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ecoSWITCHt
Advanced Load Management
Controlled Load Switch with Low RON
The NCP4552x series of load switches provide a component and
area-reducing solution for efficient power domain switching with
inrush current limit via soft start. In addition to integrated control http://onsemi.com
functionality with ultra low on−resistance, these devices offer system
safeguards and monitoring via fault protection and power good
signaling. This cost effective solution is ideal for power management RON TYP VCC VIN IMAX
and hot-swap applications requiring low power consumption in a 9.5 mW 3.3 V 1.8 V
small footprint.
10.1 mW 3.3 V 5.0 V 10.5 A
Features 12.8 mW 3.3 V 12 V
• Advanced Controller with Charge Pump
• Integrated N-Channel MOSFET with Low RON
• Input Voltage Range 0.5 V to 13.5 V
• Soft-Start via Controlled Slew Rate
• Adjustable Slew Rate Control (NCP45521) 1
• Undervoltage Lockout
• Short-Circuit Protection
MARKING DIAGRAM
• Extremely Low Standby Current
1
• Load Bleed (Quick Discharge) XX MG
• This is a Pb−Free Device G
XX = PH for NCP45520−H
Typical Applications
= PL for NCP45520−L
• Portable Electronics and Systems = SH for NCP45521−H
• Notebook and Tablet Computers = SL for NCP45521−L
M = Date Code
• Telecom, Networking, Medical, and Industrial Equipment G = Pb−Free Package
• Set−Top Boxes, Servers, and Gateways
(Note: Microdot may be in either location)
• Hot Swap Devices and Peripheral Ports
VCC EN PG* VIN
PIN CONFIGURATION
Thermal,
Bandgap Undervoltage VIN 1 8 VOUT
Control
& Logic &
Biases Short−Circuit
Protection EN 2 7 VOUT
9: VIN
VCC 3 6 PG or SR
(Top View)
NCP45520−L & NCP45521−L − Active−low digital input used to turn on the MOSFET, pin has
an internal pull up resistor to VCC
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NCP45520, NCP45521
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NCP45520, NCP45521
Table 5. SWITCHING CHARACTERISTICS (TJ = 25°C unless otherwise specified) (Notes 15 and 16)
Parameter Conditions Symbol Min Typ Max Unit
VCC = 3.3 V; VIN = 1.8 V 11.9
VCC = 5.0 V; VIN = 1.8 V 12.1
Output Slew Rate (Note 17) SR kV/s
VCC = 3.3 V; VIN = 12 V 13.5
VCC = 5.0 V; VIN = 12 V 13.9
VCC = 3.3 V; VIN = 1.8 V 220
VCC = 5.0 V; VIN = 1.8 V 185
Output Turn−on Delay (Note 17) TON ms
VCC = 3.3 V; VIN = 12 V 270
VCC = 5.0 V; VIN = 12 V 260
VCC = 3.3 V; VIN = 1.8 V 1.2
VCC = 5.0 V; VIN = 1.8 V 0.9
Output Turn−off Delay (Note 17) TOFF ms
VCC = 3.3 V; VIN = 12 V 0.4
VCC = 5.0 V; VIN = 12 V 0.2
VCC = 3.3 V; VIN = 1.8 V 0.91
VCC = 5.0 V; VIN = 1.8 V 0.93
Power Good Turn−on Time (Note 18) TPG,ON ms
VCC = 3.3 V; VIN = 12 V 1.33
VCC = 5.0 V; VIN = 12 V 1.21
VCC = 3.3 V; VIN = 1.8 V 21
VCC = 5.0 V; VIN = 1.8 V 15
Power Good Turn−off Time (Note 18) TPG,OFF ns
VCC = 3.3 V; VIN = 12 V 21
VCC = 5.0 V; VIN = 12 V 15
15. See below figure for Test Circuit and Timing Diagram.
16. Tested with the following conditions: VTERM = VCC; RPG = 100 kW; RL = 10 W; CL = 0.1 mF.
17. Applies to NCP45520 and NCP45521.
18. Applies only to NCP45520.
VTERM
RPG
OFF ON EN PG
VIN VOUT
NCP4552x−H
VCC BLEED
RL CL
SR
GND
50% 50%
VEN
TON Dt
TOFF
90%
90% DV
DV SR =
VOUT 10% Dt
TPG,ON
TPG,OFF
50% 50%
VPG
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NCP45520, NCP45521
TYPICAL CHARACTERISTICS
(TJ = 25°C unless otherwise specified)
16.5 20
VIN = 12 V
15.5 18 VCC = 3.3 V
RON, ON−RESISTANCE (mW)
8.5 6
0.5 2.5 4.5 6.5 8.5 10.5 12.5 −45 −30 −15 0 15 30 45 60 75 90 105 120
VIN, INPUT VOLTAGE (V) TJ, JUNCTION TEMPERATURE (°C)
Figure 3. On−Resistance vs. Input Voltage Figure 4. On−Resistance vs. Temperature
ISTBY, SUPPLY STANDBY CURRENT (mA)
3.0 6
5
2.5
4
2.0
VCC = 5.5 V
3
1.5
2
1.0
1 VCC = 3 V
0.5 0
3.0 3.5 4.0 4.5 5.0 5.5 −45 −30 −15 0 15 30 45 60 75 90 105 120
VCC, SUPPLY VOLTAGE (V) TJ, JUNCTION TEMPERATURE (°C)
Figure 5. Supply Standby Current vs. Supply Figure 6. Supply Standby Current vs.
Voltage Temperature
IDYN, SUPPLY DYNAMIC CURRENT (mA)
IDYN, SUPPLY DYNAMIC CURRENT (mA)
550 600
500 550
450 500
VIN = 1.8 V
450
400
400
350
350
300 VCC = 5.5 V
300
VIN = 12 V
250 250
200 VCC = 3 V 200
150 150
0.5 2.5 4.5 6.5 8.5 10.5 12.5 3.0 3.5 4.0 4.5 5.0 5.5
VIN, INPUT VOLTAGE (V) VCC, SUPPLY VOLTAGE (V)
Figure 7. Supply Dynamic Current vs. Input Figure 8. Supply Dynamic Current vs. Supply
Voltage Voltage
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NCP45520, NCP45521
TYPICAL CHARACTERISTICS
(TJ = 25°C unless otherwise specified)
700 115
IDYN, SUPPLY DYNAMIC CURRENT (mA)
145 70
RBLEED, BLEED RESISTANCE (W)
95 10
85 0
−45 −15 15 45 75 105 0.5 2.5 4.5 6.5 8.5 10.5 12.5
TJ, JUNCTION TEMPERATURE (°C) VIN, INPUT VOLTAGE (V)
Figure 11. Bleed Resistance vs. Temperature Figure 12. Bleed Pin Leakage Current vs. Input
Voltage
IPD/PU, EN PULL DOWN/UP RESISTANCE (kW)
IBLEED, BLEED PIN LEAKAGE CURRENT (mA)
80 120
0 85
−45 −15 15 45 75 105 −45 −15 15 45 75 105
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
Figure 13. Bleed Pin Leakage Current vs. Figure 14. EN Pull Down/Up Resistance vs.
Temperature Temperature
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NCP45520, NCP45521
TYPICAL CHARACTERISTICS
(TJ = 25°C unless otherwise specified)
0.140 0.20
VOL, PG OUTPUT LOW VOLTAGE (V)
0.125 0.14
VCC = 5.5 V
0.120 0.12
0.115 0.10
0.110 0.08
3.0 3.5 4.0 4.5 5.0 5.5 −45 −15 15 45 75 105
VCC, SUPPLY VOLTAGE (V) TJ, JUNCTION TEMPERATURE (°C)
Figure 15. PG Output Low Voltage vs. Supply Figure 16. PG Output Low Voltage vs.
Voltage Temperature
KSR, SLEW RATE CONTROL CONSTANT (mA)
34
33 VCC = 5.5 V
VCC = 5.5 V 33
32
32
VCC = 3 V
31 VCC = 3 V
31
30
30
29
29 28
0.5 2.5 4.5 6.5 8.5 10.5 12.5 −45 −15 15 45 75 105
VIN, INPUT VOLTAGE (V) TJ, JUNCTION TEMPERATURE (°C)
Figure 17. Slew Rate Control Constant vs. Figure 18. Slew Rate Control Constant vs.
Input Voltage Temperature
320 15
VSC, SHORT−CIRCUIT PROTECTION
VCC = 5.5 V
THRESHOLD (mV)
300 13 VCC = 3 V
290 12
VCC = 3 V
280 11
270 10
260 9
250 8
0.5 2.5 4.5 6.5 8.5 10.5 12.5 0.5 2.5 4.5 6.5 8.5 10.5 12.5
VIN, INPUT VOLTAGE (V) VIN, INPUT VOLTAGE (V)
Figure 19. Short−Circuit Protection Threshold Figure 20. Output Slew Rate vs. Input Voltage
vs. Input Voltage
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NCP45520, NCP45521
TYPICAL CHARACTERISTICS
(TJ = 25°C unless otherwise specified)
14.0 310
270 VCC = 3 V
13.0
250
12.5 VCC = 5.5 V
230
12.0
VCC = 5 V, VIN = 1.8 V 210
11.5
190
11.0 170
10.5 150
−40 −20 0 20 40 60 80 100 120 0.5 2.5 4.5 6.5 8.5 10.5 12.5
TJ, JUNCTION TEMPERATURE (°C) VIN, INPUT VOLTAGE (V)
Figure 21. Output Slew Rate vs. Temperature Figure 22. Output Turn−on Delay vs. Input
Voltage
300 1.8
TOFF, OUTPUT TURN−OFF DELAY (ms)
TON, OUTPUT TURN−ON DELAY (ms)
1.6
275 VCC = 3.3 V, VIN = 12 V
1.4
250 1.2
1.0
225 VCC = 3 V
0.8
200 0.6 VCC = 5.5 V
VCC = 5 V, VIN = 1.8 V
0.4
175
0.2
150 0
−40 −20 0 20 40 60 80 100 120 0.5 2.5 4.5 6.5 8.5 10.5 12.5
TJ, JUNCTION TEMPERATURE (°C) VIN, INPUT VOLTAGE (V)
Figure 23. Output Turn−on Delay vs. Figure 24. Output Turn−off Delay vs. Input
Temperature Voltage
1.2 1.8
TOFF, OUTPUT TURN−OFF DELAY (ms)
1.7
1.0 VCC = 5 V, VIN = 1.8 V 1.6
1.5
0.8 1.4
VCC = 3 V
1.3
0.6 1.2
1.1 VCC = 5.5 V
0.4 VCC = 3.3 V, VIN = 12 V 1.0
0.9
0.2 0.8
−40 −20 0 20 40 60 80 100 120 0.5 2.5 4.5 6.5 8.5 10.5 12.5
TJ, JUNCTION TEMPERATURE (°C) VIN, INPUT VOLTAGE (V)
Figure 25. Output Turn−off Delay vs. Figure 26. Power Good Turn−on Time vs. Input
Temperature Voltage
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NCP45520, NCP45521
TYPICAL CHARACTERISTICS
(TJ = 25°C unless otherwise specified)
1.5 24
1.4 22
VCC = 3.3 V, VIN = 12 V VIN = 13.5 V
1.3
20
1.2 VIN = 0.5 V
18
1.1
16
1.0
VCC = 5 V, VIN = 1.8 V
0.9 14
0.8 12
−40 −20 0 20 40 60 80 100 120 3.0 3.5 4.0 4.5 5.0 5.5
TJ, JUNCTION TEMPERATURE (°C) VCC, SUPPLY VOLTAGE (V)
Figure 27. Power Good Turn−on Time vs. Figure 28. Power Good Turn−off Time vs.
Temperature Supply Voltage
27.5
TPG,OFF, PG TURN−OFF TIME (ns)
25.0
VCC = 3.3 V, VIN = 12 V
22.5
20.0
15.0
12.5
10.0
−40 −20 0 20 40 60 80 100 120
TJ, JUNCTION TEMPERATURE (°C)
Figure 29. Power Good Turn−off Time vs.
Temperature
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NCP45520, NCP45521
APPLICATIONS INFORMATION
Enable Control The power good output can be used as the enable signal for
Both the NCP45520 and the NCP45521 have two part other active−high devices in the system (as shown in
numbers, NCP4552x-H and NCP4552x-L, that only differ Figure 32). This allows for guaranteed by design power
in the polarity of the enable control. sequencing and reduces the number of enable signals needed
The NCP4552x-H devices allow for enabling the from the system controller. If the power good feature is not
MOSFET in an active-high configuration. When the VCC used in the application, the PG pin should be tied to GND.
supply pin has an adequate voltage applied and the EN pin
is at a logic high level, the MOSFET will be enabled. Slew Rate Control
Similarly, when the EN pin is at a logic low level, the The NCP4552x devices are equipped with controlled
MOSFET will be disabled. An internal pull down resistor to output slew rate which provides soft start functionality. This
ground on the EN pin ensures that the MOSFET will be limits the inrush current caused by capacitor charging and
disabled when not being driven. enables these devices to be used in hot swap applications.
The NCP4552x-L devices allow for enabling the The slew rate of the NCP45521 can be decreased with an
MOSFET in an active-low configuration. When the VCC external capacitor added between the SR pin and ground (as
supply pin has an adequate voltage applied and the EN pin shown in Figures 33 and 34). With an external capacitor
is at a logic low level, the MOSFET will be enabled. present, the slew rate can be determined by the following
Similarly, when the EN pin is at a logic high level, the equation:
MOSFET will be disabled. An internal pull up resistor to K SR
Slew Rate + [Vńs] (eq. 1)
VCC on the EN pin ensures that the MOSFET will be C SR
disabled when not being driven.
where KSR is the specified slew rate control constant, found
Power Sequencing in Table 4, and CSR is the slew rate control capacitor added
The NCP4552x devices will function with any power between the SR pin and ground. The slew rate of the device
sequence, but the output turn−on delay performance may will always be the lower of the default slew rate and the
vary from what is specified. To achieve the specified adjusted slew rate. Therefore, if the CSR is not large enough
performance, there are two recommended power sequences: to decrease the slew rate more than the specified default
1) VCC → VIN → VEN value, the slew rate of the device will be the default value.
2) VIN → VCC → VEN The SR pin can be left floating if the slew rate does not need
to be decreased.
Load Bleed (Quick Discharge)
The NCP4552x devices have an internal bleed resistor, Short−Circuit Protection
RBLEED, which is used to bleed the charge off of the load to The NCP4552x devices are equipped with short−circuit
ground after the MOSFET has been disabled. In series with protection that is used to help protect the part and the system
the bleed resistor is a bleed switch that is enabled whenever from a sudden high−current event, such as the output, VOUT,
the MOSFET is disabled. The MOSFET and the bleed being shorted to ground. This circuitry is only active when
switch are never concurrently active. the gate of the MOSFET is fully charged.
It is required that the BLEED pin be connected to VOUT Once active, the circuitry monitors the difference in the
either directly (as shown in Figures 31 and 34) or through an voltage on the VIN pin and the voltage on the BLEED pin.
external resistor, REXT (as shown in Figures 30 and 33). In order for the VOUT voltage to be monitored through the
REXT should not exceed 1 kW and can be used to increase the BLEED pin, it is required that the BLEED pin be connected
total bleed resistance. to VOUT either directly (as shown in Figures 31 and 34) or
Care must be taken to ensure that the power dissipated through a resistor, REXT (as shown in Figures 30 and 33),
across RBLEED is kept at a safe level. The maximum which should not exceed 1 kW. With the BLEED pin
continuous power that can be dissipated across RBLEED is connected to VOUT, the short−circuit protection is able to
0.4 W. REXT can be used to decrease the amount of power monitor the voltage drop across the MOSFET.
dissipated across RBLEED. If the voltage drop across the MOSFET is greater than or
equal to the short−circuit protection threshold voltage, the
Power Good MOSFET is immediately turned off and the load bleed is
The NCP45520 devices have a power good output (PG) activated. The part remains latched in this off state until EN
that can be used to indicate when the gate of the MOSFET is toggled or VCC supply voltage is cycled, at which point the
is fully charged. The PG pin is an active-high, open-drain MOSFET will be turned on in a controlled fashion with the
output that requires an external pull up resistor, RPG, greater normal output turn−on delay and slew rate. The current
than or equal to 1 kW to an external voltage source, VTERM, through the MOSFET that will cause a short−circuit event
that is compatible with input levels of all devices connected can be calculated by dividing the short−circuit protection
to this pin (as shown in Figures 30 and 31). threshold by the expected on−resistance of the MOSFET.
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NCP45520, NCP45521
VTERM = 3.3 V
Power Supply
RPG or Battery
3.0 V − 5.5 V 100 kW 0.5 V − 13.5 V
Controller
VCC EN PG VIN
Thermal,
Bandgap Undervoltage
Control &
& Logic
Biases Short−Circuit
Protection
REXT
Load
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NCP45520, NCP45521
BACKPLANE
REMOVABLE
CARD
VCC EN PG VIN
Thermal,
Bandgap Control Undervoltage
& Logic &
Biases Short−Circuit
Protection
Load
VTERM = 3.3 V
RPG
Controller 10 kW
PG
EN
PG
EN
RPD RPD
100 kW 100 kW
PG PG
NCP45520−H NCP45520−H
Figure 32. NCP45520 Simplified Application Diagram − Power Sequencing with PG Output
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NCP45520, NCP45521
Power Supply
or Battery
3.0 V − 5.5 V
Controller 0.5 V − 13.5 V
VCC EN VIN
Thermal,
Bandgap Control Undervoltage
& Logic &
Biases Short−Circuit
Protection
Delay and
Charge
Pump Slew Rate
Control
CSR
REXT
Load
BACKPLANE
REMOVABLE
CARD
VCC EN VIN
Thermal,
Bandgap Control Undervoltage
& &
Biases Logic Short−Circuit
Protection
CSR
Load
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NCP45520, NCP45521
ORDERING INFORMATION
Device Pin 6 Functionality EN Polarity Package Shipping†
NCP45520IMNTWG−H PG Active−High
NCP45520IMNTWG−L PG Active−Low DFN8
3000 / Tape & Reel
NCP45521IMNTWG−H SR Active−High (Pb−Free)
NCP45521IMNTWG−L SR Active−Low
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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NCP45520, NCP45521
PACKAGE DIMENSIONS
ÇÇ
3. DIMENSION b APPLIES TO PLATED
PIN ONE TERMINAL AND IS MEASURED BETWEEN
REFERENCE E DETAIL A 0.15 AND 0.30 MM FROM TERMINAL TIP.
ÇÇ
4. COPLANARITY APPLIES TO THE EXPOSED
ALTERNATE
PAD AS WELL AS THE TERMINALS.
2X 0.10 C CONSTRUCTIONS
MILLIMETERS
DIM MIN MAX
2X 0.10 C A 0.80 1.00
TOP VIEW MOLD CMPD
ÇÇ
ÉÉ
A1 0.00 0.05
EXPOSED Cu A3 0.20 REF
DETAIL B A b 0.20 0.30
ÉÉ
0.10 C D 2.00 BSC
A3 D2 1.50 1.70
E 2.00 BSC
A1 A3 E2 0.80 1.00
0.08 C e 0.50 BSC
DETAIL B K 0.27 REF
NOTE 4 A1 ALTERNATE L 0.18 0.38
SEATING
SIDE VIEW C PLANE CONSTRUCTION L1 −−− 0.15
DETAIL A
D2
8X L
1 4
RECOMMENDED
SOLDERING FOOTPRINT*
E2 PACKAGE 8X
OUTLINE
1.70 0.50
K 8 5
8X b
e 0.10 C A B 0.20
e/2
0.05 C NOTE 3
1.00 2.30
BOTTOM VIEW
1
8X
0.50 0.30
PITCH
DIMENSIONS: MILLIMETERS
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limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
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