1.

Define a. Integrated circuits Another name for a chip, an integrated circuit (IC) is a small electronic devicemade out of a semiconductor material. The first integrated circuit was developed in the 1950s by Jack Kilby of Texas Instruments and Robert Noyce of Fairchild Semiconductor. Integrated circuits are used for a variety of devices, includingmicroprocessors, audio and video equipment, and automobiles. Integrated circuits are often classified by the number of transistors and other electronic components they contain. b. Wafer In electronics, a wafer is a thin slice of semiconductor material, such as a silicon crystal, used in the fabrication of integrated circuits and other microdevices. The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many microfabricationprocess steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning. Finally the individual microcircuits are separated (dicing) and packaged. Before structure fabrication details, a wafer is called a "slice" c. Chips

A small piece of semiconducting material (usually silicon) on which anintegrated circuit is embedded. A typical chip is less than ??-square inches and can contain millions of electronic components (transistors). Computersconsist of many chips placed on electronic boards called printed circuit boards. There are different types of chips. For example, CPU chips (also calledmicroprocessors) contain an entire processing unit, whereas memory chips contain blank memory.

Draw a diagram to show the relationship between the wafer and chips.

The process diagram shows the production of a UX:3 chip on a silicon wafer

2.

Describe the type of hybrid integrated circuit. A hybrid integrated circuit, HIC, hybrid microcircuit, or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices (e.g. transistors and diodes) and passive components (e.g. resistors, inductors, transformers, and capacitors), bonded to a substrate or printed circuit board (PCB)

3.

Explain how to get wafer from ingot. Ingot is ground to a rough size diameter (a little larger than a finished wafer) and it is either notched or flatted along it's length to indicate the orientation of the Ingot. This is also a point when many inspections are made on the ingot to catch any major flaws or problems with resistivity etc. The 200mm and 150mm ingots at the LEFT are freshly pulled and have not yet been ground, notched or flatted.

The Ingots are sliced into wafers using a diamond ID saw or other type of saw. Deionized water is used to cool the blade on this ID (inside diameter) saw. The saw at the RIGHT is slicing 150mm wafers and if you look closely you can see the major flat of the wafer on the left.

4.

Draw a cross-section diagram of the n-well CMOS transistor.

The n-well forms the base of the pnp transistor and the p+ attached to VCC is the emitter. Current injected into the pnp emitter-base junction starts latchup.