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ABSTRACT
A gas or vapor compressor is one of the key components of INTRODUCTION
many engineering systems, such as certain designs of vapor Advances in micro-fabrication capabilities over the last
compression refrigeration systems, cryo-coolers, air handlers. decades have facilitated a new era in miniaturization of
For meso-scale systems with linear dimensions of a few engineering systems. Photolithography, thin-film deposition
centimeters, conventional designs do not work efficiently and anisotropic etching, the same techniques that have allowed
because of rather large relative tolerances, and hence these the electronics industry to pack more and more memory and
meso-scale systems require micro-fabricated components for computing power into smaller and smaller chips, can be used
efficient operation. This paper presents a meso-scale to make compressors, pumps, valves, sensors, heat exchangers
centrifugal compressor fabricated by photo-lithographic and chemical reactors at millimeter or smaller scales [1-2].
techniques. Miniaturization of thermal and chemical systems offers several
A preliminary design based on 1-D flow analysis using air as advantages over their large-scale counterparts. (1) Transport
the working fluid shows that a 50 mm diameter centrifugal processes, both thermal and chemical, rely on surface area of
compressor with a blade height of 200 µm gives a static heat exchangers or reactors. Hence, the higher surface-to-
pressure ratio of 1.12. In this design, the impeller has 10 full volume ratios of a miniature system help to make more
blades and 10 splitter blades. Each blade has the NACA profile compact systems with higher volumetric transport coefficients.
9510 with the maximum camber at 50% of the chord. These (2) For meso-scale systems, micro-fabrication provides better
impeller blades have exit angles 35o with exit flow angles of tolerances, leading to better performance. (3) Smaller size
60o. A vaned diffuser having 20 equally spaced vanes with the typically leads to better safety. (4) Use of micro-fabrication
same NACA profile is used to improve compressor efficiency. technology is expected to provide better cost efficiency. (5)
A 3-D compressible, viscous flow analysis has been done using Miniaturization makes newer engineering systems possible. (6)
a commercial finite volume software. The results of this Smaller modular size leads to more options in usage.
analysis allowed the verification of the flow characteristics It is primarily the first two advantages that motivated the
inside the meso-scale centrifugal compressor. development of a meso-scale refrigerator. The two intended
The compressor has been fabricated using micro-fabrication applications of this system are (1) an integrated heat removal
techniques. The rotor and the stator are made by etching a system for electronics or photonic entities, and (2) an actively
silicon wafer by using DRIE (Deep Reactive Ion Etching) cooled jacket for personnel.
technique. A Pyrex wafer is then bonded to the stator for visual
The preliminary design requirements for the overall system
access inside the compressor.
have been set at [3-4] (1) evaporator temperature of 12 °C, (2)
condenser exit temperature of 60 °C, (3) heat removal rate of
350 W with refrigerant R134a, (4) saturated vapor at
Direction of rotation
I direction
K direction
Figure 4. Top view of velocity profile in the impeller
(in rotational frame)
The gage static pressure diagram with p = 1 atm as a reference
Impeller exit
pressure confirms the inlet section problem by the presence of
Figure 3. Top view of the impeller grid a high pressure before the impeller inlet. The pressure
decreases immediately after that section and then increases
A SIMPLEC algorithm (Semi-Implicit Method for Pressure- again until the exit of the impeller.
Linked Equation Consistent) was used to solve the three-
dimensional Navier-Stokes equations, continuity equation and
energy equation for the three velocity components and the
pressure and the temperature fields. A convergence criterion of Static Pressure (Pa)
at least 3 orders of magnitude reduction in the sum of each
residual of dependent variable was considered acceptable.
Results are given in Fig. 4 and 5 in the form of a top view of
the relative velocity profile w and static pressure distribution p
along the impeller at a height of 100 µm, which defines the
midspan of impeller blades.
High velocities that occur just after the inlet of the compressor
are due to flow blockage at the inlet. It also appears that the air
is flowing better on the concave part of the splitter blade than
on the convex part. Another noticeable feature is a weak flow
zone, and possibly a recirculation zone, close the interior of the
full blade. The mean value of the relative flow velocity at the
exit of the impeller is w2 = 63.8 m/s which is higher value than Figure 5. Top view of static pressure distribution in the
what was computed with the 1-dimensional analysis (w2 = 57.2 impeller
m/s). This increase modifies the velocity triangle at the exit of The computations for the actual vaned diffuser are performed
the impeller and changes the absolute velocity value to c2 = 63 with inlet velocity set equal to c2, as calculated from the
m/s from the 1-dimensional value of c2 = 79 m/s. The impeller flow field. The inlet temperature is also deduced from
computation of c2 and w2 confirms a flow angle at the exit of the impeller calculation.
the impeller of α2 = 60°.
Results are presented in Fig. 6 and 7 in the form of the
absolute velocity profile and the pressure distribution at a
height of 100 µm.
ACKNOWLEDGMENTS
The authors like to acknowledge the support provided by
Lockheed Martin Missiles and Fire Control and Dr. Les
Kramer who has been the program manager for this work.
The authors are also thankful to CFD-ACE, especially Mr.
Perry Daley, and to Mr. Steven Dick, the computer support
engineer of the department for their precious help.
REFERENCES
[1] Wegeng, R. S., and Drost, M. K., 1994, "Developing New
Figure 10. Picture of the impeller
Miniature Energy Systems", ASME, 119, pp. 82-84.
(D) Anodic bonding
[2] Ameel T. A., Warrington, R. S., Wegeng, R. S., and Drost,
A separate Pyrex wafer is bonded on top of the silicon
M. K., 1996, "Miniaturization Technologies Applied to Energy
compressor using anodic bonding at 450 °C and 1000 V bias
Systems", J. Energy Conversion and Management, 38, pp.
voltage. This wafer will serve as the shroud of the compressor.
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[3] Ashraf, N. S., Carter, H. C., Casey, K. C., Chow, L. C.,
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[5] Hao, Z., Kapat, J. S., Chow, L. C., and Sundaram, K. B.,
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Compressor Driven by a Comb Actuator,” submitted for
Figure 11. Picture of the diffuser and the exhaust holes presentation at the 2000 International Mechanical Engineering
(E) Glass drilling Congress & Exposition to be held in November 5-10, 2000,
An inlet hole of 3 mm diameter is drilled into the glass wafer Orlando, Florida.
using an ultrasonic drill. [6] Dixon S. L., 1998, "Fluid Mechanics and Thermodynamics
of Turbomachinery", Fourth edition, Butterworth Heinemann.