Professional Documents
Culture Documents
IME
Microdevice and system for cell
based assay
Microdevice and system for high
throughput drug screening (
molecular and cell based)
Microfludic system, micro reactor,
micro separator or micro extractor
for molecular or cell based sample
preparation and enrichment
Biosensors and chemical sensors
for molecular, specific cells or cell
secretion detection
Chen Bangtao MEMS MEMS integration and packaging, chenb@ime.a‐
vacuum packaging star.edu.sg
Cheong Jia Hao ICS‐BIC Low power ASIC design for cheongjh@ime.a‐
implantable wirelessly powered star.edu.sg
blood flow monitoring system
Cubillo Joseph IPP‐TD‐Mod&Char Electrical design, SI, PI, IC‐Package cubillojr@ime.a‐
Romen co‐design, modeling and star.edu.sg
characterization of packaging and
interconnection, such as fine pitch
high density interconnection, 3DIC
and TSV interposer
Ding Liang TSV TSV 3DIC integration dingl@ime.a‐
TSV interposer star.edu.sg
Thin wafer handling
Si photonics
Duan Ning Nano Photonics Silicon photonics duann@ime.a‐
Program star.edu.sg
Fernando Sanchitha Sensors Actuators & Inertial MEMS – accelerometers, fernandosn@ime.a‐
Nirodha Microsystems gyroscopes; star.edu.sg
Program MEMS Vacuum sensors – Pirani
Gauges, resonators
2. Circuits and systems for
neurodevices
3. Sensor node SoCs for wireless
health monitoring
4. Nano‐scale biosensor interface
ASIC for diagnostics
5. MEMS sensor and actuator
interface circuits for consumer and
industrial applications
6. Analog & mixed‐signal ICs and
wireless ICs
7. High temperature circuits and
systems for oil & gas industry
dielectrics for logic, analog and
memory applications, Metal gate
electrodes for dual‐gate CMOS,
device reliability, Si‐based
nanocrystal memory, Schottky
source/drain MOSFETs, RF CMOS
technology
Li Hong Yu TSV Program 1. 3D IC and 3D packaging process lihy@ime.a‐
integration by TSV technology. star.edu.sg
2. Fine pitch Cu to Cu bonding.
3. 3D interconnect reliability.
GaN‐on‐Si and Power Devices
Full list of supervisors
Luo Xianshu Nano Photonics 1. Silicon photonics for on‐chip luox@ime.a‐
Program optical interconnects star.edu.sg
2. Hybrid Optoelectronics IC for
Next‐Generation Optical
Communications
3. Microwave photonics by using
silicon photonics platform
Ng Sheung Yan ICS‐BIC lower power CMOS sensor ngsys@ime.a‐
Simon interface and high resolution data star.edu.sg
converter design
Park Mi Kyoung Bioelectronics Development of label‐free parkmk@ime.a‐
program immunosensors ‐ silicon photonics star.edu.sg
sensor, SPR sensor, and
electrochemical sensor; Cancer
Diagnostics, Surface Chemistry for
bio‐conjugation
Randles Andrew SAM SAW Temperature compensation, randlesab@ime.a‐
Benson cMUT design and fabrication star.edu.sg
Singh Ravinder ICS‐AMSIC Power Management IC design ravinderps@ime.a‐
Pal star.edu.sg
Singh Navab NanoElectronics Si, SiGe Nanowire Devices and their navab@ime.a‐
Program applications in low power logic, star.edu.sg
NVM, and Energy conversion
(TEC/TEG, Solar cells). Lithography.
Spintronics.
Song Junfeng Nano Photonics Silicon photonic
Program III‐V on SOI
Silicon Plasmonics
Radio on SOI
Silicon photonics biosensor
packaging and reliability, MEMS
packaging and reliability