Professional Documents
Culture Documents
When light falls on a metal surface, electrons may be ejected. The energy E of
the ejected electrons depends on the frequency ν of the incident light according
to the equation E = hν−φ, where h is Planck's constant, and φ is the energy
required to remove the electron from the metal surface. If the electrons from the
metal surface are collected to make an electric current, the strength of the
current depends on the intensity of the incident light. The discrete quantities of
radiation are called photons. Each photon has energy hν, and the intensity of the
radiation is determined by the number of photons received per unit time.
Silicon lattice with electron pairs (dots)
in covalent bonds (lines)
The atoms in crystalline solids are held together in a regular lattice by covalent
bonds. Each covalent bond linking two atoms consists of a pair of electrons,
called valence electrons, one from each atom. The valence electrons move in
the space between the two atoms with energies in a band of energies known as
the valence band. The valence band of a solid consists of a large number of
separate energy levels, one for each valence electron. The behavior of electrons
is such that when all the valence electrons are in position no more valence
electrons can be added to the lattice.
Electron energy level bands in solids
In some solids there are extra electrons moving freely through the lattice without
being held in covalent bonds. These electrons are called conduction electrons
because they carry electric currents through the solid. Their energies are in
another band known as the conduction band at a higher energy level than the
valence band. Between the highest energy level in the valence band and the
lowest energy level in the conduction band there may be a forbidden band of
energies. No electrons can have energies within the forbidden band. The
difference between the energy at the bottom of the conduction band and the
energy at the top of the valence band is called the energy gap. The most
convenient measure of energy in electronics is the energy gained by an electron
when it is accelerated through an electric potential of one volt, called the electron
volt (eV). Energy gaps are typically of the order 1 eV = 1.602×10-19J.
Electron energies in an electrical
insulator
An electrical insulator has its valence band filled with electrons and its
conduction band empty. Therefore, there are no free electrons available to
carry an electric current. Moreover, the energy gap is large, so it is not
possible for ordinary processes to provide enough energy for the valence
electrons to break out of their valence bonds and jump into the conduction
band where they might carry an electric current. Carbon in the form of
diamond is an insulator with energy gap 5.5eV
Electron energies in an electrical
conductor
Silicon may be doped with phosphorous atoms, which have five outer
electrons. Four of the outer electrons become valence electrons in the valence
band. The energy levels of the extra electrons are just below the bottom of the
conduction band with a small energy gap of 0.05 eV. This is less than twice the
value of kT (0.026 eV) at a temperature 300K. Therefore the extra electrons are
easily excited thermally into the conduction band where they become negative
charge carriers.
Majority and minority charge carriers
Silicon may also be doped with boron atoms, which have only three outer
electrons. These atoms create unfilled energy levels just above the top of the
valence band . Electrons are easily excited thermally into these levels, leaving
holes in the valence band. The holes created in this way act as positive
majority charge carriers, and the doped crystal is called a p-type semiconductor.
Charge balance
• In each type of semiconductor the electric charges
on the fixed impurities balance the charges on the
majority carriers and keep the crystal as a whole
electrically neutral. Thus, in n-type material the
impurities act as fixed positive charges, and in p-
type material the impurities act as fixed negative
charges.
• However, at a junction between an n-type and a p-
type semiconductor there can a local imbalance of
space charge, giving rise to a local electric field.
Semiconductor n-p junctions
An n-p junction is a semiconductor which
is doped as an n-type semiconductor on
one side and as a p-type semiconductor on
the other side. Near the junction, free
electrons from the n-type side fill the holes
from the p-type side forming a depletion
layer which is deficient in majority carriers.
In this layer the fixed impurities then create an excess positive charge on the
n-type side and an excess negative charge on the p-type side. This produces
an electric potential barrier Vb which counterbalances further movement of
majority carriers across the junction. The height of the potential barrier Vb
is somewhat less than the energy gap Eg because the fixed impurities slightly
hinder the movement of majority carriers. The potential difference across
the junction produces an electric field in the depletion layer directed from
the n-type side towards the p-type side.
The minority current across an
n-p junction
• When equilibrium has been reached in an n-p junction there are two
equal and opposite electric currents flowing across the depletion
layer. One current consists of minority carriers, and the other current
consists of majority carriers.
• Consider first the minority carriers. The thermally excited electrons
which are minority carriers on the p-side of the junction are caused to
drift towards the n-type side by the electric field in the depletion
layer.
• Likewise, the holes which are minority carriers on the n-type side of
the junction are caused to drift towards the p-type side.
• The effect of these two movements is a small drift current Imin from
the n-type side to the p-type side. The size of Imin depends only on the
rate at which minority carriers are being created by thermal excitations of
electrons across the energy gap Eg of the semiconductor. It does not
depend on the height Vb of the potential barrier.
The majority current across an
n-p junction
• In the equilibrium state the current Imin caused by minority
carriers is balanced by an equal and opposite current Imaj caused
by the diffusion of majority carriers.
• Because there are more electron carriers on the n-type side than
on the p-type side, there is a diffusion of electrons across the
junction from the n-type side to the p-type side.
• Likewise, there is a diffusion of holes across the junction from
the p-type side to the n-type side.
• The effect of these two movements is the diffusion current Imaj,
which is small because it is against the potential barrier. The
number of fixed impurity charges in the depletion layer adjusts
itself so that the height Vb of the potential barrier allows only
enough majority carriers across to make Imaj balance Imin.
Junction diode with reverse bias
If the applied forward bias voltage is large enough the internal electric
field across the depletion layer is from the p-type side of the junction to
the n-type side. Then a large current flows in the circuit.
Photovoltaic solar cell circuit
Pm
η=
E Ac
• This term is calculated using the ratio of the maximum power point Pm
divided by the input light irradiance (E, in W/m²) under standard test
conditions (STC) and the surface area of the solar cell (Ac in m²).
• STC specifies a temperature of 25°C and an irradiance of 1000 W/m² with
an air mass 1.5 (AM1.5) spectrum. These correspond to the irradiance and
spectrum of sunlight incident on a clear day upon a sun-facing 37°-tilted
surface with the sun at an angle of 41.81° above the horizon.
• This condition approximately represents solar noon near the spring and
autumn equinoxes in the continental United States with surface of the cell
aimed directly at the sun. Thus, under these conditions a solar cell of 12%
efficiency with a 100 cm2 (0.01 m2) surface area can be expected to produce
approximately 1.2 watts of power.
Three generations of solar cells
• Solar Cells are classified into three generations which
indicates the order of which each became prominent.
At present there is concurrent research into all three
generations while the first generation technologies are
most highly represented in commercial production,
accounting for 89.6% of 2007 production.
First generation solar cells
• First generation cells consist of large-area, high quality
and single junction devices. First Generation technologies
involve high energy and labor inputs which prevent any
significant progress in reducing production costs. Single
junction silicon devices are approaching the
theoretical limiting efficiency of 33%, and can achieve
cost parity with fossil fuel energy after a payback
period of 5-7 years.
First generation silicon technologies
• Monocrystalline silicon (c-Si): often made using the Czochralski
process. Single-crystal wafer cells tend to be expensive, and
because they are cut from cylindrical ingots, do not
completely cover a square solar cell module without a
substantial waste of refined silicon. Hence most c-Si panels
have uncovered gaps at the four corners of the cells.
• Poly- or multicrystalline silicon (poly-Si or mc-Si): made from cast
square ingots — large blocks of molten silicon carefully cooled
and solidified. These cells are less expensive to produce than
single crystal cells but are less efficient.
• Ribbon silicon: formed by drawing flat thin films from molten
silicon and having a multicrystalline structure. These cells
have lower efficiencies than poly-Si, but save on production
costs due to a great reduction in silicon waste, as this
approach does not require sawing from ingots.
Second generation technologies
• Second generation materials have been developed to address energy
requirements and production costs of solar cells. Alternative
manufacturing techniques such as vapor deposition and
electroplating are advantageous as they reduce high temperature
processing significantly. It is commonly accepted that as
manufacturing techniques evolve production costs will be dominated
by constituent material requirements, whether this be a silicon
substrate, or glass cover.
• Second generation technologies are expected to gain market share in
2008. The most successful second generation materials have been
cadmium telluride (CdTe), copper indium gallium selenide (CIGS),
amorphous silicon (a-Si), and micromorphous silicon. These
materials are applied in a thin film by standard plasma enhanced
chemical vapor deposition (PECVD) to a supporting substrate such as
glass or ceramics reducing material mass and therefore costs.
• These technologies do hold promise of higher conversion efficiencies
and cheaper production costs. Among major manufacturers there is
certainly a trend toward second generation technologies.
Combining cells with different bandgap