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Rohit Rai
Rituraj Nandan
Chandan Kumar
Introduction: Laser spot welding
z Highlights
– Highly localized heating
– High temperatures
– High precision and control
z Applications
– Electronic packaging in various industries, viz.
automobile, medical equipments, semiconductors.
Problem Description
Boundary Conditions z
h x
• Clamping on ends z
b
Initial Condition
• Temperature = 298 K
Æ
•Temperature distribution, and
•Stress field
Assumptions
z Element Type
– Solid 90 for thermal analysis
z Shape/Characteristic: Brick, 20 nodes
z d.o.f.: Temperature at each node
1. Temperature
R n D contd. …
z Thermal Strain
t=0.075 s
Simplified Analytical Solution
1200
1000
Temperature, K
Approximate analytical
800 solution
600
FEM
400
Depth, m
R n D contd. …
z Deformation
R n D contd. …
z Plastic strain
t=0.075 s
Non FE verification of stress
z Calculated from
⎡1 t / 2 12
t/2
⎤
σ = E ⎢ ∫ αT ( z )dz + 3 ∫ αT ( z ) zdz − αT ( z ) ⎥ Cheng et al.
⎣ t −t / 2 t −t / 2 ⎦
Calculated by FE model:~1.51e8 Pa
Summary and Conclusions
4. http://www.mece.ualberta.ca/tutorials/ansys/