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JMB385

JMB385 (Version D)

PCI Express to Card Reader


Host Controller

Data Sheet

Rev. 1.2

JMicron Technology Corporation


1F, No.13, Innovation Road 1,
Science-Based Industrial Park, Hsinchu, Taiwan, R.O.C
http://www.jmicron.com

Copyright © 2008 JMicron Inc. All rights reserved. 2008/12/01


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JMB385

© Copyright JMicron Technology, 2008.


All Rights Reserved.
Printed in Taiwan 2008
JMicron and the JMicron Logo are trademarks of JMicron Technology Corporation in Taiwan and/or other
countries. Other company, product and service names may be trademarks or service marks of others.

All information contained in this document is subject to change without notice. The products described in
this document are NOT intended for use implantation or other life supports application where malfunction
may result in injury or death to persons. The information contained in this document does not affect or
change JMicron’s product specification or warranties. Nothing in this document shall operate as an express
or implied license or environments, and is presented as an illustration. The results obtained in other
operating environments may vary.

THE INFORMATION CONTAINED IN THIS DOCUMENT IS PROVIEDE ON AN “AS IS” BASIS.


In no event will JMicron be liable for damages arising directly or indirectly from any use of the
information contained in this document.

JMicron Technology Corporation


1F, No.13, Innovation Road 1,
Science-Based Industrial Park
Hsinchu, Taiwan, R.O.C

For more information on JMicron products, please visit the JMicron web site at
http://www.jmicron.com or send email to sales@jmicron.com

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JMB385

Revision History
Version Date Revision Description
1.0 2008/11/06 Initial Release

1.1 2008/11/21 Change pin30 from TAV33 to NC


1.2 2008/12/01 Modify power consumption

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JMB385

Table of Contents
1. Overview......................................................................................................................................................5
2. Features ........................................................................................................................................................7
2.1 Compliance ........................................................................................................................................7
2.2 Overall................................................................................................................................................7
2.3 PCI Express........................................................................................................................................7
2.4 Memory Card .....................................................................................................................................7
2.5 DOS Utility ........................................................................................................................................7
3. Electrical Characteristic ...............................................................................................................................9
3.1 Absolute Maximum Rating................................................................................................................9
3.2 PCI Express PHY DC/AC Specification ...........................................................................................9
3.3 Digital DC/AC Specification ...........................................................................................................10
3.4 Power Specification .........................................................................................................................10
3.5 Power Supply Noise Requirement ...................................................................................................11
3.6 Transmitter Jitter Specification ........................................................................................................11
3.7 Reference Clock Input Requirement................................................................................................11
3.8 Card Reader Access Timing Characteristic .....................................................................................12
4. Pin Description...........................................................................................................................................15
4.1 Pin List Table & Floorplan...............................................................................................................15
4.2 System Control Pin ..........................................................................................................................17
4.3 PCI Express Analog Pin...................................................................................................................18
4.4 Card Reader Pin ...............................................................................................................................19
4.5 Power/Ground Pin............................................................................................................................22
5. Function Description..................................................................................................................................23
5.1 Block Diagram .................................................................................................................................23
5.2 Operating Mode Configuration........................................................................................................25
5.3 Clocking...........................................................................................................................................25
5.4 Reset and Disable Mechanism .........................................................................................................26
5.5 PCI Express Link .............................................................................................................................26
5.6 D3 Enhancement (D3E) Mode.........................................................................................................27
6. System Programming Interface..................................................................................................................28
6.1 Card Reader Pin Arrangement .........................................................................................................28
6.2 Software Development Resource.....................................................................................................29
6.3 Driver Supporting ............................................................................................................................29
7. Product Information ...................................................................................................................................30

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JMB385

1. Overview
JMB380/1/2/3/5/7 is product family that includes 1394 OHCI and Memory Card Reader Host
Controller. They are one-lane PCI Express to 1/2-port 1394a and 1/2-slot SD/MMC/MS/xD Memory Card
Reader Host Controller. The table below shows the brief feature lists of JMB38X product family.

Table 1.1 JMB38X Product Families


JMB380 JMB381 JMB382 JMB383 JMB385 JMB387
Host IF PCIe PCIe PCIe PCIe PCIe PCIe
1394a IF x1 Port x2 Port None x1 Port None None
Card Reader x1 Combo None x2 Combo x2 Combo x1 Combo x1 Combo
TQFP64
Package QFN48 LQFP48 LQFP64 (E-pad) LQFP48 LQFP48
Boot Function None None Support None None Support
Version A B A B A B C D A B
D3E x v x v x v v v v v
EEPROM v x v v v x x v x v
SPI(Boot) x x x x x x x x v v
CR1_CD2 x x x x x x v x v x
Co-layout Co-layout

For JMB380/5/7, only one set of 4-in-1 Combo Memory Card Reader Mechanism supporting no matter
which one of SD/MMC/MS/MS Duo/MS-HG (1/4/8-bit) & xD access at the same time due to only 48-pin
count. For JMB382/3, two sets of 4-in-1 Combo Memory Card Reader Mechanisms that include one of
SD/MMC/MS/MS Duo/MS-HG (1/4/8-bit) & xD and the other of SD/MMC/MS/MS Duo/MS-HG (1/4/8
-bit) at the same time. JMB382/3 is especially suitable for bigger NB when two Combo Memory Card
Reader slots needed access at the same time.
JMB380/2/3/5/7 is multi-function architecture on PCI domain. JMB381 has only 1394 OHCI
function. For 1394 OHCI function, JMB380/2/3 use Windows default driver to achieve better compatibility.
Of course, JMicron offers Windows / MAC driver on Memory Card Reader to achieve the better
compatibility and performance.
JMB380/1/2/3/5/7 supports hot-plug behavior on both 1394a ports and memory card slots. For 1394a
PHY, Programmable Output Swing Control is reserved for better compatibility. For memory card host
controller, the programmable IO driving capacity and dynamic pull high/low control is also reserved for
better system feasibility. These system feasibility guarantees better compatibility for all kinds of 1394a and
Memory Card Devices.

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JMB385

JMB380/5 Version A, JMB385 Version D, JMB387 Version B and JMB381/2/3 also reserve Serial
EEPROM interface for SVID/SSID/GUID programming. System makers can use Serial EEPROM to store
specific information in it. We also provide simple update & management tool for makers.
JMB380/1/2/3/5/7 might need some internal register setting for the best performance under different
platforms. We will provide the binary code for customers no matter binary code in Serial EEPROM or
binary code in Main BIOS.
JMB380/5 Version B/C/D and JMB387 supports D3 Enhancement (D3E) mode to make the lowest
power consumption when no 1394 device or memory cards inserted. It is very suitable for NB Application.
JMB385 Version C and JMB387 Version D use three dedicated card detection pins to detect
SD/MMC, MS and xD. These pins are connected to card connector. It can save BOM cost of one diode.

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JMB385

2. Features
2.1 Compliance
• Compliant with PCI Express Base Spec. Revision 1.1
• Compliant with SD Spec. Part 1 Physical Layer Spec. Version 2.00
• Compliant with SD Spec. Part A2 SD Host Controller Standard Spec. Version 2.00
• Compliant with SD Spec. Part E1 SDIO Spec. Version 2.00
• Compliant with SD Spec. Part 2 File System Spec. Version 2.00
• Compliant with MultiMediaCard System Spec. Version 4.2
• Compliant with Memory Stick Standard Format Spec. Version 1.43-00
• Compliant with Memory Stick Standard Memory Stick PRO Format Spec. – without security spec. –
Version 1.02-00
• Compliant with Memory Stick Pro-HG Duo Spec. Version 1.00
• Compliant with xD-Picture CardTM Card Spec. Version 1.20
• Compliant with xD-Picture CardTM Host Guideline Version 1.20
• Compliant with xD-Picture CardTM Host Compliance Design Check Spec. Version 1.20D
• Compliant with xD-Picture CardTM Format Spec. Version 1.11
• Compliant with System Management Bus Specification Revision 1.1

2.2 Overall
• Integrated PCI Express PHY and 2.5G PLL for PCI Express bus
• Output swing control and Automatic impedance calibration for PCI Express PHY
• Fabricated 0.18um/3.3V CMOS Standard Logic Process with single 3.3V power source
• JMB385 is available in 48-pin LQFP package
• Co-layout between JMB380, JMB381, JMB382 and JMB383
• Integrate External PMOS Power Switch for power control of memory card
• Integrate External Regulator for 1.8V Power source of JMB385 to save system BOM
• Support D3E mode to save more power when no 1394 device or memory card inserted

2.3 PCI Express


• Supports 1-Lane 2.5Gbps PCI Express bus
• Internal native interface multiplexed to Memory Card (SD/MMC/MS/xD)
• All registers of Memory Card accessible in unified memory space

2.4 Memory Card


• Supports 1 set of “4-in-1 Combo Memory Card Reader Mechanism”
• Programmable IO driving to adjust signal trace length
• Programmable pull high/low control for different memory card bus topology

2.5 DOS Utility


• Provide Serial EEPROM DOS Update Utility

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JMB385

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JMB385

3. Electrical Characteristic
3.1 Absolute Maximum Rating
Parameter Description Rating Unit
DV33 Digital IO Supply Voltage (Input) 3.96 V
DV18 Digital Core Power Voltage (Output) 2.02 V
APV18, APVDD PCIE Analog Power Voltage (Input) 2.02 V
VIN Input Voltage -0.3~VDD+0.3 V
0
ӨJC Thermal Resistance (Junction to Case) 29.37 C/W
0
TOPERATING Operating Environment Temperature 0~70 C
0
TSTORAGE Storage Temperature -25~135 C

3.2 PCI Express PHY DC/AC Specification


PCIE Spec JMB385
TX Parameter Min. Typ. Max. Min. Typ. Max. Unit Note
T UI 399.88 400 400.12 399.99 400.00 400.02 ps SSC is off
V tx_diff_pp 0.8 1.2 1.0 V Differential amplitude
V tx_de_ratio -3 -3.5 -4 -3.38 dB
T tx_eye 0.75 0.8563 UI @APTXP/N
T tx_eye_median_to_max_jitter 60 26.23 30.35 36.47 ps
T tx_rise 50 69.41 ps 20%~80% @APTXP/N
T tx_fall 50 71.16 ps 80%~20% @APTXP/N
V tx_cm_ac_p 20 11 mV
V tx_dc_cm 0 3.6 1.177 V
V tx_rcv_detect 600 244 mV
Z tx_diff_dc 80 100 120 95 ohm Differential impedance
C tx 75 200 100 nF AC coupled Cap.
RX Parameter Min. Typ. Max. Min. Typ. Max. Unit Note
T UI 399.88 400 400.12 399.98 400.00 400.02 ps SSC is off
V rx_diff_pp 0.175 1.2 0.869 V Differential amplitude
T rx_eye 0.4 0.85 UI @APRXP/N
T rx_eye_median_to_max_jitter 120 24.03 29.55 39.42 ps
V rx_cm_ac_p 150 84 93.57 104 mV
Z rx_diff_dc 80 100 120 95 ohm Differential impedance
V rx_idle_det_diff_pp 65 175 115 mV
ps. All symbols used are followed PCI Express Base Specification Revision 1.1.

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JMB385

3.3 Digital DC/AC Specification


Parameter Min. Typ. Max. Unit Note
DC driving at VOH(min) 8 mA Measured at GPIO1 pin
DC driving at VOL(max) 8 mA Measured at GPIO1 pin
Output High Voltage VOH 2.4 V
Output Low Voltage VOL 0.4 V
Input High Voltage VIH 1.5 V @GPIO1 pin, 8mA
Input Low Voltage VIL 1.28 V @GPIO1 pin, 8mA
Weak pull high R value 70.0 kΩ Measured at GPIO1 pin
Weak pull low R value 70.0 kΩ Measured at GPIO1 pin
AC rising time 3.6 ns @GPIO1 pin, 8mA, 10%~90%, 20pF loading
AC falling time 3.8 ns @GPIO1 pin, 8mA, 10%~90%, 20pF loading

3.4 Power Specification


Parameter Min. Typ. Max. Unit Note
Digital IO (DV33) 3.14 3.3 3.63 V -5%~10%
Digital 3.3V Power 3.14 3.3 3.63 V -5%~10%
Digital Core (DV18) 1.76 1.85 1.95 V -5%~5%
PCIE PHY Power (APV18+APVDD) 1.76 1.85 1.95 V -5%~5%
Digital Core (DV18 from DV33) 45.0 mA Measured under memory card access
Digital IO (DV33) 45.0 mA Measured under memory card access and
including power consumption of memory card
PCIE PHY Power (APV18+APVDD 80.0 mA Measured under memory card access
from DV33)
Digital 3.3V Power 1.0 mA Measured under memory card access
All Power Source (DV18+DV33+ 30.0 80.0 mA Normal D3(HOT) Power Down Mode
APV18+APVDD)
All Power Source (DV18+DV33+ 0.5 1.0 mA Advance D3E(HOT) Power Down Mode
APV18+APVDD)
0
Surface Temperature TCASE 45.1 C @JMicron EVB under room temperature 250C
0
Surface Temperature Range TCASE 100 C

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3.5 Power Supply Noise Requirement


Parameter Min. Typ. Max. Unit Note
Digital 3.3V Power 100 mV
Digital IO (DV33) 250 mV
1.8V Power (DV18/APVDD/APV18) 100 250 mV Need de-coupled capacitors

3.6 Transmitter Jitter Specification


Parameter Min. Typ. Max. Unit Note
PCIE PHY short-term jitter 70 ns @N=5
PCIE PHY long-term jitter (1) 75 90 ns @N=250
PCIE PHY long-term jitter (2) 75 250 ns @N=10000

3.7 Reference Clock Input Requirement


Parameter Min. Typ. Max. Unit Note
Absolute Max. Input Voltage VMAX 1.15 V
Absolute Min. Input Voltage VMIN -0.3 V
Input High Voltage VIH 150 mV @APCLKP&APCLKN, Differential waveform
Input Low Voltage VIL -150 mV @APCLKP&APCLKN, Differential waveform
Absolute cross point voltage VCROSS 250 550 mV Single ended waveform
Variation of VCROSS VCROSS DELTA 140 mV Single ended waveform
Ring-back Margin VRB -100 100 mV Differential waveform
Time before VRB TSTABLE 500 ps Differential waveform
Average Clock Accuracy TPERIOD AVG -300 2800 ppm Differential waveform, SSC is ON
Absolute Period TPERIOD ABS 9.847 10.203 ps Differential waveform, cycle-to-cycle jitter, PPM
& SSC effect are included
Cycle-to-cycle jitter TCCJITTER 150 ps Differential waveform
Rising Edge Rate 0.6 4.0 V/ns Between VIH and VIL
Falling Edge Rate 0.6 4.0 V/ns Between VIH and VIL
Rise-Fall Matching 20 % Single ended waveform
Duty Cycle 40 60 % Differential waveform
Clock Source Impedance ZC-DC 40 60 Ω Single ended impedance

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JMB385

3.8 Card Reader Access Timing Characteristic


3.8.1 SD Timing
SD Spec. JMB380
Default Mode Min. Typ. Max. Min. Typ. Max. Unit Note
f PP 0 25 24.96 MHz
CLK f OD 0 400 195.0 kHz
t WL 10 17.89 ns @10% level
t WH 10 19.86 ns @90% level
t TLH 10 1.53 ns 10%~90% @card
t THL 10 0.64 ns 90%~10% @card
CMD & DAT t ISU 5 28.0 ns 90% level @card
(Output) t IH 5 9.6 ns 90% level @card
SD Spec. JMB380
High Speed Mode Min. Typ. Max. Min. Typ. Max. Unit Note
f PP 0 50 49.75 MHz
CLK t WL 7 8.05 ns @10% level
t WH 7 9.8 ns @90% level
t TLH 3 1.54 ns 10%~90% @card
t THL 3 0.62 ns 90%~10% @card
CMD & DAT t ISU 6 10.4 ns 90% level @card
(Output) t IH 2 7.0 ns 90% level @card
ps. All symbols used are followed SD Specification Part 1 Physical Layer Specification Version 2.00

3.8.2 MMC testing Result


MMC Spec. JMB380
Backward Compatible Mode Min. Typ. Max. Min. Typ. Max. Unit Note
f PP 0 20 19.97 20 MHz
CLK f OD 0 400 195.3 kHz
t WL 10 24.5 ns @10% level
t TLH 10 1.6 ns 10%~90% @card
t THL 10 0.48 ns 90%~10% @card
CMD & DAT t ISU 3 34.4 ns 90% level @card
(Output) t IH 3 15.6 ns 90% level @card
MMC Spec. JMB380
High Speed Mode Min. Typ. Max. Min. Typ. Max. Unit Note
f PP 0 26/52 49.5 MHz tolerance:100KHz

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JMB385

CLK f OD 0 400 195.2 kHz tolerance:20KHz


t WL 6.5 9.87 ns @10% level
t TLH 3 1.57 ns 10%~90% @card
t THL 3 0.64 ns 90%~10% @card
CMD & DAT t ISU 3 11.77 ns 90% level @card
(Output) t IH 3 8.3 ns 90% level @card
ps. All symbols used are followed MultiMediaCard System Specification Version 4.2

3.8.3 MS testing Result


MS Spec. JMB380
Serial Interface Min. Typ. Max. Min. Typ. Max. Unit Note
t SCLKc 50 50 50.2 ns 50%~50% @card
t SCLKwh 15 25.5 ns @90% level
SCLK t SCLKwl 15 24.6 ns @10% level
t SCLKr 10 2.13 ns 10%~90% @card
t SCLKf 10 2.33 ns 90%~10% @card
t BSsu 5 24.5 ns 50%~2/80% @card
BS t BSh 5 23.9 ns 50%~2/80% @card
t BSr 10 1.77 ns 10%~90% @card
t BSf 10 1.83 ns 90%~10% @card
t Dsu 5 23.8 ns 50%~2/80% @card
DATA t Dh 5 25.1 ns 50%~2/80% @card
t Dr 10 1.38 ns 10%~90% @card
t Df 10 1.4 ns 90%~10% @card
t Dd 15 8.86 ns 50%~2/80% @card
MS Spec. JMB380
Parallel Interface Min. Typ. Max. Min. Typ. Max. Unit Note
t SCLKc 25 25 25.3 ns 50%~50% @card
t SCLKwh 5 10.2 ns @90% level
SCLK t SCLKwl 5 15.2 ns @10% level
t SCLKr 10 2.15 ns 10%~90% @card
t SCLKf 10 1.93 ns 90%~10% @card
t BSsu 8 17.5 ns 50%~2/80% @card
BS t BSh 1 5.5 ns 50%~2/80% @card
t BSr 10 2.24 ns 10%~90% @card

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JMB385

t BSf 10 4.13 ns 90%~10% @card


t Dsu 8 17 ns 50%~2/80% @card
DATA t Dh 1 6.5 ns 50%~2/80% @card
t Dr 10 1.69 ns 10%~90% @card
t Df 10 3.36 ns 90%~10% @card
t Dd 15 9.97 ns 50%~2/80% @card
ps. All symbols used are followed Memory Stick PRO Format Specification - without security specification – ver.1.02-00

3.8.4 xD testing Result


xD Spec. JMB380
Min. Typ. Max. Min. Typ. Max. Unit Note
T CLS 20 50.3 ns 50%~50% @card
T CLH 40 49.5 ns 50%~50% @card
T CS 20 49.2 ns 50%~50% @card
T CH 40 200.5 ns 50%~50% @card
T WP 40 50 ns 50%~50% @card
T ALS 20 49.7 ns 50%~50% @card
T ALH 40 50.4 ns 50%~50% @card
T DS 30 49.6 ns 50%~50% @card
T DH 20 50.3 ns 50%~50% @card
T WC 80 100.2 ns 50%~50% @card
T WH 20 50 ns 50%~50% @card
T WW 100 585 ns 50%~50% @card
T RR 20 183 ns 50%~50% @card
T RP 60 75 ns 50%~50% @card
T RC 80 8.45 ns 50%~50% @card
T CEH 100 24 ns 50%~50% @card
T REH 20 24 ns 50%~50% @card
T WHR 50 60 ns 50%~50% @card
T AR1 100 120 ns 50%~50% @card
T AR2 50 80 ns 50%~50% @card
T CR 100 250 ns 50%~50% @card
TM
ps. All symbols used are followed xD-Picture Card Card Specification Vision 1.2

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JMB385

4. Pin Description
JMB385 is LQFP48 package. The pin list table and pin floorplan of JM385 is list as below.

A: Analog, D: Digital, I: Input, O: Output, Z: I/O, L: Internal pull-low, H: Internal pull-low, S: Smittch Trigger Input,
OD: Open-Drain, PWR: Power, GND: Ground

4.1 Pin List Table & Floorplan


Table 4.1 Pin List Table of JMB385 Version D
No. Pin Name No. Pin Name No. Pin Name No. Pin Name
1 XRSTN 13 CPPEN 25 MDIO12 37 DV18
2 XTEST 14 SEECLK 26 MDIO11 38 NC
3 APCLKN 15 CR1_CD1N 27 MDIO10 39 SEEDAT
4 APCLKP 16 CR1_CD0N/WAKEN 28 MDIO9 40 MDIO7
5 APVDD 17 CR1_PCTLN 29 MDIO8 41 MDIO6
6 APGND 18 DV18 30 NC 42 MDIO5
7 APREXT 19 DV33 31 GND 43 MDIO4
8 APRXP 20 DV33 32 GND 44 DV33
9 APRXN 21 CR1_LEDN 33 GND 45 MDIO3
10 APV18 22 MDIO14 34 NC 46 MDIO2
11 APTXN 23 MDIO13 35 NC 47 MDIO1
12 APTXP 24 GND 36 NC 48 MDIO0

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JMB385

Figure 4.1 Pin Floorplan of JMB385 Version D

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4.2 System Control Pin


Table 4.2 System Control Pin
Signal Location Type Description
XRSTN 1 DIHS Whole Chip Reset#. Low-active.
It is used to reset whole chip except PLL.
XTEST 2 DIL Test Mode Enable. High-active.
It enables Testing and Debug mode. All Testing and Debug modes definition is
referenced in Section 5.2.
CPPEN 13 DO CPPEN for D3E Mode.
8mA It is low active to inform NB or SB that JMB38X hopes to wake from D3E
mode.
SEECLK 14 DOH JMB385 Serial Interface Clock. This serial interface has multiple functions
8mA Serial EEPROM Master: Clock Output
SMBUS Slave (address h’46) on SMBUS: Clock Output
SEEDAT 39 DZH Serial Interface Data.
8mA Serial EEPROM Master: Data Input/Output
SMBUS Slave (address h’46) on SMBUS: Data Input/Output
CR1_LEDN 21 DOH 1st Card Slot LED Indicator. It is CMOS push/pull type only.
(GPIO0) 8mA LED Indicator when SD/MMC/MS/xD Card access. Please reference
Application Schematic for detail LED setting.
CR1_PCTLN 17 DO 1st Card Slot Power Line. It is driving power for SD/MMC/MS/xD Card
(GPIO1) (PWR) Reader directly. Please note that at least 20 mil trace width is necessary and
250mA needs 10uF and 0.1uF de-coupled capacitors near pin.
CR1_CD0N/ 16 DIH 1st Card Slot Card Detection Pin 0/ NB or SB wakes JMB38X (see note)
WAKEN Pin status: Show at E0h.[11] when XRSTN de-assert to select mode
(GPIO2) SD/MMC: Card Detection Pin for SD/MMC Card insertion (low active)
SD/MMC: (CR1_CD1N,CR1_CD0N) = 2’b10
xD: (CR1_CD1N,CR1_CD0N) = 2’b00
Note: Please reference D3E Application Note for “NB or SB wakes
JMB38X” system behavior in detail.
CR1_CD1N 15 DIH 1st Card Slot Card Detection Pin 1.
GPIO3) Pin status: Show at E0h.[10] when XRSTN de-assert to select mode
MS: Card Detection Pin for MS Card access (low active)
MS: (CR1_CD1N,CR1_CD0N) = 2’b10
xD: (CR1_CD1N,CR1_CD0N) = 2’b00

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JMB385

4.3 PCI Express Analog Pin


Table 4.3 PCI Express Analog Pin
Signal Location Type Description
APTXP 12 AO PCI Express Serial Data Transmitter.
It transmits positive output of differential signal.
APTXN 11 AO PCI Express Serial Data Transmitter.
It transmits negative output of differential signal.
APRXP 8 AI PCI Express Serial Data Receiver.
It receives positive input of differential signal.
APRXN 9 AI PCI Express Serial Data Receiver.
It receives negative input of differential signal.
APREXT 7 AI PCI Express External Reference Resistor.
An external 8.2KΩ resistor should be connected and bypass to the APGND.
APCLKP 4 AI PCI Express PHY Differential Clock+ Input.
If it is differential clock signal, The 100MHz signal is from PCI Express finger.
APCLKN 3 AI PCI Express PHY Differential Clock- Input.
If it is differential clock signal, The 100MHz signal is from PCI Express finger.

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JMB385

4.4 Card Reader Pin


Table 4.4 Card Reader Pin
Signal Location Type Description
MDIO0 48 DZ 1st Card Slot Digital IO Pin 0.
8mA SD: Data Bus Bit 0
MMC: Data Bus Bit 0
MS: Data Bus Bit 0
xD: Data Bus Bit 0
MDIO1 47 DZ 1st Card Slot Digital IO Pin 1.
8mA SD: Data Bus Bit 1
MMC: Data Bus Bit 1
MS: Data Bus Bit 1
xD: Data Bus Bit 1
MDIO2 46 DZ 1st Card Slot Digital IO Pin 2.
8mA SD: Data Bus Bit 2
MMC: Data Bus Bit 2
MS: Data Bus Bit 2
xD: Data Bus Bit 2
MDIO3 45 DZ 1st Card Slot Digital IO Pin 3.
8mA SD: Data Bus Bit 3
MMC: Data Bus Bit 3
MS: Data Bus Bit 3
xD: Data Bus Bit 3
MDIO4 43 DZ 1st Card Slot Digital IO Pin 4.
12mA SD: Command Line Signal
MMC: Command Line Signal
MS: Bus State Signal
xD: Write Enable (low active) Signal
MDIO5 42 DZ 1st Card Slot Digital IO Pin 5.
12mA SD: Clock Signal
MMC: Clock Signal
MS: Clock Signal
xD: Card Select (low active) Signal
MDIO6 41 DZ 1st Card Slot Digital IO Pin 6.
8mA SD: Write Protection (high active) Signal
MMC: Write Protection (low active) Signal
MS: No used

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JMB385

xD: Write Protection (low active) Signal


MDIO7 40 DZ 1st Card Slot Digital IO Pin 7.
8mA SD: No used
MMC: No used
MS: No used
xD: Command Latch (high active) Signal
MDIO8 29 DZ 1st Card Slot Digital IO Pin 8.
8mA SD: No used
MMC: Data Bus Bit 4
MS: Data Bus Bit 4 (only for MS-Pro HG)
XD: Data Bus Bit 4
MDIO9 28 DZ 1st Card Slot Digital IO Pin 9.
8mA SD: No used
MMC: Data Bus Bit 5
MS: Data Bus Bit 5 (only for MS-Pro HG)
xD: Data Bus Bit 5
MDIO10 27 DZ 1st Card Slot Digital IO Pin 10.
8mA SD: No used
MMC: Data Bus Bit 6
MS: Data Bus Bit 6 (only for MS-Pro HG)
xD: Data Bus Bit 6
MDIO11 26 DZ 1st Card Slot Digital IO Pin 11.
8mA SD: No used
MMC: Data Bus Bit 7
MS: Data Bus Bit 7 (only for MS-Pro HG)
xD: Data Bus Bit 7
MDIO12 25 DZ 1st Card Slot Digital IO Pin 12.
8mA SD: No used
MMC: No used
MS: No used
xD: Read Enable (low active) Signal
MDIO13 23 DZ 1st Card Slot Digital IO Pin 13.
8mA SD: No used
MMC: No used
MS: No used
xD: Ready (high active)/ Busy (low active) Signal
MDIO14 22 DZ 1st Card Slot Digital IO Pin 14.

Copyright © 2008 JMicron Inc. All rights reserved. 2008/12/01


Data Sheet Reversion 1.2 Page 20 NDA Required
JMB385

8mA SD: No used


MMC: No used
MS: No used
xD: Address Latch (high active) Signal

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JMB385

4.5 Power/Ground Pin


Table 4.5 Power and Ground Pin
Signal Location Type Description
APVDD 5 PWRI Analog PCI Express PHY Power Supply.
It is 1.8V power pins and should be bypassed to ground by a 10uF, 0.1uF &
1000pF capacitance.
APV18 10 PWRI Analog PCI Express PHY Power Supply.
It is 1.8V power pins and should be bypassed to ground by 0.1uF capacitance
and shared 10uF with APVDD.
APGND 6 GND Analog PCI Express PHY Ground. It is ground for APVDD & APV18.
DV33 19,20,44 PWRI Digital Power Supply.
It is 3.3V power source and should be bypassed to ground by a 0.1uF
capacitance and share big capacitors with 3.3V main power.
DV18 18,37 PWRO Digital Power Supply.
It is 1.8V power pins and should be bypassed to ground by 0.1uF capacitance
and shared 10uF with APVDD. This power source is generated by internal
Regulator.
GND 24,31,32, GND Ground. It is ground for DV33 and DV18.
33

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JMB385

5. Function Description
JMB385 is a highly integrated single chip. It builds in 2.5GHz PLL and internal regulator to achieve
high-speed serial data transmission. Memory Card Interface that supports SD/MMC/MS/xD creates
feasible storage device connectivity. With 48-pin low pin-count package, it makes easy system application,
especially on NB. Favor to PCI Express bus, high performance and low pin count are major advantages on
hardware viewpoint of JMB385.
From Driver view, JMB385 supports multiple-function mode that includes SD/MMC/MS and xD
functions.

5.1 Block Diagram


The Figure 5.1 shows the Block Diagram of JMB385. Yellow parts define pins of JMB385. Gray part
includes PCI Express PHY and Memory Card pins. Light Green parts define protocol view of PCI Express
and other color parts define protocol view of SD/MMC/MS and xD.

Figure 5.1 Function View of JMB385

Figure 5.2 shows Block Diagram of Card Reader of JMB385. For each host controller of SD/MMC,
MS and xD, they all have one PCI Configuration Space and its Host Controller Register Space. For
registers in PCI Configuration Space, they define general behavior on system. For registers in Host
Controller Register Space, they define specific memory card behavior, just like DMA, Interrupt and Error
handling.

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JMB385

Figure 5.2 Block Diagram of Card Reader in JMB385

JMB385 supports 1 set of combo memory card at the same time. Due to pin limitation, first set of
memory card supports SD/MMC/MS MS Duo/MS-HG (1/4/8-bit) and xD. For different memory card, they
usually operate under different working frequency. So, frequency synchronizer is necessary to in-sync
memory card protocol control and internal FIFO control.
Table 5.1 lists all PCI Function List on SD/MMC/MS and xD.

Table 5.1 JMB385 PCI Function List


Part Number JMB385
SD/MMC Function No. Function 0
SD Standard Function No. Function 2
MS Function No. Function 3
xD Function No. Function 4

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Data Sheet Reversion 1.2 Page 24 NDA Required
JMB385

5.2 Operating Mode Configuration


JMB385 uses XTEST, CR1_CD0N and CR1_CD1N pins to define 4 operation modes. These modes
except Normal are reserved for Testing before JMB385 is shipment.
IDDQ mode is used for testing on power consumption, especially on current leakage. BIST/FL Mode
is BIST mode and Far-end Loopback. After negotiation by protocol of PCI Express, JMB385 transmits an
expected data pattern to opposite DUT, and the opposite DUT transmits its received data patterns directly.
JMB385 compares received data pattern with expected value to report status. At the same time, BIST
module will write/read internal FIFO with predicted pattern to check FIFO.
The last mode is Nandtree. All digital IO pins are chained with NAND type to check mounting status
on EVB with all input data pattern is 1.
Table 5.2 JMB385 Operating Modes
Normal IDDQ BIST/FL Nandtree
XTEST 0 1 1 1
CR1_CD0N x 0 0 1
CR1_CD1N x 0 1 1

5.3 Clocking
There are 5 clock domains existed that is in PCI Express, SD/MMC, MS and xD.
Clock Rate of internal Phase Locked Loop (PLL) of PCI Express is 2.5GHz. The clock rate for
internal parallel bus is 250MHz under 8-bit data bus and 62.5 MHz under 32-bit data bus.
For SD/MMC, the shared clock topology and its maximum clock rate is up to 50MHz. For MS, the
maximum clock rate is up to 60MHz. For xD, the maximum clock rate is up to 25MHz. Table 5.3 shows
the corresponding relationship between them.

Table 5.3 JMB385 Clock Domain List


Clock Domain Maximum Clock rate
PCI Express PHY 250MHz
PCI Express Controller 62.5MHz
SD/MMC Host Controller 50MHz
MS Host Controller 60MHz
xD Host Controller 25MHz

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Data Sheet Reversion 1.2 Page 25 NDA Required
JMB385

5.4 Reset and Disable Mechanism


There are 3-level reset mechanisms in JMB385, Chip Reset, Protocol Reset and Domain Reset
controlled by internal registers.
JMB385 uses XRSTN pin for Chip Reset that is Fundamental Reset from Pin 11 of Side A on PCI
Express slot. Besides external Chip pin, internal Power-On Reset (POR) signal is also used for Chip Reset.
The latest finishing timing for these signals is final Chip Reset of JMB385. At this time, PCI Express clock
source is already ready.
Another Reset mechanism is Protocol Reset existed in both PCI Express protocol. Protocol Reset of
PCI Express is de-asserted after Configuration.Linkwidth.Accept State and assert again when Detect,
Disable, Hot Reset or Loopback State. When Protocol Reset asserts, some PCI Configuration Register
(00~3F) must be clear to default value to fit PCI-SIG Compliance Testing.
The other Reset mechanism is Domain Reset. All function domains have itself “Reset Register” in
PCI Configuration Register Space. BIOS or Driver can reset each function domains if reset action is
necessary.
JMB385 reserves Disable mechanism for un-used memory card functions. These un-used functions
can be disabled by internal register setting through Software Programming or Serial EEPROM Master
Interface.

5.5 PCI Express Link


JMB385 is compliant with PCI Express Base Specification Revision 1.1. After Chip Reset period,
PCI Express Link Initialization is needed before Host and JMB385 start to communicate with TLP. It
includes PLL Locking, Receiver Detection, Link Training and Configuration with TS ordered set and Data
Link Layer Configuration with initial FC DLLP. Their relations are like con-circle that one step is Ok and
then later step starts.
After clock source of PCI Express is applied, PLL is stable and locking its phase to reference clock
under specific time. During this unstable-clock time period, internal POR is assert to keep Chip Reset of
JMB385. Receiver Detection starts repeating until finding differential 100Ω termination at opposite side
under stable clock. After locking COM code, MAC layer starts to train and configure PCI Express Link.
Through TS ordered set, link number, lane number and some control capability of opposite side are
available for Link Maintain when errors occurred in Physical Layer. When MAC finishes its initial
behavior, link-up status is reporting to Data Link Layer. And Data Link Layer starts its initialization with
initial FC DLLP to exchange FIFO status of opposite side as Flow Control credit value. After these actions,
TLP is starting to communicate each other from BIOS or Driver of Host to get status of JMB385.
There are 2 power management modes of PCI Express. One is PCI-PM from Driver view and another
is ASPM. ASPM is hardware-controlled actions without software effort and makes 2 Link PM State L0 and
L0s existed under D0 state. For PIPE interface of PCI Express PHY, PIPE-PM is combined with PCI-PM
and ASPM. Table 5.4 shows all PM relations and MAC LTSSM State.

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Data Sheet Reversion 1.2 Page 26 NDA Required
JMB385

Table 5.4 PCI-PM, ASPM and PIPE-PM Relation


PCI-PM Link-PM LTSSM PIPE-PM Active Condition Description
D0 L0 L0 P0 Normal operation.
D0 L0s L0s P0 ASPM and ASPM condition are both active
D3HOT L1 L1 P1 Non-D0 code and DLLP PM Protocol are both OK
D3HOT L2/3 Ready L2 P2 TLP PM Message and DLLP PM Protocol are both OK

5.6 D3 Enhancement (D3E) Mode


JMB385 Version B/C/D and JMB387 A/B supports D3 Enhancement (D3E) mode to make the lowest
power consumption when no memory cards inserted. It is very suitable for NB Application to reduce more
power consumption under so-called IDLE mode.
From system view, there are 2 ways to pull D3E_WAKEN signal to inform system that JMB385 is
wake up from D3E mode. One is D3E_WAKEN is connected to GPIO pin of South Bridge with on-board
or on-chip pull high resistor that is must within the same 3.3V Power Domain to avoid current leakage
under System S3 mode. The other is connecting to Embedded Controller on NB or Super IO Controller on
MB that is used to generate an interrupt event to inform system that PCIe link status of JMB385 changes.
If you want to implement D3E mode of JMB385, please directly contact your AE window to get the
fully supporting on HW and BIOS.

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Data Sheet Reversion 1.2 Page 27 NDA Required
JMB385

6. System Programming Interface


There are some Programming interfaces to expansion system application that are Card Reader
Interface, and Software Development Resource.
Card Reader Interface is used to control command and data transfer between memory card and
JMB385. Please reference Compliance List in Chapter 2 for the detail registers programming. GPIO
Interface has dedicated function on JMB385. It controls card detection on combo memory card mechanism,
LED to show up memory card access and external PMOS Power switch for memory cards.
Software Development Resource is included 2 set of Timer with Interrupt mechanism and 2 DW free
spaces to store some extra information between hardware, software and system.

6.1 Card Reader Pin Arrangement


Digital pins named as MDIO of JMB385 has dedicated functions when Card Reader (SD, MMC, MS
or xD) function turns on. The table below describes the full configuration and normal function of MDIO
pins.
Except MDIO pins, there is one IO group that have dedicated function when card Reader (SD, MMC,
MS or xD) function turns on. The table below describes the full configuration and normal function of
GPIO pins.
Table 6.1 Card Reader Pin Configuration and Function Table
Pin Name Default Mode SD/MMC Card MS Card XD Card
MDIO0 SD/MMC/MS/xD SD1_DAT0 MS1_DAT0 XD_DAT0
MDIO1 SD1_DAT1 MS1_DAT1 XD_DAT1
MDIO2 SD1_DAT2 MS1_DAT2 XD_DAT2
MDIO3 SD1_DAT3 MS1_DAT3 XD_DAT3
MDIO4 SD1_CMD MS1_BS XD_WE#
MDIO5 SD1_CLK MS1_CLK XD_CE#
MDIO6 SD1_WP XD_WP#
MDIO7 XD_CLE
MDIO8 MMC_DAT4 MS1_DAT4 XD_DAT4
MDIO9 MMC_DAT5 MS1_DAT5 XD_DAT5
MDIO10 MMC_DAT6 MS1_DAT6 XD_DAT6
MDIO11 MMC_DAT7 MS1_DAT7 XD_DAT7
MDIO12 XD_RE#
MDIO13 XD_R/B#
MDIO14 XD_ALE
CR1_LEDN SD1_LED# MS1_LED# XD_LED#

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Data Sheet Reversion 1.2 Page 28 NDA Required
JMB385

CR1_PCTLN SD1_PCTL# MS1_PCTL# XD_PCTL#


CR1_CD0 SD1_CD# XD_CD#
CR1_CD1 MS1_CD# XD_CD#

6.2 Software Development Resource


Inside JMB385, there are 2 Software Timer with Interrupt. It is generally used for accurate timeout
control and generate interrupt message for SD, MMC, MS and xD functions by software setting. They are
located at E8h.[31:0] and ECh.[31:0] and have the same meaning in register fields.
Programmer sets proper timeout count value (time base is 256ns) at E8h.[26:0], selects proper
function (SD, MMC, MS or xD) at E8h.[29:28] for this Timer, enable interrupt at E8h.[30], and then
enable Timer at E8h.[31]. When the Timer counts to E8h.[26:0], one interrupt status bit appears at E8h.[27],
and generate interrupt message according to function selection (E8h.[29:28]) and interrupt enable
(E8h.[30]).
There are 2 free double-word locations for development. One is located at F0h.[31:0] and reserved
for Software Development. The other is located at F4h.[31:0] and reserved for Firmware Development.
The detail definition will be final later when Software or Firmware needs to communicate with HW or
Main system BIOS.

6.3 Driver Supporting


JMB385 needs System Driver to initial the best performance through internal registers based on
different platform. JMicron will provide Windows XP/Vista 32/64-bit and MAC OS X driver.

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Data Sheet Reversion 1.2 Page 29 NDA Required
JMB385

7. Product Information
JMicron uses 12 digits number for part number.
1 2 3 4 5 6 7 8 9 10 11 12
Ex: J M B 3 8 5 - L G E Z 0 D

Part No
The comparison table of numbering
Digit Classification Numbering Definition
1~2 Brand Name JM JMicron
B: Bridge
C: Communication
P: PHY Chip
3 Product Index B,C,P…
S: SOC
V: Video
E: EVB (Evaluation Board)
4~6 Product Serial Number 001~999 A serial no, it’s up to the real situation
7 Assembly Type T, L, S… See the comparison table of assembly type
S: Standard Package
8 Environment Indicate S, G
G: Green Package
9 Bonding Type A~Z Same product has a different bonding, from A~Z
Same product has a code mask change, from
10~11 Code Mask A0~Z9
A0~Z9, ROM-free default is Z0
12 Version Code A~Z Dice Revision (From A to Z)

The comparison table of package type


Numbering Assembly Type
T TQFP
L LQFP
Q QFN
S SOP
N TSSOP
R SSOP
B BGA
JMB385 is fabricated with 0.18um/3.3V CMOS Standard Logic Process with 1.8V and 3.3V power

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Data Sheet Reversion 1.2 Page 30 NDA Required
JMB385

source that 1.8V power source is generated internally. JMB385 is available in LQFP48 package. Figure 7.1
shows the physical dimension of JMB385.

Figure 7.1 Physical Dimension of JMB385

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Data Sheet Reversion 1.2 Page 31 NDA Required

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