Professional Documents
Culture Documents
2008
Agenda
Keith Horn
Fujitsu Microelectronics America, Inc.
Our Ubiquity Vision –
Communication on-the-go
Note: Consolidated net sales, net income and R&D expenditure for fiscal year end March 31, 2008. US$1 = ¥100. WW employees as of March 31, 2008.
Consolidated net sales by business segment include Inter-segment sales.
October 1, 2008 5 © Fujitsu Microelectronics America, Inc. 2008
Fujitsu Microelectronics Limited at a Glance
Carriers Systems/Equipment
WiMAX Forum
Makers
Semiconductor
+ More Vendors
+ More
+ More
October 1, 2008 7 © Fujitsu Microelectronics America, Inc. 2008
WiMAX SoC Solution –
Key Ecosystem Driving Factor
System Makers
Base Stations
Subscriber Stations Co Subscriber Stations
ent
m st
age O
g pt
En im
M iz
OE at
io
OEM n ODM
(Original Equipment (Original Design
Manufacturers) Fujitsu & Component Manufacturers)
Vendors
Subscriber Stations
Cost Optimization
October 1, 2008 8 © Fujitsu Microelectronics America, Inc. 2008
Fujitsu – A Total System-on-Chip (SoC)
Solution Provider
WiMAX
CPE
pBS
WiMAX
uBS Phone
PDA
fBS
USB Dongle
mBS
PC Card
pBS
Roger Dorf
CISCO Systems
Fujitsu WiMAX Business Update
George Wu
Fujitsu Microelectronics America, Inc.
WiMAX SoC Roadmap
Highly scalable
From femto to pico to micro
BS solutions
Outdoor Pico Indoor Pico Femto Market-competitive BOM for
femto base station
Support for enhanced
features
Self-organizing network
(SON)
IPSec
Location ID
90nm
65nm
Demo
FPGA
Board
System
USB 45nm
Dongl New demand Volume business
Market entry
e
creation acceleration 32nm
Limited MIMO Embedded Cellular Multi-mode RF+SDR
Function Full Mobility Use Convergent SDR Combined
FPGA
16e 16e 16e 16e 16e 16e 16e
#0 #1 #2A #3 #4 #5 #6
16e Multi
Band
#2C
RF RF RF RF RF
TEG #1 #2 #3 #4
2.5GHz 2.3/2.5/3.5GHz Multi-Band Multi-Band
5/10MHz 3.5/5/7/10/20MHz Low-Cost
Other Band?
MIMO-based PA PA
#1 #2
Single-Band Multi-Band
Low cost and fully compliant with the IEEE 802.16e-2005 Mobile WiMAX standard
Small form-factor handset module (15mm x 15mm x 1.5mm)
RF, BB, PMM, PA, Flash, SDRAM and all passive components included
Built-in LMAC/UMAC firmware
Target profile: 2A/B/C (2.3GHz, 3.5/5/10MHz)
3A (2.5GHz, 5/10/20MHz)
5AL/BL/CL (3.5/5/7/10/20MHz)
Baseband support for <1GHz RF
Host interface: SPI, SDIO
Target throughput: DL 20Mbps, UL 4Mbps
Module size
15mm x 15mm = 225mm^2
RF Contents
BB SoC+SDRAM
BB (SIP) RF: Tri band (2.3/2.5/3.5GHz)
PMM
PA, switch and memories
PA
PA
PMM
PMM sub
RF
board
BB(SIP)
BB sub
RF sub
PA board
board
PA
Dean Chang
Fujitsu Microelectronics America, Inc.
Announcing
Fujitsu
Fujitsu Fujitsu Fujitsu Labs
RAN and Core
SoC Femto Solution (SoN Solution)
Network
Solution*
Semiconductor
Design and
Manufacturing Systems
Developer Network Solutions
Research
Active in WiMAX Forum SPWG Network
femto activities as well as IEEE 802.16 standards Integrator
* Other network integrators could be also considered
October 1, 2008 32 © Fujitsu Microelectronics America, Inc. 2008
Fujitsu Sales Strategy
System Mfg
Micro Femto
Chipset
Reference Kit Pico Femto
Service
Fujitsu End User
Provider
Partnership Service