Dry-Film Developments for LDI - Technology

Russell Crockett Circuit Packaging Materials. DuPont Electronic Technologies

Advanced Manufacturing Techniques.

Rotherham 4 August. 2009

9/3/2009 DUPONT CONFIDENTIAL

Laser Direct Imaging for Printed Circuit Manufacture. Why Use LDI to expose a dry film resist?
Is it an Enabling Technology?
Improve production capabilities

Does it Improve Yields?

Reduce costs

9/3/2009 DUPONT CONFIDENTIAL

Laser Direct Imaging for Printed Circuit Manufacture. The 5 Steps to Create the Image.
Surface Preparation. Resist Lamination.

Resist Exposure.LDI step. p p

Resist Development. Circuit Creation.
Etching. Plating.

9/3/2009 DUPONT CONFIDENTIAL

Laser Direct Imaging for Printed Circuit Manufacture. The main Users of LDI Equipment. Prototype Market - Enabling Technology.
Speed to production. No phototool preparation. Flexability. Single board production.

HDI Market Yield Improvement.

Side to side, layer to layer registration. Large panel registration to micro vias. Reduced repeat fault ( dirt ) imaging for fine line. Better quality and lower total cost.
9/3/2009 DUPONT CONFIDENTIAL

LDI History
Polyscan PDI-2000 Nikon Pentax DI-2000

Orbotech DP-100

Dai-Nihon Screen

1990

1995

2000

UV Laser out put

360nm 405nm
9/3/2009 DUPONT CONFIDENTIAL

* 350 - 365nm * 400 - 415nm

LDI Technology 355nm vs. 405nm

Polygon Mirror System DMD (Digital Micro Mirror Devise) System

Laser
Wave Length355nm DMD
Scan direction Feed direction

Laser
Wave Length405nm

Polygon Mirror

Panel
Feed direction

Panel

Polygon Mirror 305nm

Orbotech

DMD. Digital Micro-mirror Devise 405nm

Fuji Pentax (ORC) Hitachi

9/3/2009 DUPONT CONFIDENTIAL

Polygon Optical System

source: ORBOTECH

AOM UV Laser Beam Splitter S litt Polygon Lens System

Stage movement during imaging Panel

9/3/2009 DUPONT CONFIDENTIAL

DMD 405nm LDI system

Optical system Exposure
Light Lens

DMD

CAD data
Focus Lens

ON OFF

Optical head

Imaging
Direct imaging Panel feed direction
9/3/2009 DUPONT CONFIDENTIAL

DMD Digital Micro mirror Device

Laser technology and Resist evolution.

Polygon Plotters ( DP 100 )

Low energy Productivity gated by photospeed, ~ 10mJ

Dry film resists( LDI 300, 500 Series )

V Very hi h photospeed, high h t d 8 - 10mJ 30micron resist 15 18mJ 50micron resist

Trade off
Unstable to heat and yellow light. Poor processing productivity, development, stripping. Brittle, poor tenting. Conventional resist 60 75mJ

9/3/2009 DUPONT CONFIDENTIAL

10

LDI History
Orbotech DP-100
Dai-Nihon Screen

Polyscan PDI-2000

Nikon

Pentax DI-2000

1990

1995
LDI 200

2000

LDI 300

LDI 500

9/3/2009 DUPONT CONFIDENTIAL

11

LDI 500 series dry-film 405nm + 355nm

LDI540 @ 405nm LDI540 @ 355nm

9/3/2009 DUPONT CONFIDENTIAL

12

LDI 500 series dry-film 405nm + 355nm

LDI540 @ 405nm 25 28 mJ/cm2 LDI540 @ 355nm 14 16 mJ/cm2

9/3/2009 DUPONT CONFIDENTIAL

13

LDI Dry-Film Developments

Orbotech DP-100
Dai-Nihon Screen LI-7000

Polyscan PDI-2000

Nikon

Pentax DI-2000

1990

1995
LDI 200 LDI 300

2000

LDI 500

LDI 800

9/3/2009 DUPONT CONFIDENTIAL

14

Laser technology and Resist evolution.

Digital Micro Mirror Device, LDI plotter

High resolution Smaller panel format Used U d mainly i A i i l in Asia. Needed specific photo-initiator at 405nm. Not compatible with other dry film photo-initiators. Not compatible with other exposure equipment. Riston* LDI 800 developed specifically for 405nm wave length.

9/3/2009 DUPONT CONFIDENTIAL

15

Laser technology and Resist evolution.

Polygon Plotters ( Paragon 8000 )

Higher energy Productivity gated by photospeed, ~ 18mJ

Dry film resists( LDI 7000 and 7200 Series )

Hi h photospeed, High h t d

Benifits
More stable to heat and yellow light. Improved resolution. Improved resist flow and adhesion. Improved processing productivity, development, stripping. Higher yields.

9/3/2009 DUPONT CONFIDENTIAL

16

LDI Dry-Film continued developments

Orbotech DP-100
Dai-Nihon Screen

Polyscan PDI-2000

Nikon

Pentax DI-2000

1990

1995 199
LDI 200

2000

LDI 300 LDI 500 LDI 800 LDI 7000

9/3/2009 DUPONT CONFIDENTIAL

17

Laser Direct Imaging for Printed Circuit Manufacture. Why Use LDI to expose a dry film resist?
Is it an Enabling Technology?
Improve production capabilities

Does it Improve Yields?

Reduce costs

9/3/2009 DUPONT CONFIDENTIAL

18

Why Use LDI to expose a dry film resist?

Yield Imaging Defects, none LDI exposure
100 90 80 70 60 Yield % 50 opens/nicks 40 30 20 10 0 75 50 Feature size ym

without Repeats with Repeats

9/3/2009 DUPONT CONFIDENTIAL

19

Why Use LDI to expose a dry film resist?

Yield Imaging Defects, 50ym
100 90 80 70 Yield % 60 Imaging 50 Defects 40 30 20 10 0 1 LDI Exposure 2

( non-repeating )

without Cleaning with Cleaning

9/3/2009 DUPONT CONFIDENTIAL

20

Why Use LDI to expose a dry film resist? Yield Mis-registration Defects (610 x 510mm)

100 90 80 70 60 Yield % 50 Misregistration 40 30 20 10 0 Feature size 50ym

Film exposure LDI exposure

9/3/2009 DUPONT CONFIDENTIAL

21

Riston* LDI 7040

9/3/2009 DUPONT CONFIDENTIAL

22

LDI Dry Film Resist Requirements All Applications

Adhesion to many surface finishes Productivity, all processes. Flow at lamination. Resolution, Resolution ~ 50ym Etching, Acid and Alkaline Plate Cu, Sn, PB,Ni, Au. Tenting, T&E and Plating. Stability, Transport, yellow light. Can be exposed on conventional printers. Highest possible yields.
9/3/2009 DUPONT CONFIDENTIAL

23

LDI Dry Film Resist Requirements Best in class dry film, plus LDI exposure
Riston* LDI 7000 and 7200 series.
Good Adhesion on all surfaces Good Flow - Characteristics High Resolution Good Tenting ( 8mm through 65m Cu acid etch ) High Productivity - fast development - fast and easy stripping Acid and Alkaline etch. Plating, Cu, Sn, Pb, Ni, Au.
9/3/2009 DUPONT CONFIDENTIAL

24

LDI 7000,7200, Dry Film Resists

Riston* LDI 7000 and 7200 series.
Thicker resists 7250,7262,7275 and 7299
Optimized for through polymerization.

Cover sheet clarity and quality. High resolution capability, sub 50ym. ( resist thickness ) Compatibility with standard exposure equipment. Production proven high yield performance.
Etching innerlayers. Tent and etch. Cu & Sn and Ni & Au plating.
9/3/2009 DUPONT CONFIDENTIAL

25

Riston* LDI 7000 / 7200 Series LDI 7030 16 mJ/cm2 LDI 7040 20 mJ/cm2 LDI 7250 30 mJ/cm2 Paragon 8000, gate energy 18mJ.

9/3/2009 DUPONT CONFIDENTIAL

26

LDI 7040 - 37 micron L/S

14 mJ/cm2

20 mJ/cm2

9/3/2009 DUPONT CONFIDENTIAL

27

LDI 7030

LDI 7250

9/3/2009 DUPONT CONFIDENTIAL

28

Riston* LDI 7040

9/3/2009 DUPONT CONFIDENTIAL

29

Riston* LDI 7250

9/3/2009 DUPONT CONFIDENTIAL

30

Riston* LDI 7250

9/3/2009 DUPONT CONFIDENTIAL

31

LDI Productivity? Paragon + DuPont WBR 2100

9/3/2009 DUPONT CONFIDENTIAL

32

9/3/2009 DUPONT CONFIDENTIAL