A European Project supported through the Seventh Framework Programme for Research and Technological Development

ContExt
3D integration is a rapidly emerging technology that vertically stacks and interconnects multiple materials, technologies, and functional components to form highly integrated micro- and nanosystems for cross-sectorial applications such as medical implantable devices, intelligent sensors, flash memory, computer memory, camera chips, and radio frequency devices in mobile phones. 3D integration is a very promising area of technological development and shows huge economic potential; The state-of-the-art technology for 3D integration relies on robotic pick-and-place machines and machine vision, which cannot be simultaneously very fast and very accurate. If high precision e.g. a micrometer is needed, the cycle time of the integration can be very long, from e.g. over ten seconds to minutes, or even not achievable. Concept of self alignment : Self alignment will contribute to fast and accurate 3D integration. The inaccuracy of a fast pick and place process is compensated by a liquid layer that generates the driving force for accurate alignment.

sELF ALiGnmEnt For 3D intEGrAtion

Component and interface design are important items in FAB2ASM enabling self alignment. Essential for 3D integration is stacking of chips including electrical connection by through silicon vias. Main step for 3D Integration Component and interface design

Ultrafast robotic coarse placing

High precision self-alignment

Fixing and Bonding

MEMS Logic DRAM

RF Analog

3D Integration

obJECtivEs
FAB2ASM will develop a new manufacturing technology for 3D integration of microelectronics and microsystems which is simultaneously very fast and very accurate which currently is the bottle neck limiting industry take-up. FAB2ASM will overcome the current conflict between speed and accuracy by joining the traditional robotic tools with the physics of self-alignment where tiny chips will align due to surface tension of liquid or other physical forces acting at the microscale. FAB2ASM will develop a highly industry relevant technology that not only reuses most of the industrial process steps, but also improves the performance of the integration process in terms of precision and efficiency. FAB2ASM will allow handling of small (100 m) and/or thin dies (20 m) and ultra high speed assembly (40,000 unit per hour), while ensuring industry proven reliability. Three industry-led demonstrators will validate the achievements in the fields of manufacturing equipment, photonic IC and microelectronics.

Microfabrication Surface chemistry Robotics

Microelectronics Optoelectronics Nanomaterials

ProJECt struCturE
WP1: Specifications and roadmapping Applied research WP2: Components and Interfaces (IMEC) WP3: High Precision Assembly (UFC) WP4: Bonding and Joining (EMPA) WP7: Dissemination, training and exploitation (UT) WP8: Management (AALTO) Industrial development Demonstration

WP5: Integration and Reliability (AALTO)

WP6: Demonstrations (NXP)

Consortium

Industrial partners Beam Express, Switzerland NXP, The Netherlands Management consulting ALMA Consulting Group, France

Research partners AALTO University, Finland (coordinator) University of Twente, The Netherlands University of Franche-Comt, France EMPA, Switzerland IMEC, Belgium

ACKnoWLEDGmEnt
Supported by the European commission through the 7th Framework Programme for Research and development with up to 4.7 Mio out of a total budget of 7.1 Mio This 3 year project will run from 1st May 2010 to 30th April 2013.

www.fab2asm.eu
Project Coordinator: Aalto University Dr. Tech., Adjunct Professor Quan Zhou, +358 9 470 25241 quan.zhou@tkk.fi With the support of: ALMA Consulting Group Emmanuelle Bur, +33 (0)4 72 35 88 27 ebur@almacg.com