Professional Documents
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Version: V6.20.71
ZTE CORPORATION
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Revision History
I
4.1.1 Shelf Classification ................................................................................... 4-1
4.1.2 Shelf Location .......................................................................................... 4-2
4.2 Shelf Configuration............................................................................................. 4-2
4.2.1 Shelf Configuration When Using Resource Shelf ........................................ 4-2
4.2.2 Shelf Configuration When Using GB Resource Shelf .................................. 4-6
4.3 Inter-Shelf Interconnection .................................................................................. 4-9
4.3.1 Inter-Shelf Connection for Resource Shelf ................................................. 4-9
4.3.2 Inter-Shelf Connection for GB Resource Shelf.......................................... 4-15
II
5.3.26 SBCX Board ....................................................................................... 5-110
5.3.27 SBCX2 Board...................................................................................... 5-114
5.3.28 SDTB Board........................................................................................ 5-116
5.3.29 SDTB2 Board......................................................................................5-120
5.3.30 SPB Board..........................................................................................5-125
5.3.31 SPB2 Board ........................................................................................5-129
5.3.32 UIMC Board ........................................................................................5-133
5.3.33 UIMU Board ........................................................................................5-137
5.3.34 UPPB Board .......................................................................................5-142
5.4 Rear Board .....................................................................................................5-146
5.4.1 RCHB1 Board .......................................................................................5-146
5.4.2 RCHB2 Board .......................................................................................5-148
5.4.3 RCKG1 Board.......................................................................................5-151
5.4.4 RCKG2 Board.......................................................................................5-154
5.4.5 RDTB Board .........................................................................................5-157
5.4.6 RGER Board.........................................................................................5-159
5.4.7 RGER2 Board.......................................................................................5-160
5.4.8 RGIM1 Board........................................................................................5-161
5.4.9 RGUM1 Board ......................................................................................5-162
5.4.10 RGUM2 Board ....................................................................................5-164
5.4.11 RMNIC Board......................................................................................5-165
5.4.12 RMPB Board.......................................................................................5-167
5.4.13 RSPB Board .......................................................................................5-168
5.4.14 RSVB Board .......................................................................................5-170
5.4.15 RUIM1 Board ......................................................................................5-172
5.4.16 RUIM2 Board ......................................................................................5-173
5.4.17 RUIM3 Board ......................................................................................5-175
5.5 Backplane.......................................................................................................5-176
5.5.1 BCTC Backplane...................................................................................5-176
5.5.2 BPSN Backplane...................................................................................5-179
5.5.3 BUSN Backplane ..................................................................................5-181
5.5.4 BGSN Backplane ..................................................................................5-183
III
6.1.4 ALB Interfaces ......................................................................................... 6-4
6.1.5 ALB Buttons............................................................................................. 6-6
6.1.6 ALB Indicators ......................................................................................... 6-7
6.1.7 Connection Mode ..................................................................................... 6-7
6.2 Relevant GPS Devices ....................................................................................... 6-9
6.2.1 GPS Active Antenna and Lightning Protector/Frequency Divider ................. 6-9
6.2.2 GPS L1 Signal Transponder and GPS Antenna Feeder Lightning
Protector .............................................................................................. 6-12
IV
About This Manual
Purpose
This manual describes the hardware of the ZXG10 iBSC, including cabinet, subrack, shelf,
board, and auxiliary devices.
Intended Audience
l Planning engineers
l Equipment installation engineers
l Commissioning engineers
l Maintenance engineers
Chapter Summary
Chapter 3, Subrack Describes the functions, structure, and interfaces of the ZXG10 iBSC
subrack.
Chapter 4, Shelf Describes the types, configuration, and interconnection of the ZXG10
iBSC shelf.
Chapter 5, Board Describes the functions, structure, and interfaces of the ZXG10 iBSC
board.
Chapter 6, Auxiliary Devices Describes the functions and structure of the ZXG10 iBSC auxiliary
devices.
Appendix A, Combined Describes meaning of combined indicator status of the ZXG10 iBSC
Indicator Status Descriptions board.
I
II
Chapter 1
Overview
Table of Contents
Product Description ....................................................................................................1-1
Hardware Composition ...............................................................................................1-1
1-1
1-2
The ZXG10 iBSC cabinet complies with the CompactPCI standard. Its front door is in dark
blue with dense air vents. The cabinet body is in dark blue.
2-1
2-2
2-3
2-4
1. Installation plate of the wire 2. Installation plate of the top 4. Grounding screw
out module filter 5. Installation plate of the top
3. Grounding ID fan
2-5
Top Fan
The top fan is an iminterfaceant component of the whole equipment for ventilation and
dissipation. It consists of a bottom installation plate, six fans, and a monitoring circuit
plate.
For the top fan structure, see Figure 2-7.
2-6
Top Filter
The top filter is a interface for power input of the whole equipment. The -48 V power cable
from the equipment room is connected to the input end of the top filter. After the power
is filtered, the power cable is connected to the internal power distribution subrack of the
cabinet.
For the top filter structure, see Figure 2-8.
2-7
Wire Reel
The wire reel is used to wrap remaining fibers. It consists of the bottom plate, wire post,
and cover.
For the wire reel structure, see Figure 2-9.
2-8
2-9
2.2.3 Rack
The rack is composed of the top shelf, bottom shelf, post, adjustable rail, and side door.
For its structure, see Figure 2-11.
2-10
Note:
When multiple cabinets are installed side by side, only the side doors of the two cabinets
located outside need to be installed.
2.2.4 Busbar
The power distribution cable and grounding cable of the ZXG10 iBSC are connected in the
unified manner through the busbar. For the busbar structure, see Figure 2-12.
The busbar is located at the right side of the cabinet back and provides six groups of
connectors. The first group of connectors are connected to the power distribution subrack.
The 2 thru 5 groups of connectors are connected to their corresponding fan subracks and
shelves. The sixth group of connectors are connected to the third fan subrack.
2-11
1. The first and sixth groups provide six connectors each. From top to bottom, the signals
are defined as follows:
l -48 V
l -48 VGND
l PE
l PE
2. The 2 thru 5 groups provide six connectors each. From top to bottom, the signals are
defined as follows:
l -48 V
l -48 VGND
l -48 V
l -48 VGND
l PE
l PE
2-12
2-13
Note:
Among the signal cables of the ZXG10 iBSC, only fibers are led from the front board panel
and all the other cables are led from the rear board panel.
2-14
Power
1. The normal voltage for system operating is -48 V DC. It ranges from -40 V DC to -57
V DC.
2. The system power uses the fully distributed design. The board itself provides a power
module that implements one-off voltage conversion and isolation from -48 V to board
voltage such as +5 VDC, +3.3 VDC, +2.5 VDC, and +1.8 VDC.
3. The cabinet power input is a power distribution subrack that has two power inputs.
One of them is selected by using the switch to provide power for all shelves and fans.
The two power inputs are mutually backed up. The -48 V power is transmitted from
the power distribution subrack downwards through a busbar. The power of all shelves
and fan subracks is from one -48 V busbar.
Grounding
There are two grounding types.
1. -48 VGND: -48 V ground
2. GNDP: system protection ground
The active board GND and electrostatic GNDE of each shelf are converged to the
GNDP through a filter and connected to PE of the busbar. The PE binding post at the
upper right of the subrack is used to connect the GNDP to the grounding bar of the
equipment room.
Note:
Judgment method of left and right PE binding posts: From the back of the cabinet, the
PE binding post on the left is the left PE binding post and the one on the right is the
right PE binding post.
The -48 VGND is led from the power subrack and uses a busbar to connect the -48
VGND of all subsystems.
The -48 VGND is connected to the GNDP securely in the equipment room.
The subrack provides two grounding types: grounding upwards and grounding
downwards. The subrack pick-up impedance ranges from 0.1 Ω to 0.3 Ω. The
grounding impedance of the equipment room must be less than 1 Ω.
Anti-Dust
1. A anti-dust mesh is installed at the bottom air intake of the subrack. The anti-dust
mesh is made of a frame (ABS plastic) and nylon mesh. It is soft and convenient for
installation and uninstallation.
2. The anti-dust mesh on the door panel is made of a metal frame with secondary
polyurethane foaming plastic.
2-15
The two types of anti-dust meshes can be cleaned and reused. In addition, they can be
easily uninstalled or replaced.
Dissipation
For dissipation air duct of the ZXG10 iBSC, see Figure 2-15.
2-16
EMC
The EMC design lies in the shielding and grounding processes of shelves and subracks.
The shielding process is of the subrack level. The minimum shielding characteristic is 40
dB when the frequency ranges from 30 MHz to 1 GHz.
Subracks supinterface EMC shielding and adopt electroplating and surface treatment. This
ensures that the subracks have good conductivity.
The contact between subracks and plug-ins or between plug-ins are connected by using
conductive springs.
To ensure normal grounding, subracks have special anti-static grounding devices for
connecting subracks and shelves.
2-17
2-18
3-1
For the rear panel of a power distribution subrack, see Figure 3-3.
Flashing at 1 Hz:
indicates that the power
distribution subrack
operates normally.
Not lit: indicates that
the power distribution
subrack operates
RUN Green Operating indicator abnormally.
3-2
3-3
3-4
l Supports being monitored and managed by the OMP board through the RS485 bus,
reports the detected information to the OMP board, and provides related indications
through the indicators on the panel of the power distribution subrack.
The PWRD consists of several parts, including one power distribution module, one main
monitoring module, one transit board (PWRDB),and four fan group control modules.
1. The power distribution module processes the input two channels of -48 V power
including filter, lightning protection and isolation, and supplies power for all shelves
through the busbar. In addition, the power distribution module samples the power
before the two channels of power merge at the busbar and sends the power to the
PWRD for overvoltage or undervoltage monitoring.
2. The PWRD processes the two channels of -48 V voltage, including overvoltage
and undervoltage detection, rotation detection for 24 fans, temperature detection,
humidity detection, smoke sensing detection, infrared alarm detection, and door
access detection for cabinet and equipment room.
The power distribution subrack consists of the power distribution module and PWRD.
3. The fan subrack consists of the 2 x 3 fan group and fan group control module.
The fan subrack gets the -48 V power from the busbar and sends the fan monitoring
signal to the PWRD.
4. The PWRDB board provides a interface for the PWRD board to access environmental
monitoring signals.
3-5
Default Setting
DIP Switch
Name Usage 1 (High Bit) 2 3 4 (Low Bit)
Used for
setting the
working mode
S2 to normal or ON OFF ON ON
debug. The
default value
is debug.
3-6
2. When the PWRD board is located at the middle of the 485 bus, 485 signals need to
be transmitted to the corresponding output interface, that is, pins 3 thru 4 and 7 thru
8 are short circuited.
3-7
3-8
3-9
3-10
4-1
For shelf location in the cabinet when resource shelves are used, see Figure 4-2.
4-2
CMP, CMP2 - 1, 2, 3, 4, 5, 6, 7, 8
RUIM2
UIMC 9, 10
RUIM3
RCHB1
CHUB 15, 16
RCHB2
RCKG1
CLKG (CLKG), CLKG (ICM) 13, 14
RCKG2
PSN - 7, 8
GLI, GLI4 - 1, 2, 3, 4
4-3
RUIM2
UIMC
RUIM3 15, 16
1. GLI or GLI4 boards must be installed in pair and from left to right.
For typical board configuration of a packet switching shelf, see Figure 4-4.
UIMU RUIM1 9, 10
4-4
1. At most three DTB or DTEC boards can be configured. You are not recommended to install DTB and
DTEC boards in slots 1 and 17. Each resource shelf can be configured with at most eight DTB or
DTEC boards.
2. When SDTB and ESDT boards do not work in active/standby state, you are recommended to install
them in slot 17. When they are installed in other slots, the adjacent slot of the active and standby
boards cannot be installed with HW boards, such as DTB and GUP.
3. When GUP boards function as BIPB or TIPB, you are recommended to install them in slots ranging
from 5 to 8 or from 11 to 14. If they are installed in slots ranging from 1 to 4 or 15 to 16, the adjacent
slot of the active and standby GUP boards can be installed with the boards that do not use internal
user-plane network interfaces, such as DTB and SDTB. When the GUP boards function as DRTB,
they can be installed in any slots except 9 and 10.
4. Only one SPB board can be installed in slot 15 or 16.
5. You are recommended to install UPPB boards in slots ranging from 5 to 8 or 11 to 14. If they are
installed in slots ranging from 1 to 4 or from 15 to 16, the adjacent slot of the active and standby
UPPB boards can be installed with the boards that do not use internal user-plane network interfaces,
such as DTB and SDTB.
6. You are recommended to install BIPI and BIPI4 boards in slots ranging from 5 to 8 or from 11 to 14.
7. You are recommended to install EIPI and EIPI4 boards in slots ranging from 5 to 8 or from 11 to
14. When they are installed in the slots for active and standby boards, the adjacent slot cannot be
installed with HW boards, such as DTB, SPB, and SDTB. If they are installed in slots ranging from 1
to 4 or from 15 to 16, the adjacent slot cannot be installed with any board.
8. In the case of only one shelf, the OMP and OMP boards must be installed in slots 11 and 12.
If the Abis interface uses the FE+E1 mode and A and Ater interfaces use the E1 mode,
the board configuration of a resource shelf is shown in Figure 4-5.
4-5
CMP, CMP2 - 1, 2, 3, 4, 5, 6, 7, 8
RUIM2
UIMC 9, 10
RUIM3
RCHB1
CHUB 15, 16
RCHB2
RCKG1
CLKG (ICM) 13, 14
RCKG2
RCKG1
ICM 13, 14
RCKG2
4-6
PSN - 7, 8
GLI, GLI4 - 1, 2, 3, 4, 5, 6
1. GLI or GLI4 boards must be installed in pair and from left to right.
For typical board configuration of a packet switching shelf, see Figure 4-7.
RGUM1
GUIM, GUIM2 9, 10
RGUM2
4-7
1. At most three DTB or DTEC boards can be configured. You are not recommended to install DTB and
DTEC boards in slots 1 and 17. Each resource shelf can be configured with at most eight DTB or
DTEC boards.
2. When SDTB2 and ESDT2 boards do not work in active/standby state but are installed in the slots
for active and standby boards, the adjacent slot of the active and standby boards cannot be installed
with HW boards, such as DTB, DTEC, GUP2, SPB2, EIPI, and GUP.
3. Only one EIPI, EIPI4, GIPI, or SPB2 board can be installed in slot 15 or 16.
4. The GIPI is used to provide the OMCB channel or is installed in a slot ranging from 5 to 8 or 13 to 14
when the MR server is to be connected.
5. In the case of one shelf or two shelves, the OMP boards must be installed in slots 11 and 12.
6. When the SDTB2, ESDT2, SPB2, GIPI, EIPI, EIPI4, or GUP2 board is installed in slot 15 or 16, the
TDM trunk board cannot extract the 8K clock reference and the serial interface of slot 16 cannot be
used.
If the Abis interface uses the E1 or IPoE mode and A and Gb interfaces use the E1 mode,
the board configuration of a GB resource shelf is shown in Figure 4-8.
4-8
4-9
Note:
In Figure 4-9, CLKG refers to CLKG (CLKG) or CLKG (ICM) and both CLKG
(CLKG) and CLKG (ICM) can provide clock signals. This is the same for other
parts of this section. DTB, STDB, and SPB can extract clock signals for CLKG.
The above figure takes DTB as an example.
l Clock distribution
The RCKG1 and RCKG2 rear boards of the CLKG board are connected to
the UIMU/UIMC board of each shelf by using clock cables. The UIMU/UIMC
board distributes the clock to all slots of this shelf.
In Figure 4-10, continuous lines represent cable connections and dotted lines
represent backplane edge connections.
4-10
The user planes of one resource shelf are interconnected through the backplane
and the user planes among resource shelves are interconnected through the
GLI/GLI4 and PSN boards of the packet switching shelf. That is, the UIMU boards
of all resource shelves are connected to the GLI/GLI4 boards by using fibers.
d. Monitoring cable connection
4-11
The fan subracks and power distribution subracks of all layers are connected by
using electrical cables for fan monitoring.
The OMP/OMP2 board is connected to the PWRD board in the power distribution
subrack for monitoring.
All sensors are connected to the power distribution subrack for external
environment monitoring.
Dual Cabinet
1. When two cabinets are configured, the cables to be connected inside the ZXG10 iBSC
include:
a. Clock distribution cable and line clock extraction cable
c. User-plane fiber
d. Monitoring cable
4-12
For the schematic drawing of clock extraction and distribution when the iBSC is
configured with two cabinets, see Figure 4-13.
All shelves of the iBSC require system clock. The clock extraction and distribution
are described as follows:
4-13
In Figure 4-14, continuous lines represent cable connections and dotted lines
represent backplane edge connections.
The control-plane Ethernet interconnection is described as follows:
l The UIMC or UIMU boards of all shelves except the control shelf of No.1
cabinet are connected to the CHUB board by using electrical cables.
l The UIMC board in the control shelf of No.1 cabinet is connected to the CHUB
board by using a backplane edge cable.
c. User-plane interconnection
For the user-plane interconnection, see Figure 4-15.
The user planes of one resource shelf are interconnected through the backplane
and the user planes among resource shelves are interconnected through the
GLI/GLI4 and PSN boards of the packet switching shelf. That is, the UIMU boards
of all resource shelves are connected to the GLI/GLI4 boards by using fibers.
4-14
The fan subracks and power distribution subracks of all layers in cabinets are
connected by using electrical cables for fan subrack monitoring.
The OMP/OMP2 board of No.1 cabinet is connected to the PWRD board of this
cabinet. The PWRD board of No.2 cabinet is connected to the PWRD board of
No.1 cabinet. This helps monitor the PWRD boards of No.1 cabinet and No.2
cabinet.
All sensors are connected to the power distribution subrack of No.1 cabinet for
external environment monitoring.
c. User-plane fiber
d. Monitoring cable
2. Connection example description
4-15
For the schematic drawing of clock extraction and distribution when the iBSC is
configured with a single cabinet, see Figure 4-17.
Note:
In Figure 4-17, CLKG (ICM) can be replaced with ICM and both CLKG (ICM) and
ICM can provide clock signals. This is the same for other parts of this section.
DTB, STDB, SDTB2, and SPB2 can extract clock signals for CLKG (ICM)/ICM.
The above figure takes DTB as an example.
The CLKG (ICM)/ICM board also supports inputting BITS clock reference or
extracting clock reference from the GPS module.
l Clock distribution
The RCKG1 and RCKG2 rear boards of the CLKG (ICM)/ICM board are
connected to the GUIM/GUIM2/UIMC board of each shelf by using clock
cables. The GUIM/GUIM2/UIMC board distributes the clock to all slots of
this shelf.
4-16
In Figure 4-18, continuous lines represent cable connections and dotted lines
represent backplane edge connections.
The control-plane Ethernet interconnection in the iBSC is implemented through the
CHUB board. The control-plane Ethernet interconnection is described as follows:
l The GUIM/GUIM2 board of the GB resource shelf is connected to the UIMC
and CHUB boards of the packet switching shelf by using cables.
l The UIMC board of the control shelf is connected to the CHUB board by using
a backplane edge cable.
c. User-plane interconnection
For the user-plane interconnection, see Figure 4-19.
4-17
The user planes of one GB resource shelf are interconnected through the
backplane and the user planes among GB resource shelves are interconnected
through the GLI/GLI4 and PSN boards of the packet switching shelf. That is, the
GUIM/GUIM2 boards of all GB resource shelves are connected to the GLI/GLI4
boards by using fibers.
d. Monitoring cable connection
For the monitoring cable interconnection, see Figure 4-20.
4-18
The fan subracks and power distribution subracks of all layers are connected by
using electrical cables for fan monitoring.
The OMP/OMP2 board is connected to the PWRD board in the power distribution
subrack for monitoring.
All sensors are connected to the power distribution subrack for external
environment monitoring.
Dual Cabinet
1. When two cabinets are configured, the cables to be connected inside the ZXG10 iBSC
include:
a. Clock distribution cable and line clock extraction cable
c. User-plane fiber
d. Monitoring cable
4-19
For the schematic drawing of clock extraction and distribution when the iBSC is
configured with two cabinets, see Figure 4-21.
All shelves of the iBSC require system clock. The clock extraction and distribution
are described as follows:
The CLKG (ICM)/ICM board also supports inputting BITS clock reference or
extracting clock reference from the GPS module of the ICM board.
l Clock distribution
The RCKG1 and RCKG2 rear boards of the CLKG (ICM)/ICM board are
connected to the GUIM/GUIM2 board of each GB shelf or the UIMC board of
the packet switching shelf by using clock cables. The GUIM/GUIM2 or UIMC
board distributes the clock to all slots of this shelf.
b. Control-plane Ethernet interconnection
For the schematic drawing of control-plane Ethernet interconnection when the
iBSC is configured with two cabinets, see Figure 4-22.
4-20
In Figure 4-22, continuous lines represent cable connections and dotted lines
represent backplane edge connections.
The control-plane Ethernet interconnection is described as follows:
l The UIMC or GUIM/GUIM2 boards of all shelves except the control shelf of
No.1 cabinet are connected to the CHUB board by using electrical cables.
l The UIMC board in the control shelf of No.1 cabinet is connected to the CHUB
board by using a backplane edge cable.
c. User-plane interconnection
For the user-plane interconnection, see Figure 4-23.
The user planes of one GB resource shelf are interconnected through the
backplane and the user planes among GB resource shelves are interconnected
through the GLI/GLI4 and PSN boards of the packet switching shelf. That is, the
4-21
The fan subracks and power distribution subracks of all layers in cabinets are
connected by using electrical cables for fan subrack monitoring.
The OMP/OMP2 board of No.1 cabinet is connected to the PWRD board of this
cabinet. The PWRD board of No.2 cabinet is connected to the PWRD board of
No.1 cabinet. This helps monitor the PWRD boards of No.1 cabinet and No.2
cabinet.
All sensors are connected to the power distribution subrack of No.1 cabinet for
external environment monitoring.
4-22
5-1
5-2
Button Description
5-3
Refer to Appendix A
RUN Green Operating indicator "Combined Indicator
Status Descriptions".
Refer to Appendix A
ALM Red Alarm indicator "Combined Indicator
Status Descriptions".
5-4
5-5
Button Description
5-6
Refer to Appendix A
RUN Green Operating indicator "Combined Indicator
Status Descriptions".
Refer to Appendix A
ALM Red Alarm indicator "Combined Indicator
Status Descriptions".
5-7
l CPU unit
5-8
Connects to the logic unit and Ethernet switch unit through the control bus and
configures the switch chip.
l Logic unit
Supports all logic processing functions.
l Ethernet switch unit
Implements Ethernet changeover and control-plane convergence.
5-9
Button Description
Refer to Appendix A
RUN Green Operating indicator "Combined Indicator
Status Descriptions".
Refer to Appendix A
ALM Red Alarm indicator "Combined Indicator
Status Descriptions".
5-10
Flashing at 1 Hz:
indicates that the board
can be removed. If
the micro switch is
turned on during board
operation and the board
operates in standby or
idle state, the board
can be removed.
Not lit: indicates that
the micro switch is in
normal state.
5-11
The function modules of the CLKG (CLKG) board are described as follows:
1. Main control unit
Manages the board, communicates with the system control unit, implements the
core clock control algorithm, controls clock signal output in accordance with the data
provided by the phase discrimination and phase lock unit, and selects the clock
reference.
2. Reference selection unit
Selects a proper reference clock from multiple input reference clocks under the control
of the main control unit.
3. Voltage controlled oscillator unit
Provides a high-precision clock source for the board by using an oven controlled crystal
oscillator that meets the level-3 clock standard.
4. Phase detection and phase lock unit
Adjusts the phase comparison between the clock signal and input reference, and
provides quantitative data to the main control unit so as to control the voltage controlled
oscillator unit. The phase-lock system uses the loose coupling phase-lock principle.
5-12
Button Description
5-13
Button Description
Refer to Appendix A
RUN Green Operating indicator "Combined Indicator
Status Descriptions".
Refer to Appendix A
ALM Red Alarm indicator "Combined Indicator
Status Descriptions".
5-14
5-15
5-16
Debugging
X48 It is open when
- Open
X50 the board operates
normally.
Protection ground
jumper used for When pins 1 and 2
connecting to the are short circuited,
X53 Pins 1 and 2 short
coaxial cable shell the coaxial cable shell
X56 circuited
in the case of two is connected to the
channels of 2 Mbit/s or protection ground.
2 MHz clock inputs
5-17
The function modules of the CLKG (ICM) board are described as follows:
Selects a proper reference clock from multiple input reference clocks under the control
of the main control unit.
Provides a high-precision clock source for the board by using an oven controlled
crystal oscillator that meets the level-3 clock standard.
5-18
5-19
Button Description
Refer to Appendix A
RUN Green Operating indicator "Combined Indicator
Status Descriptions".
Refer to Appendix A
ALM Red Alarm indicator "Combined Indicator
Status Descriptions".
5-20
5-21
5-22
Settings
S1 ON ON ON ON
75 Ω
S5 ON ON ON ON
S1 ON ON ON ON
100 Ω
S5 OFF OFF OFF OFF
5-23
5-24
5-25
Button Description
Refer to Appendix A
Alarm indicator of CPU
ALM1 Red "Combined Indicator
unit A
Status Descriptions".
Refer to Appendix A
Operating indicator of
RUN1 Green "Combined Indicator
CPU unit A
Status Descriptions".
5-26
Flashing at 1 Hz:
indicates that the board
can be removed. If
the micro switch is
turned on during board
operation and the board
operates in standby or
idle state, the board
can be removed.
Not lit: indicates that
the micro switch is in
normal state.
Refer to Appendix A
Alarm indicator of CPU
ALM2 Red "Combined Indicator
unit B
Status Descriptions".
Refer to Appendix A
Operating indicator of
RUN2 Green "Combined Indicator
CPU unit B
Status Descriptions".
5-27
5-28
Button Description
5-29
Button Description
Refer to Appendix A
Alarm indicator of CPU
ALM1 Red "Combined Indicator
unit A
Status Descriptions".
Refer to Appendix A
Operating indicator of
RUN1 Green "Combined Indicator
CPU unit A
Status Descriptions".
5-30
operates in standby or
idle state, the board
can be removed.
Not lit: indicates that
the micro switch is in
normal state.
Refer to Appendix A
Alarm indicator of CPU
ALM2 Red "Combined Indicator
unit B
Status Descriptions".
Refer to Appendix A
Operating indicator of
RUN2 Green "Combined Indicator
CPU unit B
Status Descriptions".
5-31
5-32
5-33
Button Description
Refer to Appendix A
RUN Green Operating indicator "Combined Indicator
Status Descriptions".
Refer to Appendix A
ALM Red Alarm indicator "Combined Indicator
Status Descriptions".
5-34
5-35
Settings
DIP Switch
Name Usage Mode 1 2 3 4
Used for 75 Ω ON ON ON ON
setting the
matching
S1-S6 receive
S9 impedance
120 Ω OFF OFF OFF OFF
S12 of each E1
channel to
75 Ω or 120
Ω.
Used for 75 Ω ON ON ON ON
showing the
matching
S7 receive
S8 impedance 120 Ω OFF OFF OFF OFF
of each E1
chip for the
CPU.
5-36
Connects to the circuit switch unit, provides E1/T1 and HW interfaces, and extracts
line clock.
3. Circuit switching unit
5-37
Receives the clock from the backplane. After the clock is processed such as frequency
division and timeslot adjustment, it is provided for the board.
6. EC subcard
Implements echo suppression.
5-38
Button Description
Refer to Appendix A
RUN Green Operating indicator "Combined Indicator
Status Descriptions".
Refer to Appendix A
ALM Red Alarm indicator "Combined Indicator
Status Descriptions".
5-39
DIP Settings
Switch
Name Usage Mode 1 2 3 4
5-40
DIP Settings
Switch
Name Usage Mode 1 2 3 4
5-41
5-42
Button Description
Refer to Appendix A
RUN Green Operating indicator "Combined Indicator
Status Descriptions".
Refer to Appendix A
ALM Red Alarm indicator "Combined Indicator
Status Descriptions".
5-43
operates in standby or
idle state, the board
can be removed.
Not lit: indicates that
the micro switch is in
normal state.
5-44
Button Description
5-45
Refer to Appendix A
RUN Green Operating indicator "Combined Indicator
Status Descriptions".
Refer to Appendix A
ALM Red Alarm indicator "Combined Indicator
Status Descriptions".
5-46
5-47
5-48
Button Description
Refer to Appendix A
RUN Green Operating indicator "Combined Indicator
Status Descriptions".
Refer to Appendix A
ALM Red Alarm indicator "Combined Indicator
Status Descriptions".
5-49
Flashing at 1 Hz:
indicates that the board
can be removed. If
the micro switch is
turned on during board
operation and the board
operates in standby or
idle state, the board
can be removed.
Not lit: indicates that
the micro switch is in
normal state.
5-50
2. Interface unit
Connects to the circuit switch unit and provides an STM-1 interface.
5-51
5-52
Button Description
Refer to Appendix A
RUN Green Operating indicator "Combined Indicator
Status Descriptions".
Refer to Appendix A
ALM Red Alarm indicator "Combined Indicator
Status Descriptions".
5-53
can be removed. If
the micro switch is
turned on during board
operation and the board
operates in standby or
idle state, the board
can be removed.
Not lit: indicates that
the micro switch is in
normal state.
5-54
5-55
5-56
Button Description
Refer to Appendix A
RUN Green Operating indicator "Combined Indicator
Status Descriptions".
Refer to Appendix A
ALM Red Alarm indicator "Combined Indicator
Status Descriptions".
5-57
5-58
5-59
5-60
Button Description
Refer to Appendix A
RUN Green Operating indicator "Combined Indicator
Status Descriptions".
Refer to Appendix A
ALM Red Alarm indicator "Combined Indicator
Status Descriptions".
5-61
and an alarm is
reported.
Flashing at 1 Hz:
indicates that the board
can be removed. If
the micro switch is
turned on during board
operation and the board
operates in standby or
idle state, the board
can be removed.
Not lit: indicates that
the micro switch is in
normal state.
5-62
5-63
5-64
Button Description
Refer to Appendix A
"Combined Indicator
RUN Green Operating indicator Status Descriptions".
Refer to Appendix A
"Combined Indicator
ALM Red Alarm indicator Status Descriptions".
5-65
5-66
5-67
5-68
Button Description
Refer to Appendix A
RUN Green Operating indicator "Combined Indicator
Status Descriptions".
Refer to Appendix A
ALM Red Alarm indicator "Combined Indicator
Status Descriptions".
5-69
5-70
5-71
5-72
5-73
Button Description
Refer to Appendix A
RUN Green Operating indicator "Combined Indicator
Status Descriptions".
Refer to Appendix A
ALM Red Alarm indicator "Combined Indicator
Status Descriptions".
5-74
5-75
5-76
5-77
Button Description
Refer to Appendix A
RUN Green Operating indicator "Combined Indicator
Status Descriptions".
Refer to Appendix A
ALM Red Alarm indicator "Combined Indicator
Status Descriptions".
5-78
5-79
5-80
Implements conversion between TDM and IP packets over the Ater interface, that is,
searches for 20 ms TRAU frames by channel and assembles them as IP packets.
l Abis interface processing board BIPB
The CS and PS services from the BTS are switched to the BIPB board through
the circuit switch network of the resource shelf. The interface searches for 20 ms
TRU (PCU) frames by channel on the BIPB board, assembles them as IP packets,
and sends them to the TCU for code pattern conversion and rate adaption or to the
user-plane processing unit (UPU).
l Dual-rate conversion board DRTB
Implements code pattern conversion, provides code pattern conversion and rate
adaption for TRAU frames, and supports the FR, EFR, HR, AMR, and TFO functions.
Manages the board, processes Abis signaling, and provides an external control-plane
FE interface.
5-81
l Logic unit
Supports all logic processing functions.
l DSP unit
Provides multiple DSP chips for code pattern conversion, rate adaption, or data packet
conversion.
l Ethernet switch unit
Connects multiple DSP chips over Ethernet and provides an external user-plane FE
interface.
l Clock unit
Provides necessary clock signals for all units on the board.
l Circuit switch unit
Connect the serial interfaces of multiple DSP chips to the circuit packet network.
5-82
Button Description
5-83
Refer to Appendix A
RUN Green Operating indicator "Combined Indicator
Status Descriptions".
Refer to Appendix A
ALM Red Alarm indicator "Combined Indicator
Status Descriptions".
5-84
5-85
Provides multiple DSP chips for code pattern conversion, rate adaption, or data packet
conversion.
l Clock unit
Provides necessary clock signals for all units on the board.
5-86
Button Description
5-87
Refer to Appendix A
RUN Green Operating indicator "Combined Indicator
Status Descriptions".
Refer to Appendix A
ALM Red Alarm indicator "Combined Indicator
Status Descriptions".
5-88
Selects a proper reference clock from multiple input reference clocks under the control
of the main control unit.
l Voltage-controlled crystal oscillation unit
5-89
Provides a high-precision clock source for the board by using an oven controlled
crystal oscillator that meets the level-3 clock standard.
l Phase discrimination and phase lock unit
Adjusts the phase comparison between the clock signal and input reference,
and provides quantitative data to the main control unit so as to control the
voltage-controlled crystal oscillation unit. The phase-lock system uses the loose
coupling phase-lock principle.
l Active/standby changeover unit
Implements the active/standby board changeover. The impact of the active/standby
switch on the clock is acceptable. The active and standby ICM boards are locked to
one reference for smooth changeover.
5-90
5-91
Button Description
Refer to Appendix A
RUN Green Operating indicator "Combined Indicator
Status Descriptions".
Refer to Appendix A
ALM Red Alarm indicator "Combined Indicator
Status Descriptions".
5-92
and an alarm is
reported.
Flashing at 1 Hz:
indicates that the board
can be removed. If
the micro switch is
turned on during board
operation and the board
operates in standby or
idle state, the board
can be removed.
Not lit: indicates that
the micro switch is in
normal state.
5-93
5-94
5-95
Flashing at 2 Hz:
indicates that the
antenna feeder
operates normally but
fails to find the satellite.
Flashing at 0.5 Hz:
indicates that short
circuit occurs in the
antenna.
Flashing at 5 Hz:
indicates that no
message is received
during initialization.
Settings
DIP Switch
Mode Name 1 2 3 4
S1 ON ON ON ON
75 Ω
S5 ON ON ON ON
S1 ON ON ON ON
100 Ω
S5 OFF OFF OFF OFF
5-96
Settings
DIP Switch
Mode Name 1 2 3 4
5-97
5-98
5-99
Button Description
Refer to Appendix A
Alarm indicator of CPU
ALM1 Red "Combined Indicator
unit A
Status Descriptions".
Refer to Appendix A
Operating indicator of
RUN1 Green "Combined Indicator
CPU unit A
Status Descriptions".
5-100
Flashing at 5 Hz:
HD1 Red Hard disk indicator 1 indicates that the hard
disk is operating.
Refer to Appendix A
Alarm indicator of CPU
ALM2 Red "Combined Indicator
unit B
Status Descriptions".
Refer to Appendix A
Operating indicator of
RUN2 Green "Combined Indicator
CPU unit B
Status Descriptions".
5-101
can be removed. If
the micro switch is
turned on during board
operation and the board
operates in standby or
idle state, the board
can be removed.
Not lit: indicates that
the micro switch is in
normal state.
Flashing at 5 Hz:
HD2 Red Hard disk indicator 2 indicates that the hard
disk is operating.
5-102
Button Description
5-103
Button Description
Refer to Appendix A
Alarm indicator of CPU
ALM1 Red "Combined Indicator
unit A
Status Descriptions".
Refer to Appendix A
Operating indicator of
RUN1 Green "Combined Indicator
CPU unit A
Status Descriptions".
5-104
Flashing at 5 Hz:
HD1 Red Hard disk indicator 1 indicates that the hard
disk is operating.
Refer to Appendix A
Alarm indicator of CPU
ALM2 Red "Combined Indicator
unit B
Status Descriptions".
Refer to Appendix A
Operating indicator of
RUN2 Green "Combined Indicator
CPU unit B
Status Descriptions".
5-105
Flashing at 5 Hz:
HD2 Red Hard disk indicator 2 indicates that the hard
disk is operating.
5-106
5-107
Button Description
5-108
Refer to Appendix A
RUN Green Operating indicator "Combined Indicator
Status Descriptions".
Refer to Appendix A
ALM Red Alarm indicator "Combined Indicator
Status Descriptions".
5-109
5-110
5-111
RX1/TX1 - Reserved
RX2/TX2 - Reserved
Button Description
Board removal
ENUM Yellow Reserved
indicator
Active/standby status
ACT Green Reserved
indicator
5-112
5-113
5-114
Button Description
Board removal
ENUM Yellow Reserved
indicator
Active/standby status
ACT Green Reserved
indicator
5-115
5-116
5-117
5-118
Button Description
Refer to Appendix A
RUN Green Operating indicator "Combined Indicator
Status Descriptions".
Refer to Appendix A
ALM Red Alarm indicator "Combined Indicator
Status Descriptions".
5-119
5-120
5-121
5-122
Button Description
Refer to Appendix A
RUN Green Operating indicator "Combined Indicator
Status Descriptions".
Refer to Appendix A
ALM Red Alarm indicator "Combined Indicator
Status Descriptions".
5-123
5-124
l CPU unit
Implements signaling processing, board management, and internal connection
control.
l Control plane switching unit
5-125
Button Description
5-126
Refer to Appendix A
RUN Green Operating indicator "Combined Indicator
Status Descriptions".
Refer to Appendix A
ALM Red Alarm indicator "Combined Indicator
Status Descriptions".
5-127
Settings
DIP Switch
Name Usage Mode 1 2 3 4
Used for 75 Ω ON ON ON ON
setting the
S3-S6 matching receive
120 Ω OFF OFF OFF OFF
impedance of
each E1 channel.
Used for 75 Ω ON ON ON ON
setting the
S2 matching receive
120 Ω OFF OFF OFF OFF
impedance of
each E1 chip.
5-128
1. S3-S6 are used for setting the matching receive impedance of each E1 channel. OFF
indicates that the matching impedance is 120 Ω and ON indicates that the matching
impedance is 75 Ω.
l Channels 1 thru 4 of S3 represent E1 channels 1 thru 4 of the SPB board.
l Channels 1 thru 4 of S4 represent E1 channels 5 thru 8 of the SPB board.
l Channels 1 thru 4 of S5 represent E1 channels 9 thru 12 of the SPB board.
l Channels 1 thru 4 of S6 represent E1 channels 13 thru 16 of the SPB board.
2. S1 and S2 are used for setting the long-haul and short-haul status of the E1 chip and
its matching receive impedance. The CPU reads the status and initializes the E1 chip
in accordance with the status.
Channels 1 thru 4 of S1 and S2 represent parts 1 thru 4 of the E1 chip, that is, E1
channels 1 thru 4, 5 thru 8, 9 thru 12, and 13 thru 16.
l S1: OFF indicates the long haul and ON indicates the short haul.
l S2: OFF indicates that the matching impedance is 120 Ω and ON indicates that
the matching impedance is 75 Ω.
Processes FR, NS, and BSSGP packets of the GPRS and supports Gb interfaces.
5-129
5-130
Button Description
5-131
Refer to Appendix A
RUN Green Operating indicator "Combined Indicator
Status Descriptions".
Refer to Appendix A
ALM Red Alarm indicator "Combined Indicator
Status Descriptions".
5-132
5-133
5-134
Button Description
5-135
Refer to Appendix A
RUN Green Operating indicator "Combined Indicator
Status Descriptions".
Refer to Appendix A
ALM Red Alarm indicator "Combined Indicator
Status Descriptions".
5-136
5-137
l Logic unit
Supports all logic processing functions.
l Timeslot switching unit
Implement 16K circuit changeover and provides an inner circuit switch network for the
resource shelf.
l Ethernet switch unit
Implements user plane and control plane Ethernet changeover in the resource shelf.
5-138
5-139
Button Description
Refer to Appendix A
RUN Green Operating indicator "Combined Indicator
Status Descriptions".
Refer to Appendix A
ALM Red Alarm indicator "Combined Indicator
Status Descriptions".
5-140
5-141
5-142
l CPU unit
Manages the board, processes Gb signaling, and provides an external control-plane
FE interface.
l Logic unit
Supports all logic processing functions.
l DSP unit
Provides multiple DSP chips, processing user-plane core protocols.
l Ethernet switching unit
Connects multiple DSP chips over Ethernet and provides an external user plane FE
interface.
l Clock unit
Provides necessary clock signals for all units on the board.
5-143
Button Description
5-144
Refer to Appendix A
RUN Green Operating indicator "Combined Indicator
Status Descriptions".
Refer to Appendix A
ALM Red Alarm indicator "Combined Indicator
Status Descriptions".
5-145
5-146
5-147
For a description of the external interfaces on the RCHB1 V040502 board, refer to Table
5-91.
Table 5-91 External Interfaces on the RCHB1 V040502 Board
5-148
5-149
5-150
For a description of the external interfaces on the RCHB2 V040502 board, refer to Table
5-93.
Table 5-93 External Interfaces on the RCHB2 V040502 Board
5-151
5-152
For a description of the external interfaces on the RCKG1 V071200 board, refer to Table
5-95.
5-153
5-154
5-155
For a description of the external interfaces on the RCKG2 V071200 board, refer to Table
5-97.
5-156
5-157
5-158
5-159
5-160
5-161
5-162
5-163
5-164
5-165
5-166
5-167
5-168
5-169
5-170
For a description of the external interfaces on the RSVB V090300 board, refer to Table
5-108.
5-171
5-172
5-173
5-174
5-175
5.5 Backplane
5.5.1 BCTC Backplane
5.5.1.1 BCTC Backplane Structure
The BCTC is a control shelf backplane. Its has two versions: V040203 and V060201.
5-176
5-177
5-178
For DIP switch configuration of the BCTC board, refer to Table 5-112.
S1/X2 Used for configuring an office The office number is the value
number of three bits on the left of S1 or
at the bottom of X2.
S2/X3 Used for configuring a rack The rack number is the value of
number all four bits on S2 or X3 plus the
value 1.
S3/X4 Used for configuring a shelf The shelf number is the value
number of two bits on the left of S3 or at
the bottom of X4 plus the value
1.
5-179
5-180
5-181
5-182
5-183
5-184
6-1
6-2
The voice management at background realizes the voice recording, edit and
pre-play, and downloads the voice file into the FLASH of the alarm box.
c. LCD screen
6-3
There are some function buttons on the alarm box, which realize the operation
and maintenance functions together with LCM.
4. Logic unit
Use EPLD to implement the required combinational and sequential logic.
5. Power supply unit
The input voltage of the alarm box is -48 V DC from the equipment room, and is
converted to +5 V, +3.3 V and other voltages for each unit by DC-DC power converter.
When the alarm box is in the duty room outside the equipment room, there may not be -48
V DC power, in this case, a external AC/DC power adapter is required to convert 110/220
V AC to 48 V DC, providing -48 V DC power to the alarm box. AC/DC power adaptor is an
optional accessory of the alarm box.
The left top of the panel is the indicator in arc shape and the LCD screen is located in the
center of the panel.
6-4
ZXG10 iBSC uses 2 to connect Hub and background EMS, 4 to download alarm box
versions, 6 to connect DC power supply, and 7 for power supply.
1. The alarm box comprises cover components, body components, PCB board,
apparatus, and assembly fasteners.
a. Cover components include LCD screen, buttons, indicators, and lamp plate.
b. Body components are the sheet-metal parts to mount the motherboard and
speakers.
c. PCB comprises motherboard, lamp plate, keyboard, and modem board.
d. Apparatus contains LCD screen, indicators, buttons, switches, RJ11, RJ45, DB9,
earphone hole, mobile antenna, GPS interface, 48V socket, and speakers.
e. Alarm box is locked.
f. The outline dimensions of an alarm box is: 220 mm x 310 mm x 58 mm (H x W x
D)
2. Interface Description
The relevant interfaces on the alarm box board are described in Table 6-1
6-5
The parallel bus of the master unit attaches cable MODEM chip,
to provide the external cable modem interface and to implement
Cable modem in- the cable transmission of alarm information (currently, ZXG10
terface iBSC does not use this interface).
Name Description
6-6
6-7
ALB expansion function enables ALB to be installed in remote areas and connected
to the remote server, and receives on-site alarms through the data network. One ALB
can simultaneously connect five background servers at most.
6-8
Function Description
The GPS antenna receives GPS satellite navigation and positioning signals, and
demodulates the frequency, clock signal, and AGPS information through GPS signal
receiver. The clock signal is sent to relevant units in ZXG10 iBSC system while the AGPS
information is sent to the processing unit.
The GPS antenna lightning protector/frequency divider uses dual-frequency-dividing
coaxial cable protector, which is installed at the connector between communication
equipment and coaxial cable, or at lightning protection devices between two
communication equipments. It effectively prevents damages due to temporary
over-voltage caused by lightning induction.
The GPS antenna lightning protector/frequency divider adopts the high-frequency filter
principle and performs three-level protection for the DC feed channel. The RF insertion
loss is small, the discharge current is large, and the measured limiting voltage is low. It is
an ideal protection device for various public antenna communication equipments.
Device Description
1. Figure 6-6 shows the active GPS antenna.
6-9
Wiring Description
Figure 6-8 shows connections between ICM, GPS active antenna, and GPS antenna
lightning protector/frequency divider (fixed on the cabinet top).
6-10
Figure 6-8 Connection of ICM, Active GPS Antenna, and Lightning Protector/Frequency
Divider
1. GPS antenna
2. GPS Antenna Lightning
Protector/Frequency
Divider
Technical Parameters
1. Table 6-4 shows the technical parameters of active GPS antenna.
Parameter Specification
DC voltage 4.5 ~ 6 V
DC current <35 mA
Parameter Specification
Insertion loss ≤ 4 dB
6-11
Parameter Specification
Parameter Specification
Gain 45 dB ± 2 dB
Connectors TNC
2. Table 6-7 describes technical parameters of the GPS L1 indoor transmitting antenna.
Parameter Specification
Gain 26 dB ± 2 dB
6-12
Parameter Specification
Connectors TNC
Cable length 10 m
Parameter Specification
Current 80 mA
Connectors TNC
Parameter Specification
DC voltage 5.5 V
Remained voltage 20 V
Installation Mode Installing through the wall; installing by the copper lug
6-13
Parameter Specification
6-14
Periodically flashing
Running normally at 1 Hz Always OFF Normal running
Periodically flashing
at 5 Hz Always OFF Version being downloaded
Periodically flashing
Always OFF at 5 Hz Board self-test failure.
A-1
Periodically flashing
at 1 Hz Always ON Hardware clock is lost.
A-2
I
ZXG10 iBSC Hardware Description
II
Figures
III
ZXG10 iBSC Hardware Description
IV
Figures
V
Figures
VII
ZXG10 iBSC Hardware Description
VIII
Tables
IX
ZXG10 iBSC Hardware Description
X
Glossary
APS
- Automatic Protection Switching
BCTC
- Backplane of Control Center
BGSN
- Backplane of Giga universal Service Network
BPSN
- Backplane of Packet Switch Network
BSSAP
- Base Station Subsystem Application Part
BSSGP
- Base Station Subsystem GPRS Protocol
BUSN
- Backplane Of Universal Service Network
CAS
- Channel Associated Signaling
CCS
- Common Channel Signaling
CS
- Circuit Switched
GPRS
- General Packet Radio Service
GPS
- Global Positioning System
PS
- Packet Switched
PWRD
- Power Distributor
PWRDB
- POWER Distributor Backplane
XI