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Introduction
Strasbaugh’s Semiconductor CMP tools are designed for high reliability, superior process performance and low
cost of ownership. Strasbaugh offers the STB P300 and 6DS-SP CMP systems for high-volume production.
The 6EG and 6EC CMP systems are ideal for low-volume applications, consumables and process research and
development, and whole wafer sample preparation for failure analysis.
Our backgrinding systems, the 7AF and the 7AA-II provide high reliability and excellent process performance for
high volume production as well as research and development.
Applications
• Tungsten
• Oxide
• STI
• Copper
• Silicon
• R&D
• Failure Analysis
• 3D Stacked Wafer
• Thin Wafer
Wafer Sizes
• 75mm to 300mm
• Notched, flatted, and round wafers accommodated
Products
• Greatest Production
and Process
Flexibility
• Built for High Volume
Production
• Small Lot, High Mix
Capability
• Ultra Low Downforce
Process Capability
• Reliable
• Small Footprint
• Reduces Setup
Time and FWD
• Low Cost of
Ownership
• Low Capital Cost
• Handles 150mm,
200mm, or 300mm
Wafers
• Independent Turrets
• Advanced Wafer Carriers
• Optical Endpoint Detection
• Ultra-Precise Pad Conditioning
• Industry-Proven, Integrated Cleaning
Advanced Technologies
Increased Reliability
6EG Benefits
6EC Benefits
7AF Benefits
7AF Technologies
• In-feed technology
• In-situ thickness control
• Force adaptive grinding
• Linear traversing grind spindles
• Automated process control
• Thin wafer handling
7AF Applications
State-of-the-Art Technologies
7AF is now offered with ultra-fine grit grind wheels.
The ultra-fine grit grind wheels enhance die strength
and improve surface finish, making them well-suited
for the most demanding thin wafer applications.
Introduction
Strasbaugh’s offers two silicon polishers, a wax-mount and a free-mount system, designed for high-volume
production. Both polishers provide superior process performance, resulting in higher yields.
The 6DZ Single-Wafer, Wax-Mount Polisher, is the industry’s only fully-automated, wax-mount, silicon wafer
polishing system for prime wafer polishing. The STB P300 Silicon Polisher is particularly effective for final haze
removal.
• ViPRR and membrane wafer carriers improve TTV and reduce edge exclusion
• Defectivity controls reduce contamination and improve yield
• Reduced wafer handling further enhances yield
Applications
Wafer Sizes
• 100mm to 300mm
• Notched, flatted, and round wafers accommodated
Products
Single Wafer, Wax Mount Silicon Prime Wafer Polishing Equipment for Higher
Yields
6DZ Benefits
• High Yield; Low Cost of
Ownership
• Automated Step for Both Stock
and Finish Polishing
• Production-Proven with
Consistent Wafer-to-Wafer
Results
• Reliable Performance with
Unsurpassed MTBF
• Cassette-to-Cassette
Automated Wafer Handling
• Innovative Wax Mount
Technology Seals Wafer
Backside
• Single Wafer Processing Yields
Excellent TTV and STIR
• Available in 2 or 3 Polish Table
Configurations
The 6DZ consists of three major mechanical components (rough polisher, finish polisher and mounting area),
all housed within a protective enclosure. This wax-mount polisher features a superior mechanical design and
utilizes a PC-based computer for machine and process control functions. The combined benefits of an intuitive
control system and machine configuration allow uninterrupted cassette to cassette wax mount wafer polishing.
The results: a consistent, controllable process providing superior results and higher yield.
For more informatin on Strasbaugh's 6DZ Wax Mount Wafer Polisher, click here.
MEMS Polishing and Grinding
Introduction
Strasbaugh offers a complete polishing and grinding solution for MEMS applications. Our products are designed
for high reliability, superior process performance and low cost of ownership. State-of-the-art technologies enhance
process capability and make our products suitable for a broad range of applications.
For polishing, Strasbaugh offers the STB P300 and 6DS-SP CMP systems. The 7AF and the 7AA-II wafer grinders
provide precision surface grinding, while the 7AB Edge Profiler grinds the edge of the wafer.
• Force Adaptive, In-feed wafer grinding technology limits grind force, protecting fragile substrates, whle
optimizing throughput
• In-situ thickness measurement improves TTV and ensures wafer-to-wafer consistency
• Unique edge profiling technology
Applications
• Silicon
• Glass
Wafer Sizes
• 75mm to 300mm
• Notched, flatted, and round wafers accommodated
Products
Production Proven, Precision Edge Profiling for SOI and Stacked Wafer Applications
7AB Benefits
• High Throughput
• Proven Production Performance
• Advanced Engineering
• Automated Process Control
• High Quality Components & Subsystems
• Flexible Operation
• The System of Choice for High-Precision
Applications (i.e. SOI)
• Ideally Suited for Compound
Semiconductors, Stacked Wafers, Silicon
and Other Prime Wafers
7AB Applications
Automated Control
The 7AB is a fully automated system for precise edge
grinding. The system's reliable performance and
MTBF are maximized through self-diagnostic error
software.
To request more information on Strasbaugh's 7AB
edge grinder, click here.