BFG67; BFG67/X; BFG67/XR

NPN 8 GHz wideband transistors

Rev. 05 — 23 November 2007 Product data sheet

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NXP Semiconductors
NXP Semiconductors Product specification

NPN 8 GHz wideband transistors BFG67; BFG67/X; BFG67/XR

FEATURES PINNING
• High power gain DESCRIPTION
• Low noise figure PIN
BFG67 BFG67/X BFG67/XR
• High transition frequency
1 collector collector collector
• Gold metallization ensures
2 base emitter emitter
excellent reliability.
3 emitter base base
4 emitter emitter emitter
APPLICATIONS
Wideband applications in the GHz
range, such as satellite TV tuners and
portable RF communications
equipment.

DESCRIPTION
NPN silicon transistor in a 4-pin,
4
handbook, 2 columns 3 3
handbook, 2 columns 4
dual-emitter SOT143B plastic
package. Available with in-line emitter
pinning (BFG67) and cross emitter
pinning (BFG67/X). Version with
2 1
reverse pinning (BFG67/XR) also 1 2
available on request. Top view MSB014 Top view MSB035

MARKING

TYPE NUMBER CODE

BFG67 (Fig.1) V3%
Fig.1 Simplified outline Fig.2 Simplified outline
BFG67/X (Fig.1) %MV SOT143B. SOT143R.
BFG67/XR (Fig.2) V26

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT

VCEO collector-emitter voltage open base − 10 V
IC collector current (DC) − 50 mA
Ptot total power dissipation Ts ≤ 65 °C − 300 mW
Cre feedback capacitance IC = ic = 0; VCB = 8 V; f = 1 MHz 0.5 − pF
fT transition frequency IC = 15 mA; VCE = 8 V; f = 500 MHz 8 − GHz
GUM maximum unilateral power IC = 15 mA; VCE = 8 V; 17 − dB
gain Tamb = 25 °C; f = 1 GHz
F noise figure Γs = Γopt; IC = 5 mA; VCE = 8 V; 1.3 − dB
Tamb = 25 °C; f = 1 GHz
Γs = Γopt; IC = 5 mA; VCE = 8 V; 2.2 − dB
Tamb = 25 °C; f = 2 GHz

Rev. 05 - 23 November 2007 2 of 14

NXP Semiconductors Product specification

NPN 8 GHz wideband transistors BFG67; BFG67/X; BFG67/XR

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCBO collector-base voltage open emitter − 20 V
VCEO collector-emitter voltage open base − 10 V
VEBO emitter-base voltage open collector − 2.5 V
IC collector current (DC) − 50 mA
Ptot total power dissipation Ts ≤ 65 °C; see Fig.3; note 1 − 380 mW
Tstg storage temperature range −65 150 °C
Tj junction temperature − 175 °C

Note
1. Ts is the temperature at the soldering point of the collector pin.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth j-s thermal resistance from junction to soldering point note 1 290 K/W

Note
1. Ts is the temperature at the soldering point of the collector pin.

MBC984 - 1
400
handbook, halfpage
Ptot
(mW)

300

200

100

0
0 50 100 150 200
T ( o C)
s

Fig.3 Power derating curve.

Rev. 05 - 23 November 2007 3 of 14

NXP Semiconductors Product specification

NPN 8 GHz wideband transistors BFG67; BFG67/X; BFG67/XR

CHARACTERISTICS
Tj = 25 °C unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

ICBO collector leakage current VCB = 5 V; IE = 0 − − 50 nA
hFE DC current gain IC = 15 mA; VCE = 5 V 60 100 −
fT transition frequency IC = 15 mA; VCE = 8 V; f = 500 MHz − 8 − GHz
Cc collector capacitance IE = ie = 0; VCB = 8 V; f = 1 MHz − 0.7 − pF
Ce emitter capacitance IC = ic = 0; VEB = 0.5 V; f = 1 MHz − 1.3 − pF
Cre feedback capacitance IC = ic = 0; VCB = 8 V; f = 1 MHz − 0.5 − pF
GUM maximum unilateral power IC = 15 mA; VCE = 8 V; − 17 − dB
gain; note 1 Tamb = 25 °C; f = 1 GHz
IC = 15 mA; VCE = 8 V; − 10 − dB
Tamb = 25 °C; f = 2 GHz
F noise figure Γs = Γopt; IC = 5 mA; VCE = 8 V − 1.3 − dB
Tamb = 25 °C; f = 1 GHz
Γs = Γopt; IC = 15 mA; VCE = 8 V; − 1.7 − dB
Tamb = 25 °C; f = 1 GHz
IC = 5 mA; VCE = 8 V; − 2.5 − dB
Tamb = 25 °C; f = 2 GHz; ZS = 60 Ω
IC = 15 mA; VCE = 8 V; − 3 − dB
Tamb = 25 °C; f = 2 GHz; ZS = 60 Ω

Note
S 21 2
1. GUM is the maximum unilateral power gain, assuming S12 is zero and G UM = 10 log -------------------------------------------------------------- dB.
( 1 – S 11 2 ) ( 1 – S 22 2 )

Rev. 05 - 23 November 2007 4 of 14

NXP Semiconductors Product specification

NPN 8 GHz wideband transistors BFG67; BFG67/X; BFG67/XR

MBB302
MBB301
120 handbook,0.8
halfpage
handbook, halfpage
Cre
(pF)
h FE
0.6

80

0.4

40
0.2

0 0
0 20 40 60 0 4 8 12 16
I C (mA) VCB (V)

VCE = 5 V. IC = ic = 0; f = 1 MHz.

Fig.4 DC current gain as a function of collector Fig.5 Feedback capacitance as a function of

current. collector-base voltage.

MBB303 MBB304
10
handbook, halfpage handbook,25
halfpage
fT
gain
(GHz) (dB)
MSG
8 20 G max

G UM
6 15

4 10

2 5

0 0
0 10 20 30 40 0 10 20 30 40
IC (mA)
I C (mA)

VCE = 8 V; f = 1 GHz.
VCE = 8 V; Tamb = 25 °; f = 2 GHz. GUM = maximum unilateral power gain;
MSG = maximum stable gain;
Gmax = maximum available gain.
Fig.6 Transition frequency as a function of
collector current. Fig.7 Gain as a function of collector current.

Rev. 05 - 23 November 2007 5 of 14

NXP Semiconductors Product specification

NPN 8 GHz wideband transistors BFG67; BFG67/X; BFG67/XR

MBB305 MBB306
50
handbook, halfpage 50
handbook, halfpage
gain gain
(dB) (dB)
40 40

G UM G UM
30 30

MSG MSG
20 20

G max G max
10 10

0 2 3 4 0 2 3 4
10 10 10 f (MHz) 10 10 10 10 f (MHz) 10

VCE = 8 V; IC = 5 mA. VCE = 8 V; IC = 15 mA.

GUM = maximum unilateral power gain; GUM = maximum unilateral power gain;
MSG = maximum stable gain; MSG = maximum stable gain;
Gmax = maximum available gain. Gmax = maximum available gain.

Fig.8 Gain as a function of frequency. Fig.9 Gain as a function of frequency.

MBB307
MBB308
handbook,50
halfpage 4
handbook, halfpage
gain f = 2 GHz
F
(dB)
(dB)
40
G UM 3
1 GHz

30 900 MHz
MSG
500 MHz
2

20

G max
1
10

0 2 3 4 0
10 10 10 f (MHz) 10 1 10 100
I C (mA)

VCE = 8 V; IC = 30 mA.
GUM = maximum unilateral power gain; VCE = 8 V.
MSG = maximum stable gain;
Gmax = maximum available gain.
Fig.11 Minimum noise figure as a function of
Fig.10 Gain as a function of frequency. collector current.

Rev. 05 - 23 November 2007 6 of 14

NXP Semiconductors Product specification

NPN 8 GHz wideband transistors BFG67; BFG67/X; BFG67/XR

MBB309
4
handbook, halfpage
F
I C = 30 mA
(dB)

3
15 mA

5 mA
2

0
10 2 10 3 10 4
f (MHz)

VCE = 8 V.

Fig.12 Minimum noise figure as a function of

frequency.

BFG67/X
stability
f VCE IC
on

1 circle
gi
re

(MHz) (V) (mA)

le
ab

0.5
st

500 8 5 2
un

Noise Parameters

Fmin Gamma (opt) 0.2

Fmin=0.95 dB
5
Rn/50
(dB) (mag) (ang) OPT 10
+j
0.95 0.455 33.8 0.288 0.2 0.5 1 2 5 10
0 ∞
−j
1.5 dB 10
2 dB

0.2 3 dB 5

0.5 2

MBB317
1
ZO = 50 Ω.

Fig.13 Noise circle figure.

Rev. 05 - 23 November 2007 7 of 14

NXP Semiconductors Product specification

NPN 8 GHz wideband transistors BFG67; BFG67/X; BFG67/XR

BFG67/X
stability
f VCE IC circle 1
(MHz) (V) (mA)
0.5 2
1000 8 5

reg table
Noise Parameters

ion
s
un
Fmin Gamma (opt) 0.2 Fmin =1.3 dB 5
Rn/50
(dB) (mag) (ang) OPT
10
1.3 0.375 65.9 0.304 +j
∞
0.2 0.5 1 2 5 10
0
−j
2 dB 10

0.2 3 dB 5
4 dB

0.5 2

MBB316
1
ZO = 50 Ω.

Fig.14 Noise circle figure.

BFG67/X
1
f VCE IC
(MHz) (V) (mA)
0.5 2
2000 8 5

Noise Parameters
0.2 5
Gamma (opt) Fmin =2.2 dB
Fmin 3 dB
4 dB
Rn/50
(dB) (mag) (ang) OPT 5 dB 10
+j
2.2 0.391 136.5 0.184 0
0.2 0.5 1 2 5 10
∞
G max
–j
Average Gain Parameters =12dB 11 dB 10
10 dB
9 dB
GMAX Gamma (max) 0.2 5
(dB) (mag) (ang) 8 dB

12 0.839 −170
0.5 2

MBB315
1

ZO = 50 Ω.

Fig.15 Noise circle figure.

Rev. 05 - 23 November 2007 8 of 14

NXP Semiconductors Product specification

NPN 8 GHz wideband transistors BFG67; BFG67/X; BFG67/XR

handbook, full pagewidth 1

0.5 2

3 GHz
0.2 5

10
+j
0
0.2 0.5 1 2 5 10
∞
−j
40 MHz 10

0.2 5

0.5 2

MBB314
1

VCE = 8 V; IC = 15 mA; ZO = 50 Ω.

Fig.16 Common emitter input reflection coefficient (S11).

handbook, full pagewidth 90°

120° 60°

150° 30°

40 MHz
+ϕ
50 40 30 20 10 3 GHz
180° 0°
−ϕ

150° 30°

120° 60°
VCE = 8 V; IC = mA; ZO = 50 Ω. 90° MBB313

Fig.17 Common emitter forward transmission coefficient (S21).

Rev. 05 - 23 November 2007 9 of 14

NXP Semiconductors Product specification

NPN 8 GHz wideband transistors BFG67; BFG67/X; BFG67/XR

handbook, full pagewidth 1

0.5 2

0.2 5

10
+j
0.2 0.5 1 2 5 10
0 ∞
−j 40 MHz
3 GHz 10

0.2 5

0.5 2

MBB312
1

VCE = 8 V; IC = 15 mA.

Fig.18 Common emitter reverse transmission coefficient (S12).

handbook, full pagewidth 90°

120° 60°

3 GHz
150° 30°

+ϕ
0.5 0.4 0.3 0.2 0.1 40 MHz
180° 0°
−ϕ

150° 30°

120° 60°
MBB311
90°
VCE = 8 V; IC = 15 mA.

Fig.19 Common emitter output reflection coefficient (S22).

Rev. 05 - 23 November 2007 10 of 14

NXP Semiconductors Product specification

NPN 8 GHz wideband transistors BFG67; BFG67/X; BFG67/XR

PACKAGE OUTLINES

Plastic surface mounted package; 4 leads SOT143B

D B E A X

y
v M A HE

e
bp w M B

4 3

A1

c
1 2
Lp
b1
e1 detail X

0 1 2 mm

scale

DIMENSIONS (mm are the original dimensions)

A1
UNIT A bp b1 c D E e e1 HE Lp Q v w y
max
1.1 0.1 0.48 0.88 0.15 3.0 1.4 2.5 0.45 0.55
mm 1.9 1.7 0.2 0.1 0.1
0.9 0.38 0.78 0.09 2.8 1.2 2.1 0.15 0.45

OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC EIAJ PROJECTION

SOT143B 97-02-28

Rev. 05 - 23 November 2007 11 of 14

NXP Semiconductors Product specification

NPN 8 GHz wideband transistors BFG67; BFG67/X; BFG67/XR

Plastic surface mounted package; reverse pinning; 4 leads SOT143R

D B E A X

y
v M A HE

e
bp w M B

3 4
Q

A1
c
2 1
Lp
b1
e1 detail X

0 1 2 mm

scale

DIMENSIONS (mm are the original dimensions)

A1
UNIT A bp b1 c D E e e1 HE Lp Q v w y
max
1.1 0.1 0.48 0.88 0.15 3.0 1.4 2.5 0.55 0.45
mm 1.9 1.7 0.2 0.1 0.1
0.9 0.38 0.78 0.09 2.8 1.2 2.1 0.25 0.25

OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC EIAJ PROJECTION

SOT143R 97-03-10

Rev. 05 - 23 November 2007 12 of 14

NXP Semiconductors BFG67; BFG67/X; BFG67/XR
NPN 8 GHz wideband transistors

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Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.

Definitions malfunction of an NXP Semiconductors product can reasonably be expected

Draft — The document is a draft version only. The content is still under
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Limiting values — Stress above one or more limiting values (as defined in
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Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com

Rev. 05 - 23 November 2007 13 of 14

NXP Semiconductors BFG67; BFG67/X; BFG67/XR
NPN 8 GHz wideband transistors

Revision history
Table 1. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BFG67_X_XR_N_5 20071123 Product data sheet - BFG67_X_XR_4
Modifications: • Page 2; Table Marking code; row 1 and 2 code changed
BFG67_X_XR_4 19981002 Product specification - BFG67_SERIES_3
(9397 750 04349)
BFG67_SERIES_3 19950901 Product specification - BFG67_SERIES_2
BFG67_SERIES_2 - Product specification - BFG67_SERIES_1
BFG67_SERIES_1 - - - -

Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.

© NXP B.V. 2007. All rights reserved.

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 23 November 2007
Document identifier: BFG67_X_XR_N_5