Industry Sector

RTD Thematic Area Multi Physics and Analysis

Date 27th February 2002

Deliverable Nr

Challenges of Multi-Physics Coupling in a Commercial FE Code David Ellis Idac Ltd, London, United Kingdom

Summary This presentation will illustrate the capabilities of the ANSYS program for solving Multiphysics Coupled Field solutions and describe the challenges faced in solving these problems as well as offering some advice in tackling these challenging physics simulations.

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Introduction Idac We are a London based Engineering Analysis Consultancy company performing the following activities: Consultancy Analysis Customisation & Implementation Software Sales ANSYS DesignSpace LS-DYNA DynaForm PowerFLOW Training Courses Technical Support

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What Type of Coupling Can be Solved? The Physics involved are the following: Structural Thermal Acoustics Electrostatics Electro-magnetics Computational Fluid Dynamics (CFD)

The physics above can be coupled together and solved in one of two ways: Sequential Analysis Direct Coupled Analysis

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History of Multi-Physics within the ANSYS program

Early 1970s - Thermal and stress analysis linked via temperatures. Simple load vector coupling of thermal strain. First commercial code to introduce thermal-stress analysis. Geared toward power industry (GE, Westinghouse, etc.) Late 1970s - Add thermal-electric capability to compute Joule heating effects coupled through load vector from current solution to compute I**2R heating. Applications: Bus bars, switchgear, etc. Mid 1980's - Introduced first general-purpose coupled-field elements SOLID5, SOLID98, PLANE13. Multiple DOF options. Load vector coupling: Allowed for thermal-electric, magneto-structural, electro-magnetic coupling. Also, first fully-coupled formulation (matrix coupling) for Piezoelectric analysis. Late 1980's, early 1990's - Addition of matrix coupling for acoustic-structural analysis. Time-transient current conduction-electromagnetic coupling (for eddy current/skin-effect analysis). This was also coupled to thermal and structural analysis. Late 1990s through 2002 - Introduced Physics file concept for general coupling of field solutions using the same mesh. Introduced electrostatic-structural coupling for MEMS devices, both load-vector coupled and matrix coupled. Introduced induction heating. Now releasing fully coupled transient FSI.

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History of Multi-Physics within the ANSYS program Some examples of coupled solutions through from the first ones that were implemented through to the coupling that we can perform today: Early: Static thermal-stress analysis Today: Dynamic fluid-structure interaction with dissimilar mesh interfaces between fluid and solid. Coupled-field dynamic FSI simulation: Ink-jet printer simulation with electrostatic-actuated MEMS device ejecting a fluid droplet simulated using an ALE/VOF method CFD formulation.

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Challenges Faced in Introducing Coupled Solutions in the ANSYS Program Convergence - Some physics do not lend themselves to loose coupling (eddy currents, piezoelectrics) Time-accurate transient solutions - Most early coupling was static or time-harmonic, current needs are dynamic. This required time-transient solutions with "staggers" between physics and equilibrium iterations to converge each physics at each time point. Compatible time-stepping algorithms for each physics is an issue. Convergence of non-linearities is an issue. Efficient equation solvers for coupled problems - Resulting matrices of coupled systems can be ill-conditioned, dense, etc., leading to inefficiencies in standard iterative solvers, and direct solvers. Finite-element methods with structural coupling to a field solution (magnetics, electrostatics, fluids) involving mesh "morphing". This has limitations and robustness issues.

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Thermo-Structural Coupling Sequential Analysis Power Station Expansion Joint Analysis

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Thermo-Structural Coupling Sequential Analysis Sequential Analysis: The sequential method involves two or more sequential analyses, each belonging to a different field. You couple the two fields by applying results from the first analysis as loads for the second analysis. An example of this is a sequential thermal-stress analysis where nodal temperatures from the thermal analysis are applied as "body force" loads in the subsequent stress analysis.

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Thermo-Structural Coupling Sequential Analysis

Sequential Analysis: Data Flow for a Sequential Coupled-Field Analysis

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Thermo-Structural Coupling Sequential Analysis

Sequential Analysis: Data Flow for a Sequentially Coupled Analysis (Using Physics Environments)

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Thermo-Structural Coupling Sequential Analysis Thermal Analysis Solid Elements, Temp DOF, (1 DOF per node) Shell Elements, Temp DOF, (1 DOF per node)

Structural Analysis Solid Elements, UX, UY, UZ DOFs, (3 DOFs per node) Shell Elements, UX, UY, UZ, ROTX, ROTY, ROTZ, (6 DOFs per node)

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Thermo-Structural Coupling Direct Coupling Analysis

Bi-metallic Strip Thermo-structural Analysis

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Thermo-Structural Coupling Direct Coupling Analysis Thermo-Structural Analysis Solid Elements, Temp , UX, UY, UZ DOF, (4 DOFs per node) Shell Elements, Temp , UX, UY, UZ, ROTX, ROTY, ROTZ DOF (7 DOFs per node)

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Thermo-Structural Coupling Direct Coupling Analysis Direct Coupled Analysis: The direct method usually involves just one analysis that uses a coupled-field element type containing all necessary degrees of freedom. Coupling is handled by calculating element matrices or element load vectors that contain all necessary terms.

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Coupling Methods Used in Direct Coupled-Field Analyses Type of Analysis

Thermal-structural Magneto-structural Electro-magnetic Electro-magnetic-thermal-structural Electro-magnetic-thermal Piezoelectric Thermal-pressure Velocity-thermal-pressure Pressure-structural (acoustic) Thermal-electric Magnetic-thermal Electrostatic-structural Electromagnetic-circuit Electro-structural-circuit
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Coupling Method
Load vector (and matrix, if contact elements are used) Load vector Matrix Load vector Load vector Matrix Matrix and load vector Matrix Matrix Load vector Load vector Load vector Matrix Matrix

Direct Coupling The finite element formulation which treats a single phenomenon uses matrix algebra represented by:

[K]{X} = {F}
where [ K ] is the coefficient matrix { X } is the vector of nodal unknowns { F } is the known load vector

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Direct Matrix Coupling

[K11] [K12] [K21] [K22]

]{ } { }
[X1] [X2] = [F1] [F2]

Coupled effects are accounted for by off-diagonal coefficient terms K12 and K21 Provides for coupled response in solution after one iteration.

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Matrix Coupling Examples Category Electromagnetics Piezoelectrics Thermal-pressure Pressure-structural Circuit-magnetic Fluid-structural Applications Induction motors Microphones, sensors Piping networks Acoustics Motors with circuitry High speed machinery

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Direct Load Vector Coupling

[K11] [ 0 ] [ 0 ] [K22]

]{ } { }
[X1] [X2] = [F1] [F2]

Coupled effects are accounted for by load terms F1 and F2 At least two iterations, one for each physics, in sequence are needed to achieve a coupled response.

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Direct Load Vector Coupling Examples Category Thermal-structural Fluid-structural (FSI) Fluid-electromagnetic Electromagnetic-structural Electromagnetic-thermal Thermal-electric-CFD Applications High-temp gas turbines Airplane wings, heart valves Induction stirring Solenoids Induction heating High-temp electronics

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Thermo-Structural Coupling Direct Coupling Analysis Thermo-Structural Analysis Solid Elements, Temp, UX, UY, UZ DOF, (4 DOFS per node) Shell Elements, Temp, UX, UY, UZ, ROTX, ROTY, ROTZ (7 DOFs per node)

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Electrostatic-Thermo-Structural Coupling Sequential Analysis MEMS Thermo-Electric Actuator

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Electrostatic-Thermo-Structural Coupling Sequential Analysis Electrostatic Analysis Solid Elements, Volt, Curr (2 DOFS per node) Thermal Analysis Solid Elements, Temp (1 DOF per node) Structural Analysis Solid Elements, UX, UY, UZ (3 DOFS per node)

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Electromagnetic-Structural Coupling Rotational Solenoid Analysis

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Electromagnetic-Structural Coupling Electromagnetic-Structural Analysis 3D Solid Elements, AX, AY, AZ, UX, UY, UZ (6 DOFS per node) 2D Solid Elements, AZ, UX, UY (3 DOFS per node)

Use of Electric Circuit Elements to Drive the Device 3D Solid Elements, Volt, Curr, emf, AX, AY, AZ, UX, UY, UZ (9 DOFS per node) 2D Solid Elements, Volt, Curr, emf, AZ, UX, UY (6 DOFS per node)

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Fluid-Thermo-Structural Coupling Automotive Radiator Analysis

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Fluid-Thermo-Structural Coupling Fluid-Thermo-Structural Analysis Solid Elements, VX, VY, VZ, Pres, Temp, UX, UY, UZ (8 DOFs per node) Shell Elements, VX, VY, VZ, Pres, Temp, UX, UY, UZ, ROTX, ROTY, ROTZ (11 DOFs per node)

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Why Perform Coupled Analysis Solutions?

A coupled-field analysis is an analysis that takes into account the interaction (coupling) between two or more disciplines (fields) of engineering. A piezoelectric analysis, for example, handles the interaction between the structural and electric fields: it solves for the voltage distribution due to applied displacements, or vice versa. Other examples of coupled-field analysis are thermal-stress analysis, thermal-electric analysis, and fluid-structure analysis. Some of the applications in which coupled-field analysis may be required are pressure vessels (thermal-stress analysis), fluid flow constrictions (fluid-structure analysis), induction heating (magnetic-thermal analysis), ultrasonic transducers (piezoelectric analysis), magnetic forming (magneto-structural analysis), and micro-electro mechanical systems (MEMS). By definition coupled solutions are problems where these physics interact with each other and are dependent upon each other.
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Multiphysics Interaction

Structural

Thermal

CFD

Electromagnetics
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Acoustics

Electronic Packaging Electronics package cooling using CFD analysis Two-dimensional simulation Heat sources from boards Fan cooled Need to predict Velocity pattern Temperature profile

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Electronics System Cooling

Cooling simulation of a television set. Conjugate heat-transfer simulation using FLOTRAN

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Electronic Package Cooling

Simultaneous solution of air flow and package temperature Applicable to free-convection and forced convection problems

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Electronic Package Cooling

Air temperature profile

Chip Surface Temperature

Experimental: 78 deg C. FLOTRAN: 77 deg C.

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Acoustics
Acoustics Capabilities Two and three dimensional analysis Modal, Harmonic, and Transient simulation to determine pressures, particle velocity, and decibel level Fluid-structure interaction Impedance boundary condition Displacement, force, pressure loads Absorbing boundary condition

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Speaker System
Acoustic simulation of a speaker system Flexible tweeter dome Axisymmetric model Voice coil driven by applied force Frequency domain solution

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Tweeter pressure and deflection

Pressure distribution and tweeter deflection @ 11.8 KHz.

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Tweeter sound pressure level

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Induction Stirring
Simulation of Induction stirring Induction furnace modeled at 2500 F Molten steel stirred by electromagnetic forces from coils Forces coupled to CFD analysis to determine flow pattern

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Induction Stirring
Electromagnetic solution: AC (Harmonic) electromagnetic field simulation performed to predict magnetic field in conducting bath. (Flux lines shown) Lorentz forces induced in bath are automatically calculated for use in CFD run.

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Induction Stirring
Lorentz forces in bath Electromagnetic forces provide driving force for fluid motion

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Fluid motion computed from Lorentz Force Load

Computation fluid dynamics simulation performed to determine stirring pattern Turbulent flow reveals two eddy regions (Velocity profile shown)

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What Does the Future Hold? New element architecture for fully-coupled multiphysics simulation Uses "core" single physics elements "Builds" a coupled-field element from "core" elements based on user specification Enhance material constitutive relations to handle advanced multiphysics phenomena. New Product - AI*EMAX for the Solution of High Frequency Phenomena (Antennas, Stealth Technology, EMC). It is also possible to couple AI*EMAX to ANYS/Multiphysics to do RF heating!

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Recommendations
Build up to the full solution slowly, may be start with 2D solution Start with the physics that is driving the problem Add subsequent physics one at a time Try sequential solutions first of all Then run analysis as a directly coupled solution In ANSYS use Run Time Statistics prior to solution gives memory & file size estimates Memory is crucial rather than disc space as there are physical limits on various hardware platforms (64Mb = 50k DOFs) Be careful in defining the FE mesh for coupled solutions The mesh for the solution of one physics problem is not necessarily a good mesh for other physics ANSYS can perform mesh morphing and result mapping automatically

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THE END!!!
Thank you for listening

Any Questions!!
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