: 406 456 6F No.456-6, Dunhua RD., Beitun District,Taichung, Taiwan, R.O.C WEB: http://www.Raystar-Optronics.com E-mail: sales@raystar-optronics.

com Tel:886-4-22911297 Fax886-4-22911296

RG12864B-BIW-V

SPECIFICATION CUSTOMER :

APPROVED BY:
( FOR CUSTOMER USE ONLY )

PCB VERSION:

DATA:

SALES BY

APPROVED BY

CHECKED BY

PREPARED BY

ISSUED DATE:
Page 1 , Total 23 Pages

RG12864B-BIW-V

Contents
1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. Specification Revision History General Specification Module Classification Information Interface Pin Function Outline dimension & Block Diagram Display Control Instruction Detailed Explanation Timing Characteristics Optical Characteristics Absolute Maximum Ratings Electrical Characteristics Backlight Information Reliability Inspection specification Precautions in use of LCD Modules Material List of Components for RoHs Page 3 Page 4 Page 5 Page 6 Page 7 Page 8 Page 9 Page 11 Page 12 Page 13 Page 13 Page 14 Page 15 Page 16 Page 20 Page 21

Page 2 , Total 23 Pages

1. Specification Revision History

RECORDS OF REVISION
VERSION 1 DATE 2008.1.23 REVISED PAGE NO. Note First issue

Page 3 , Total 23 Pages

2. General Specification
The Features of the Module is description as follow: Module dimension: 75.0 x 52.7 x 8.9 (max.) mm3 View area: 60.0 x 32.6 mm2 Active area: 55.0 x 27.48 mm2 Number of Dots: 128 x 64 Dot size: 0.39 x 0.39 mm2 Dot pitch: 0.43 x 0.43 mm2 LCD type: STN Negative, Transmissive , blue Duty: 1/64 View direction: 6 oclock Backlight Type: LED, White

Page 4 , Total 23 Pages

3. Module Classification Information

RG
Item 1 2 3 4

12864

BB I W V
Description

BrandRaystar Optronics Inc. CCharacter Type, Display Type GGraphic Type Display Font128 x64 Dots Serials Code. PTN Positive, Gray NTN Negative, GSTN Positive, Gray YSTN Positive, Yellow Green BSTN Negative, Blue FFSTN Positive TFSTN Negative AReflective, N.T, 6:00 KTransflective, W.T,12:00 DReflective, N.T, 12:00 1Transflective, U.T,6:00 GReflective, W. T, 6:00 4Transflective, U.T.12:00 JReflective, W. T, 12:00 0Reflective, U. T, 6:00 3Reflective, U. T, 12:00 BTransflective, N.T,6:00 ETransflective, N.T.12:00 HTransflective, W.T,6:00 NWithout backlight PEL, Blue green TEL, Green DEL, White CTransmissive, N.T,6:00 FTransmissive, N.T,12:00 ITransmissive, W. T, 6:00 LTransmissive, W.T,12:00 2Transmissive, U. T, 6:00 5Transmissive, U.T,12:00 YLED, Yellow Green ALED, Amber WLED, White OLED, Orange

LCD Mode

LCD Polarizer Type/ Temperature range/ View direction

Backlight Type

FCCFL, White GLED, Green Special Code V: Build in Negative voltage output

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4. Interface Pin Function

Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Symbol VDD VSS Vo DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 CS1 CS2 RST R/W D/I E Vee A K Level 5.0V 0V H/L H/L H/L H/L H/L H/L H/L H/L L L L H/L H/L H Power supply (+5V) Power supply (GND) Data bus line Data bus line Data bus line Data bus line Data bus line Data bus line Data bus line Data bus line Select Column 1~ Column 64 Select Column 65~ Column 128 Reset signal H: Read (MPUModule) , L: Write (MPUModule) H: Data , L : Instruction Description

(Variable) Contrast Adjustment

Enable signal Negative Voltage output Power Supply for LED (+) Power Supply for LED (- )

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5. Outline Dimension &Block Diagram

2.5 2.2
0.5 2.9 9.05 11.59

7.5 10.0

75.0 0.5 70.0 70.6 60.0(VA) 55.0(AA)

1.5 2-R1.25 PTH 2-R2.0 PAD

20.12

8.9Max 5.4

52.7 0.5 49.7 44.6 32.6(VA) 27.48(AA)

128*64 Dots
K

20

13.37 37.5

P2.54*19=48.26 LED B/L

2.5

20- 1.0PTH 20- 1.8PAD

2- 2.5 PTH 2- 4.0 PAD

1.0

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

Vdd Vss Vo DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 CS1 CS2 RST R/W D/I E Vee A K

0.43 0.39

10.16

25.35

The non-specified tolerance of dimension is

0.43 0.39

0.3mm.

DOT SIZE

128X64 DOT

Seg1~64

Seg65~128

Bias and Power Circuit

Seg Driver

Seg Driver

FR,M,CL,CLK1,CLK2

Com Driver

Com1~64

MPU
80 series or 68 series

CS1 CS2 RST

N.V. Generator

E D/I R/W DB0~DB7

Vdd Vo

VR 10K~20K

VEE

External contrast adjustment.

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6. Display Control Instruction

The display control instructions control the internal state of the NT7108. Instruction is received from MPU to NT7108 for the display control. The following table shows various instructions.

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7. Detailed Explanation

The display data appears when D is 1 and disappears when D is 0. Though the data is not on the screen with D=0, it remains in the display data RAM. Therefore, you can make it appear by changing D=0 into D=1. SET ADDRESS (Y ADDRESS)

Y address (AC0-AC5) of the display data RAM is set in the Y address counter. An address is set by instruction and increased by 1 automatically by read or write operations of display data. SET PAGE (X ADDRESS)

X address (AC0-AC2) of the display data RAM is set in the X address register. Writing or reading to or from MPU is executed in this specified page until the next page is set. DISPLAY START LINE (Z ADDRESS)

Z address (AC0-AC5) of the display data RAM is set in the display start line register and displayed at the top of the screen. When the display duty cycle is 1/64 or others (1/32-1/64), the data of total line number of LCD screen, from the line specified by display start line instruction, is displayed.

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STATUS READ

BUSY When BUSY is 1, the Chip is executing internal operation and no instructions are accepted. When BUSY is 0, the Chip is ready to accept any instructions. ON/OFF When ON/OFF is 1, the display is OFF. When ON/OFF is 0, the display is ON. RESET When RESET is 1, the system is being initialized. In this condition, no instructions except status read can be accepted. When RESET is 0, initializing has finished and the system is in usual operation condition. WRITE DISPLAY DATA

Writes data (D0-D7) into the display data RAM. After writing instruction, Y address is increased by 1 automatically. READ DISPLAY DATA

Reads data (D0-D7) from the display data RAM. After reading instruction, Y address is increased by 1 automatically.

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8. Timing Characteristics
MPU Interface Characteristic E cycle E high level width E low level width E rise time E tall time Address set-up time Address hold time Data set-up time Data delay time Data hold time (write) Data hold time (read) Symbol tcyc twhE twlE tr tf tas tah tdsw tddr tdhw tdhr Min 1000 450 450 140 10 200 10 20 Typ (T=25, VDD=+5.0V0.5) Max 25 25 320 Unit ns ns ns ns ns ns ns ns ns ns ns

tC
tW L

0 .7 V D D 0 .3 V D D

t W
tR

H
tF

R /W

0 .7 V D D 0 .3 V D D

tA S U
tA S U

t A H

C S 1 B ,C S 2 B , C S 3 ,R S

0 .7 V D D 0 .3 V D D

t D S U
0 .7 V D D

t D H W

D B 0 - D B 7
0 .3 V D D

MPU Read Timing

tC

tW

0 .7 V D D 0 .3 V D D

t W

tR
0 .7 V D D

tF
t A H
t A H

R /W

tA S U
0 .3 V D D

tA S U

C S 1 B ,C S 2 B , C S 3 ,R S

0 .7 V D D 0 .3 V D D

tD
0 .7 V D D

tD H R

D B 0 - D B 7
0 .3 V D D

MPU Write Timing

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9. Optical Characteristics
Item View Angle Contrast Ratio Response Time Symbol (V) (H) CR T rise T fall Condition CR2 CR2 Min 20 -30 Typ 3 150 150 Max 40 30 200 200 Unit deg deg ms ms

Definition of Operation Voltage (Vop)

Definition of Response Time ( Tr , Tf )

Intensity 100

Selected Wave

Non-selected Conition Intensity

Selected Conition

Non-selected Conition

Non-selected Wave

10

Cr Max

Cr = Lon / Loff

100

90

Vop

Driving Voltage(V)

Tr

Tf

[positive type]

[positive type]

Conditions : Operating Voltage : Vop Frame Frequency : 64 HZ Viewing Angle() : 0 0 Driving Waveform : 1/N duty , 1/a bias

Definition of viewing angle(CR2)

b f = 180

= 270

= 90

= 0
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10. Absolute Maximum Ratings

Item Operating Temperature Storage Temperature Input Voltage Supply Voltage For Logic Supply Voltage For LCD Symbol TOP TST VI VDD VDD-VLCD Min -20 -30 0 0 0 Typ Max +70 +80 VDD 6.7 16.7 Unit V V V

11. Electrical Characteristics

Item Supply Voltage For Logic Symbol VDD-VSS Condition Ta=-20 Supply Voltage For LCD VDD-V0 Ta=25 Ta=+70 Input High Volt. Input Low Volt. Output High Volt. Output Low Volt. Supply Current VIH VIL VOH VOL IDD Min 4.5 7.6 2.0 0 2.4 0 3.0 Typ 5.0 8.0 4.0 Max 5.5 9.6 VDD 0.8 VDD 0.4 5.0 Unit V V V V V V V V mA

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12. Backlight Information

Specification
PARAMETER Supply Current Supply Voltage Reverse Voltage Luminous Intensity Wave Length Life Time Color SYMBOL ILED V VR IV p White MIN 48 3.4 150 50K TYP 60 3.5 200 MAX 90 3.6 5 UNIT mA V V TEST V=3.5V CONDITION

cd/m2 ILED=60mA nm Hr. ILED=60mA ILED=60mA

Note: The LED of B/L is drive by current only, drive voltage is for reference only. drive voltage can make driving current under safety area (current between minimum and maximum).

.Drive from pin19,pin20

A K

B/L

LCM

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13. Reliability
Content of Reliability Test (wide temperature, -20~70) Environmental Test
Test Item
High Temperature storage Low Temperature storage High Temperature Operation Low Temperature Operation High Temperature/ Humidity Operation time. time. and the thermal stress to the element for a long time. for a long time. The module should be allowed to stand at 60,90%RH max For 96hrs under no-load condition excluding the polarizer, Then taking it out and drying it at normal temperature. The sample should be allowed stand the following 10 cycles of operation -20 Thermal shock resistance 30min 5min 1 cycle Total fixed amplitude : 15mm Vibration test Endurance test applying the vibration during transportation and using. Vibration 10~55Hz One cycle 60 seconds to 3 directions of X,Y,Z for Each 15 minutes VS=800V,RS=1.5k Static electricity test Endurance test applying the electric stress to the terminal. CS=100pF 1 time Frequency : 3 30min 25 70 -20/70 10 cycles

Content of Test

Test Condition
200hrs 200hrs 200hrs 200hrs 60,90%RH 96hrs

Note
2 1,2 1

Endurance test applying the high storage temperature for a long 80 Endurance test applying the high storage temperature for a long -30 Endurance test applying the electric stress (Voltage & Current) 70 Endurance test applying the electric stress under low temperature -20

1,2

Note1: No dew condensation to be observed. Note2: The function test shall be conducted after 4 hours storage at the normal Temperature and humidity after remove from the test chamber. Note3: Vibration test will be conducted to the product itself without putting it in a container.

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14. Inspection specification

NO Item Criterion 1.1 Missing vertical, horizontal segment, segment contrast defect. 1.2 Missing character , dot or icon. 1.3 Display malfunction. 1.4 No function or no display. 1.5 Current consumption exceeds product specifications. 1.6 LCD viewing angle defect. 1.7 Mixed product types. 1.8 Contrast defect. AQL

01

Electrical Testing

0.65

02

Black or white 2.1 White and black spots on display 0.25mm, no more than spots on LCD three white or black spots present. (display only) 2.2 Densely spaced: No more than two spots or lines within 3mm 3.1 Round type : As following drawing =( x + y ) / 2 LCD black spots, white spots, contamination (non-display)

2.5

SIZE 0.10 0.100.20 0.200.25 0.25

03

Acceptable Q TY Accept no dense 2 1 0 Acceptable Q TY Accept no dense 2 As round type

2.5

3.2 Line type : (As following drawing) Length Width --W0.02 L3.0 0.02W0.03 L2.5 0.03W0.05 --0.05W

2.5

04

Polarizer bubbles

If bubbles are visible, judge using black spot specifications, not easy to find, must check in specify direction.

Size 0.20 0.200.50 0.501.00 1.00 Total Q TY

Acceptable Q TY Accept no dense 3 2 0 3

2.5

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NO 05

Item Scratches

Criterion Follow NO.3 LCD black spots, white spots, contamination

AQL

Symbols Define: x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length: 6.1 General glass chip : 6.1.1 Chip on panel surface and crack between panels:

06

Chipped glass

y: Chip width x: Chip length Not over viewing x1/8a area Not exceed 1/3k 1/2tz2t x1/8a If there are 2 or more chips, x is total length of each chip. 6.1.2 Corner crack:

z: Chip thickness Z1/2t

2.5

y: Chip width x: Chip length Not over viewing x1/8a area Not exceed 1/3k 1/2tz2t x1/8a If there are 2 or more chips, x is the total length of each chip.

z: Chip thickness Z1/2t

Page 17 , Total 23 Pages

NO

Item

Criterion

AQL

Symbols : x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length 6.2 Protrusion over terminal : 6.2.1 Chip on electrode pad :

y: Chip width x: Chip length y0.5mm x1/8a 6.2.2 Non-conductive portion:

z: Chip thickness 0 zt

06

Glass crack

2.5

y: Chip width x: Chip length z: Chip thickness y L x1/8a 0 zt If the chipped area touches the ITO terminal, over 2/3 of the ITO must remain and be inspected according to electrode terminal specifications. If the product will be heat sealed by the customer, the alignment mark not be damaged. 6.2.3 Substrate protuberance and internal crack. y: width y1/3L x: length xa

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NO 07

Item Cracked glass

Criterion The LCD with extensive crack is not acceptable. 8.1 Illumination source flickers when lit. 8.2 Spots or scratched that appear when lit must be judged. Using LCD spot, lines and contamination standards. 8.3 Backlight doesnt light or color wrong. 9.1 Bezel may not have rust, be deformed or have fingerprints, stains or other contamination. 9.2 Bezel must comply with job specifications. 10.1 COB seal may not have pinholes larger than 0.2mm or contamination. 10.2 COB seal surface may not have pinholes through to the IC. 10.3 The height of the COB should not exceed the height indicated in the assembly diagram. 10.4 There may not be more than 2mm of sealant outside the seal area on the PCB. And there should be no more than three places. 10.5 No oxidation or contamination PCB terminals. 10.6 Parts on PCB must be the same as on the production characteristic chart. There should be no wrong parts, missing parts or excess parts. 10.7 The jumper on the PCB should conform to the product characteristic chart. 10.8 If solder gets on bezel tab pads, LED pad, zebra pad or screw hold pad, make sure it is smoothed down. 10.9 The Scraping testing standard for Copper Coating of PCB
X Y

AQL 2.5 0.65 2.5 0.65 2.5 0.65 2.5 2.5 0.65 2.5 2.5 0.65 0.65 2.5 2.5

08

Backlight elements

09

Bezel

10

PCBCOB

X * Y<=2mm2 2.5 2.5 2.5 0.65

11

Soldering

11.1 No un-melted solder paste may be present on the PCB. 11.2 No cold solder joints, missing solder connections, oxidation or icicle. 11.3 No residue or solder balls on PCB. 11.4 No short circuits in components on PCB.

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NO

Item

Criterion 12.1 No oxidation, contamination, curves or, bends on interface Pin (OLB) of TCP. 12.2 No cracks on interface pin (OLB) of TCP. 12.3 No contamination, solder residue or solder balls on product. 12.4 The IC on the TCP may not be damaged, circuits. 12.5 The uppermost edge of the protective strip on the interface pin must be present or look as if it cause the interface pin to sever. 12.6 The residual rosin or tin oil of soldering (component or chip component) is not burned into brown or black color. 12.7 Sealant on top of the ITO circuit has not hardened. 12.8 Pin type must match type in specification sheet. 12.9 LCD pin loose or missing pins. 12.10 Product packaging must the same as specified on packaging specification sheet. 12.11 Product dimension and structure must conform to product specification sheet.

AQL 2.5 0.65 2.5 2.5 2.5 2.5 2.5 0.65 0.65 0.65 0.65

12

General appearance

15. Precautions in use of LCD Modules

(1)Avoid applying excessive shocks to the module or making any alterations or modifications to it. (2)Dont make extra holes on the printed circuit board, modify its shape or change the components of LCD module. (3)Dont disassemble the LCM. (4)Dont operate it above the absolute maximum rating. (5)Dont drop, bend or twist LCM. (6)Soldering: only to the I/O terminals. (7)Storage: please storage in anti-static electricity container and clean environment.

Page 20 , Total 23 Pages

16. Material List of Components for RoHs

1. RAYSTAR Optronics Inc., hereby declares that all of or part of products, including, but not limited to, the LCM, accessories or packages, manufactured and/or delivered to your company (including your subsidiaries and affiliated company) directly or indirectly by our company (including our subsidiaries or affiliated companies) do not intentionally contain any of the substances listed in all applicable EU directives and regulations, including the following substances. Exhibit AThe Harmful Material List

Material Limited Value

(Cd) 100 ppm

(Pb) 1000 ppm

(Hg) 1000 ppm

(Cr6+) 1000 ppm

PBBs 1000 ppm

PBDEs 1000 ppm

Above limited value is set up according to RoHS. 2. Process for RoHS requirement (1) Use the Sn/Ag/Cu soldering surface the surface of Pb-free solder is rougher than we used before. (2) Heat-resistance temp. Reflow250,30 seconds Max. Connector soldering wave or hand soldering320, 10 seconds max. (3) Temp. curve of reflow, max. Temp.2355 Recommended customers soldering temp. of connector280, 3 seconds.

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Page: 1

LCM Sample Estimate Feedback Sheet

Module Number

1Panel Specification
1. Panel Type Pass NG , 2. View Direction Pass NG , 3. Numbers of Dots Pass NG , 4. View Area Pass NG , 5. Active Area Pass NG , 6.Operating Temperature Pass NG , 7.Storage Temperature Pass NG , 8.Others 2Mechanical Specification 1. PCB Size Pass NG , 2.Frame Size Pass NG , 3.Materal of Frame Pass NG , 4.Connector Position Pass NG , 5.Fix Hole Position Pass NG , 6.Backlight Position Pass NG , 7. Thickness of PCB Pass NG , 8. Height of Frame to PCB Pass NG , 9.Height of Module Pass NG , 10.Others Pass NG , 3Relative Hole Size 1.Pitch of Connector Pass NG , 2.Hole size of Connector Pass NG , 3.Mounting Hole size Pass NG , 4.Mounting Hole Type Pass NG , 5.Others Pass NG , 4Backlight Specification 1.B/L Type Pass NG , 2.B/L Color Pass NG , 3.B/L Driving Voltage (Reference for LED Type) Pass NG , 4.B/L Driving Current Pass NG , 5.Brightness of B/L Pass NG , 6.B/L Solder Method Pass NG , 7.Others Pass NG ,

Go to page 2
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Page: 2 Module Number 5Electronic Characteristics of Module 1.Input Voltage Pass 2.Supply Current Pass 3.Driving Voltage for LCD Pass 4.Contrast for LCD Pass 5.B/L Driving Method Pass 6.Negative Voltage Output Pass 7.Interface Function Pass 8.LCD Uniformity Pass 9.ESD test Pass 10.Others Pass 6Summary

NG , NG , NG , NG , NG , NG , NG , NG , NG , NG ,

Sales signature Customer Signature

Date

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