SEMICONDUCTOR

TECHNICAL DATA
VOLTAGE DETECTOR

KIA7019AP/AF/AT~ KIA7045AP/AF/AT
BIPOLAR LINEAR INTEGRATED CIRCUIT

Function of this IC is accurately resetting the system after detecting voltage at the time of switching power on and instantaneous power off in various CPU systems and other logic systems.
K D E G

FEATURES
Current Consumption is Low. ICCL=300 A Typ. ICCH=30 A Typ. Resetting Output Minimum Guarantee Voltage is Low 0.8V Typ. Hysteresis Voltage is Provided. 50mV Typ. Reset Signal Generation Starting Voltages : KIA7019 1.9V Typ. KIA7021 2.1V Typ. KIA7023 2.3V Typ. KIA7025 2.5V Typ. KIA7027 2.7V Typ. KIA7029 2.9V Typ. KIA7031 3.1V Typ. KIA7032 3.2V Typ. Taping Type is also Available.
J B E L
1 2 3 F H F

KIA7033 3.3V Typ. KIA7034 3.4V Typ. KIA7035 3.5V Typ. KIA7036 3.6V Typ. KIA7039 3.9V Typ. KIA7042 4.2V Typ. KIA7045 4.5V Typ.
A H

DIM A B C D E F G H J K L M N

MILLIMETERS 4.70 MAX 4.80 MAX 3.70 MAX 0.45 1.00 1.27 0.85 0.45 _ 14.00 + 0.50 0.55 MAX 2.30 0.45 MAX 1.00

J
1. VCC 2. GND 3. OUT

TO-92

D K

APPLICATIONS
(1) As Control Circuit of Battery-Backed Memory. (2) As Measure Against Erroneous Operations at Power ON-OFF. (3) As Measure Against System Runaway at Instantaneous Break of Power Supply etc. (4) As Resetting Function for the CPU-Mounted Equipment, such as Personal Computers, Printers, VTRs and so forth.
1 2 F

DIM A B C D E F G H J K

MILLIMETERS 4.70 MAX _ 2.50 + 0.20 1.70 MAX 0.45+0.15/-0.10 4.25 MAX _ 1.50 + 0.10 0.40 TYP 1.75 MAX 0.75 MIN 0.5+0.10/-0.05

1. VCC 2. GND 3. OUT

EQUIVALENT CIRCUIT
VCC OUT + G
2 K E B

SOT-89

DIM A B
C 3 D E F G H I J K L I H J

MILLIMETERS _ 2.9 + 0.2 1.6+0.2/-0.1 _ 0.70 + 0.05 _ 0.4 + 0.1

2.8+0.2/-0.3 _ 1.9 + 0.2 0.95 _ 0.16 + 0.05 0.00-0.10 0.25+0.25/-0.15 0.60 0.55

GND

Type No. KIA7019AF/AT KIA7021AF/AT KIA7023AF/AT KIA7025AF/AT KIA7027AF/AT

Marking 6A 6B 6C 6D 6E

Type No. KIA7029AF/AT KIA7031AF/AT KIA7032AF/AT KIA7033AF/AT KIA7034AF/AT

Marking 6F 6G 6H 6J 6K

Type No. KIA7035AF/AT KIA7036AF/AT KIA7039AF/AT KIA7042AF/AT KIA7045AF/AT

Marking 6L 6M 6N 6P 6R

Marking

1. VCC 2. OUT 3. GND

2 3 1

TSM

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KIA7019AP/AF/AT~KIA7045AP/AF/AT
MAXIMUM RATINGS (Ta=25 ) SYMBOL VCC KIA7019AP 45AP Power Dissipation (Package Limitation) KIA7019AF 45AF KIA7019AT 45AT Operating Temperature Storage Temperature Topr Tstg PD RATING -0.3 +15.0 400 500 350 -30 +75 -55 +150 mW UNIT V

CHARACTERISTIC Supply Voltage

ELECTRICAL CHARACTERISTICS (VCC=5V, VEE=GND, Ta=25 )

CHARACTERISTIC SYMBOL TEST CIRCUIT TEST CONDITION KIA7019 KIA7021 KIA7023 KIA7025 KIA7027 KIA7029 Detecting Voltage VS 1 RL=200 VOL 0.4V KIA7031 KIA7032 KIA7033 KIA7034 KIA7035 KIA7036 KIA7039 KIA7042 KIA7045 Low-Level Output Voltage Output Leakage Current Hysteresis Voltage Detecting Voltage Temperature Coefficient Circuit Current at on Time Circuit Current at off Time Threshold Operating Voltage "L" Transmission Delay Time "H" Transmission Delay Time Output Current at on Time I Output Current at on Time II Vs/ VOL IOH Vs T 1 1 1 1 1 1 1 2 2 1 1 RL=200 VCC=15V RL=200 RL=200 VCC=Vsmin.-0.05V VCC=5.25V RL=200 , VOL RL=1.0k RL=1.0k 0.4V MIN. 1.75 1.95 2.15 2.35 2.55 2.75 2.95 3.05 3.15 3.25 3.35 3.45 3.75 4.05 4.35 30 20 16 TYP. 1.9 2.1 2.3 2.5 2.7 2.9 3.1 3.2 3.3 3.4 3.5 3.6 3.9 4.2 4.5 50 0.01 300 30 0.8 10 15 MAX. 2.05 2.25 2.45 2.65 2.85 3.05 3.25 3.35 3.45 3.55 3.65 3.75 4.05 4.35 4.65 0.4 0.1 100 500 50 V A mV %/ A A V s s mA mA V UNIT

IccL IccH Vopr tpHL tpLH IoL I IoL II

, CL=100pF , CL=100pF

VCC=Vsmin.-0.05V, Tc=25 VCC=Vsmin.-0.05V, Tc=-30 +75

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KIA7019AP/AF/AT~KIA7045AP/AF/AT

TEST CIRCUIT 1.
A1 1 RL V1 KIA70XX 2 3 10uF/10V M A2

TEST CIRCUIT 2.

1 KIA70XX Input Pulse 0.2uF /10V 2 3 CL

RL 10uF/10V M 5.0V

APPLICATION CIRCUIT (1) BATTERY LOW INDICATOR

VCC 1 KIA70XX 2 3 LED R2

(2) CPU RESETTING

VCC 5V 1 KIA70XX 2 3 C1 R1 Reset VCC CPU GND

VCC VS

5V

Delay Time for Power ON

Reset

(NOTE) (1) Connecting of LED and R2 obtains a voltage drop indicator. (2) Connecting of C1 and selection of time constant with C1 and R1 set the power on delay time.

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KIA7019AP/AF/AT~KIA7045AP/AF/AT
PRECAUTION FOR USE

SOLDERING Flat Package (SOT-89 Package)

Elements mounting styles of electronic devices are gaining in further diversification over recent years, and needs for components are all the more expanding in varieties. Especially, surface mounting is steadily penetrating into industrial segments as a world-wide popular technical trend. Although exposure to high temperature is inevitable during soldering we recommend limiting the soldering temperature to low levels as shown in figure for the sake of retaining inherent excellent reliability.

Atomospheric temperature( C) =resin suface temperature

240

210

150

60 sec. Within 10 sec. Within 30 sec.

Time (sec.)

Fig 6
(a) When employing solder reflow method Atmospheric temperature around resin surfaces must be less than 240 , not exceeding the time length of 10 sec. Recommend temperature profile Precautions on heating method When resin in kept exposed to high temperature for a long time, device reliability may be marred. Therefore, it is essential to complete soldering in the shortest time possible to prevent temperature of resin from rising. (b) When employing halogen lamps or infrared-ray heaters When halogen lamps or infrared-ray heaters are used, avoid direct irradiation onto resin surfaces; such devices cause extensive localized temperature rise. Please keep a reflow solder operating when SOT-89 package's soldering.

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