Professional Documents
Culture Documents
-1-
What is Evaporation Method?
Thermal evaporation of source material and its transport to the
substrate within a high vacuum environment
heating
-2-
Deposition by Evaporation
• Direct evaporation
• Reactive evaporation
Ti + C2H2 → TiC + H2
Ti + O2 → TiO2
Zn + O2 → ZnO
• Multisource evaporation
-3-
Different types of Evaporation
Based on Hearing Sources
Resistive Heating
Thermal Evaporation
Inductive Heating
Arc Evaporation
Laser Evaporation
-4-
Thermal Evaporation?
A method of forming a thin film by evaporating a material by
heating using resistance of electric current flowing in a conductor
such as W, Mo, Ta, etc. to heat and evaporate the material and
form a thin film on a substrate
-5-
Thermal Evaporation?
Resistive Heating
A method of forming a thin film by evaporating a material by heating using
resistance of electric current flowing in a conductor. W, Mo, Ta, etc. to heat
and evaporate the material
-6-
Electron Beam Evaporation
• Multiple deposition
• X-ray generation
-7-
Source Feeding in Electron Beam Evaporation
-8-
What is sputtering?
Sputtering Process
-9-
Sputtering System
substrate
plasma gas
target
gauge
DC/RF generator
-10-
Schematic of Sputtering Process
Cathode
Target
Sputtered Atoms
+ Ar+ +
Plasma
electrons +
Thin films
Substrate
Substrate holder
-11-
Sputtering on Alloys & Compounds
The composition of a sputtered film tends to be the same as that of the target,
Provided that :
Sputtering yield SNi = 2.1 SFe = 1.4 High Low High Low
Yield Yield Yield Yield
material material material material
Sputtering ratio ; Ni : Fe = 80 x 2.1 : 20 x 1.4 = 86 : 14
72.7% Ni vs 27.3% Fe
target target
-12-
Microstructure of Thin Films
-13-
SEM images of TiN thin films on Si substrates
Films were prepared by sputtering method
50 W 50 W
power
300nm 300nm
200 W 200 W
300nm 300nm
2 mTorr 10 mTorr
-14-
Why RF Sputtering ?
DC methods can not be used to sputter Non-conducting targets
Conducting Targets
The ions reaching the cathodes are supplied with electrons
from the cathode and are reduced to a netural normal atom
or molecule
Insulating Targets
• Ions accumulate on the cathode surface because they
can not provide electrons to the ions that reach the
cathode
• When a lot of ions are accumulated, the surface of the
cathode becomes a positive potential, ions can no longer
come in, and the electric equilibrium state inside the
plasma is broken, so that the plasma disappears within a
few microseconds. ( t ≒ 1~10 μs )
-15-
Why RF Sputtering ?
A RF sputtering system can be used to deposit
conducting, semiconducting, insulating coatings
Discharge circuit
Electrical Equivalent
Time dependence of V
-16-
Self DC Bias of RF Electrodes
AC glow discharge circuit
Schematic of a high frequency glow discharge circuit Voltage and target current waveforms
Va : applied voltage
Vb Negative shift
C : capacitance of insulating target
Net current = 0
Vb : voltage of blocking capacitor
-17-
Magnetron Sputtering
A method of increasing the sputter yield by locating permanent magnets on the back
surface of the target and locally gathering electrons emitted from the target in a
magnetic field by forming a magnetic field to accelerate collision with Ar atoms
N S N
Cathode
Target
Sputtered Atoms
+ Ar+ +
Plasma
electrons +
Thin films
Substrate
Substrate holder
-18-
Movement of electrons in E & B Fields
-19-
Pulsed Laser Deposition
-20-
Different Types of Chemical Method
PCVD
-21-
Types of Plating
Plating: a surface covering in which a metal is
deposited on a conductive surface.
-22-
Classification of Solution Methods
Electrodeposition
Bath-based Photochemical
SILAR Process
Non-Vacuum
Spray pyrolysis Ball-milling
Solution Methods Pure Solution Based
(sol-gel like process)
Hot-injection
Direct Liquid Particle Dispersed
Deposition (Ink/Slurry Formation)
Hydro/Solvo
thermal
Mixed Solution-Particle*
Microwave
assisted
*IBM-Champion Cell
-23- Lab.
Classification of CVD
Parameters Types
Source Gases MICVD, MOCVD
Temperature Range Low, Medium, High
Deposition Pressure Atmospheric, Low Pressure
Reactor Geometry/Wall Temp. Hot Wall, Cold Wall
Energy Source Thermal, Plasma, Photon
Horizontal, Vertical, Barrel,
Reactor Continuous, Buried,
Rotational
-24- Lab.
Classification of CVD
CVD
APCVD LPCVD
Pressure
Heating Hot Wall Cold Wall Hot Wall Cold Wall Hot Wall Cold Wall
Buried
-25- Lab.
Schematic of CVD Process
A method of forming a nonvolatile solid thin film on a substrate by reacting gaseous
gases having components of the thin film to be formed on the substrate without
changing the properties of the substrate
5
1
3 기판
2 4
SiH4 Si H2(g)
-26-
Solution Deposition Method
Pb(CH3COO)23H2O Ti[(CH3)2-CHO]4
Spin-coating or dip-coating
amorphous phase
Decomposition (pyrolysis)
formation
crystalline phase
Crystallization (annealing)
formation
-27-
Spin Coating Method
-28-
Hydro/Solvo-thormal Synthesis
• Soluble precursors
• Teflon lined vessel
• 80°C to 200°C
• Benefits
– Low cost
– Minimal waste
– Ease of production
-29-
Chemical Bath Deposition
Zn source S source
(Zn acetate) (Thiourea)
substrate
substrate
Characterization
• XRD
• SEM
• XPS
• TEM
• UV-Vis
HotHeating 80ºC
plate and stirrier
60ºC
-30-
Plating
Plating is a surface covering in which a metal is deposited on a conductive surface.
-31-
Electroplating
Electroplating is a process that uses electric current to reduce dissolved metal
cations so that they form a thin coherent metal coating on an electrode
32
-32-
Electrodeposition
Electrodeposition may refer to:
Electroplating, a process that uses electric current to reduce dissolved metal cations
so that they form a coherent metal coating on an electrode
Reaction at Cathode (Electrodeposition) Reaction at Anode
e- e-
Reference Electrode
Cathode
Anode
Platinum Electrode
Working Electrode
Na+
Cu2+
HSeO3-
In3+
Cl-
Ga3+
H2O, H+ Electrolyte
33
-33-
Electroplating VS Electroless Plating
-34-