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MICROELECTRONICS CORP.
Spec. No. : Preliminary Data Issued Date : 2001.08.01 Revised Date : 2001.08.24 Page No. : 1/3
HBD140
PNP POWER TRANSISTORS
Description
PNP power transistor in a TO-126 plastic package. NPN complements: HBD139
Features
High Current (max. 1.5A) Low Voltage (max. 80V)
Applications
General purpose power applications, e.g. driver stages in hi-fi amplifiers and television circuits.
Limiting Values
Symbol VCBO VCEO VEBO IC ICM IBM PD Tstg Tj Tamb Parametor Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current (DC) Peak Collector Current Peak Base Current Total Dissipation at Storage Temperature Junction Temperature Operating Ambient Temperature Conditions Open Emitter Open Base Open Collector Min. -65 -65 Max. -100 -80 -5 -1.5 -2 -1 1.2 15 150 150 150 Unit V V V A A A W W C C C
Ta=25C Tc=25C -
HBD140
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000 1000
Spec. No. : Preliminary Data Issued Date : 2001.08.01 Revised Date : 2001.08.24 Page No. : 2/3
hFE
100
VCE(sat) @ IC=10IB
VBE(sat) @ IC=10IB
VBE(on) @ VCE=2V
ON Voltage (mV)
100 0.1 1 10 100 1000 10000
1 PT=1mS
HBD140
HI-SINCERITY
MICROELECTRONICS CORP.
TO-126 Dimension
D A B 1 2 3 G C I E J K M
Spec. No. : Preliminary Data Issued Date : 2001.08.01 Revised Date : 2001.08.24 Page No. : 3/3
Marking :
3
Date Code
H BD 1 4 0 Control Code
Laser Marking
F H
1 2
3-Lead TO-126 Plastic Package HSMC Package Code : T *:Typical
DIM 1 2 3 4 A B C D E
Inches Min. Max. *3 *3 *3 *3 0.1500 0.1539 0.2752 0.2791 0.5315 0.6102 0.2854 0.3039 0.0374 0.0413
Millimeters Min. Max. *3 *3 *3 *3 3.81 3.91 6.99 7.09 13.50 15.50 7.52 7.72 0.95 1.05
DIM F G H I J K L M
Inches Min. Max. 0.0280 0.0319 0.0480 0.0520 0.1709 0.1890 0.0950 0.1050 0.0450 0.0550 0.0450 0.0550 *0.0217 0.1378 0.1520
Millimeters Min. Max. 0.71 0.81 1.22 1.32 4.34 4.80 2.41 2.66 1.14 1.39 1.14 1.39 *0.55 3.50 3.86
Notes : 1.Dimension and tolerance based on our Spec. dated Mar. 6,1995.
2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
Lead : 42 Alloy ; solder plating Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. HSMC reserves the right to make changes to its products without notice. HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
HBD140