Professional Documents
Culture Documents
December 1998
Prepared by:
The software described in this document is furnished under a license and may be used or copied only in accordance with the
terms of such license.
SICL ................................................................................................................................1
INTRODUCTION................................................................................................................................................ 2
SUMMARY.................................................................................................................................................................... 2
BACKGROUND............................................................................................................................................................ 3
STARTING .................................................................................................................................................................... 3
PROGRAM........................................................................................................................................................... 3
INPUT ............................................................................................................................................................................ 3
OUTPUT ........................................................................................................................................................................ 4
PROGRAM........................................................................................................................................................... 4
PROGRAM........................................................................................................................................................... 4
SYNTAX......................................................................................................................................................................... 5
SPECIFICATION ......................................................................................................................................................... 7
STANDARD................................................................................................................................................................... 8
FACILITY ..................................................................................................................................................................... 8
HELPFUL............................................................................................................................................................. 9
CONFIGURATION ...................................................................................................................................................... 9
AUXILIARY ................................................................................................................................................................ 10
RECOVERY ................................................................................................................................................................ 10
BLOCKS ...................................................................................................................................................................... 11
LOGICALS......................................................................................................................................................... 11
RESAP...........................................................................................................................13
RESAP ................................................................................................................................................13
SOIL .................................................................................................................................................................... 13
TYPES................................................................................................................................................................. 13
METHODS ......................................................................................................................................................... 14
INPUT-DATA .................................................................................................................................................... 15
COMPUTATIONS ............................................................................................................................................ 16
MALT............................................................................................................................17
MALT .................................................................................................................................................17
FEATURES ........................................................................................................................................................ 18
INPUT ................................................................................................................................................................. 21
OUTPUT ............................................................................................................................................................. 21
APPLICATIONS ............................................................................................................................................... 22
PROBLEM-DESCRIPTION............................................................................................................................ 23
SOIL .................................................................................................................................................................... 23
FAULT-CURRENTS ........................................................................................................................................ 24
GROUNDING-GRID ........................................................................................................................................ 25
COMPUTATION............................................................................................................................................... 25
SAFETY.............................................................................................................................................................. 26
INPUT-DESCRIPTION.................................................................................................................................... 26
ACCELERATION............................................................................................................................................. 28
IRREGULAR ..................................................................................................................................................... 28
MALZ............................................................................................................................31
iii
Table of Contents (Cont'd)
Page
MALZ.................................................................................................................................................31
GROUND ............................................................................................................................................................32
NETWORKS ......................................................................................................................................................32
ANALYSIS..........................................................................................................................................................33
GROUND- ...........................................................................................................................................................34
POTENTIAL- .....................................................................................................................................................35
EARTH-...............................................................................................................................................................36
COORDINATES ................................................................................................................................................36
CHARACTERISTICS.......................................................................................................................................37
OTHER-DATA...................................................................................................................................................38
COMPUTATIONS.............................................................................................................................................38
SPLITS..........................................................................................................................39
SPLITS ...............................................................................................................................................39
CAPABILITIES .................................................................................................................................................39
DEFINITIONS ...................................................................................................................................................40
SENSITIVITY ....................................................................................................................................................41
SAFETY ..............................................................................................................................................................41
INFORMATION ................................................................................................................................................41
TRALIN ........................................................................................................................43
TRALIN .............................................................................................................................................43
PROGRAM .........................................................................................................................................................43
CONDUCTORS .................................................................................................................................................44
SYSTEM-MODULE ..........................................................................................................................................44
INDUCTION-MODULE ...................................................................................................................................45
GRADIENT-MODULE.....................................................................................................................................45
HIFREQ ........................................................................................................................47
HIFREQ .............................................................................................................................................47
APPLICATIONS................................................................................................................................................47
COORDINATES ................................................................................................................................................48
INFORMATION-REQUIRED.........................................................................................................................48
SOIL-TYPE ........................................................................................................................................................49
CONDUCTOR-GEOMETRY ..........................................................................................................................49
ENERGIZATION ..............................................................................................................................................49
TYPES-OF-CONDUCTORS ............................................................................................................................51
COMPUTATIONS.............................................................................................................................................51
RESTART-INSTRUCTIONS...........................................................................................................................52
DIFFERENCES-WITH-MALZ .......................................................................................................................52
COMMON-PROBLEMS ..................................................................................................................................52
FCDIST .........................................................................................................................53
FCDIST ..............................................................................................................................................53
REPRESENTATION.........................................................................................................................................53
CONDUCTOR-DATA.......................................................................................................................................54
CURRENT-SOURCE-DATA ...........................................................................................................................55
iv
Table of Contents (Cont'd)
Page
FFTSES .........................................................................................................................57
FFTSES...............................................................................................................................................57
SPECIAL-FEATURES ..................................................................................................................................... 58
FREQUENCY .................................................................................................................................................... 58
MAIN-STEPS..................................................................................................................................................... 59
ADVANCED-FEATURES................................................................................................................................ 60
INFORMATION................................................................................................................................................ 60
v
General Technical Information for SICL Page 1
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For information on one or more of the following titles, type in the corresponding topic commands in lowercase characters
after the HELP,ASKME command.
For example type: HELP,ASKME
and then specify: intro*
This will yield any topics whose names begin with the letters "intro". Note that the asterisk {*} is a wildcard character. It can
replace one or more characters, thereby facilitating the entry of long topic names.
===========================================================================
TABLE OF CONTENTS TOPIC NAME
-------------------------------------------------------------------------
INTRODUCTION { introduction }
============
a. Summary { summary }
b. Assumed Background of User { background }
c. Starting a SICL Session { starting }
PROGRAM ENVIRONMENT { program envi }
===================
a. Input Units { input }
b. Output Units { output }
PROGRAM STRUCTURE { program stru }
=================
a. The Syntax of SICL { syntax }
b. Specification Commands { specification }
c. Standard Commands { standard }
d. HELP Facility { facility }
HELPFUL HINTS { helpful hint }
=============
a. Selecting the Right SICL Configuration { configuration }
b. Using Specialized Auxiliary Files { auxiliary }
c. Recovery from Abnormal Termination { recovery }
d. Usings Blocks of Data Prepared in Advance { blocks }
>>>>>>>>>>>>>>>>>>>>>>>>> MORE INFORMATION <<<<<<<<<<<<<<<<<<<<<<<<<
The logical unit table lists the unit numbers and files to and from which
SICL makes READS and WRITES. It is available by specifying the text topic
{logicals}.
Background information on the engineering applications modules can be obtained
by specifying the following text topics {LOGICALS}.
TITLE TOPIC NAME
=====================================================================
RESAP {resap}
MALT {malt}
MALZ {malz}
SPLITS {splits}
TRALIN {tralin}
HIFREQ {hifreq}
FCDIST {fcdist}
FFTSES {fftses}
It combines the ease of hierarchical menus with the flexibility of powerful interactive commands. At the same time, SICL
provides extensive on-line documentation and context-sensitive HELP and MENU information. Another feature of SICL
resides in its ability to accept input data from several input files as defined by the user at any time during the session. Finally,
the user may at any time add data to correct or modify most items defined in the programs.
It is recommended that the user read the SICL User's Manual at least once through before running SICL. This will allow the
user to use SICL's help facility in the most efficient way possible. This help facility is quite complete and makes finding
information extremely rapid.
SETUP : A flag setup file, associated with Device 88, contains various software flags which customize SICL for
optimum performance in a given computer system environment. This file is not normally altered by the
user.
1- Answer
2- Command#ppppp,qualifier 1,...,qualifier n,variable 1,...variable m
where the items listed in each data line are defined in the following paragraphs.
1.1 ANSWER FORMAT
"Answer" is the string of characters typed by a user in response to a question asked by SICL. If the expected response is a
YES or NO, then "YES", "yes", "YE", "ye", "Y", "y", "bbb.....b" (where b is a blank) or <RETURN> are interpreted as YES.
Anything else is interpreted as NO. If the expected response is to be a choice from several items proposed by SICL, then
"Answer" should match one of the items; otherwise, SICL will ask the question again.
1.2 COMMAND FORMAT
"Command#ppppp" and "qualifier i" are strings of characters, while "variable i" can be a string of characters, an integer or a
real value. Such an entry can be made whenever the SICL prompt is presented by the program:
SICL>>-{?}->
"Command#ppppp" can be broken down as follows: "Command" is either a Specification command or a Standard command,
"#" is the number symbol, and "ppppp" is an integer between 1 and 30 000. The "#ppppp" part of the command is optional
and can be used only with specification commands, when IMPLICIT-REPLACE is turned on. If it is specified, then it
becomes the "command number" of the command when IMPLICIT-REPLACE is turned on. If it is not specified, then the
program automatically assigns a "command number" of its own. These command numbers can be examined by entering the
SHOW-MODULE command. They are to be found in the second column from the left of the display. The use for these
command numbers is explained in the IMPLICIT-REPLACE help item.
There may be zero, one or several qualifiers and/or variables associated with the command. When omitted, they cause the
program to select default values in most cases; otherwise, the user is invited to reenter the data. Note that even if a command
has one or more qualifiers associated with it, no qualifiers need be specified if the default one is desired.
Commas, blanks, hyphens, underline characters, and semicolons play a special role in SICL syntax. The comma is the default
data delimiter: it is inserted between data fields so that the program knows where one begins and ends, instead of requiring
the precise positioning of data in fixed fields on a line. All blanks are ignored, unless they are found within a data entity, in
which case they are synonymous with hyphens and underline characters. For example, the command "RESOLVE-
AMBIGUI" may also be entered as "RESOLVE AMBIGUI" or "RESOLVE_AMBIGUI". This makes it possible to enter
comments or labels on any line.
The commands and qualifiers consist of a minimum of Nmin and a maximum of Nmax characters respectively,
where:
Nmin : is the minimum number of characters which should match a valid command before any specified command
is accepted by SICL. The default value of Nmin is 1 and is set at the beginning of a SICL session. The user,
however, can change this value at any time using the Standard command "ACCEPT" described in the
{standard} help item.
Nmax : is the maximum number of characters which are used to define the valid commands recognized by SICL.
The default value of Nmax is 12. This is also the maximum possible value of Nmax in this version of SICL.
1.3 SIGNIFICANT PORTION OF COMMANDS AND QUALIFIERS
The values of Nmin and Nmax at the beginning of a SICL session are the default values (Nmin=1 and Nmax=12). In this
case, SICL accepts commands and qualifiers consisting of from 1 to 12 characters and compares them to the valid ones. If a
unique match is found, the command is accepted. If several interpretations are possible (ambiguous command), then SICL
asks the user to resolve the ambiguity. For example, suppose that the desired valid command is "CONDUCTOR" and that the
specified command is "CON". SICL may find that the command is ambiguous because other commands such as
"CONNECTION" and "CONDUCTIVITY" are valid as well. If the specified command had been "CONZ" then it would have
been declared invalid (no commands correspond to CONZ...). The user however, may require that a minimum of 4 characters
be specified before the command or qualifier is declared valid, by using the Standard command "ACCEPT" (see the
ACCEPT help item). For example, if Nmin = 4, even "CON" would be declared invalid because now the minimum number
of characters which must be specified is 4.
Finally, SICL will compare each character of the specified command or qualifier up to a maximum of Nmax. In the default
set-up (where Nmax=12), all characters specified by the user will be examined. For example "CON" and CONDUC" will be
accepted as valid while "CONDUCTUR" will not. If this is inconvenient, then the user has the choice of restricting the
character comparison to Nmin by using the Specification command "MATCH" described in the MATCH help item.
Assuming the default case of Nmin=4, this action will cause SICL to declare "CONDXYZ" a valid entry. Note however, that
in this case, "CONDUCTOR" and "CONDUCTIVITY" become indistinguishable and the only way SICL will be able to
select the desired command is by one of the following means:
1- Ask the user
2- Resolve the ambiguity by comparing the number and type of the items associated with the command (this
action will be taken only if the user has authorized it (see the help item for the the Standard command
"RESOLVE-AMBI").
3- Determine the most "logical" or "probable" path which should be retained based on the user's preceding
commands.
For example, when the user specifies the command "CONDUCTOR" for the first time using a reduced string such as "CON",
a selection may have to be made among various possible interpretations as determined by SICL. However, the user can
specify further "CONDUCTOR" commands using a one character string "C". This is because command "CONDUCTOR" is
the most likely next entry.
1.4 HIERARCHY OF COMMANDS
SICL recognizes Standard and Specification commands. Specification commands are structured in a hierarchy of five layers.
The top or first layer of commands consists of the program names. Entry to and exit from the programs are accomplished as
explained in topic {specification}. This topic also explains the hierarchical rules which apply to the Standard and
Specification commands (including their synonyms) within and outside a program. As a general rule however, one must
remember that a synonym is hierarchically inferior to a command of its type (Standard or Specification types). Therefore, an
ambiguity between a command and a synonym (of another command) will always result in the selection of the command.
There is only one Program command per program. The MENU,ALL command shows the commands and their structure for
each engineering module supported by the SICL software package. Two commands at adjacent layers are said to be
connected (or linked) if, in principle, it is necessary to specify the higher-layer command before reaching the lower-layer one.
The term "in principle" is used because in practice, the user may allow jumps over layers (bypass) using the "BYPASS".
Specification command described in topic {standard}. This operation however will succeed only if the bypassed commands
(or levels) do not require items (qualifiers and/or values if any) which cannot be defaulted.
If two commands are connected, the upper-level command is called "ascendant" while the lower one is the "descendant". All
other commands which are at the same level as the descendant and which are connected to the same ascendant are said to be
"equipotent" (equivalent, having equal capacities). Two lexically identical commands which have different ascendants are
different commands as far as SICL is concerned.
When a command is specified, SICL examines its descendants (if any) to determine if one or several matches exist. If so, the
search stops. If not, the search continues among the descendants of the descendants, and so on, until at least one match is
found. If none is found after the lowest command levels have been examined, SICL searches the equipotent commands and if
still none is found, the rest of the program commands are scanned, followed (if necessary) by a search among the synonyms
of the program commands, if any.
More information is also provided under the following topic names: {helpful hint} and {program stru}. Topic {standard}
describes many of the Standard commands which have an influence on the syntactical and hierarchical interpretations of
SICL. Topic {helpful hint} makes several recommendations concerning a suitable use of such commands.
a) If the abbreviation matches a Standard command or one of its synonyms, then SICL will not find the desired
Specification command.
b) Same as ii) above if a) does not hold.
c) Same as iii) above if a) does not hold.
The hierarchy of Specification commands can be invoked for different programs with the MENU, ALL command.
Possibly the most important command a user can remember is the HELP, PROMPT command. As soon as this is entered,
SICL responds by asking the user for one or more desired help items. These can be command names (Standard or
Specification) and must be entered in uppercase except when the lowercase autorization flag is on (see topic {standard}) or if
the HELP command is invoked with the COMMANDS qualifier. In both cases lowercase characters are automatically
converted to uppercase, as explained hereafter. The help items can also be texts on particular topics (referred to in command
help texts as sources of additional information). These must be entered in lowercase except if the HELP command is invoked
with the TEXT qualifier, in which case the HELP items are automatically converted to lowercase characters as explained
hereafter. Up to four items may be entered. SICL then displays the desired information.
If SICL is within a program when the HELP, PROMPT command is issued, then SICL seeks a Specification command
within that program whose name matches a given item on the list. In fact, SICL first examines all subcommands of the
current command and returns a description of these (if found) and then stops. If none of these subcommands match the item,
then SICL examines all other commands in the program for a match. If some are found, then the descriptions are displayed
and the search stops. If no commands in the program match the item, then SICL attempts to make a match with the Standard
commands. If successful, the corresponding Standard commands are described. The search then ends whether or not
matching Standards commands are found.
If SICL is not within a program when the HELP,PROMPT command is issued, then all Standard and Specification
commands (in all eight programs) which match a given item are shown.
The user will notice a line at the bottom of the screen when HELP information is displayed, which states that the user can
STOP or CANCEL by entering the appropriate characters. If STOP is chosen, SICL interrupts its description of the present
item, and goes on the next one on the list (if there is one). If CANCEL is chosen, SICL interrupts its description of the
present item and omits its descriptions of the rest of the items on the list (if any).
HELP itself is a Standard command, one of whose qualifiers is PROMPT.
The user may specify more than one qualifier, but if two contradicting qualifiers are entered then the program will accept the
last one entered. This option is available in case the user makes an error in specifying the qualifier. If none are specified,
SICL will choose the default qualifier (*).
In specifying an item, the user may use an asterisk {*} to replace one or more characters of the command or text name. The
user is permitted to use more than one of these asterisks in the same item name.
>>> MENU COMMAND <<<
Next to HELP, the most important Standard command is MENU. MENU is important because it can show the user the
complete list of Standard commands, or the hierarchy (in whole or in part) of Specification commands belonging to a given
program. When a Specification command structure is displayed, the current command is indicated with special characters and
attributes if the video screen supports such features, and with two "#" characters placed before the command when the
display device does not support such features. Thus, the MENU command serves as a road-map of SICL.
Note that the MENU that is displayed will differ depending upon whether SICL is inside a program or not. If SICL is outside
the programs and the MENU command is entered, then a complete list of all Standard commands will be displayed, as well
as a list of presently available programs. If SICL is inside a program, then MENU results in a display of Specification
commands. The number of command levels shown depends upon the position of the current command in the command
hierarchy and upon the qualifier used with MENU.
NOTES :
1) If SICL is not inside any of the programs, then all qualifiers are ignored, and a menu of all the Standard commands
and program names is produced.
2) If two qualifiers contradict each other, then SICL uses the second of the two.
3) The wildcard character, {*}, cannot be used in specifying items for the MENU command.
4) If the MENU command is entered without qualifiers, then SICL defaults to the * qualifier.
The SICL software package behaves very much like a smart, capable, and obedient assistant which makes certain
assumptions about the user's requirements, based on past commands entered.
This is different from the SIDS interactive input processor which is constantly guiding the user through a dialogue where
questions (always originating from the program) are dependent upon the user's previous responses. SICL awaits user's
commands and instructions, interprets them in a most logical way based on the current as well as past contexts, without
interrupting the session with unnecessary messages or acknowledgments. Only when confirmation is needed or when errors,
warnings and ambiguities are detected, does SICL inform the user by displaying complete but concise diagnostic messages.
The other occasions when SICL displays information are when the HELP or MENU commands are entered. In these cases
the information may be quite brief or rather extensive, depending on the user's choice.
This discretion manifested by SICL may disorient the novice user who realizes that SICL acknowledges valid commands
simply by displaying the next command prompt. The remedy is to request the MENU from time to time to ascertain that the
current command is truly where it should be. However, this may not be sufficient if the user allows SICL a high degree of
freedom in its interpretations by setting it up in a loose configuration. Since SICL is extremely flexible thanks to its
numerous switches, it can be arranged in a rather large number of practical syntactical and operational configurations some of
which may be suitable only to experienced users or for special applications. It is therefore recommended that the user
experiment with some of the more liberal settings and understand the resulting behaviour before using them on a permanent
basis.
For example, allowing SICL to accept very short commands but not to report all valid matches may lead to confusion which
is avoided only by very frequently invoking the MENU command to verify that the desired command was retained. On the
other hand, requesting large values for the minimum number of characters in a command will slow the input session without
any significant decrease in the number of possible reported ambiguities.
---------------------------------------------------------------------------
| |Unit| Variable | | File
| | No.| Name | Description | Name
=======================================================================
| | 5 | INDIAL | Logical unit number of the file or| System
| I | | | (device) from which the main in- | Default
| N | | | put data is read (interactively). |
| P |----|----------|-----------------------------------|-------------
| U | 12 | INFILE | Logical unit number of auxiliary | SICLINP.INP
| T | | | input file. | or as defi-
| | | | | ned by user
| |----|----------|-----------------------------------|-------------
| | 16 | MVARFI | Logical unit number for debug | System
| | | | files. | Default
| |----|----------|-----------------------------------|-------------
| I | 18 | INHELP | Logical unit number of the HELP | SICLHLP.HLP
| N | | | file. |
| P |----|----------|-----------------------------------|-------------
| U | 19 | INLEC | Logical unit number of the file | PRGCOMMA.NDS
| T | | | containing the commands, their |
| | | | qualifiers, and their synonyms. |
| |----|----------|-----------------------------------|-------------
| | 31 | INTERG | Logical unit number used to enter | System
| | | | user prompt for the DRAW command. | Default
| |----|----------|-----------------------------------|-------------
| | 44 | INGENE | Logical unit number used | System
| | | | temporarily by the GENERATE | Default
| | | | command in SICL. | |
| |----|----------|-----------------------------------|-------------
| | 88 | IRDFLG | Logical unit number of the SICL | SICLFLG.FLG
| | | | flag setup file. |
=======================================================================
|---------------------------------------------------------------------
| |Unit| Variable | | File
| | No.| Name | Description | Name
=======================================================================
| | 6 | IQUEST | Logical unit number of device | System
| O | | | to which questions and messages | default
| U | | | are sent during interactive input |
| T | | | sessions. |
| P |----|----------|-----------------------------------|-------------
| U | 71 | IOFRES | Logical unit number where the | FRESAP.DAT
| T | 72 | | processed input data for each | FMALT.DAT
| | 73 | | specified program is saved. | FMALZ.DAT
| | 74 | | | FSPLITS.DAT
| | 75 | | | FTRALIN.DAT
| | 76 | | These are the SICL output files. | FHIFREQ.DAT
| | 77 | | | FFCDIST.DAT
| | 78 | | | FFFTSES.DAT
| |----|----------|-----------------------------------|-------------
| | 8 | ISAVME | Logical unit number of session |
| | | | record file (also referred to as | SICLSAV.SAV
| | | | session save file). |
| |----|----------|-----------------------------------|-------------
| | 9 | IOKSAV | Logical unit number of the | SICLSTR.UCT
| | | | structured SICL file. |
| |----|----------|-----------------------------------|-------------
| | 10 | IOFTEM | Logical unit number of a temporary| System
| | | | direct access file. | default
| |----|----------|-----------------------------------|-------------
| | 11 | IRDFIL | Logical unit number of a temporary| System
| | | | file used by SICL. | default
| |----|----------|-----------------------------------|-------------
| | 30 | IPLOT | Logical unit number for the plot | SICLPLO.OUT
| | | | file. |
| |----|----------|-----------------------------------|-------------
| | 40 | IOMLIS | Logical unit numbers for debug | System
| | 41 | IOM | purposes (SES use only). | default
| |----|----------|-----------------------------------|-------------
| | 44 | INGENE | Logical unit number used | System
| | | | temporarily by the generate | default
| | | | command in SICL. | |
=======================================================================
- 2 Layer Horizontal
- 2 Layer Vertical
- 3 Layer Vertical (not yet available)
- Multi-Layer Horizontal
- Multi-Layer Vertical (not yet available)
- Exponential Soil (resistivity varies exponentially with depth)
The "exponential" earth structure is comparable to an earth structure with horizontal layers. It is sometimes used as a model
for computing transmission line parameters.
Considering electrode penetration depth to be small compared to electrode spacing, the preceding equation effectively
describes the variation in measured resistivity as a function of electrode separation a. Physically, the greater the electrode
spacing, the greater the volume of earth encompassed by the test current in its traverse from C1 to C2 and hence, the greater
depth of earth involved in the measurement.
It is important to note that the equation is valid for electrode spacings much larger than electrode length (or burial depth, if
spherical sources are used). Wenner has developed an equation which takes into account the depth of a point source, but is
not applicable to spikes which are commonly used as electrodes. RESAP will optionally use an exact equation which takes
the lengths of the probes into consideration.
An important variation of the equally-spaced four probe method, which is widely used in geophysical prospecting, is the
unequally-spaced symmetrical or Schlumberger arrangement. This method circumvents a shortcoming of the Wenner method
often encountered at large probe spacings whereby the magnitude of the potential between the potential probes becomes too
small to give reliable measurements. By moving the potential leads closer to the outer current electrodes, the potential value
is increased and the sensitivity limitations encountered using the Wenner method may be overcome. For large probe
spacings, the apparent resistivity according to the Schlumberger method is given by:
Rho=(pi)Rc(c+d)/d
where
|-----------------|
| C1 P1 P2 C2 | Four Terminal
| o o o o | Test Set
|---|--|---|--|---|
| | | |
______| | | |____________
| _| |__ |
| | <- V- >| |
|< Se1 >| < Si >| < Se2 > |
====+=======+========+============
^ ^
^ POTENTIAL ^
| PROBES |
| |
|--- CURRENT PROBES ----|
Se1 : Spacing between a current (outer) electrode C1 and its adjacent potential (inner) electrode P1 (see figure).
R: Apparent soil resistance in ohms (i.e., V/I) or apparent soil resistivity in ohm-m corresponding to the
electrode spacings Se1, Si and Se2 (i.e., (2piV/I) (1/Se1+1/Se2-1(Se1+Si)-1/(Se2+Si)) with Se1, Si and Se2
specified in meters).
When the RESISTIVITY setting is specified for the MEASUREMENTS module, the measured data should
be entered as apparent resistivities. When the APPARENT-RESistance setting or no setting is specified, the
apparent resistance values should be entered.
Do : Is the average length of current (outer) electrodes (meters or feet). If this field is blank or zero, then the
program assumes a negligible length and will use appropriate formulas (depending on the length of the
potential electrodes) to compute the apparent resistivity. Otherwise, it will compute the apparent resistivity
based on a more accurate formulation for handling cylindrical spikes.
Di : Is the average length. of potential (inner) electrodes (meters or feet). If this field is blank or zero, then the
program assumes a negligible length of the current electrodes) to compute the apparent resistivity.
Otherwise, it will compute the apparent resistivity based on a more accurate formulation for handling
cylindrical spikes.
Si : Spacing between two potential (inner) electrodes (see figure).
Se2 : Spacing between the remaining (outer) electrode C2 and its adjacent potential (inner) electrode (see figure).
Computer program MALT is used primarily to analyze power system grounding networks. It is also used to investigate
various engineering problems where conduction of current in metallic conductors buried in the soil is the critical factor. In all
cases however, the preparation of the input data closely follows the basic steps described under the following titles:
/ / // / / //// /
/ // / Soil / //// Soil /// // / \\ Soil
// / /// Surface / // / Surface / // / /\\\ Surface
/__________________ /____/______ /____/___/______
|| ^ ||| | ||| | || | |
|| | h1 p1 | | | | |
|__v_______________ | pl | pr | pl | p | pr
|== h2 p2 == | | | |
|---------
| etc.
a) Multiple Horizontal Layers b) Vertical Layers
0-----,-----0---.
/| / /| \
/ / 0-----/-----/------0
/ / / y ^ /| / / /
/ /// / / 0 / 0------/
/ // / / x /\____/\ /| 0
------------- ---------> / \ \ /______/
|########### | / \ \/ /
|######### | 0------0-----0-----0
|######## | | | /|
|##### | | |
V z
Skywire
----------/\----------------/\----------------/\
---------/--\---_;---------/--\--------------/--\-. .-
| | _/ | | Phase wire | | \_. ._/
| |/ Fault | | | | # #
/ \ / \ / \ ====== Substation
|______| |______| ) |______| { }
______/||||||||\________/||||||||\______|_/||||||||\_{__}______________
_/ / | \__ __/ | | \
_/ / | ```------>------'' | |
/ | \ / | \
V V \_ _/ /
`--.___ ___.--' ^ ^
````-->--'''' |
___________________
|
.--| SUBSTATION |--.
_/ | | \_
_/ _/-------------------\_ \_
\_ / / / | \ \ V
\_ | | | | | |
\_V V V V V V V
\ | | | | | | \ \
`*-------------------------------------- \/\ \/\ ------
/ Buried Pipe \ \
/
.______. Rectifier
----------|--|>--|---------
| - `------' +
Earth Surface |
_____________\__________|_________________________|___________
| .-<-.
Soil | / \##########
_____________________|____________./ ## ## ## Anode
(0) ).--<-- ## ## ##
(000) Protected Structure ) | |
(0)__________________________________)\ / |
|_ \_ `-<-' __| | Earth Currents
\__ `---------<-----' _/
`--------------------<-----'
C D
U E | _/\
R N | / \
R S | / \
E I | ^ / \
N T | / \ / \
T Y | / \ / \ _/\ --_
|----/-----\-----/-------------\-----/---\--/---\--/\-/-->AVERAGE
| / \ / \ / \/ \/ -
| / \_/ \_/
|_/
+------------------------------------------------------->
CONDUCTOR NUMBER
Figure 6 Current Densities in Conductors
- Soil potential values at any point on or below the earth's surface.
Potential profiles are calculated for any direction specified
in the data (Figure 7).
^ , , , ,
P | /,\/,\/,\/,\
O | ,/ \/ \/ \/ \\
T | ./ \\
E | ./ \\ Isolated Grid
N |./ \\
T |/ \ ` . __
I |--------------------\------- Remote Soil Potential
A | \ /-
L | \ / Grid and Return Electrode
| v
+----------------------------->
DISTANCE
Figure 7 Soil Potentials
- Calculation of tower footing resistance and potential rise; touch and step voltages; lightning performance.
- Investigation of earth potential gradients caused by buried structures such as pipelines, metallic conduits, railways,
etc.
- Rate of corrosion of structures buried in soils subject to electric fields caused by dc or ac sources. Determination of
necessary cathodic protection.
- Design of HVDC electrodes for the earth return path of dc currents.
0------------+------------+-----------0
Incoming | | | | Outgoing
Transmission | | | | Transmission
Lines |------------+------------+-----------| Lines
=============>| | | |==============>
| | |
|------------+------------+-----------0
| | | ^
| | |
0------------+------------0 <--- Ground
^ Rods
Fault occurring at
a remote location
<====== Grounding Grid
Often the resistivity of the top soil layer is not constant throughout the year and varies with time mainly because of the
climatic conditions (in northern countries the top soil freezes and thaws regularly, leading to large variations of the top soil
resistivity). In such instances, it is necessary to study the ground network for various top soil resistivity values, adequately
selected to reflect existing variations. Earth resistivity sometimes varies significantly over horizontal dimensions, and
therefore, cannot be ignored. In such instances, earth structures with vertical layers provide an excellent equivalent soil model
of the real situation.
Computer program RESAP can be used to determine the parameters of the equivalent layered earth.
where +------------------------------------+
| It: TOTAL FAULT CURRENT
|
| Is: GRID CURRENT
|
| Ig, Ig1 : GROUND WIRE CURRENTS
+------------------------------------+
Fault occurring at
a remote location Substation Ground Wire
<========= _/ _/ Phase Conductor
/ / /
--------#--------#--------#--------|---------#--------#---_/---#--------
________#________#________# ----> | ----> #________#__/_____#________
# # <--- # Ig | Ig1 # # # <----
# # It # | # # #
Soil # # # | | Is # # #
Surface # # # | V # # #
________#________#________#________|_________#________#________#________
||| # # # | # # # ||
# # # ____|___ # # # ========>
_/ ' ' ' \_ Generating
--<--'' / ^ \ ``--->-- Stations
/ | `--->---
--<--'
`- Grounding Grid
^
/ y / / Earth Surface
/ / x // | x
-+-------------->---------------- -x--------------------------->
| | (Xp,Yp,Zp)
| ________________ | 9 / 13
| | | | | o ________5_______o
| 9 & 10 ^ 11 12 & 13 | 1| 2| 3| 4
| z | | |_____|___6_|_____
v | | | | |
Conductor Grid | |_____|___7_|_____o
| | | | 12
| o_____|___8_o
-y | 10 \ 11
v (Xs,Ys,Zs)
a) Cross-section giving side view b) Top view of grid
of conductor grid
* Note: The grid current usually does not distribute uniformly over all the conductors. Much soil current exists at
the grid periphery and comparatively less exists at the center of the grid in most cases.
The resistance and the potential rise of the ground network (R and Vr) are usually important values in grounding design. For
example, the potential rise, which is the product of resistance and grid current, must not exceed 10 kV or preferably, 5 kV
(for the protection of communication equipment in the substation and to prevent dangerous transferred potentials which may
develop after the insulation breakdown of a communication insulating transformer).
Other values of interest are the touch and step voltages, particularly at the periphery of the grid and at mesh centers, during a
ground fault condition on the power system. In order to calculate these values, the user should specify points at which earth
potentials are to be computed, run MALT, and then run SIRPS to compute touch and/or step voltages.
y ^ Sl Sr
/ \||||||x Mr Earth Surface
/ Ml x||||||\
O / \||||||\ a. x
___/__________________\||||||\_________________>__________
| |//////
| pl |/ p //| pr
| |//////
z v |//////| Soil Cross Section
|//////
Sl Sr
Figure 11 Vertical Layers
Figure 11 shows an earth model consisting of three vertical layers with resistivities pl, p and pr respectively. The reference
layer resistivity is always the center layer resistivity p (for horizontally-layered soils, the reference resistivity is that of the top
layer). If the earth structure consists of two vertical layers only, then the reference layer resistivity is that of the left layer.
Examination of Figure 11 reveals that the interface plane between two adjacent vertical planes can be uniquely defined by the
angle "a" of the interface trace on the X-Y plane (earth surface) with respect to the positive direction of the X axis, and by the
X and Y coordinates of one point on the interface trace. For example, the interface plane separating the right and central
layers (Sr) is defined by the angle "a" and the coordinates of point Mr.
It is clear now that one needs to know how to distinguish the left layer from the right layer because firstly, one does not
necessarily have to orient the X axis from left to right (arbitrary choice of the coordinate system) and secondly, there are
ambiguous situations (such as interface planes parallel to the X axis) for which the distinction between the left and right
layers becomes blurred. To resolve such cases, MALT always assumes that the observation point Mo defined by the
coordinates x = infinity, y = 0, z = 0 is ALWAYS in the RIGHT layer. If Mo happens to be located exactly on the interface
plane, then the point Mo will be defined by x = infinity, y = E, z = 0 (E being a small positive number).
SPHERICALLY LAYERED SOIL MODELS
A spherical soil model is composed of three soil regions delineated by two concentric hemispherical interfaces. Spherical soil
models are useful in modelling grounding systems located in finite soil heterogeneities. Typically, these soil structures are
artificial. For example, a spherical soil model can be used to represent a building foundation buried in a given volume of
backfill, and surrounded by native soil.
DIAMETER OF EQUIVALENT
ORIGINAL CONDUCTOR ASSUMED SHAPE CYLINDRICAL CONDUCTOR
.______.
^ |//////
| |//////
l | |//////| - same - 2(l + w)/pi
| |//////
| |//////
v |______
<------>
w
^ ## ^ #
| ## | ###
l | ## l | ##### (l + w + SQRT(l*l + w*w))/pi
| ## | #######
v ######### v #########
<-------> <------->
w w
^ ## ## ^ #########
| ## ## | #########
l | ## ## l | ######### 2(l + w)/pi
| ## ## | #########
v ######### v #########
<-------> <------->
w w
^ ######### ^ #########
| # | #######
l | # l | ##### (w + SQRT(4*l*l + w*w))/pi
| # | ###
v # v #
<-------> <------->
w w
discover that MALZ requires additional data related to the ground conductor characteristics, current frequency and method of
current injection.
The following topics describe this information and related concepts:
{ground-network} : The Ground Network
{potential-rise} : The Potential Rise Concept
{earth-fault} or {fault-current} : Earth Fault Current
{coordinates} or {coordinate-system} : The MALZ Coordinate System
{characteristics} or {injection-leads} : Physical Characteristics and
Currents Injection Leads
{other-data} : Other Input Data
{computations} : MALZ Computations
{acceleration} : Description of Computation Speed
Often, the voltage drop between two points of the ground network some distance apart may be of the same order of
magnitude as the average potential rise of the station (with respect to remote earth, which is at a zero potential). This voltage
drop will depend on a number of factors, such as ground network configuration, earth structure, current frequency, as well as
the number and locations of current injection nodes.
It is also quite possible that, above a certain frequency, the current does not reach the edge of the ground network, which
therefore appears smaller to the power system than it really is (from an electrical point of view). One particular example of
this phenomenon is clearly illustrated by a long ground conductor often used to build HVDC ground electrodes or
transmission line counterpoises (Fig. 1).
I |
v
|0
--/~/----------------------------------------------------------------\~\-->
V | | | | | | | V
V | | | | | V X
| V | | | V
| V | V
| V i(x)
|
|<------------------- Effective Length le ------------------>
| I
| v K
O === Bus K O
\ (4) | \ (5)
\ | \
(1) \ | \ (3)
O----------O----------O----#----O---------------O---------O
\ <---(2)---> / \
\ ^ / \
\ | / \
O Current Conductor O
Injection Node
Node
LEGEND: (j) conductor segment j
Figure 2 Current Injection Segment
Each injection node is the terminal point of a current lead originating from a "current source bus" common to all current leads
belonging to that particular bus. The total earth current at this bus k is Ik. The value of Ik is a complex number in Cartesian
form; the phase shift of each current is relative to that of the reference bus (highest numbered bus), which is typically set to 0
degrees.
where R is the resistance to ground of the ground conductor network, and Ie is the current injected into the soil by the ground
conductor network. This resistance R represents the resistance of the earth medium surrounding the ground network and is
essentially a function of the soil structure and geometry of the ground network.
The preceding "potential rise" concept cannot be used in MALZ, since by virtue of the longitudinal impedances of the ground
conductors, each point of the ground network is at a different potential. Hence, the potential rise cannot refer to the entire
ground network, but rather, refers to a specific location in the ground network. By convention, the potential rise (GPR) is
defined as the difference of voltage which exists between the power system reference current source bus (assuming that the
reference bus is the only current source bus of the system) and remote earth (assumed to be at zero potential). This general
definition is consistent with the implicit assumptions made in Program MALT. However, when voltage differences exist
between various points within the ground conductors, the general form of equation 1-1 becomes:
where Z is now defined as the ground impedance of the ground network as seen from the reference current source bus. This
impedance consists of the resistance and reactance of the metallic ground conductor paths and the resistance of the soil
volume surrounding the ground network. At low frequencies and for ground networks which are moderate or small in size,
the resistance of the soil volume is significantly larger than the metallic path impedance. Therefore, this last value can be
neglected and the MALT program can be used advantageously to model the problem.
Note that the ground network performance is proportional(*) to the currents flowing in the source busses. This is an
important observation which is very useful to solve the problem discussed in the {earth-fault} section.
* NOTE: It is assumed that there are no saturation and other nonlinear processes which are current-dependent.
Phase Wire
_______/|\__________/|\_____________/|\_____________/|\__________/|\_______
/ | I t
Il \ V Ir
< ---- / ---- > Ground Wire
_______/|\__________/|\_____________/|\_____________/|\__________/|\_______
| | | | | | | |
| | | | | | | | |
| | | | | | Ie | | |
| | | | | V | | |
===== ===== /-----/-|---/-----/ ===== =====
/-----/--*--/-----/
/-----/-----/-----/
<----<-----<-----<----/ V V \---->----->----->---->
which are assumed to be cylindrical, are defined by the coordinates of the conductors' extremities, i.e., origin (Xo, Yo, Zo)
and end (Xe, Ye, Ze) and by their radii.
The XY plane is located at the soil surface and the Z axis is directed downward. For example, a portion of a ground network
is shown in Figure 1 with respect to the MALZ coordinate system. When possible, X and Y axes parallel to the ground
conductors should be selected for the sake of simplicity.
In the MALT program, the preceding data suffices to fully describe the ground network. In the MALZ program, additional
data is necessary to define the conductor impedances, coatings and current injection leads: see the "characteristics" topic for
further details.
Y Z (Xo,Yo,Zo) (Xe,Ye,Ze)
| | |
-0-------------------------> X -0---|--------------|-----> X
| | V V
| ________________ | /----/-*--/----/
| | | | | | / / / /
| | /----/-*--/-*--/----/----/----*
| | / / / / /
| | /----/----/----/----/
| | / / / / /
v v /----/----/----/----/----*
Z Side View -Y Top View
Note that the current leads are assumed to be perfectly insulated. Therefore, no conduction current flows from the surface of
the leads directly to earth. The function of these connections is to provide a direct path from the current source busses to the
buried ground network.
The series impedances and shunt capacitances of the current injection leads are also specified using the categorization
procedure.
Segment 1 Segment 1
______________________________ ______________________________
|_/___/___/___/___/___/___/__|__________ |_/___/___/___/___/___/___/__
|_\___\___\___\___\___\___\__| |_\___\___\___\___\___\___\__
Segment 2 Segment 2
Figure 1 Overlapping Conductors
When MALZ finishes the required input data transformation and preparation, it starts to compute the currents which circulate
in the current leads, in the ground conductor segments (current entering and exiting the segments) and the current which
penetrates the earth medium from each conductor segment. In addition, the potential at each conductor segment center (on the
metal surface and on the coating-earth interface, if applicable) and at each conductor segment extremity is also computed and
displayed in the printout. Finally, the potential rise of each current source bus is determined and printed.
These computation results are part of the normal printout generated by Program MALZ.
If the user has also requested earth potential and magnetic field calculations at selected observation points or along profiles,
the program computes the requested potential and magnetic field values and uses both Cartesian and polar representations to
print the results.
Typically:
* The source voltage driving each conductor can have any value. Therefore, unbalanced multiphase power systems
can be modelled.
* Phase conductors, neutral conductors, and ground wires are modelled the same way, except that the neutral
conductor (or ground wire) source voltage is typically zero and shunt impedances of the neutral conductor represent
the tower ground impedances. The shunt impedances of a phase wire represent (if desired) the distributed conductor
capacitances. When, at localized areas along the line, shunt capacitors or reactors are installed, these are also
modelled as shunt impedances.
* Each single shunt (or tower) impedance can be assigned a unique value different from all other shunt values.
* Open circuit conditions are modelled by insertion of high impedance values at the desired locations or by specifying
dummy sections.
* Mutual coupling between any pair of conductors can be specified and can vary from one span to the other.
* The so-called "bus to neutral" impedances at the Central (or Main) Station are generally used to represent the
equivalent impedances of a transformer. In the event of a phase to ground fault, this impedance is replaced by a
short or by the impedance of the arc or fault path. When a conductor is not connected to the substation neutral path,
a large impedance value must be specified.
A line section is a segment of line existing between two shunt impedances and is typically a power line span. Note
that the sections are numbered starting from 1 at the section adjacent to the central station. The last section is
adjacent to the terminal.
Mutual and Connection Impedances
Mutual and connection impedance values can be specified between any pair of lines belonging to the same section.
Differentiating Between Lines
SPLITS does not differentiate between an overhead ground wire, cable shield, pipe, phase wire, or any other type of
conductor. All these are considered to be "lines" connected to the associated bus. For example, a ground wire can be
described as a phase wire connected to a voltage source of 0 volts. In addition, the ground wire bus is connected
directly to the ground network. Similarly, a section of pipe close to the power system can be described as a ground
wire open at its terminals (using high impedance values).
Each line must be connected to a bus, which is assigned a name and a number. The bus number is used by SPLITS
to identify the bus. The bus name is optional but highly recommended, since SPLITS can recognize certain ground
or neutral conductor names when it compiles its summary table of how the fault current splits.
reduction in the TRALIN program when calculating the line parameters. The shunt impedances are the ground
resistances of the structures, accounting for the counterpoise ground resistance.
In SYSTEM, the user specifies the coordinates and characteristics of all the conductors and their insulation. Two-dimensional
Cartesian coordinates are used to specify the locations of lone conductors, and the centers of conductor bundles. On the other
hand, polar coordinates are used to specify the positions of bundle members with respect to the bundle centers.
Characteristics to be specified are: size, conductivity, permittivity, permeability and composition (strands or solid-core).
It is important to understand that the SYSTEM subcommands comprise three methods of describing the conductors, but
ONLY ONE may be chosen for any given run. These three are: GROUP, SINGLE, and LINES. Note that if any underground
conductors or pipe-enclosed cable groups or any cables with concentric conductors are to be entered, then the GROUP mode
MUST be chosen.
The PARAMETER module has two parts: INDUCTION and BASE-VALUES. INDUCTION is used for calculating voltages
induced in conductors by either faulted lines or lines under normal operating conditions. INDUCTION informs the program
what inducing currents shall pass through the conductors, or with which potentials they are energized, and in which
conductor induced potentials are to be calculated.
BASE-VALUES is used to inform the program of the power frequencies to be used in the calculation of line parameters and
induced voltages. BASE-VALUES also specifies how accurately calculations are to be made. Note that command BESSEL is
used only when conductors are specified in GROUP mode. Otherwise, it is ignored if entered.
The GRADIENT section should be invoked if either electric potentials or electric fields are to be determined by TRALIN.
The voltage distribution is entered as are the points where potentials or fields are desired. Note that this module can be
invoked only if conductors are specified in LINES mode (i.e., on a per-circuit basis).
The SOIL-TYPE section describes the soil model to the program. The proper description of the earth is important if accurate
results are desired. Program RESAP can help formulate such a model.
For more information on the system, induction and gradient modules, request help on the "system module", "induction
module" and "gradient module" topics.
- The induced currents and voltages in pipes and other buried objects caused by the presence of overhead conductors
(transmission line, etc.).
- Eddy currents in the soil caused by overhead structures or buried, energized conductors. (The Eddy currents are
proportional to the electric field).
- Fault current distribution on a portion of a transmission line, and the electromagnetic fields at the fault site.
HIFREQ’s computational engine is based on field theory. As such, it takes induction effects fully into account. This allows
the computation of the self-inductance of arbitrary circuits and of the mutual inductances between any two such circuits.
Capacitances can likewise be computed. In particular, this means that the following problems can be studied with HIFREQ:
- Currents and voltages induced on a secondary circuit caused by the presence of a large current on a primary circuit.
- Induced currents in an arbitrary, three-dimensional wire-frame structure (such as a metallic building frame) caused
by the presence of nearby electromagnetic field sources.
It is also possible to specify that lumped impedances (resistors, capacitors and inductances) be attached to the conductors.
This means that it is possible to perform ordinary circuit analysis with HIFREQ.
HIFREQ’s computations are valid up to several tens of MHz. In fact, HIFREQ can be used to do wire antenna calculations!
This high-frequency capability, coupled with Fourier analysis (such as that performed by SES’ own, powerful FFTSES
program), means that HIFREQ can be used to study time dependent phenomena, such as:
- Lightning performance of towers and grids.
- Behavior of transients caused by lightning or switching.
- Effects of higher harmonics on the electromagnetic fields (non-sinusoidal currents and voltages, pulse trains, etc...)
Pseudo-node is an isolated node at which there is only one conductor, while a Proper-node is a common node shared by two
or more conductors.
External and Internal Energizations
In general, it may well prove impossible to model the entire electrical network under consideration, because of its size.
However, complete modeling is rarely necessary: the local electromagnetic fields do not depend critically on the details of the
remote parts of the network. It is usually sufficient to represent the remote network as a source of currents and voltages for
the local network. This is referred to as “External Energization”. External Energization can be achieved by specifying the
currents flowing into (or out of) the local network (with LEAD energizations at pseudo-nodes) and the potentials at which the
various parts of the network are kept (with GPR energizations). It can also be achieved by specifying the Thevenin equivalent
of the remote system (a combination of VOLTAGE energization and an impedance).
It is also possible to have “Internal Energizations” in the local network. These are current sources (LEAD energization at
proper-nodes) and voltage generators (VOLTAGE energization). They behave exactly the same in circuit analysis.
Which approach is used for external energization depends on the problem under consideration. In many cases, this is only a
matter of taste, as different methods of energization can be used equivalently. However, in some cases, one method can be
greatly superior to the others. As an example, a lightning stroke is much more easily represented as a current source than in
any other way.
1. LEAD ENERGIZATION
The LEAD energization is used to specify the current to be injected into the network. It can be applied to both pseudo-nodes
and proper-nodes. With the LEAD energization, a current of ReI + j ImI is forced to flow into the origin of the energized
conductor towards its end. If the origin of the energized conductor is a proper-node, the LEAD energization acts as a current
source, familiar from circuit theory. The proper-node energization can be used, for instance, to model a loop with a specified
circulating current. If the origin of the energized segment is a pseudo-node, the current is assumed to be drawn from an
adjacent network which is not modeled.
2. GPR ENERGIZATION
The GPR energization forces the scalar potential to be ReV + j ImV on the energized conductor. At the same time, an
unknown current Ix determined by HIFREQ is allowed to flow into the origin of the energized conductor so that the right
value of the scalar potential ReV + j ImV is produced. As in the case of the LEAD energization, Ix is assumed to be drawn
from an adjacent network. It is important to note that presently the GPR energization can only be applied to a pseudo-node.
This restriction will be lifted in the future. The GPR energization can be used to model a voltage generator with one lead
connected to remote ground. It works well at relatively low frequencies (< 1 MHz).
3. VOLTAGE ENERGIZATION
The VOLTAGE energization inserts a zero-gap voltage generator in the middle of the energized conductor to establish a
voltage difference of ReV + j ImV across that point. Note that the program automatically segments the energized conductor
in the middle. Note also that no further segmentation of that conductor is allowed, i.e., a conductor subject to a VOLTAGE
energization must not cross the air-soil interface or any other conductors. Also, the desired number of segments for this
conductor must be 1.
The voltage difference is imposed so that the voltage close to the end of the conductor minus the voltage close to its origin is
given by the specified ReV + j ImV.
The VOLTAGE energization behaves precisely as a voltage generator in circuit theory.
To energize a conductor, its Lead-Type connection code must be set to 0 and its Energization-Type connection code must
be set to the value corresponding to the desired ENERGIZATION. Setting the Lead-Type connection code to -1 informs the
program that the corresponding conductor is not directly energized. Refer to the examples in Chapter 6 of the HIFREQ
User’s Manual for further details.
Note that the electromagnetic fields close to energization points can be somewhat inaccurate due to the idealized modeling of
the energizations. This is usually not a big concern for internal energizations but it can have a substantial effect for external
energizations. A rule of thumb is that whenever the distance between the observation point and the closest conductor is about
10 times smaller (or less) than the distance between the observation point and the closest external energization, the fields
should be very accurate. Also, the magnetic field is much less sensitive to this effect than the electric field and scalar
potential.
In case of doubt, it is always possible to model a little bit more of the remote network (thereby pushing the external
energizations further away) to ascertain the extent of the effects of the external energizations on the fields.
Important Note:
The currents at all pseudo-nodes are physically forced to be zero, except when the pseudo-nodes are subjected to LEAD or
GPR ENERGIZATION. This leads to a very common mistake when in-air conductors are energized. For example if one end
of a long conductor is energized with a 100 Amps LEAD and its other end is a pseudo-node, the entire 100 Amps will be
forced to leak into the air, creating huge, unphysical, electric fields and potentials.
Unless a current of zero is specifically desired, all in-air pseudo-nodes should be subject to either a LEAD or a GPR
energization. Since these energizations can only be applied at the origin of the segments, one must make sure that in-air
pseudo-nodes are located at the origin of each such segment, by orienting these segments appropriately. Whether a LEAD or
a GPR energization should be used depends on the problem being modeled, as does the magnitude of the energization. See
the examples in Chapter 6 of the HIFREQ User’s Manual.
computations. If the field in the air and close to the ground is desired, the observation points should have a small,
negative, Z-coordinate.
c. One or several computation frequencies can be specified with FREQUENCY. The frequencies are specified
INDIVIDUALly or in a group, AUTOMATICally.
3) Transmission Lines. The transmission line is modeled as a single faulted phase and a single ground (or neutral or
static) wire group. Each transmission line is made up of sections (i.e., spans) which are all of the same length. Each
span is terminated by a ground shunt connected to the ground (or neutral or static) wire group. This represents the
ground impedance of the transmission line towers connected to the ground (or neutral or static) wire group. Each
section of the ground wire group has a series impedance and mutual impedance with respect to the faulted phase.
Data entered by the user is given below:
• Faulted Phase: the location of the faulted phase is specified in terms of its cross-sectional location in the
right-of-way.
• Ground (or Neutral or Static) Wire Group: the FCDIST model also includes a single ground (or neutral
or static) wire group. It can be composed of several conductors regularly arranged on the perimeter of a
circle. Its location is specified in terms of the position of the group's center and the number of conductors,
and the position of the first conductor. The ground wire group has a series impedance and a mutual
impedance with respect to the faulted phase, which can be calculated by the program or specified by the
user. More details are provided in the "conductor-data" help topic.
• Section Shunt: each section (or span) of the transmission line has a ground shunt impedance located at its
extremity which is furthest away from the central site. The section shunt represents the ground impedance
of the transmission line structures. This ground shunt is a complex-valued quantity which is the same for all
structures in a given arm of the transmission line network.
• The user must also specify the span length and the number of spans in each transmission line arm.
Note that terminal, source, ground wire group, section and phase parameters must be specified separately for each
transmission line arm.
To fully describe the transmission line network, it is also necessary to specify the electrical characteristics (resistivity and
permeability) of the soil in which the network is located. A uniform soil model is used. The user must also specify the power
system frequency.
Note: all members of a ground wire group must be identical and arranged along the perimeter of a circle at regular
intervals (i.e., at the vertices of a regular polygon).
• Relative permeability of members of the ground wire group. Alternatively, this value can also be specified as the
geometric mean radius or the 60 hertz reactance at 1 foot spacing of the conductor (the option selected depends on
the setting of a flag specified by the user).
• Relative resistivity of members of the ground wire group. Alternatively, the user can specify this parameter in terms
of the conductor dc resistance or the conductor ac resistance (the option selected depends on the setting of a flag
specified by the user).
• External radius of members of the ground wire group
• Internal radius of the members of the ground wire group, in the case of hollow conductors (this is 0 for solid
conductors).
Required data for the faulted phase:
• For the faulted phase, the coordinates must be specified when the characteristics mode is specified (in order to
calculate the mutual impedance between the faulted phase and the ground wire group). When the impedances are
entered directly by the user, the coordinates of the faulted phase are not used.
inverse FFT to all the single frequency results from the frequency domain software for this point (or segment), modulated by
the frequency spectrum of the input transient. This method for transient analysis is called the "frequency domain approach''.
these curves. If any resonance exists, the frequency domain software HIFREQ or MALZ should be run at some
additional frequencies near these resonance frequencies to provide a more precise modeling of the shapes of the
spectrum curves. Otherwise, the time domain response may be distorted due to a lack of accuracy in the spectrum
curve modeling near these resonance frequencies. In fact, FFTSES will issue a warning in the output file to signal
the presence of such resonance frequencies and suggest the additional frequencies to be run.
A
ACCELERATION, SICL, MALT.............................................................................................................................................................. 28
ADVANCED-FEATURES, SICL, FFTSES............................................................................................................................................... 60
ANALYSIS, SICL, MALZ ........................................................................................................................................................................ 33
APPLICATIONS, SICL, HIFREQ............................................................................................................................................................. 47
APPLICATIONS, SICL, MALT ................................................................................................................................................................ 22
C
CAPABILITIES, SICL, SPLITS................................................................................................................................................................ 39
CHARACTERISTICS, SICL, MALZ ........................................................................................................................................................ 37
COMMON-PROBLEMS, SICL, HIFREQ ................................................................................................................................................. 52
COMPUTATION, SICL, MALT ............................................................................................................................................................... 25
COMPUTATIONS, SICL, HIFREQ .......................................................................................................................................................... 51
COMPUTATIONS, SICL, MALZ ............................................................................................................................................................. 38
COMPUTATIONS, SICL, RESAP ............................................................................................................................................................ 16
CONDUCTOR-DATA, SICL, FCDIST ..................................................................................................................................................... 54
CONDUCTOR-GEOMETRY, SICL, HIFREQ.......................................................................................................................................... 49
CONDUCTORS, SICL, TRALIN .............................................................................................................................................................. 44
COORDINATES, SICL, HIFREQ ............................................................................................................................................................. 48
COORDINATES, SICL, MALZ ................................................................................................................................................................ 36
CURRENT-SOURCE-DATA, SICL, FCDIST........................................................................................................................................... 55
D
DEFINITIONS, SICL, SPLITS.................................................................................................................................................................. 40
DIFFERENCES-WITH-MALZ, SICL, HIFREQ ....................................................................................................................................... 52
E
EARTH- FAULT, SICL, MALZ................................................................................................................................................................ 36
ENERGIZATION, SICL, HIFREQ............................................................................................................................................................ 49
F
FAULT-CURRENTS, SICL, MALT.......................................................................................................................................................... 24
FCDIST, SICL, FCDIST............................................................................................................................................................................ 53
FEATURES, SICL, MALT ........................................................................................................................................................................ 18
FFTSES, SICL, FFTSES............................................................................................................................................................................ 57
FREQUENCY, SICL, FFTSES.................................................................................................................................................................. 58
G
GRADIENT-MODULE, SICL, TRALIN................................................................................................................................................... 45
GROUND- NETWORK, SICL, MALZ ..................................................................................................................................................... 34
GROUND, SICL, MALZ........................................................................................................................................................................... 32
GROUNDING-GRID, SICL, MALT ......................................................................................................................................................... 25
H
HELPFUL HINTS, AUXILIARY, SICL, General Information .................................................................................................................. 10
HELPFUL HINTS, BLOCKS, SICL, General Information......................................................................................................................... 11
HELPFUL HINTS, CONFIGURATION, SICL, General Information .......................................................................................................... 9
HELPFUL HINTS, RECOVERY, SICL, General Information ................................................................................................................... 10
HIFREQ, SICL, HIFREQ .......................................................................................................................................................................... 47
I
INDUCTION-MODULE, SICL, TRALIN................................................................................................................................................. 45
INFORMATION, SICL, FFTSES.............................................................................................................................................................. 60
INFORMATION, SICL, SPLITS .............................................................................................................................................................. 41
INFORMATION-REQUIRED, SICL, HIFREQ ........................................................................................................................................ 48
INPUT, SICL, MALT................................................................................................................................................................................ 21
INPUT-DATA, SICL, RESAP................................................................................................................................................................... 15
INPUT-DESCRIPTION, SICL, MALT ..................................................................................................................................................... 26
INTRODUCTION, BACKGROUND, SICL, General Information .............................................................................................................. 3
INTRODUCTION, STARTING, SICL, General Information ...................................................................................................................... 3
INTRODUCTION, SUMMARY, SICL, General Information...................................................................................................................... 2
IRREGULAR, SICL, MALT ..................................................................................................................................................................... 28
L
LOGICALS, SICL, General Information ................................................................................................................................................... 11
M
MAIN-STEPS, SICL, FFTSES.................................................................................................................................................................. 59
MALT, SICL, MALT ................................................................................................................................................................................ 17
MALZ, SICL, MALZ ................................................................................................................................................................................ 31
METHODS, SICL, RESAP ....................................................................................................................................................................... 14
N
NETWORKS, SICL, MALZ...................................................................................................................................................................... 32
O
OTHER-DATA, SICL, MALZ .................................................................................................................................................................. 38
OUTPUT, SICL, MALT............................................................................................................................................................................ 21
P
POTENTIAL- RISE, SICL, MALZ ........................................................................................................................................................... 35
PROBLEM-DESCRIPTION, SICL, MALT............................................................................................................................................... 23
PROGRAM ENVIRONMENT, INPUT, SICL, General Information........................................................................................................... 3
PROGRAM ENVIRONMENT, OUTPUT, SICL, General Information ....................................................................................................... 4
PROGRAM ORGANIZATION, SICL, TRALIN....................................................................................................................................... 43
PROGRAM STRUCTURE, FACILITY, SICL, General Information........................................................................................................... 8
PROGRAM STRUCTURE, SICL, General Information.............................................................................................................................. 4
PROGRAM STRUCTURE, SPECIFICATION, SICL, General Information................................................................................................ 7
PROGRAM STRUCTURE, STANDARD, SICL, General Information ....................................................................................................... 8
PROGRAM STRUCTURE, SYNTAX, SICL, General Information ............................................................................................................ 5
R
REPRESENTATION, SICL, FCDIST ....................................................................................................................................................... 53
RESAP, SICL, RESAP.............................................................................................................................................................................. 13
RESTART-INSTRUCTIONS, SICL, HIFREQ.......................................................................................................................................... 52
S
SAFETY, SICL, MALT ............................................................................................................................................................................ 26
SAFETY, SICL, SPLITS........................................................................................................................................................................... 41
SENSITIVITY, SICL, SPLITS.................................................................................................................................................................. 41
SICL, SICL, General Information ................................................................................................................................................................ 1
SIRPS, CSIRPS, General Information........................................................................................................................................................ 61
T
TRALIN, SICL, TRALIN .......................................................................................................................................................................... 43
TYPES, SICL, RESAP .............................................................................................................................................................................. 13
TYPES-OF-CONDUCTORS, SICL, HIFREQ ........................................................................................................................................... 51