Art Wafer Clean Room Activity Guide

Operation: _ Manufacturing an Art Wafer_________________ ______________

Tools & Materials: 4” or 6” Silicon wafer with 0.5-1um silicon dioxide________________

IMPORTANT STEPS KEY POINTS REASONS

Hexamethaldisilazane (HMDS) Deposition - Oven

HMDS Coat
Prepare HMDS oven for wafer.
Make sure the oven is ready for wafer.
Load wafer in HMDS oven.
Provides a chemical
HMDS should not be inhaled,
“priming” and vapor
therefore this process should be
evaporation. Creates a
done in an HMDS Oven.
hydrophobic surface.
Already pre-programmed. The program First wafer should have to
should be set to bake and coat the wafer wait for bake plate to reach
at 100⁰C for 20 sec. 100⁰C.

Place wafer in the HMDS oven with wafer ***CAUTION***

tongs. Once wafer is placed, make sure Beware of pinch point, keep fingers and
your hands are free from the wafer area. tools out of the bake plate area once “F2”
(start process) is selected.
Page Up twice using the “up” arrow, then
press “F2” to begin process.
Remove and place wafer on table to
chill.

When process is complete, HMDS oven Cools wafer down prior to

*** Caution ***
will open. Use wafer tongs to remove placing in the boat. Hot
Wafer will be hot
wafer. wafers will melt the boat.

Place wafer on table to cool for 10

seconds.

SCME-Art Wafer Job Instruction Rev 9 – October, 2017

 Photoresist Application – CEE 100 Coater and Bake Station
Prepare for Soft Bake
Set hot plate to 110⁰C and ensure it
reaches this temperature.
Pre-set timer for 90 seconds
Prepare photoresist
Obtain a small bottle of AZ 1518
photoresist and a pipette.
Prepare coater for resist coat
Press Prog button
Press 0
Enter through parameters on the right to
make sure parameters are correct, you
may have to adjust the program
parameters.
Ensure the appropriate chuck is on the
spinner (Either 4” or 6”).
You may have to screw the chuck on the
spinner if it is not on.
Set program Parameters
Press “Run”
Select program 0
Press “Enter”
Load the wafer on spin chuck
Use wafer tongs to place the wafer on the
spin chuck.
Center wafer on the wafer chuck.
Press “Start”
The wafer will rotate several times to test
centering of wafer.
Nudge the wafer with tweezers to center it
or use the appropriately sized centering
tool.
Press “0” to re-test the centering.
Continue this process until the wafer is
well centered and you see minimal
wobble.
SCME-Art Wafer Job Instruction Rev 9 – October, 2017
AZ 1518 is a solvent and should be
acquired by the instructor from the solvent
cabinet. Please follow procedures for
using a solvent.
Program Parameters
500 rpm – Slow spin to distribute resist
2500 rpm – Ramp spin to 2500 rpm
5 sec – Allow 5 seconds for ramp
2500 rpm – Casting speed
2500 rpm – r/s
30 sec – Spin for 30 seconds at casting
speed
Ensure the polished (shiny) side is up.
Try to center the wafer as best as
possible as you place it on the spin
Most processing is done on
chuck.
the polished side of the
wafer. The unpolished side
You may choose to use the centering tool
of the wafer is considered
to help you center the wafer. If so, hold
the back of the wafer.
the appropriate sized tool so it is flush
with the chuck, then place the wafer on
the chuck as it is held flush to the
centering tool.
The first time you hit “Start”, the spin
chuck will test how centered the wafer is.
Notice if the wafer seems to wobble as it
A centered wafer ensures
spins. You will use your eye to center the
even distribution of resist. If
wafer on the chuck or use the
the wafer is not centered; it
appropriately sized centering tool.
will come off the chuck
during the high speed
***CAUTION***
portion of the program and
If you inadvertently select run/start before
shatter.
the wafer is centered and after the initial
centering attempt, select the STOP button
immediately – know where this is located
before starting.
Apply photoresist on wafer
Fill disposable pipette with at least 2 ml of
AZ 1518 photo resist. You will need this
volume to cover the entire wafer.
Hold pipette vertically above center of
wafer and squeeze once to dispense
directly in the center of the wafer.
Close the cover
Press “Start” to continue the coat
program.
Remove wafer from chuck/Begin Soft
Bake
Use wafer tweezers to grab wafer and
place on the pre-heated hot plate at
100⁰C for soft bake.
Start timer for 90 seconds.
Place the wafer on the table to cool
Use wafer tongs to place wafer on table
for 5 seconds.
Move wafer to boat.
Use wafer tongs to place wafer with front
side (coated side) oriented away from the
H-bar of boat.
SCME-Art Wafer Job Instruction Rev 9 – October, 2017
One application (squirt) vertically above
wafer directly in the center. Keep pipette
vertical at all times to avoid bubbles in the
pipette.
Please follow procedures for using a
solvent.
Make sure it is closed to avoid spray and
to ensure proper air flow over wafer
during spin which results in better resist
uniformity.
The wafer will spin slowly (500rpm) to
initially spread the photo resist. It will
Thicker (more viscous) resist
then ramp up to the casting speed (2500
requires higher spin speeds.
rpm) over 5 seconds. It will spin at 2500
rpm for 30 seconds.
Beeping sound indicates completion.
The coater will continue
beeping until the wafer is
Open lid and remove the wafer from the removed.
spin chuck. Soft Bake sets resist. Most
of the solvent is evaporated
from the resist.
Cools wafer down prior to
placing in the boat. Hot
wafers will melt the boat.
This is a MTTC standard
procedure.

Load Mask
Verify Vacuum is on
Pull out mask holder
Place mask face down on mask holder.
Protect mask with hand as you flip mask
holder to load into machine.
Set Exposure Parameters
Select PGM
Verify “Hard Contact’ is selected
Exposure time is set to 30 seconds.
Gap is typically 10-40µm.
Load Wafer
Slide wafer holder out
Place wafer on the wafer chuck
Press “Enter” then move the wafer chuck
slider into the aligner.
Press Enter to Confirm slider is in
position. Follow instructions on exposure
tool.
Begin Exposure Process
Press “Exposure”
When process is complete, confirm with
“Enter”
Move wafer to boat.
Use wafer tongs to place wafer with front
side (patterned side) oriented away from
the H-bar of boat.
SCME-Art Wafer Job Instruction Rev 9 – October, 2017
Expose
Make sure you place your mask with the
For the art wafer, students
correct side facing down in the holder.
will make masks on
(Chrome side facing down)
transparencies to fit the
wafer, either 100mm (4in) or
If vacuum is not on, mask will not stay in
150mm (6in).
mask holder and it will fall out and break.
The transparency is cut to
7x7in to fit on the glass plate
Make sure to protect the back of the mask
(clear mask).
as you flip mask holder into its slot.
Note: to change to Hard Contact, select
PGM, until hard contact comes up.
Edit Parameters with the arrow keys (up
and down to adjust exposure). Select edit
parameters to back out.
To ensure pattern is placed
on correct side of wafer and
Make sure wafer is centered with resist to ensure patterning
coated side up and the flat side is aligned alignment/orientation.
with the two small holes on bottom of
chuck. The vacuum holds wafer in
place during expose.
This applies vacuum to the chuck to hold
the wafer while sliding into Align/Expose
position.
Since the exposure unit is
on a vibration isolation table,
Do not touch table during this time.
this could pick up the user’s
Exposure time is 30 seconds.
motion and result in a
blurred, out of focus image.
This is a MTTC standard
procedure.

Turn on bake plate and set
temperature to 110C
Bake the exposed wafer for 60
seconds
Remove the wafer from bake
plate and cool
Post Exposure Bake - Optional
Pre heat the bake plate(s)
Set timer for 60 seconds
Open lid and place the wafer on the
pre-heated bake plate.
Place wafer on table to cool for at
least 5 seconds.
Post exposure bake is used to
reduce standing wave patterns, in
allows the PAC (photo active
compound) to diffuse after
exposure and before develop.
Stops the diffusion process.

Develop

Put on Personal Protective Equipment According to Safety Orientation To prevent injury due to
(PPE) standards. chemical splashes.

Prepare Develop Solution

Measure 50ml 1:4, 400K AZ developer in

Follow safety protocol
a graduated cylinder. Always pour away
Always pour away from you
from you.
Try to achieve a smooth pour, no gurgling
Pour 50 ml developer into single wafer
pyrex dish.
Begin Develop process
Make sure a partner presets timer for 120
seconds.
Develop for 120 seconds This develop process
removes photo resist from
Use wafer tongs to place wafer in
Appropriate concentration and time are exposed areas. The areas
developer.
important to achieve correct develop. exposed to light becomes
soluble to developer
Have partner start timer.
solution. This is a positive
photoresist. Image begins to
While wafer is developing, place wafer
form immediately.
boat in the Quick Dump Rinse (QDR)

Fill QDR with water just above the boat

Remove wafer
After wafer has been in developer solution
for 120 seconds, use wafer tongs to lift
wafer from developer at a 45 degree
angle.
Place wafer in wafer boat in the QDR with
front side oriented away from the H-bar of
boat.
Rinse developer from wafer
Dump water from QDR
Refill tank with water/Dump
Repeat 4 times
Once the QDR cycle is completed 5
times. Make sure and close the empty
tub.
The QDR should be repeated a total of
five times.
45 degree angle minimizes
drag while transferring to
Quick/Dump/Rinse (QDR). –
The water stops the develop
process and rinses off the
develop solution.
You can continue adding
other developed wafers
before proceeding with the
QDR 5 dump/fill cycle.

SCME-Art Wafer Job Instruction Rev 9 – October, 2017

 Spin/Rinse/Dry
Select the proper Spin Rinse
Dryer (SRD) – Either 4” or 6”
The MTTC has several
No need to change programs, use the default on the
Open door with foot pedal. SRDs’, they are set up for
SRD.
either 4inch or 6 inch
Place wafer boat in drier - carriers. Ensure you use the
Auto programmed for 120 seconds/240 seconds at
Orient H-bar towards back. correct one
1600 rpm according to recipe.
Close door with foot pedal. Drier feature requires that if
Pedal is important so that any chemical that might be
door was opened with foot
on gloves does not get on buttons.
Press “Start”. pedal it must close with the
foot pedal.
Open door with foot pedal and
remove boat box.
Post Develop Inspection

If there is “scumming” you

Look at wafer under the
Make sure the resist is cleared from the open areas. may repeat the develop
microscope
step.

Hard Bake
Prepare for Hard Bake
Set to Hot Plate to 120⁰C
Any solvent is baked off. Hardened to stand up to
Use wafer tongs to place the etch step.
wafer on hot plate for 2
minutes according to recipe.

This step cools the wafer before putting it in the

Place wafer on table to cool
wafer carrier. Avoids the possibility of the wafer
for 5-10 seconds.
melting the carrier slots.

Move wafer to boat.

Use wafer tongs to place
wafer with front side This is a MTTC standard procedure.
(patterned side) oriented
away from the H-bar of boat.

SCME-Art Wafer Job Instruction Rev 9 – October, 2017


Put on Personal Protective
Equipment (PPE)
Attach Handle to Teflon
Carrier containing wafers as
instructed.
Have partner preset timer for
8 minutes.
Place wafers in the BOE bath
in the Acid Sink.
Start timer.
Rinse Wafers
Place wafers in the QDR in
the Acid Sink.
Select “Run”
Select the proper Spin Rinse
Dryer (SRD) – Either 4” or 6”
Open door with foot pedal.
Place wafer boat in drier -
Orient H-bar towards back.
Close door with foot pedal.
Press “Start”.
Open door with foot pedal and
remove boat box.
SCME-Art Wafer Job Instruction Rev 9 – October, 2017
Buffered Oxide Etch (BOE) Etch
BOE 20:1 Ammonium fluoride
and HF solution.
HF burns can result in death. Fluorine ions react
HF (Hydrofluoric Acid) is used
with calcium in your bones; too many of these ions
in this process. Safety is
can also stop your heart.
paramount. PPE is required.
According to Safety
Orientation standards.
Bare silicon is hydrophobic. Silicon Dioxide is
hydrophilic.
After 8 minutes, slowly lift up
to check for complete etch – When etching is complete, and the exposed SiO2
underlying crystalline silicon has been removed, the silicon crystal is exposed.
surface is hydrophobic. These regions of no pattern then become
hydrophobic and look dry when the wafers are
raised from the HF solution.
This will automatically rinse
Removes acid from the wafers’ surface.
the wafers.
Spin/Rinse/Dry
The MTTC has several
No need to change programs, use the default on the
SRDs’, they are set up for
SRD.
either 4inch or 6 inch
carriers. Ensure you use the
Auto programmed for 120 seconds/240 seconds at
correct one
1600 rpm according to recipe.
Drier feature requires that if
Pedal is important so that any chemical that might be
door was opened with foot
on gloves does not get on buttons.
pedal it must close with the
foot pedal.
 Resist Strip
Strip remaining resist with
Acetone

Take the wafer (which is in the

wafer boat) to the solvent
bench. This stainless steel hood is
You will be using a solvent, Acetone – you need to do
metal due to the fact that
this in the solvent hood only.
Use wafer tongs to place solvents are often
wafer in acetone tray. flammable. It also contains
This step removes any remaining photoresist on the
the CO2 fire suppression
wafer.
Dispense Acetone on the system.
wafer in the tray.

You may hold the wafer with

tongs at an angle and rinse
with acetone.

Rinse Acetone treated Displaces the Acetone, IPA

Hold the wafer at an angle with wafer tongs, rinse the
wafer with IPA on a wafer is acceptable
acetone off with Isopropyl Alcohol (IPA)
for the QDR.

This rinses the wafer. It is

Rinsing the wafer undesirable that IPA dry on
Place boat in the QDR at the the wafer; this will result in
Once all the wafers have been placed in the boat, the
acid bench. water spots.
QDR can be started.
Place wafer in the boat.
Start the QDR Cycle This rinses the wafers five
times automatically.
Spin/Rinse/Dry
Select the proper Spin Rinse
Dryer (SRD) – Either 4” or 6”
The MTTC has several
No need to change programs, use the default on the
Open door with foot pedal. SRDs’, they are set up for
SRD.
either 4inch or 6 inch
Place wafer boat in drier - carriers. Ensure you use the
Auto programmed for 120 seconds/240 seconds at
Orient H-bar towards back. correct one
1600 rpm according to recipe.
Close door with foot pedal. Drier feature requires that if
Pedal is important so that any chemical that might be
door was opened with foot
on gloves does not get on buttons.
Press “Start”. pedal it must close with the
foot pedal.
Open door with foot pedal and
remove boat box.
Microscope Inspection
Make sure process is
Place a wafer on the complete. Typically, all
The instructor will teach you how to use this tool.
microscope stage and inspect. resist is removed and only
the oxide is left.

Adapted from Graupp, P. & Wrona, R. (2006) The TWI Workbook: Essential Skills for Supervisors.
New York, NY. Productivity Press.

SCME-Art Wafer Job Instruction Rev 9 – October, 2017