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o meet the demand for more features, smaller require maximum signal-to-noise performance. Still,
size and lower cost, the design of all electronic there are plenty of applications where CMOS is the
equipment keeps moving to higher levels of inte- best choice.
gration. The size and functionality advantages are For higher performance, another “old” technology
obvious, but there are many different aspects of the continues to be improved. BiCMOS, which can accom-
cost equation. Highly integrated devices cut the total modate designs with both CMOS and bipolar devices,
component cost of finished products, which reduces continues to have a solid niche. It is also a low cost
assembly cost. In high volumes, automated manufac- process, but is not low power. In general, BiCMOS is
turing keeps the unit cost low. used when the application has a combination of digital
The up-front engineering costs of a semiconductor and analog circuits on the same chip, in a circuit that
IC or other type of integrated device is usually higher required a combination of RF and low microwave fre-
than discrete designs. This is due to the additional quency response, medium power levels and low noise.
design effort to translate the electronic design into a Process improvements are largely incremental, since
physical design for the chosen fabrication process. this is a mature technology.
Thus, this discussion applies to products with a large It has been barely ten years since IBM began its
potential customer base, or which have uncompro- major promotion of silicon-germanium (SiGe) technol-
mised requirements for the space savings that comes ogy. In a relatively short time, the process successfully
with an integrated device. found the answers to problems that arose during early
Although “integrated circuit” has traditionally production efforts. Today, SiGe is replacing BiCMOS as
meant a monolithic device on a semiconductor sub- the process of choice for most mainstream RFIC appli-
strate, this term now has a wider meaning. Now, any cations. Its promise of lower noise and higher frequen-
technology that offers a substantial reduction in size, cies has been met, as well as its promise to deliver that
usually accompanied with automated fabrication, performance with only a tiny cost premium.
may be referred to as an IC. This report will highlight Gallium arsenide (GaAs) has had a more dramatic
some of these “IC” technologies that apply to high fre- history. Even with a lot of government money behind
quency (RF, microwave and optical) systems. its development, and early success in providing a huge
step forward in microwave IC development, it took a
RFICs and MMICs long time and much turmoil to reach today’s status of
First are the “classic” semiconductor integrated cir- GaAs as a commonly-used MMIC process. Among the
cuits, where all the technologies have undergone sig- companies involved in the MIMIC program that creat-
nificant changes in recent years. The low-cost ed the GaAs industry, very few remain in the GaAs
workhorse, CMOS, is now being fabricated with business.
dimensions in 0.1 micron range. In addition to the However, the technology remains strong. It is the
high-profile 2+ GHz computer MPUs, RF and process most commonly used for wireless phone power
microwave devices in this same frequency range are in amplifiers, thanks primarily to the development of the
production. WLAN, Bluetooth, and similar cost-sensi- heterojunction bipolar transistor (HBT) and indium-
tive technologies have benefitted from the low process- gallium-phosphide (InGaP) process enhancements.
ing costs—and low power consumption—of CMOS. With its ability to handle higher power than other pro-
CMOS has the disadvantage of higher noise than cesses, GaAs is also the typical choice for RF switches.
other RF/microwave IC technologies, so its applica- Its original advantage of higher frequency operation is
tions have been primarily in systems with communi- still significant, making GaAs (and its enhancements)
cation range and modulation formats that do not the only choice for many microwave and mm-wave ICs.
There are other processes and materials that have optimum dielectric constant, and may be lossy at
an impact on high frequency ICs. Some of these are microwave frequencies. On the other hand, ceramics
derivatives or enhancements of those noted above; oth- and established laminate materials are designed
ers are not yet in significant production. The most sig- specifically for microwave applications. Although the
nificant new processes are aimed at mm-wave and low-temperature ceramics used in LTCC circuits are
higher frequencies, and we are watching their progress not as good as traditional alumina, but they are a lot
with great interest. better than silicon.