DP50749-02

ORDER NO.PDP0905001CE

50-inch (diag.) HD Plasma Display Panel Module

MD-50H12NBC

Specifications
Power Source Plasma Display panel 100-240 V AC, 50 / 60 Hz Drive method : AC type 50-inch, 16:9 aspect ratio Screen size No. of pixels Weight Operating Conditions Temperature Humidity Notes: Design and specifications are subject to change without notice. Weight and dimensions shown are approximate. 32F - 104F (0 C - 40 C) 20 % - 80 % 1,106.46 mm (W) 622.08 mm (H) 1,049,088 (1,366 (W) 768 (H)) [4,098 768 dots] approx. 18.5 kg net

Panasonic Corporation 2009. Unauthorized copying and distribution is a violation of law.

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CONTENTS
Page
1 Safety Precautions 1.1. General Guidelines 2 Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensitive (ES) Devices 3 About lead free solder (PbF) 4 PCB Structure and List 5 Set Serial Label Information 6 Troubleshooting guide 6.1. How to identify SOS Signal 6.2. Timing Chart of LED Blinking 6.3. How to Display Internal Test pattern 6.4. No Power 6.5. No Picture 4 5 6 7 8 8 8 9 10 10 3 3 6.6. Local screen failure 7 Adjustment Procedure 7.1. Driver Set-ups 7.2. Initialization Pulse Adjust 7.3. P.C.B. (Printed Circuit Board) exchange 7.4. Adjustment Volume Location 7.5. Test Point Location 8 Block Diagram 8.1. Main Block Diagram 9 Replacement Parts List 9.1. Replacement Parts List Notes 9.2. Parts List

Page
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1 Safety Precautions
1.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit. 2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed. 3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1.1.1.

Leakage Current Cold Check

1.1.2.

1. Unplug the AC cord and connect a jumper between the two prongs on the plug. 2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be between 1M and 5.2M. When the exposed metal does not have a return path to the chassis, the reading must be .

Leakage Current Hot Check (See Figure 1.)

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check. 2. Connect a 1.5k, 10 watts resistor, in parallel with a 0.15F capacitors, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1. 3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor. 4. Check each exposed metallic part, and measure the voltage at each point. 5. Reverse the AC plug in the AC outlet and repeat each of the above measurements. 6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer.

Figure 1

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2 Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by electrostatic discharge (ESD). 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can generate electrical charge sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. Caution Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).

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3 About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements. In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder. The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu). That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available. This model uses Pb Free solder in its manufacture due to environmental conservation issues. For service and repair work, wed suggest the use of Pb free solder as well, although Pb solder may be used. PCBs manufactured using lead free solder will have the PbF within a leaf Symbol Caution Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 F (30~40 C) higher. Please use a high temperature soldering iron and set it to 700 20 F (370 10 C). Pb free solder will tend to splash when heated too high (about 1100 F or 600 C). If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder. After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the opposite side. (see figure below) stamped on the back of PCB.

Suggested Pb free solder There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

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4 PCB Structure and List

Board Name P D C1 C2 C3 SC SU SD SS SS2

Function Power Supply Interface & Digital Process Data Driver (Lower Right) Data Driver (Lower Center) Data Driver (Lower Left) Scan Drive Scan Drive out (Upper) Scan Drive out (Lower) Sustain Drive Sustain Connector out

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5 Set Serial Label Information

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6 Troubleshooting guide
6.1. How to identify SOS Signal
[Function] When an abnormality has occurred in the PDP module, the protection circuit operates and reset to the stand-by mode. At the same time, the defective P.C.Board can be indicated by the number of the pulse at Pin 17(LED_R) of D6 connector on D Board. By using this tool (V1 board), the indication of pulse is shown to the blinking of red LED. (Pluse High = LED light, Pulse Low light off)
Tool name V1 board Part number TNPA3199 Supply period until end of AUG /2009 Supply route Normal spare part route (chargeable)

[How to check] Connect the V34 connector on V1 board to D6 connector on D board with Lead Wire (V1-D). And then turn on the power of PDP module. If power is shut down by protection circuit, the red LED of V1 board will be shown as blinking. (If the unit keeps power on, the green LED of V1 board will be lighting.)

6.2.

Timing Chart of LED Blinking

1. Subject Information of LED Blinking timing chart. 2. Contents When an abnormality has occurred the unit, the protection circuit operates and reset to the stand by mode. At this time, the defective block can be identified by the number of blinkes of LED on V1 board.

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6.3.

How to Display Internal Test pattern

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6.4.

No Power

Preparation The V1 board is connected with D board (D6 connector). First check point There are following 3 states of No Power indication by power LED. 1. No lit 2. Green is lit then turns red blinking a few seconds later. 3. Only red is lit.

6.5.

No Picture

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6.6.

Local screen failure

Plasma display may have local area failure on the screen. Fig-1 is the possible defect P.C.B. for each local area.

Fig-1

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7 Adjustment Procedure
7.1.
7.1.1.

Driver Set-ups
Item / Preparation

1. Input a white signal of RGB signal generator.

7.1.2.

Adjustments

Adjust driver section voltages referring the panel data on the panel data label.

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7.2.

Initialization Pulse Adjust

1. Input a white signal of RGB signal generator. 2. Adjust the indicated test point for the specified wave form.
T2 Test point TPSC1 (SC) Volume VR16601 (SC) Level 210V 10V at 100s period of the initialization pulse slope by VR16601

7.3.
7.3.1. 7.3.2.

P.C.B. (Printed Circuit Board) exchange

Caution Quick adjustment after P.C.B. exchange
Name Vsus Vad Vscn Vset Ve Vda Test Point TPVSUS (SS) TPVAD (SC) TPVSCN (SC) TPVSET (SC) TPVE (SS) TPVDA (P) Voltage Vsus 2V -180V 2V Vad_base:+145V4V GND_base: -35V6V 290V 9V Ve 2.5V 60V +1V , -2V Volume R737 (P) VR16600 (SC) Fixed Fixed Fixed Fixed Remarks *

1. To remove P.C.B. , wait 1 minute after power was off for discharge from electrolysis capacitors.

P.C.B. P Board SC Board

SS Board

*See the Panel label.

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7.4.

Adjustment Volume Location

7.5.

Test Point Location

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8 Block Diagram
8.1. Main Block Diagram

D5 D FORMAT CONVERTER,
READY ARARM PANEL STBY_ON

PLASMA AI PROCESSOR

SS3 SC SCAN DRIVE

SC2 VSUS GenX7 PANEL MICOM

10bit LVDS

POWER SUPPLY P2 VSUS SS SUSTAIN DRIVE SS3

SU SCAN OUT (UPPER)

SC-BOARD ENEGRY RECOVERY SOS DETECT

POWER SOS EEPROM

SOS4_PS

SOS4_PS +5V(P)

PS SOS4

P-BOARD SOS DETECT VSUS P11 +15V(P) SS11 VSUS +15V(P) SS-BOARD SOS DETECT

SOS6_SC1

D25
CONTROL SIGNAL

P25

STBY5V +15V(P)

POWER MICOM
ON/OFF CONTROL

PANEL MAIN ON

SC-BOARD FLOTING PART SOS DETECT Vda SOS7_SC2 SC20 SCAN DRIVER D20 SOS6_SC1 SOS7_SC2 +5V(P) +15V(P) SU41 SC41 SCAN CONTROL FSTBY+15V VIDEO DATA (24bit) CONTROL PULSE SCAN CONTROL SU11 +5V(P) SD11 D31 SCAN DRIVER VSCAN GEN. VSET GEN. P9 BUFFER SD46 SC46 D32 P60 +5V(P) P7 SOS8_SS SUSTAIN CONTROL
FSTBY+15V

SOS6_SC1 SOS7_SC2 SOS8_SS RESET

LVDS RX CPG with SS H/V SYNC CONTROL SUB-FIELD PROCESSOR PLASMA AI DATA DRIVER

DDR

+15V(P) +5V(P)

PROCESS VOLTAGE RECTIFIER

SUSTAIN VOLTAGE RECTIFIER

VSUS GEN. VE GEN.

FLASH MEMORY COLD HOT POWER FACTOR CONTROL

+5V(P) SOS8_SS SUSTAIN CONTROL

VIDEO DATA (24bit)

STBY5V

STANBY VOLTAGE RECTIFIER

SS22 SS24

DISCHARGE CONTROL

P6

+15V(AUDIO) STBY5V F_STBY_ON UNREG_15V UNREG_FSTB

RECTIFIER

SS23 MAIN SW2 MAIN SW1 Vda SS2 P34 SUSTAIN CONNECTOR (LOWER)

RECTIFIER

RELAY

SD42

SC42

P35

C11 C1 DATA DRIVER (RIGHT)

+5V(P) +5V(P)

C21 C2 DATA DRIVER (CENTER) C3 DATA DRIVER (LEFT)

C35 Vda +5V(P) SOS8_SS C22 C32 SUSTAIN CONTROL Vda VIDEO DATA C33 +5V(P) SOS8_SS SUSTAIN CONTROL

+5V(P)

Vda VIDEO DATA

Vda

C10

C20

Vda

SD SCAN OUT (LOWER)

DATA DRIVER

DATA DRIVER

DATA DRIVER

DATA DRIVER

DATA DRIVER

DATA DRIVER

DATA DRIVER

DATA DRIVER

DATA DRIVER

DATA DRIVER

DATA DRIVER

MD-50H12NBC Main Block Diagram

MD-50H12NBC Main Block Diagram

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NOTE

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9 Replacement Parts List

9.1. Replacement Parts List Notes

9.2.
Ref. No. PCB PCB PCB PCB PCB PCB PCB PCB PCB PCB

Parts List
Part No. LSEP1279WMHB TXNC111ABG TXNC211ABG TXNC311ABG TZTNP011ABG TXNSC11ABG TXNSD11ABG TXNSS11ABG TXNSS211ABG TXNSU11ABG THEL069J THEL069J XYN4+F10FJ XYN4+F10FJ Part Name & Description CIRCUIT CIRCUIT CIRCUIT CIRCUIT CIRCUIT CIRCUIT CIRCUIT CIRCUIT CIRCUIT CIRCUIT BOARD BOARD BOARD BOARD BOARD BOARD BOARD BOARD BOARD BOARD P C1 C2 C3 D SC SD SS SS2 SU Pcs 1 1 1 1 1 1 1 1 1 1 29 33 4 8 Remarks

SCREW (TU:2 INLET:3 CONT:1) SCREW (TU:2 INLET:3 CONT:1) SCREW(SUSD:4) SCREW(HANGERE METAL KARI) CABLE(SU11-SD11/ C10-C20) CABLE(D20-SC20) CABLE(C22-C32) CABLE(C11-D31) CABLE(C21-D32) PLASMA DISPLAY PANEL

TSXL519 TSXL719 TSXL737 TSXL779 TSXL780 MD50H12M1J

2 1 1 1 1 1

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NOTE

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