PC123 Series

DIP 4pin Reinforced Insulation Type

PC123 Series Photocoupler

■ Description ■ Agency approvals/Compliance

PC123 Series contains an IRED optically coupled to
a phototransistor.
It is packaged in a 4-pin DIP, available in wide-lead
spacing option and SMT gullwing lead-form option.
Input-output isolation voltage(rms) is 5.0kV.
CTR is 50% to 400% at input current of 5mA.
■ Features
1. 4-pin DIP package
2. Double transfer mold package (Ideal for Flow Solder-
ing)
3. Current transfer ratio (CTR : MIN. 50% at IF=5 mA,
VCE=5V)
4. Several CTR ranks available
5. Reinforced insulation type (Isolation distance : MIN.
0.4mm)
6. Long creepage distance type (wide lead-form type
only : MIN. 8mm)
7. High isolation voltage between input and output
(Viso(rms) : 5.0 kV)
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC123)
2. Approved by BSI, BS-EN60065, file No. 7087, BS-
EN60950 file No. 7409, (as model No. PC123)
3. Approved by SEMCO, EN60065, EN60950, file No.
204582 (as model No. PC123)
4. Approved by DEMCO, EN60065, EN60950 (as mod-
el No. PC123)
5. Approved by NEMKO, EN60065, EN60950, file No.
P03100205 (as model No. PC123)
6. Approved by FIMKO, EN60065, EN60950, file No.
19383 (as model No. PC123)
7. Recognized by CSA file No. CA95323 (as model No.
PC123)
8. Approved by VDE, VDE0884 (as an option) file No.
83601 or No. 134349 or No.40005304 (as model
No. PC123)
9. Package resin : UL flammability grade (94V - 0)
■ Applications
1. I/O isolation for MCUs (Micro Controller Units)
2. Noise suppression in switching circuits
3. Signal transmission between circuits of different po-
tentials and impedances
4. Over voltage detection

Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A02902EN
1 Date Oct. 31. 2003
© SHARP Corporation
 PC123 Series

■ Internal Connection Diagram

1 Anode
1 4
2 Cathode
3 Emitter
2 3
4 Collector

■ Outline Dimensions (Unit : mm)

1. Through-Hole [ex. PC123] 2. Through-Hole (VDE0884 option) [ex. PC123Y]

Rank mark Rank mark
Anode mark Anode mark
Factory identification mark Factory identification mark

1.2±0.3
1.2±0.3

0.6±0.2
0.6±0.2

Date code Date code

1 4

4.58±0.3
1 4
4.58±0.3

PC123 PC123
2 3 2 4 3

SHARP mark "S"

2.54±0.25

6.5±0.3
6.5±0.3 VDE0884

2.54±0.25
Indenfication mark

7.62±0.3 4.58±0.3 7.62±0.3 4.58±0.3

0.5TYP.
0.5TYP.

3.5±0.5
3.5±0.5

3.0±0.5
3.0±0.5

Epoxy resin

±0.5
Epoxy resin
±0.5

0.26±0.1 0.26±0.1

2.7
2.7

0.5±0.1 0.5±0.1
θ θ θ θ
θ : 0 to 13˚ θ : 0 to 13˚

3. Wide Through-Hole Lead-Form [ex. PC123F] 4. Wide Through-Hole Lead-Form (VDE0884 option) [ex. PC123FY]

Rank mark Factory identification mark Rank mark Factory identification mark
Anode mark Anode mark
±0.25
±0.25

Date code Date code

±0.3
±0.3

2.54
±0.2
±0.2

2.54

1.2
1.2

0.6
0.6

1 4 1 4
±0.3

PC123
4.58

2 PC123 3 2 3
4
±0.3

±0.1
±0.1

SHARP mark "S"

4.58

1.0

6.5±0.3
1.0

6.5±0.3
VDE0884
Indenfication mark
±0.3 ±0.3 ±0.3 ±0.3
7.62 4.58 7.62 4.58
±0.5
±0.5

3.5
3.5

2.7MIN.
2.7MIN.

Epoxy resin Epoxy resin

±0.1 ±0.1
0.26 0.26
±0.5 ±0.1 ±0.5 ±0.1
10.16 0.5 10.16 0.5

Product mass : approx. 0.18g

Sheet No.: D2-A02902EN

2
 PC123 Series

(Unit : mm)

5. SMT Gullwing Lead-Form [ex. PC123P] 6. SMT Gullwing Lead-Form (VDE0884 option) [ex. PC123PY]

Rank mark Factory identification mark Rank mark Factory identification mark
Anode mark Anode mark

2.54±0.25
2.54±0.25
Date code Date code

1.2±0.3
1.2±0.3

0.6±0.2
0.6±0.2

1 4 1 4

4.58±0.3
4.58±0.3
2 PC123 3 2 PC123 3

4
SHARP mark "S"
6.5±0.3
6.5±0.3 VDE0884
7.62 ±0.3 4.58±0.3 Indenfication mark
7.62±0.3 4.58±0.3
0.35±0.25
0.26±0.1

3.5±0.5

0.35±0.25
±0.1

3.5±0.5
0.26
1.0+0.4
−0
Epoxy resin 1.0+0.4
−0
2.54±0.25
1.0+0.4 Epoxy resin 1.0+0.4 2.54±0.25
10.0+0
−0.5 −0 −0

10.0+0
−0.5

7. Wide SMT Gullwing Lead-Form [ex. PC123FP] 8. Wide SMT Gullwing Lead-Form (VDE0884 option) [ex. PC123ZY]

Rank mark Rank mark

Anode mark Factory identification mark Anode mark Factory identification mark
1.2±0.3

1.2±0.3
0.6±0.2

±0.2

Date code Date code

0.6

1 4 1 4
4.58±0.3

4.58±0.3
2 PC123 3 2 PC123 3

4
1.0±0.1

±0.1

SHARP mark "S"

2.54±0.25

6.5±0.3
1.0

±0.3 VDE0884
6.5
Indenfication mark
7.62±0.3 4.58±0.3
2.54±0.25
±0.25

0.26±0.1

3.5±0.5

7.62±0.3 4.58±0.3
0.25

0.25±0.25

0.26±0.1

3.5±0.5

Epoxy resin 0.5±0.1

±0.25 ±0.5 ±0.25
0.75 10.16 0.75
12.0MAX Epoxy resin 0.5±0.1
±0.25 ±0.5 ±0.25
0.75 10.16 0.75
12.0MAX

Product mass : approx. 0.18g

Sheet No.: D2-A02902EN

3
 PC123 Series

Date code (2 digit)

1st digit 2nd digit
Year of production Month of production
A.D. Mark A.D Mark Month Mark
1990 A 2002 P January 1
1991 B 2003 R February 2
1992 C 2004 S March 3
1993 D 2005 T April 4
1994 E 2006 U May 5
1995 F 2007 V June 6
1996 H 2008 W July 7
1997 J 2009 X August 8
1998 K 2010 A September 9
1999 L 2011 B October O
2000 M 2012 C November N
2001 N ·· ·· December D
· ·

repeats in a 20 year cycle

Factory identification mark

Factory identification Mark Country of origin
no mark
Japan

Indonesia

Philippines

China
* This factory making is for identification purpose only.
Please contact the local SHARP sales representative to see the actual status of the
production.

Rank mark
Refer to the Model Line-up table

Sheet No.: D2-A02902EN

4
 PC123 Series

■ Absolute Maximum Ratings (Ta=25˚C)

Parameter Symbol Rating Unit
Forward current IF 50 mA
*1
Input

Peak forward current IFM 1 A

Reverse voltage VR 6 V
Power dissipation P 70 mW
Collector-emitter voltage VCEO 70 V
Output

Emitter-collector voltage VECO 6 V

Collector current IC 50 mA
Collector power dissipation PC 150 mW
Total power dissipation Ptot 200 mW
*2
Isolation voltage Viso (rms) 5.0 kV
Operating temperature Topr −30 to +100 ˚C
Storage temperature Tstg −55 to +125 ˚C
*3
Soldering temperature Tsol 260 ˚C
*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1 minute, f = 60Hz
*3 For 10s

■ Electro-optical Characteristics (Ta=25˚C)

Parameter Symbol Conditions MIN. TYP. MAX. Unit
Forward voltage VF IF=20mA − 1.2 1.4 V
Input Reverse current IR VR=4V − − 10 µA
Terminal capacitance Ct V=0, f=1kHz − 30 250 pF
Collector dark current ICEO VCE=50V, IF=0 − − 100 nA
Output Collector-emitter breakdown voltage BVCEO IC=0.1mA, IF=0 70 − − V
Emitter-collector breakdown voltage BVECO IE=10µA, IF=0 6 − − nA
Collector current IC IF=5mA, VCE=5V 2.5 − 20 mA
Collector-emitter saturation voltage VCE (sat) IF=20mA, IC=1mA − 0.1 0.2 V
Transfer Isolation resistance RISO DC500V, 40 to 60%RH 5×1010 1×1011 − Ω
charac- Floating capacitance Cf V=0, f=1MHz − 0.6 1.0 pF
teristics Cut-off frequency fc VCE=5V, IC=2mA, RL=100Ω, −3dB − 80 − kHz
Rise time tr − 4 18 µs
Response time VCE=2V, IC=2mA, RL=100Ω
Fall time tf − 3 18 µs

Sheet No.: D2-A02902EN

5
 PC123 Series

■ Model Line-up
Lead Form Through-Hole Wide Through-Hole SMT Gullwing Wide SMT Gullwing
Sleeve Taping IC [mA]
Package Rank mark
100pcs/sleeve 2 000pcs/reel (IF=5mA, VCE=5V, Ta=25˚C)
VDE0884 − Approved − Approved − Approved − Approved
PC123 PC123Y PC123F PC123FY PC123P PC123PY PC123FP PC123ZY with or without 2.5 to 30.0
PC123A PC123Y1 PC123F1 PC123FY1 PC123P1 PC123PY1 PC123FP1 PC123ZY1 A 2.5 to 7.5
Model No. PC123B PC123Y2 PC123F2 PC123FY2 PC123P2 PC123PY2 PC123FP2 PC123ZY2 B 5.0 to 12.5
PC123C PC123Y5 PC123F5 PC123FY5 PC123P5 PC123PY5 PC123FP5 PC123ZY5 No mark 10.0 to 20.0
PC123S PC123YS PC123FS PC123FY8 PC123PS PC123PY8 PC123FP8 PC123ZY8 S 5.0 to 10.0
Please contact a local SHARP sales representative to inquire about production status and Lead-Free options.

Sheet No.: D2-A02902EN

6
 PC123 Series

Fig.1 Forward Current vs. Ambient Fig.2 Diode Power Dissipation vs.
Temperature Ambient Temperature

50 100

Diode power dissipation P (mW)

Forward current IF (mA)

40 80
70
30 60

20 40

10 20

0 0
−30 0 25 50 55 75 100 125 −30 0 25 50 55 75 100 125
Ambient temperature Ta (˚C) Ambient temperature Ta (˚C)

Fig.3 Collector Power Dissipation vs. Fig.4 Total Power Dissipation vs. Ambient
Ambient Temperature Temperature
250 250
Collector power dissipation PC (mW)

200 Total Power dissipation Ptot (mW) 200

150 150

100 100

50 50

0 0
−30 0 25 50 75 100 125 −30 0 25 50 75 100 125
Ambient temperature Ta (˚C) Ambient temperature Ta (˚C)

Fig.5 Peak Forward Current vs. Duty Ratio Fig.6 Forward Current vs. Forward Voltage

10 000
Pulse width≤100µs 500
Ta=75˚C
5 000 Ta=25˚C
200
50˚C 25˚C
2 000
Peak forward current IFM (mA)

100 0˚C
Forward current IF (mA)

1 000
50 −25˚C
500
20
200
100 10

50 5

20 2
10
1
5
5 10−3 2 5 10−2 2 5 10−1 2 5 1 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
Duty ratio Forward voltage VF (V)

Sheet No.: D2-A02902EN

7
 PC123 Series

Fig.7 Current Transfer Ratio vs. Forward Fig.8 Collector Current vs. Collector-emitter
Current Voltage
300
VCE=5V Ta=25˚C
Ta=25˚C 60
250 54
Current transfer ratio CTR (%)

PC (MAX.)

Collector current IC (mA)

48
200
42
36
150
30
mA
30
100
24 I F= 20
mA
18 I F=
IF=10mA
50 12
6 IF=5mA
0 0
0.1 1 10 100 0 1 2 3 4 5 6 7 8 9 10
Forward current IF (mA) Collector-emitter voltage VCE (V)

Fig.9 Relative Current Transfer Ratio vs. Fig.10 Collector - emitter Saturation Voltage
Ambient Temperature vs. Ambient Temperature
150 0.16
IF=5mA IF=20mA

Collector-emitter saturation voltage VCE (sat) (V)

VCE=5V IC=1mA
0.14
Relative current transfer ratio (%)

0.12
100
0.10

0.08

0.06
50
0.04

0.02

0 0.00
−30 0 25 50 75 100 −30 0 20 40 60 80 100
Ambient temperature Ta (˚C) Ambient temperature Ta (˚C)

Fig.11 Collector Dark Current vs. Ambient Fig.12 Response Time vs. Load Resistance
Temperature
10−5 1 000
VCE=50V
5 VCE=2V
IC=2mA
−6
10 Ta=25˚C
Collector dark current ICEO (A)

5
100
−7
Response time (µs)

10
5 tr
tf
10−8 10
5
td
10−9
5 ts
1
10−10
5

10−11 0.1
−30 0 20 40 60 80 100 0.01 0.1 1 10 100
Ambient temperature Ta (˚C) Load resistance (kΩ)

Sheet No.: D2-A02902EN

8
 PC123 Series

Fig.13 Test Circuit for Response Time Fig.14 Frequency Response

5
VCE=5V
IC=2mA
Input
VCC Ta=25˚C
Output 0
Input RD RL Output 10%

Voltage gain Av (dB)

90% −5
VCE td ts
tr tf
−10
Please refer to the conditions in Fig.12.
RL=10kΩ 1kΩ 100Ω
−15

−20
0.1 1 10 100 1 000
Frequency (kHz)

Fig.15 Collector-emitter Saturation Voltage

vs. Forward Current
Ta=25˚C
Collector-emitter saturation voltage VCE (sat) (V)

5.0 IC=0.5mA
4.5 1mA
3mA
4.0 5mA
7mA
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
0 2 4 6 8 10 12 14 16 18 20
Forward current IF (mA)

Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.

Sheet No.: D2-A02902EN

9
 PC123 Series

■ Design Considerations
● Design guide
While operating at IF<1.0mA, CTR variation may increase.
Please make design considering this fact.

This product is not designed against irradiation and incorporates non-coherent IRED.

● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5years)
into the design consideration.

● Recommended Foot Print (reference)

SMT Gullwing lead-form Wide SMT Gullwing lead-form
8.2 10.2

2.54
2.54

1.7
1.7

2.2 2.2

(Unit : mm)

✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.

Sheet No.: D2-A02902EN

10
 PC123 Series

■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)

300 Terminal : 260˚C peak

( package surface : 250˚C peak)

200

Reflow
220˚C or more, 60s or less
Preheat
100
150 to 180˚C, 120s or less

0
0 1 2 3 4 (min)

Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.

Flow soldering should be completed below 270˚C and within 10s.

Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.

Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.

Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.

Sheet No.: D2-A02902EN

11
 PC123 Series

● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less

Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.

Recommended solvent materials:

Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-
tual using conditions since some materials may erode the packaging resin.

● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances:CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.

Sheet No.: D2-A02902EN

12
 PC123 Series

■ Package specification
● Sleeve package
1. Through-Hole
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless
stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0

±2
520
10.8
5.8

6.7
(Unit : mm)

2. Wide Through-Hole
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless
stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
15.0

±2
520
10.8
5.9

6.35

(Unit : mm)

Sheet No.: D2-A02902EN

13
 PC123 Series

● Tape and Reel package

1. SMT Gullwing
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F D J
E G I

C
B
A
H

H X.
MA
K

5˚
Dimensions List (Unit : mm)
A B C D E F G
16.0±0.3 7.5±0.1 1.75±0.1 8.0±0.1 2.0±0.1 4.0±0.1 φ1.5−0
+0.1

H I J K
10.4 ±0.1 0.4±0.05 4.2±0.1 5.1±0.1

Reel structure and Dimensions

e d

g
c

Dimensions List (Unit : mm)

a b c d
330 17.5±1.5 100±1.0 13±0.5
f e f g
a b 23±1.0 2.0±0.5 2.0±0.5

Direction of product insertion

Pull-out direction

[Packing : 2 000pcs/reel]

Sheet No.: D2-A02902EN

14
 PC123 Series

2. Wide SMT Gullwing

Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F D G J
I
E
C

A
H

H
AXM
.
5˚
K

Dimensions List (Unit : mm)

A B C D E F G
+0.1
24.0±0.3 11.5±0.1 1.75±0.1 8.0±0.1 2.0±0.1 4.0±0.1 φ1.5−0
H I J K
12.4±0.1 0.4±0.05 4.1±0.1 5.1±0.1

Reel structure and Dimensions

e d

g
c

Dimensions List (Unit : mm)

a b c d
330 25.5±1.5 100 ±1.0 13±0.5
f e f g
a b 23±1.0 2.0±0.5 2.0±0.5

Direction of product insertion

Pull-out direction

[Packing : 2 000pcs/reel]

Sheet No.: D2-A02902EN

15

■ Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems rela-
ted to any intellectual property right of a third party re-
sulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the spec-
ifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufac-
turing locations are also subject to change without no-
tice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
16
PC123 Series
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high lev-
el of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall with-
in the scope of strategic products described in the For-
eign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP de-
vices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means, elec-
tronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
Sheet No.: D2-A02902EN