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#51005E-0
Revised on Feb 4, 2014

Koki no-clean LEAD FREE solder paste

Contents

Features

Specifications

Continual printability
High-reliability Low Ag Lead Free Solder Paste
Viscosity variation S1XBIG58-M500-4
Super fine pattern wetting

Anti-pillow
Product information
Voiding

Halogen contents

Other properties
S1XBIG
Alloy thermal cycle test

T/C - Cross-section SAC305

Handling guide After -40/125ºC, 1000 cycles

This Product Information contains product performance assessed strictly according to our own test procedures
and may not be compatible with results at end-users.

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Product features
Contents

Features

Specifications  Solder alloy composition is Sn 1.1Ag 0.7Cu 1.8Bi +Ni.

Continual printability
 HIGH RELIABILITY Low-Ag Alloy compared with conventional low-Ag alloys
Viscosity variation

Super fine pattern wetting  PERFECT MELTING and wetting at super fine pitch micro components
(>0.25mm dia. CSP, 0603 chip).
Anti-pillow

Voiding  Stable viscosity performance due to prevention with chemical reaction

between solder powder and flux.
Halogen contents

Other properties  Liquidus point (223ºC) may allow to apply the CONVENTIONAL reflow
profile for SAC305.
Alloy thermal cycle test

T/C - Cross-section  Conforms to HALOGEN FREE standard (Cl+Br = Less than 1500ppm) BS
EN14582.
Handling guide

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Specifications
Contents

Features
Application Printing - Stencil
Specifications
Product S1XBIG58-M500-4
Continual printability
Alloy Composition (%) Sn 1.1Ag 0.7Cu 1.8Bi +Ni

Viscosity variation Melting point (ºC) 211 - 223

Alloy
Shape Spherical
Super fine pattern wetting
Particle size (µm) 20 - 38
Anti-pillow
Halide Content (%) 0
Flux
Voiding Flux Type ROL0*3

Flux Content (%) 11.2 ±1.0

Halogen contents
Viscosity*1 (Pa.s) 220 ± 30
Other properties
Copper plate corrosion*2 Passed
Product
Alloy thermal cycle test Tack Time > 24 hours

Shelf Life (0-10ºC) 6 months

T/C - Cross-section
Optional powder size (µm) 20 - 45: S1XBIG48-M500-4
Handling guide
*1. Viscosity : Malcom spiral type viscometer, PCU-205 at 25ºC 10rpm
*2. Copper plate corrosion : In accordance with IPC J-STD-004A
*3. Flux type : According to IPC J-STD-004A

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Contents
Continual printability

Features Test condition

• Stencil : 0.12mm thickness, laser cut stencil

Specifications
Continual printability
Viscosity variation
• Printer : Model YVP-Xg YAMAHA Motor
• Squeegee : Metal blade, Angle - 60º
• Print speed : 40 mm/sec
• Atmosphere : 24-26ºC (50-60%RH)
• Test pattern : 0.25 mm dia., 0.4mmP QFP pattern

Super fine pattern wetting After 200strokes

1st print 10th print
10th print
Anti-pillow

Voiding
0.25mmdia.

Halogen contents

Other properties

Alloy thermal cycle test

0.4mmP QFP

T/C - Cross-section

Handling guide

Consistent and quality printability over the continual prints.

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Contents
Viscosity variation

Features Test condition

Specifications
Continual printability
Print (knead) solder paste on the sealed-up stencil continually up for 24 hours to observe viscosity variation.
• Squeegee : Metal blade, Angle - 60º
• Squeegee speed : 30mm/sec.
• Print stroke : 300mm
• Printing environment : 24-26ºC, 40-60%RH

Viscosity variation
300
Super fine pattern wetting
250

Anti-pillow
200
Viscosity (Pa.s)

Voiding
150

Halogen contents
100
S1XBIG58-M500-4
Other properties
50
*120 strokes/hour
Alloy thermal cycle test 0
0 500 1000 1500 2000 2500 3000
T/C - Cross-section
No. of print strokes (times)

Handling guide

A newly developed flux formula has succeeded to realize consistent long term printability by preventing
excessive viscosity drop due to shear thinning and excessive increase due to chemical reaction between
solder powder and flux medium during the repeated rolling.

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Contents
Super fine pattern wetting
0.25mm dia.
Features
Test condition

Specifications • Material : Glass epoxy FR-4

• Surface treatment : OSP
• Stencil thickness : 0.12mm (laser cut)
Continual printability • Pad size : 0.25mm dia.
• Component: 0603R (0201) chip, 100%Sn
Viscosity variation • Stencil aperture : 100% aperture opening to pad
• Heat source : Hot air convection
• Atmosphere : Air 0603R (0201)
Super fine pattern wetting • Reflow profile : See below chip

Anti-pillow
300

250
Voiding
0.25mm dia. 0603R(0201) 200

Temp. (ºC)
Halogen contents 150

100
Other properties S1XBIG58-
M500-4 50
Alloy thermal cycle test 0
0 50 100 150 200 250 300
Time(s)
T/C - Cross-section

Handling guide

Larger relative surface areas of solder paste exposed due to miniaturization of components (CSP, 0603 chips), often
causes incomplete coalescence of the solder due to excessive oxidation during the reflow. An improved flux formula
ensures complete coalescence by minimum deterioration of barrier performances .
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Contents
Anti-pillow test
Test condition Good
Features
• Material : Glass epoxy FR-4
• Surface treatment : OSP
Specifications • Stencil thickness : 0.12mm (laser cut)
• Pad size : 0.8 x 0.8mm diameter
NG
• Component: 0.76mm ball SAC305
Continual printability • Stencil aperture : 100% aperture opening to pad area
• Heat source : Solder pod 275ºC
Viscosity variation • Mount interval: 10sec.
Drop a solder ball every 10 sec. after the solder paste
Super fine pattern wetting has melted to see the heat durability of flux.
Pillow defect
30sec 40sec 50sec
Anti-pillow

Voiding
S1XBIG58-
M500-4
Halogen contents

Other properties

Alloy thermal cycle test

Conventional
T/C - Cross-section solder paste

Handling guide

M500-4 retained the activation even up to 50sec. and allowed the complete merger of the solder bump with the molten
solder, while the conventional solder paste resulted in the partial merger only 30sec. after the solder paste has melted.
The results demonstrates that M500-4 shall effectively prevent the occurrence of head-in-pillow defect.

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Voiding
Contents

Features
Test condition
6330R(2512)
Specifications • Material : Glass epoxy FR-4
BGA
• Surface treatment : OSP
• Stencil thickness : 0.12mm (laser cut) Pwtr
Continual printability • Stencil aperture : 100% aperture opening to pad area
• Components Pwtr, 6330R(2512) -100% Sn
BGA ball - SAC305
Viscosity variation
• Heat source : Hot air convection
• Atmosphere : Air
Super fine pattern wetting • Reflow profile : Same as “Super fine pattern wetting”

Anti-pillow

Pwtr. 6330R(2512) BGA

Voiding

Halogen contents
S1XBIG58-
Other properties M500-4

Alloy thermal cycle test

T/C - Cross-section

Handling guide

M500-4 ensures low voiding regardless of the type and size of the components.

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Halogen contents
Contents

Features
Test condition
Specifications * BS EN14582

Continual printability

Elements Results
Viscosity variation

Super fine pattern wetting

F Not detected
Anti-pillow

Voiding
Cl Not detected
Halogen contents

Other properties
Br Not detected
Alloy thermal cycle test

T/C - Cross-section Halogen contents (ppm)

Handling guide

Conforms to Halogen-free standard (Cl+Br: less than 1500ppm) BS EN14582.

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Other properties
Contents

Features

Specifications
Item Result Method
Continual printability

Tack time > 24 hours JIS Z 3284

Viscosity variation

Super fine pattern wetting

Heat slump 0.3mm pass JIS Z 3284

Anti-pillow
Solder balling < Category 3 JIS Z 3284
Voiding

Halogen contents
Copper mirror corrosion Type L IPC J-STD-004A

Other properties
IPC J-STD-004A
Copper plate corrosion Pass
Alloy thermal cycle test JIS Z 3284

T/C - Cross-section IPC J-STD-004A

Voltage applied SIR > 1E+9
JIS Z 3284
Handling guide

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Thermal cycling test; Share strength

Contents
Test condition
Features
• Thermal cycling conditions : -40/+125ºC, 60min./cycle x 1000cycles
• Testing machine : SEISIN SS30WD
Test board & components
Specifications
Thermal cycle conditions;　-40/125℃ 3216R (30pcs)
2012R (30pcs)
Continual printability
1608R (30pcs)
150 1005R (30pcs)
SAC305 0603R (30pcs)
Viscosity variation S1XBIG
125
PCB: FR4
Joint strength　(N)

Super fine pattern wetting Surface finish: OSP

100 Cu thickness : 18μm
PCB thickness : 1.6mm
Anti-pillow
75 Pad size

Voiding 50 3216R A

C
B
Halogen contents 25 (mm)
2012R
A B C
Other properties 0
3216R 1.40 0.90 2.20
0

0
500
1000

500
1000

500
1000

500
1000

500
1000
1608R
2012R 1.05 0.60 1.30
Alloy thermal cycle test 1005R 1680R 0.80 0.50 0.80
3216R 2012R 1608R 1005R 0603R
T/C - Cross-section Chip Chip Chip Chip Chip 0603R
1005R 0.30 0.40 0.50

0603R 0.30 0.23 0.25

No of cycle
Handling guide

S1XBIG solder alloy exhibits higher shear strength than SAC305, especially with relative large
components due to solid solution effect of Bi containing alloy.

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Thermal cycling test; Cross-sectional observation

Contents

Features T/C condition Alloy SAC305 S1XBIG

Specifications

Continual printability
Before

Viscosity variation

Super fine pattern wetting

Anti-pillow 3216R Chip

500cycles
Voiding
-40/+125ºC

Halogen contents
Cracking
Other properties

Alloy thermal cycle test 1000cycles

T/C - Cross-section

Handling guide

No cracking or rupture occurred in the solder fillets formed by S1XBIG, while SAC305
solder fillets show some cracking after 1000 cycles.

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Contents
Handling guide

Features 1. Printing
1) Recommended printing parameters
Specifications (1) Squeegee
1. Kind : Flat
Continual printability 2. Material : Rubber or metal blade
3. Angle : 60º (rubber) or metal blade
4. Pressure : Lowest
Viscosity variation 5. Squeegee speed : 20~100mm/sec.

Super fine pattern wetting (2) Stencil

1. Thickness : 150~100m for 0.65~0.4mm pitch pattern
Anti-pillow 2. Type : : Laser or electroform
3. Separation speed : 7.0~10.0mm/sec.
4. Snap-off distance : 0mm
Voiding
(3) Ambiance
Halogen contents 1. Temperature : 23~27ºC
2. Humidity : 40~60%RH
3. Air draft : Air draft in the printer badly affects stencil life and tack performance of solder pastes.
Other properties
2. Shelf life
Alloy thermal cycle test
0~10ºC : 6 months from manufacturing date

T/C - Cross-section
* Manufacturing date can be obtained from the lot number
Handling guide ex. Lot No. 4 02 04 2
No. of lot : 2nd
Date : 4th
Month : Feb
Year : 2014

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Contents
Handling guide – Recommended reflow profile

Features

Specifications
(ºC) Peak temp.
Continual printability 230~250ºC
250
Viscosity variation
223 Pre-heat temp.
Super fine pattern wetting
200 150~190ºC 60~100sec.
Anti-pillow
Over 223ºC >30 sec.
150
Voiding

Halogen contents Ramp-up temp.

100
1.0~3.0ºC/sec.
Other properties Pre-heat conditions
Target : 150~180ºC 100sec
Alloy thermal cycle test
50 Upper limit: 180~190ºC 100sec
Lower limit: 150~175ºC 60sec
T/C - Cross-section
0
60 120 180 240
Handling guide
(sec.)

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Handling guide – Recommended reflow profile

Contents

Features
Specifications
(ºC)
Continual printability
Viscosity variation
Super fine pattern wetting
Shorter TAL and lower peak temperature may become
a cause of voiding.
In case relatively larger volume of voiding is observed,
it is recommended either to increase the peak
temperature or extend TAL (for >45sec.).
250
Higher pre-heating temperature may lead to
grainy solder fillet or de-wetting by accelerating
oxidization of the solder alloy and exhaustion of
the flux activation. It is recommended to decrease
200 pre-heating temperature in case poor solder
wetting is observed.

Anti-pillow
150
Voiding
Similarly to the pre-heating, slow
temperature elevation between pre-
Halogen contents heating to the peak is prone to cause
100 grainy solder fillet and/or de-wetting to
the pad due to excessive oxidization of
Other properties the solder alloy, pad surface and
exhaustion of the flux activation.
Fast ramp-up speed is prone to cause bridging , It is recommended to quicken
Alloy thermal cycle test 50 mid-chip balling or solder beading by promoting temperature elevation speed in case
heat slumping. It is recommended to slow down the poor solder wetting is observed.
ramp-up temperature to alleviate the degree of
T/C - Cross-section heat slump of the solder paste.
0
Handling guide
60 120 180 240
(sec.)

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