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Description
HexPly 914 is a highly successful modified epoxy matrix which is used extensively in high temperature resistant
primary aircraft structures. The controlled melt viscosity and excellent matrix rheology of 914 permits a wide
range of processing conditions for high quality components.
HexPly 914 is easily processed by press or autoclave for optimum composite properties and is also suitable for
vacuum-bag cure of high quality thin components.
40
100
20
10 0
40 65 90 115 140 165 195 130 140 150 160 170
Temperature °C Temperature °C
Components up to 2 mm thick can be cured without a dwell in the cure schedule, provided a maximum heat up
rate of 2°C/minute is used. For thicker components a dwell temperature between 120-135°C is recommended
to avoid the possibility of an exotherm in the matrix. (Thicker components need longer dwells at the lower
temperature).
¥¥Storage conditions.
HexPly 914 prepregs should be stored as received in a cool dry place or in a refrigerator. After removal from
refrigerator storage, prepreg should be allowed to reach room temperature before opening the polythene bag,
thus preventing condensation. (A full reel in its packaging can take up to 48 hours).
For US quotes, orders and product information call toll-free 1-800-688-7734. For other worldwide sales office
FTA-053-MC17
http://www.hexcel.com/contact/salesoffice
©2017 Hexcel Corporation – All rights reserved. Hexcel Corporation and its subsidiaries (“Hexcel”) believe that the technical data and other information
provided herein was materially accurate as of the date this document was issued. Hexcel reserves the right to update, revise or modify such technical data and
information at any time. Any performance values provided are considered representative but do not and should not constitute a substitute for your own testing of
the suitability of our products for your particular purpose. Hexcel makes no warranty or representation, express or implied, including but not limited to
the implied warranties of merchantability and fitness for a particular purpose, and disclaims any liability arising out of or related to, the use of or
reliance upon any of the technical data or information contained in this document.
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