6K
L703 L709 L707 L708
Figure 3
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9.7
Voice transmitting Failure

(Reference Figure 3)
9.8 Vibration Failure
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9.9 The SIM Card cant Be Identified

9.10
FM Failure
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J700 Pin1 J700 Pin2
J700 Headset socket
Q700 FM-LNA
Figure 4
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9.11
Signal Failure
Analysis Above all, check RF parameter whether is correct, the wrong RF parameter can cause
the failure usually. (Reference Figure 5)
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VBAT3.05V-5.5V VRF1=1.8V VRF2=2.5V
VDD1V8/VRF1 Test Point L401
Z300 RX SAW Filter U302 Multi-function IC J300 U302-VBAT Test Point C324
U401 CPU X300 TCXO
VRF2 Test Point C302
Figure 5
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9.12
RF Transmitting Failure
AnalysisAbove all, check RF parameter whether is correct. The U302 cause the failure usually. (Reference Figure 5)
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10 Functional Test
10.1 Introduction to the Key and icons
Up Key Left Soft Key Left Key Right Soft Key Right Key End Key
Send Key
OK Key
Down Key
10.2
MMI Test
Insert the SIM card. Enter MMI test command *2846570+Down to access the MMI keypad binding combination test mode. No. Item Proced ure Contents Method and phenomenon (Take the new device as a standard. Press the Send key to enter the next procedure.) Enter the test command to access the SIM card test. If the SIM card is identified, the "SIM card test succeeded" is displayed. Otherwise, the "SIM card test failed" is displayed. Press the Send key and the LCD displays the white screen, and LCD Test display in middle.
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1 SIM Test 2 Card 1
Whether the SIM card is identified White screen
LCD Test
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No.
Item
Proced ure
Contents
Method and phenomenon (Take the new device as a standard. Press the Send key to enter the next procedure.) Press the Send key and the LCD displays the dark screen. Press the Send key and the LCD displays the color panel grids. Press the Send key and the LCD displays the black and white dots. Press the Send key and the LCD displays a black block overlapped with a white block. (Note: There is a white block amid the black block.) Press the Send key and the LCD displays a white block overlapped with a black block. (Note: There is a black block amid the white block.) Press the Send key. Then all the keypad LEDs are on and the motor vibrates. Press the Send key to display the keypad diagram. When you press any key except Send and End the keypad, a blue square grid appears on the key in the diagram. Press the Send key LCD displays Sound. then the speaker makes sound. When you use the headset,sound can be heard through the headset. Press the Send key and speak to the microphone, then you can hear your sound from the receiver; When you use the headset, your voice can be heard through the headset. Insert the headset first, Press the Send key to test FM function.
3 4 5
Black screen multicolor stripe Dot
Black and white blocks Black and white blocks LED and motor Keypad
7 3 4 Key test 5 Sound Test 10 LED and motor test
11
Speaker MIC and headset
6 Call test 7 12
FM test
13
FM
Press the Send key display MMI Test Result, all the test Item and test result displays. If test pass, will display succeed after test Item, otherwise display failed after test Item. Completed MMI test, press End key to exit MMI Test Mode.
10.3
Voice Call Test
Insert a normally used SIM card and the battery into the phone to be tested. Press and hold the End key to power on the phone. Check whether the signal strength is changed normally in normal network environment. Dial the number of a fixed-line phone to test the voice quality during a call. If the preceding tests are normal, end the voice call test. Otherwise, perform the test again or send the phone to advanced maintenance center for repair.
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G2100 Maintenance Manual Basic Version V1.

Prepared by Reviewed by Approved by

Maintenance Documentation Support Team

Date Date Date

Huawei Technologies Co., Ltd.

All rights reserved

G2100 Maintenance Manual Basic Version V1.0

Author Maintenance Documentation Support Team

Huawei confidential. No spreading without permission.

G2100 Maintenance Manual Basic Version V1.0

G2100 Maintenance Manual Basic Version V1.0

Phone can not be powered on-Small Current ...................................................................................... 33

Huawei confidential. No spreading without permission.

G2100 Maintenance Manual Basic Version V1.0

Huawei confidential. No spreading without permission.

G2100 Maintenance Manual Basic Version V1.0

1.2 Product Features

Huawei confidential. No spreading without permission.

G2100 Maintenance Manual Basic Version V1.0

2.2 Maintenance Precautions

2.3 Obtaining Maintenance Information

Huawei confidential. No spreading without permission.

G2100 Maintenance Manual Basic Version V1.0

3 Exploded View of the Whole Unit

Name Description Lens Protection Film Lens Speaker Net

Huawei confidential. No spreading without permission.

G2100 Maintenance Manual Basic Version V1.0

Huawei confidential. No spreading without permission.

G2100 Maintenance Manual Basic Version V1.0

4 Location of Components on the Main Board

X300 TCXO-26MHz It damaged result: No powered on; No signal

Huawei confidential. No spreading without permission.

G2100 Maintenance Manual Basic Version V1.0

Upgrade Software Tool

5.2 Hardware connection

5.3 Upgrade Procedure

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G2100 Maintenance Manual Basic Version V1.0

NOTE: If it cant install automatically, please install USB driver by manually.

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G2100 Maintenance Manual Basic Version V1.0

2 Select I accept, show as below figure:

3 Input the information, click Next ,show as below figure:

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G2100 Maintenance Manual Basic Version V1.0

4 Click Install, show as below figure:

Start installation, show as below figure:

G2100 Maintenance Manual Basic Version V1.0

5.3.3 Install Upgrade Project File 1 Double click icon

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G2100 Maintenance Manual Basic Version V1.0

Upgrade Double click Mobile Studio-R, select project.

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G2100 Maintenance Manual Basic Version V1.0

Select product type ULC3

Select Others OWM, click Init.

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G2100 Maintenance Manual Basic Version V1.0

Select upgrade files of safety project version, click Apply

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G2100 Maintenance Manual Basic Version V1.0

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G2100 Maintenance Manual Basic Version V1.0

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