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PIN Diodes

Characteristics diode is related to the geometry cause this capacitance error; no


The most important feature of the and electrical properties of the reverse bias is needed to deplete
PIN diode is its basic property of I-layer similar to the case of RF the I layer. The frequency where
being an almost pure resistor at resistance, an R-C trade-off may the resistance of the undepleted
RF frequencies, whose resistance be feasible. Special techniques charge equals the reactance of the
value can be varied from approxi- can be employed to minimize undepleted layer is called the
mately 10,000 Ω to less than 1 Ω capacitance (and other parasitic) dielectric relaxation frequency
by the control current flowing effects, and in some cases even to (FDR). Below this frequency,
through it. Most diodes exhibit take advantage of them. (Some of reverse voltage is needed to
this characteristic to some degree, the techniques for improving high measure the minimum value of the
but the PIN diode is optimized in frequency performance are diode’s junction capacitance (CJ).
design to achieve a relatively wide discussed in Application Note 922, Above the FDR, the zero bias value
resistance range, good linearity, “Applications of PIN Diodes” and of CJ is almost the same as the
low distortion, and low current Application Note 957-2, “Reducing reverse bias CJ value.
drive. The characteristics of the the Insertion Loss of a Shunt PIN
PIN diode make it suitable for use Diode”.) For example, when the
in switches, attenuators, modula- HSMP-3810 PIN diode is mounted
tors, limiters, phase shifters, and Dielectric Relaxation in series in a 50 ohm line and
other signal control circuits. Frequency measured at a fixed frequency, a
When current is removed from a plot of total capacitance (CT) vs.
Device Characteristics PIN diode, most of the charges reverse voltage (VR) such as
return to the P and N layers. shown in Figure 1 would result. At
The principal parameters of a PIN
However, some charges remain in the low frequency of 1 MHz and
diode which play major roles in
a portion of the I layer, the zero bias, the capacitance is
determining the performance of a
undepleted portion. At low relatively high, about 0.45 pF. As
circuit include the following:
frequencies this undepleted I the frequency is increased, still at
layer resistance shorts out a zero bias, to 30␣ MHz the capaci-
Capacitance
portion of the I layer capacitance. tance drops significantly to a
Diode capacitance limits switch
A low frequency capacitance quarter dB. As frequency in-
and attenuator performance at
measurement would be relatively creases further, capacitance is flat
high frequencies in the form of
high because only a portion of the at about 0.20␣ pF. Applying reverse
isolation rolloff and increased
I layer, the depleted portion, bias at the higher frequencies does
insertion loss. Optimum perfor-
would be measured. At higher not significantly affect the total
mance can be achieved by one of
frequencies the reactance of the capacitance. Figure 2 shows
several alternatives available.
undepleted I layer is smaller and similar results for the HSMP-3830
Using a low capacitance diode
the resistance of the undepleted PIN diode. Note the HSMP-3810 is
would be one solution. Since the
charges is not small enough to flat above 100␣ MHz and the
junction capacitance of a PIN

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HSMP-3830 becomes relatively The high off resistance and low For further details, read AN␣ 922,
flat about 1␣ GHz. on resistance make the PIN diode “Applications of PIN Diodes.”
0.45 attractive for switching applica-
tions. Power Handling Capability
0.40 The RF power (CW or pulse) that
TOTAL CAPACITANCE (pF)

1 MHz
At RF frequencies, the PIN diode can be handled safely by a diode
0.35
with forward bias behaves switch is limited by two factors —
0.30 essentially as a pure resistor. The the breakdown voltage of the
resistance of the PIN diode is diode, and thermal consider-
0.25 30 MHz related to the bias current, the ations, which involve the maxi-
frequency > 100 MHz geometry of the I-layer and the mum junction temperature and
0.20
properties of the carriers. For a the thermal resistance of the
0.15 given type of PIN diode with diode and packaging. Other
0 4 8 12 16 20
uniform characteristics, resis- factors affecting power handling
REVERSE VOLTAGE (V)
tance is inversely proportional to capability are ambient tempera-
Figure 1. RF Capacitance vs.
the forward bias current. tures, frequency, attenuation level
Reverse Bias at 25°C, HSMP-3810
Series.
Whereas, only high off resistance (which is related to diode resis-
and low on resistance are impor- tance), pulse width and duty
0.35 tant in switching applications, the cycle. (See Application Note 922,
resistance characteristics in the “Applications of PIN Diodes,” for
TOTAL CAPACITANCE (pF)

0.30 1 MHz
entire dynamic range are of details.)
concern in attenuator applica-
tions. Linearity of resistance with Thermal Resistance
0.25 bias makes the PIN diode useful Thermal resistance is normally
100 MHz for attenuator applications. designated by θjc “theta-j-c” or the
0.20 1 GHz
thermal resistance from the
Power Handling junction to the case. It is specified
The calculation of power handling in terms of °C per Watt (°C/W).
0.15
0 4 8 12 16 20 in a PIN diode is complicated and
REVERSE VOLTAGE (V) involves the nature of the RF Using this number θjc and know-
Figure 2. RF Capacitance vs. signal (frequency, CW or pulsed, ing the amount of power being
Reverse Bias at 25°C, HSMP-3830 duty cycle), the resistance of the dissipated as heat in the diode,
Series. PIN diode (a function of bias) and one can calculate the temperature
the package, the ambient tem- rise of the junction with respect
RF Resistance perature, the number and arrange- to the case. Conversely, one can
The PIN diode structure consists ment of PIN diodes in the circuit, reverse the process and use
of an I (Intrinsic) layer of very the amount of reverse bias on the temperature rise and power data
high resistivity material sand- unbiased diodes, and the thermal to compute θjc. This calculation is
wiched between regions of highly resistance of the diode and its based upon the measurements
doped P (positively charged) package. For a switch, with two which we made when we pro-
material and N (negatively extreme states (on and off) there duced our diode data sheet.
charged) material. With reverse or are two diode conditions to
zero bias, the I-layer is depleted of consider: The numbers to use are:
charges and the PIN diode 1 when the PIN diode is forward 1 Tjmax, the maximum junction
exhibits very high resistance. biased, it can be represented operating temperature
When forward bias is applied as a resistor. You control the 2 Pmax, the maximum DC power
across the PIN diode, positive resistance by the amount of dissipation
charge from the P region and forward bias. 3 Ct, the case temperature =
negative charge from the N region 2 when the PIN diode is reverse 25°C
are injected into the I-layer, biased, the limitation is the
therefore increasing its conductiv- sum of reverse (DC) bias plus
ity and lowering its resistance. the peak reverse RF voltage of
the source.

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Items 1 and 2 are found in the This application note presents an Insertion Loss
Maximum Ratings table on the empirically optimized four diode π The loss of signal attributed to
diode’s data sheet. The computa- attenuator covering 300 KHz to the diode when the switch is on
tion is as follows: 3␣ GHz using the HSMP-3814 (transmission state) is insertion
θjc = (Tjmax – Ct) / Pmax diodes. Modeling the signals and loss. For low insertion loss, low
the resulting distortion products resistance is needed in a series
As an example, consider the
is not practical as multiple diodes, switch (Figure 4). Low capaci-
HSMP-3860 PIN diode.
in any configuration, will produce tance (particularly at high fre-
In this case,
a rich spectrum of distortion quencies) is needed in a shunt
Tjmax = 150°C products, all at different values of switch (Figure 5).
Pmax = 250 mW = 0.25 W amplitude and phase angle. These .8
and our calculation yields signals, distortion products, and 50 R

θjc = (150 – 25) / 0.25 = 500°C/W passive circuit elements (bias 50


elements, etc.) will interact by .6

INSERTION LOSS (dB)


reinforcing or canceling and make
Modeling
predicting the results impractical.
Proper modeling of PIN diodes .4 HPND-4005
requires careful analysis of carrier
Carrier Lifetime
lifetime. Since the Spice engine I.L. = 20 LOG (1 + R )
An important parameter of the .2
100
does not model this important
PIN diode is the carrier lifetime, τ,
parameter, HP does not support
which is useful for defining the 5082-0034
Spice models for PIN diodes.
low frequency limit, fo = 1/2πτ, for .1
0 2 4 6 8
linear performance of the diode. CUTOFF FREQUENCY (KHz)
Touchstone, a linear modeling
For RF signal frequencies below Figure 4. Typical Insertion Loss of
program, can be used to model
fo , the PIN diode rectifies the Series Diode Switch.
linear performance of PIN diodes
signal much like an ordinary PN
using the following diagram. 10
junction diode, and considerable
50 Ω
CP output distortion results. (See C (pF) 3.0 1.0 0.8
Application Note 957-3, “Rectifica- 50 Ω
tion Effects in PIN Attenuators,”
for additional discussion on
INSERTION LOSS (dB)

LP RS Rj 1
rectification causes and effects.)
I.L. = 10 LOG
Cj At frequencies above fo, less [1 + (50πfC)2]

2
-000

-001
Figure 3. rectification occurs with increas-
5082

ing frequency, allowing the PIN 5082


Distortion diode to appear more linear, .1
Distortion in a PIN diode is a approaching a pure resistor.
function of I-layer thickness, not
05
D-40

carrier lifetime. It turns out that For applications requiring good


HPN

diodes with thick I-layers also linearity and low distortion the
0.01
have long lifetimes, but the minimum signal frequency should 0 0.1 1 10 100
lifetime is an effect, not a cause. be ten times fo, i.e., fmin = 10/2πτ, FREQUENCY (GHz)

= 1.6/τ. This restriction is not Figure 5. Typical Insertion Loss of


Figure 5. Typical Insertion Loss of
Much valuable work on PIN diode important in switching applica- Shunt Diode Switch.
amplitude distortion has been tions, where the diode is normally
done by Dr. Robert Caverly of biased either completely OFF or Isolation
Southeastern Massachusetts ON. In those states, since most of Isolation is the measure of RF
University. References can be the power is either reflected or leakage between the input and
found in Application Note␣ 1048, transmitted, the effect of RF output when the switch is off. For
“A Low-Cost Surface Mount PIN current on the total charge is high isolation (low transmission)
Diode π Attenuator.” small and distortion is not a low capacitance is required in a
problem. series switch especially at high

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frequencies (Figure 6). Low to decrease. The time required for forward biased PIN diode to decay
resistance is required in a shunt the reverse current to decrease to 1/e of its initial (DC biased)
switch (Figure 7). from 90% to 10% is called the value. Determined by diode
transition time, tt. The sum, td + tt, design, lifetime is an important
80 C (pF)
50 C is the reverse recovery time, characteristic of these diodes in
.01
.1
.03
50
which is a measure of the time it that it affects switching speed as
60
takes to switch the diode from ON well as distortion performance. τ
.3 ISOLATION = to OFF. can range from 10␣ nsec to 2 µsec.
ISOLATION (dB)

1
10 log (1 +
200πfC
)2 The Cutoff Frequency is calcu-
H

Reverse Breakdown Voltage lated by


PN 2-0

40
50 82-

The reverse breakdown voltage


-4
8

00
50

fc = 1/(2πτ)
5
01 1

defines the maximum signal level


2
00
0

20 which may be applied to the A plot of lifetime (τ) versus fc is


diode. Operation at signal levels provided in Figure 8.
above the reverse breakdown 1 x 105
0
.01 .1 1 10 100 voltage may result in degradation

CUTOFF FREQUENCY (KHz)


FREQUENCY (GHz) of diode characteristics or in
1 x 104
Figure 6. Typical Isolation of Series
Figure 6. Typical Isolation of Series
permanent damage to the diode.
Diode Switch.
Cutoff Frequency (fc) 1 x 103

Reverse Recovery Time At frequencies much below cutoff


Reverse recovery time is a mea- (fc), a PIN diode tends to behave 100
sure of switching time, and is as a simple PN junction, while
dependent on the forward and well above the cutoff frequency 10
reverse bias applied. With forward the diode exhibits the characteris- 1 10 100 1 x 103 1 x 104
DIODE LIFETIME (nsec)
bias current, charge is stored in tics of a simple current controlled
Figure 8. Diode Lifetime, nsec.
the I-layer. When a reverse pulse resistor.
is applied, reverse current will Switching Speed
flow for a short period of time, The recombination lifetime in a In many applications, switching
known as delay time, td. When a PIN diode, usually designated as τ time is very important. Reverse
sufficient number of carriers have (tau), is the time required for the recovery time is a measure of the
been removed, the current begins stored charge in the I region of a switching time of a PIN diode, the
time required to switch the diode
from ON to OFF. The time needed
70 to switch the diode from OFF to
ON is shorter. (See Application
60
50 Ω
Note 929, “Fast Switching PIN
Diodes,” for details.)
50 R 50 Ω
Applications of
ISOLATION (dB)

40 PIN␣ Diodes
PIN diodes are used principally
30
5082-0001, -0012
for the control of RF and micro-
wave signals. Applications include
20 switching, attenuating, modulat-
ISOLATION = 20 log (1 + 25) HPND-4005 ing, limiting and phase shifting.
R
10 Certain diode requirements are
common to all these control
0 functions, while others are more
0.1 0.3 1 3 10
important in a particular type of
DIODE RESISTANCE – R (Ω)
usage.
Figure 7. Typical Isolation of Shunt Diode Switch.

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Switching Applications attenuator, constant input and circuits by an auxiliary Schottky
The performance of a PIN diode output impedance can be diode) biases the diode to a low
circuit is directly related to the achieved throughout the attenua- resistance state. Most of the input
basic characteristics of the diode. tion range. power is then attenuated, allow-
As an illustrative example, the ing very little to be transmitted.
performance of a PIN diode An additional requirement in most The sensitive equipment that
switch can be simply approxi- attenuator applications is low follows is thus protected.
mated by treating the PIN diode distortion. Distortion can be kept
essentially as a resistor in the to a minimum, if the carrier For a limiter circuit to be effi-
forward biased state and a capaci- lifetime of the PIN diode used is cient, it is essential that the PIN
tor in the reverse biased state. greater than the inverse of the diode has fast switching time.
Switch performance is normally signal frequency. HP recommends Without an auxiliary diode, a PIN
evaluated by the Insertion Loss, the minimum signal frequency be diode with good rectification
Isolation, Switching Speed, and ten times the cutoff frequency, fc, efficiency is needed to achieve
Power Handling Capability i.e., fc␣ =␣ 10/2 πτ or 1.6/τ, where τ is low resistance. Another diode
characteristics. These are summa- the carrier lifetime and f is the requirement is good heat transfer
rized in the “Characteristics of signal frequency. characteristics (low thermal
PIN Diodes” section. resistance).
See Distortion in the “Characteris-
Attenuators tics of PIN Diodes” section. Phase Shifters
Whereas a switch is used only in The high speed switching capa-
its maximum ON or OFF state, an Limiters bilities and low ON and high OFF
attenuator is operated throughout Sensitive amplifiers, mixers, and resistance states of the PIN diode
its dynamic range (or resistance detectors in microwave systems make it also very useful for many
range in the case of a diode can be protected against damage types of high speed, current
attenuator). Although a single by high level signals with the use controlled phase shifter applica-
diode series or shunt switch can of a PIN diode limiter shunting tions. Another important require-
be used as an attenuator, it cannot the transmission line. ment for these applications is the
offer in its entire dynamic range uniformity of diode characteris-
constant input and output imped- A PIN diode limiter is essentially tics such as capacitance and
ance, which is required for an attenuator that uses self bias resistance, particularly in systems
optimum source and load match- rather than externally applied where a large number of elements
ing in most attenuator applica- bias. As the RF input increases, are involved.
tions. By using a multiple diode the rectified current generated by
circuit such as π, T, or bridged-T the PIN diode (in some limiter

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Application Recommendations
Glass
HSMP HSMP HSMP HSMP HSMP HSMP HSMP Axial Beam General
Applications 380x 381x 382x 383x 386x 388x 389x Lead Lead Chip Pkgd Interest
Attenuators • • • • • •
Switching • • • • • • •
AGC Circuits • • • •
Power Limiters •
Phase Shifting • •
Modulating • •
Application Notes Number/Subject
A001 Notes on Choke Network Design •
A004R ESD and ESD Control •
A005 Transistor Chip Use •
A006 Packaged Semi Mounting •
922 Applications • • • • • • • • • • •
929 Fast Switching • • • • •
957-2 Reducing Shunt Insertion Loss • • • • •
957-3 Rectification Effects •
979 Handling/Bonding of Beam Lead Devices •
985 Hi Iso in Series Apps with HPND 4005 •
992 Beam Lead Attachment Methods •
993 Beam Lead Bonding to Soft Substrate •
1048 Low-Cost SMT Pi Attenuator • • • •
1049 Low Distortion Switch • • • •
1050 Low-Cost Power Limiters •
1054 Low-Cost Frequency Multipliers •
1067 SPDT T/R Switch for PCN Applications • • • • •
1072 HSMP 3890 Switching Applications •

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