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THERMAL CONTACT RESISTANCE

DOI: 10.1615/AtoZ.t.thermal_contact_resistance

When a junction is formed by pressing two similar or dissimilar metallic materials together, only a small fr
nominal surface area is actually in contact because of the nonflatness and roughness of the contacting surfa
flux is imposed across the junction, the uniform flow of heat is generally restricted to conduction throug
spots, as shown in Figure 1. The limited number and size of the contact spots results in an actual contact a
significantly smaller than the apparent contact area. This limited contact area causes a thermal resistanc
resistance or thermal contact resistance.

Figure 1. Magnified view of two materials in contact.

The presence of a fluid or solid interstitial medium between the contacting surfaces may contribute to o
heat transfer at the junction, depending upon the thermal conductivity, thickness, and hardness (in the ca
of the interstitial medium. If there is a significant temperature difference between the surfaces composing
heat exchange by radiation also may occur across the gaps between the contacting surfaces.

When a metallic junction is placed in a vacuum, conduction through the contact spots is the primary m
transfer, and the contact resistance is generally greater than when the junction is in the presence of air or o
a vacuum, the temperature distribution in the contacting materials, with the resulting temperature diffe

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