Electronics Module for Flow Simulation

Bill Dziedzic, Senior Fluid Flow Support Engineer

Dassault Systemes SolidWorks Corp.
Electronics Module

• New in 2011
• Add-on module
requiring additional
purchase
• Separate item on
Product Activation list
• Not stand-alone
requires SolidWorks
and Flow Simulation
(same version)
Agenda

• Electronics Module
 Two-resistor Component Compact model
−Junction Temperature
 Joule Heating
 Heat pipe Compact model
 PCB generator
 Library Update
Electronics Module

• Feature Manager Tree and Engineering Database

Electronics Module

• Why Electronics Module?

 New boundary conditions
− increases analysis capability for electronics analysis
− increases accuracy by improving the simulation of electronic components

 Expanded Engineering Database

− Improves accuracy of results
− Reduces the time the user has to search for material properties and vendor components

 Overall model is more realistic

Where to find information?

• Technicalreference.pdf file
• Tutorial.pdf file.
• Online Help
• Customer Portal –Knowledge Base article
• Training example
Two-Resistor Component Model
• Captures thermal behavior of ICs at critical points (Junction
and Case)
• Increased accuracy compared to classic single-resistor model
• Significant increase in calculation efficiency due to library
items based on JEDEC*-Standard
T
Die Encapsulant Die
θjc

Substrate J

θjb

PCB B

* Joint Electron Device Engineering Council

 Two-Resistor Component Model

• Definition of a 2R-Component (Package)

• Model is represented by two solid
blocks
C
• Input of power dissipation [W] (source),
θjc
as well as Junction and Case
J thicknesses
θjb
• Definition of a thermal resistance
B [°C/W] between Junction and Case
(Rjc) as well as Junction and Board
(Rjb) – definition via Engineering
1D Thermal Conduction: T2 T1 Rth Q12 Database
• Sidewalls are insulated (adiabatic)
• The generated heat only spreads
through the package top and bottom
jc – Thermal resistance Junction-Case [°C/W]

jb – Thermal resistance Junction-Board [°C/W]

Junction Temperature

• Junction temperature is the highest temperature of the actual

semiconductor in an electronic device.
 While operating its temperature is higher than the case
temperature and the temperature of the part's exterior.
 The temperature difference is equal to the amount of heat
transferred from the junction to case times the junction-to-case
thermal resistance.
• Maximum junction temperature is specified in a part's datasheet and
is used when calculating the necessary case-to-ambient thermal
resistance for a given power dissipation.
 This in turn is used to select an appropriate heat sink if
necessary.
Junction Temperature

• An estimation of the chip-junction temperature, TJ, can

be obtained from the following equation:

 TJ = TA + ( R θJA × PD )
−where: TA = ambient temperature for the package (
ºC)
−R θJA = junction to ambient thermal resistance ( º C
/W)
−PD = power dissipation in package (W)
Two-Resistor Compact Model

• If the analysis model involves conjugate heat transfer in

an electronic device containing small electronic
packages (chips, etc.), the user may use the two-resistor
model, i.e. as a flat heat source with specified thermal
resistance to heat conduction from junction to case.
• To create a two-resistor component:
 Click Two-Resistor Component on the Flow Simulation toolbar
or Flow Simulation, Insert, Two-Resistor Component.
- or -
In the Flow Simulation analysis tree, right-click the Two-Resistor
Components item and select Insert Two-Resistor Component.
Two-Resistor Compact Model

• Under Selection specify components to apply case and

junction bodies.
• In the graphics area, click a face, edge or point to select
a component to apply the Case Body list.
 You can also select a component in the flyout FeatureManager
design tree.
 You can select only one component.
• In the graphics area, click a face, edge or point to select
a component to apply the Junction Body list.
 You can also select a component in the flyout FeatureManager
design tree.
 You can select only one component.
Two-Resistor Compact Model

• Under Component select two-resistor component from

the Two-resistor Components list.
 If you want to add a new two-resistor component to the
Engineering Database or edit an existing one, click Create/Edit
to open the Engineering Database.

• Under Source specify the Heat Generation Rate value.

 If you want to specify a time-dependent value, click Dependency.
Two-Resistor Compact Model

• The user can also associate a two-resistor component

with a goal(s), which will be automatically created
together with the two-resistor component
 Select the Create associated goals check box under Options.
You can associate goals with a two-resistor component under
the Automatic Goals item of the Options dialog box.
Joule Heating
• Joule Heating Calculation (Electrical Condition)
 Steady-state direct electric current in electro-conductive solids
 The corresponding specific Joule heating effect (R•I²) is automatically
calculated and included in the heat transfer calculations
 The calculation of electrical potential and current is only performed in
electrical-conductive solids, i.e. metals and metal-containing composite
materials
−Dielectric solids, semiconductors, fluid and void areas do not
participate in the calculation

Electrical current density distribution

Joule Heating - (Electronics module)

Benefits:
 Provides a solution for many
applications in automotive and
power electronics, where Joule
heating effects are a crucial
physical process (e.g. electronic
motor control units or power
distribution racks).
 Allows accurate modelling of the
physics in applications where
heating is an unwanted by-product
of current use (e.g. load losses in
electrical transformers).
 Provides a solution for a common
request to be able to model the
joule heating effect of PCB traces
Joule Heating Definition

• Joule heating, also known as ohmic heating and resistive heating, is

the process by which the passage of an electric current through a
conductor releases heat.
 It was first studied by James Prescott Joule in 1841.
 Joule immersed a length of wire in a fixed mass of water and measured
the temperature rise due to a known current flowing through the wire for
a 30 minute period.
 By varying the current and the length of the wire he deduced that the
heat produced was proportional to the square of the current multiplied
by the electrical resistance of the wire.
• This relationship is known as Joule's First Law.
 The SI unit of energy was subsequently named the joule and given the
symbol J. The commonly known unit of power, the watt, is equivalent to
one joule per second.
Joule Heating in Flow Simulation

• Flow Simulation is able to calculate steady-state (and

quasi time-dependent) direct electric current in
electroconductive solids.
 Inthe presence of the electric current, the
corresponding specific Joule heat QJ [W/m3] is
released and included in QH of heat transfer equation.
 In the case of isotropic material,QJ = r·i2
−where r is the solids' electrical resistivity [Ω·m] (it
can be temperature-dependent) and i is the electric
current density [A/m2].
Joule Heating in Flow Simulation

• Transient electric problems with boundary conditions

depending on time are considered as quasi-steady-state.
• In this case the steady-state problem for potential is
solved at each time step, not taking into account
transient electrical processes in solids.
• The Laplace equation is solved numerically in the
computational subdomain (it may be a part of the overall
computational domain) of electroconductive materials.
 Thiscomputational subdomain automatically excludes
dielectric solids and fluid areas inside.
Joule Heating in Flow Simulation

• The electrical resistivity of electroconductive solids can be

anisotropic, i.e. specified by its components in the coordinate
system's directions ri , i=1,2,3.

• The isotropic/anisotropic type of material is specified for electrical

resistivity and thermal conductivity simultaneously, i.e. so that their
main axes coincide.
Joule Heating in Flow Simulation

• The electric current density vector

• is determined via the electric potential ϕ [V]. To obtain the electric potential
ϕ, Flow Simulation utilizes the steady-state Laplace equation

• Here rii is the temperature-dependent electrical resistivity in the i-th

coordinate direction.
Joule Heating in Flow Simulation

• A surface between electroconductive solids in the computational

subdomain is either considered zero-resistance (default) or the
electric contact resistance is specified on it.
• The resistance value is either given explicitly or calculated from the
given material and its thickness.
• A contact resistance specified on a surface implies that the current
passing through it produces the corresponding Joule heating, which
yields the following surface heat source QJS [W/m2]:

 where in is the electric current density normal to the surface and

Δϕ is the electric potential drop at this surface.
Joule Heating in Flow Simulation

• The total electric current in normal direction over a surface In [A] or

electric potential ϕ [V] may be specified by the user as boundary
conditions for the problem.

• These conditions may be imposed on surfaces between

fluid/electroconductive solid, electroconductive
solid/electroconductive solid, dielectric solid/electroconductive solid,
and outer solid surfaces.

• If no electrical boundary conditions are specified by user, the In = 0

boundary condition is automatically specified by default on bounding
surfaces.
Joule Heating in Flow Simulation

• If you are solving a problem that includes electric current, you may
specify the electrical contact condition at the boundary between two
conducting solids or on the outer boundary of a conducting solid.
 The possible types of an electrical condition are Current, Voltage, and
Contact Resistance.
• The contact resistance can be specified either by selecting one of
the Electrical Resistances available in the Engineering Database or
by selecting the material of the contact layer and its thickness.
 In the latter case, the thickness serves only to calculate the effective
resistance; from the geometrical standpoint, the contact layer is still
considered infinitely thin.
Joule Heating in Flow Simulation

• Click Electrical Condition on the Flow Simulation Flow Simulation,

Insert, Electrical Condition.
- or -
In the Flow Simulation analysis tree right-click the Electrical
Conditions icon and select Insert Electrical Condition.

• In the Type list select the desired electrical condition type: Current,
Voltage or Contact Resistance.

• In the graphics area select the model faces on which you want to
specify the electrical condition.
Joule Heating in Flow Simulation

• If the selected type of electrical condition is Current, specify the

following parameters under Value:
 In or Out direction.
 Current value.
−Click Dependency if you want to specify time-dependent
values.

• If the selected type of electrical condition is Voltage, specify the

Voltage value under Value.
 Click Dependency if you want to specify time-dependent values.
Joule Heating in Flow Simulation

• If the selected type of electrical condition is Contact Resistance,

select the definition under Value:
 Resistance. The contact resistance is defined by the selecting
its value.
 Under Electrical Resistance select the desired contact electrical
resistance from the list of available values of electrical
resistances (for various materials) in the Engineering Database.
 You can add a new contact electrical resistance to the
Engineering Database or edit an existing one.

• NOTE: The specified Electrical Resistance is distributed among the

selected faces in proportion to faces areas.
Joule Heating in Flow Simulation
 Material/thickness. The contact resistance is defined by
specifying the contact layer material and its thickness:
−Under Solid material select the desired material from the list
of solid materials available in the Engineering Database.
− You can add a new solid material to the Engineering
Database or edit an existing one click Create/Edit to open
the Engineering Database.
−Under Thickness specify Material Thickness , i.e. the
thickness of the contact layer material.
− Click Dependency if you want to specify time-dependent
values.
Joule Heating – Example

0 mV

Voltage-drop 5mV

5 mV Material: Aluminum
Joule Heating – Example Results

• Voltage [V]
Joule Heating – Example Results

• Electrical current density [A/m²]

Joule Heating – Example Results

• Solid-Temperature
Heat Pipe Model
 A simple and pragmatic method for modelling a predominant
cooling approach in laptops and other space constrained or
conduction cooled designs.

 Avoids the need to model the complex two-phase physics

happening within the device
Heat Pipe Definition

• "Heat Pipe" is a device (of arbitrary form: a tube, a plate, etc.)

transferring heat from its hotter surface to its colder surface due to
evaporating a liquid (water, etc.) and condensing its vapor in this
device's inner hollow.
• This liquid evaporates near the hotter surface and its vapor
condenses near the colder surface.
• The condensed liquid then returns to the hotter end due to gravity or
by a wick.
 If such a device operates under its design conditions, the heat
transfer rate provided by this device exceeds substantially any
value achievable by a solid body of similar dimensions.
• In Flow Simulation a "Heat Pipe" is modeled simplistically as an
extremely heat-conducting body. To model real efficiency of a heat
pipe, a non-zero thermal resistance can be assigned to it.
Heat Pipe Model
• Definition of a Heat Pipe
 Specify heat flux direction, i.e. input and output face
 Enter heat pipe equivalent thermal resistance
 Outer walls may need to have surface resistances defined, especially if they
are connected to another surface (TIM, solder,etc.)

Heat Pipe body (component) Heat Sink

Input surface (in Output surface (contact surface to heat sink)

contact with package)
PCB Generator (Electronics module)

Features:
 This feature allows you to obtain the
bi-axial thermal conductivity values,
with the normal (through plane) and
in-plane thermal conductivities
automatically derived from the PCB
structure and the properties of the
specified conductor and dielectric
materials.
 The board can also be arbitrarily
oriented with respect to the global
coordinate system,
– i.e. angled PCB’s can be modelled.
Printed Circuit Boards (PCBs)

• Applied PCBs
 Easy analysis of multi-layer boards -> minimizing CAD efforts
 Anisotropic conductivity properties are taken into acount (orthogonal,
biaxial, etc.)
 Quick and accurate calculation of arbitrary placed components such as
DIMMs (Dual Inline Memory Module), e.g. diagonal placement
Printed Circuit Boards (PCBs)
• Definition via PCB Generator
 Input:
−Number of conducting layers
−Percentage cover and layer thickness of conducting layers (%),
or
−Volume- / mass fraction of board and conductive layer
−Thermal conductivity of board and conductive layer material
(planar, normal)
−Default material settings (density, specific heat)
Printed Circuit Boards (PCBs)
• Definition via PCB Generator
 Input:
−Number of conducting layers
−Percentage cover and layer thickness of conducting layers (%),
or
−Volume- / mass fraction of board and conductive layer
−Thermal conductivity of board and conductive layer material
(planar, normal)
−Default material settings (density, specific heat)
PCB Generator - (Electronics module)

Benefits:
 Simple and standard approach for determining the physical
properties of multi-layer PCB’s.
 The arbitrary orientation enables compact and accurate
modeling of devices such as angled DIMM’s.
Printed Circuit Boards (PCBs)

• Applied PCBs
 Easy analysis of multi-layer boards -> minimizing CAD efforts
 Anisotropic conductivity properties are taken into acount
(orthogonal, biaxial, etc.)
 Quick and accurate calculation of arbitrary placed components
such as DIMMs (Dual Inline Memory Module), e.g. diagonal
placement
Printed circuit boards (PCBs)

• Printed circuit boards (PCBs) are a special case of a solid material

setting having anisotropic thermal conductivity.
 The integral characteristics of a PCB, i.e. its effective density,
specific heat, and components of thermal conductivity, are
calculated on the basis of the PCB structure.
 You can either select a pre-defined PCB from the Engineering
Database, or create a user-defined PCB by specifying its
parameters.
−In a user-defined PCB, you must specify density, specific
heat, and thermal conductivity for both dielectric and
conductor materials of the PCB, and describe its internal
structure in one of the provided types.
Printed circuit boards (PCBs)

• The Layer Definition type implies that you must specify the number
of conducting layers and the span and thickness of each.

• The Conductor Volume Fraction type requires the specification of

volume fraction of conductor material in the PCB.

• With the Board Mass type, the total mass and total volume of the
PCB are used to calculate the fraction of conductor material in it.
Electronics Module – Engineering
Database
• Features and benefits of the extended Engineering Database
 Features:
−Solid Materials (especially IC Packages)
−Fans (Axial, Radial, Fan Curves)
−TECs
−2R-Models
 Library interface developed in cooperation with suppliers and
customers
 Wide range of experience due to Mentor Graphics
Mechanical Analysis Division leadership in the electronics
cooling market
 Quick and easy to use
 Library can be customized
Libraries – Fans (Electronics module)
Electronics Module – Engineering
Database
• Thermoelectric Coolers (TEC) Interface
 Marlow
 Melcor
Electronics Module – Engineering
Database
• Supporting Thermal Models of JEDEC-Standards (mono-chip package)
 CBGA, Chip Array, LQFP, MQFP, PBGA, PLCC, QFN, SOP, SSOP,
TQFP, TSOP, TSSOP
JEDEC

• JEDEC brings manufacturers and suppliers together to participate in more

than 50 committees and subcommittees, with the mission to create
standards to meet the diverse technical and developmental needs of the
industry.
• JEDEC’s collaborative efforts ensure product interoperability, benefiting the
industry and ultimately consumers by decreasing time-to-market and
reducing product development costs.
• JEDEC publications and standards are accepted throughout the world, and
are free and open to all.
• JEDEC is accredited by ANSI and maintains liaisons with numerous
standards bodies throughout the world.
• http://www.jedec.org
Microchip Packages styles

• CBGA -multilayer ceramic ball grid array

• LQFP -A Low-profile Quad Flat Package is a surface mount
integrated circuit package format with component leads extending
from each of the four sides. Pins are numbered counter-clockwise
from the index dot. Spacing between pins can vary; common
spacings are 0.4, 0.5, 0.65 and 0.80 mm intervals.
• MQFP -Metric Quad Flat Package
• PBGA -Plastic Ball Grid Array
• PLCC -A plastic leaded chip carrier is a plastic, four-sided chip
carrier, with a “J”-lead and pin spacings of 0.05" (1.27 mm).
Microchip Packages styles

• QFN -Quad Flat No leads physically and electrically connect

integrated circuits to printed circuit boards.
• SSOP -Shrink small-outline package is a microchip package for
surface-mount technology. SSOP chips have "gull wing" leads
protruding from the two long sides, and a lead spacing of 0.025
inches (0.635mm).
• TSOPs -Thin small-outline packages are a type of surface mount IC
package. They are notably very low-profile (about 1mm) and have
tight lead spacing (as low as 0.5mm).
• TSSOP -Thin-shrink small outline package is a four-sided,
rectangular, thin body size surface mount component.
• TQFP -A thin quad flat pack is a type of surface-mounted package.
TQFPs provide the same benefits of the metric QFP, but are thinner
(body thickness of 1.0 mm) and have a standard lead-frame footprint
(2.0 mm lead footprint).
Electronics Module – Engineering Database

• Thermal Interface Materials

 Berquist
 Chomerics
 Dow Corning
 Thermagon

• These interface resistances are frequently a source of concern to

users and appropriate data can be difficult to determine, so these
manufacturer based datasets are of real value
 Background – PCB’s

• Typical Analysis Goals

 Determine the maximum 1A
temperature of the trace (s)
−Design limits linked to glass
transition limit of FR4 at
~110 ºC or solder integrity
concerns
 Determine the trace width
required to avoid thermal
issues
 Determine the maximum
0 mV
permissible current
 Determine the voltage drop
along a track
Background – Meshing Matters

mesh-dependent
error source
Background – Meshing Matters

Use CAD Geometry: OFF

trace section view

Use CAD Geometry: ON

Background – Meshing Matters
Background – Meshing Matters

Use CAD Geometry: OFF

trace section view

Use CAD Geometry: ON

 Background – Meshing Matters

• Keep in mind:

 Aim to generate at least 5 cells across the

trace sections that are not aligned to the
global CS
 Not always sufficient, so it is always a good
reason to check!
Background – Meshing Matters

Mesh Sensitivity

5 1

4.5 0.9

4 0.8
Joule Heating (Watts)

3.5 0.7

Voltage Drop (Volts)

3 0.6
Joule Heat
2.5 0.5
Voltage Drop
2 0.4

1.5 0.3

1 0.2

0.5 0.1

0 0
0 5 10 15 20 25
# of cells across trace
Background – Meshing Matters

 The PCB component should be

of rectangular shape!


 In case of an inclined PCB in
contact with another non-inclined
PCB. It is recommended that the
inclined plate is inserted either
directly into the non-inclined

plate or the connector block.
 Take care to refine the
contacting faces properly!
 In the example shown, the
region is well resolved:
— The easiest way is to apply a local
mesh to the connecting faces with
appropriate refinement of solid
and/or partial cells.
Background – Meshing Matters
 2R-Components
— Resolve clean to avoid
significant “Cell Cut-Off”
— Use “Control Planes”!

Pic.1: Significant cut-off at case top-surface Pic. 1

Pic. 2: improved mesh-structure with an

neglectable cut-off area Pic.2
Electronics Module –Tutorial Example

• Tutorial
 C:\Program Files\SolidWorks Corp\SolidWorks Flow Simulation
\lang\english\Docs\technicalreference.pdf

• Training example