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RFD8P05, RFD8P05SM, RFP8P05

Data Sheet July 1999 File Number 2384.2

8A, 50V, 0.300 Ohm, P-Channel Power Features


MOSFETs • 8A, 50V
These products are P-Channel power MOSFETs
• rDS(ON) = 0.300Ω
manufactured using the MegaFET process. This process,
which uses feature sizes approaching those of LSI circuits, • UIS SOA Rating Curve
gives optimum utilization of silicon, resulting in outstanding • SOA is Power Dissipation Limited
performance. They were designed for use in applications
such as switching regulators, switching converters, motor • Nanosecond Switching Speeds
drivers, and relay drivers. These transistors can be operated • Linear Transfer Characteristics
directly from integrated circuits.
• High Input Impedance
Formerly developmental type TA09832.
• Related Literature
- TB334 “Guidelines for Soldering Surface Mount
Ordering Information Components to PC Boards”
PART NUMBER PACKAGE BRAND

RFD8P05 TO-251AA D8P05


Symbol
D
RFD8P05SM TO-252AA D8P05

RFP8P05 TO-220AB RFP8P05


G
NOTE: When ordering, use the entire part number. Add the suffix 9A
to obtain the TO-252AA variant in tape and reel, i.e.,
RFD8P05SM9A. S

Packaging
JEDEC TO-220AB JEDEC TO-251AA
SOURCE
DRAIN
SOURCE
GATE
DRAIN
GATE
DRAIN (FLANGE) DRAIN (FLANGE)

JEDEC TO-252AA

DRAIN (FLANGE)

GATE
SOURCE

4-112 CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999.
RFD8P05, RFD8P05SM, RFP8P05

Absolute Maximum Ratings TC = 25oC Unless Otherwise Specified


RFD8P05,
RFD8P05SM, RFP8P05 UNITS
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS -50 V
Drain to Gate Voltage (RGS = 20KΩ) (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VDGR -50 V
Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID -8 A
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM -20 A
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS ±20 V
Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD 48 W
Dissipation Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.27 W/oC
Single Pulse Avalanche Energy Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EAS See Figure 6
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ , TSTG -55 to 175 oC

Maximum Temperature for Soldering


Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL 300 oC
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Tpkg 260 oC

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTE:
1. TJ = 25oC to 150oC.

Electrical Specifications TC = 25oC Unless Otherwise Specified


PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Drain to Source Breakdown Voltage BVDSS ID = 250µA, VGS = 0V (Figure 9) -50 - - V
Gate Threshold Voltage VGS(TH) VGS = VDS, ID = 250µA (Figure 8) -2 - -4 V
Zero Gate Voltage Drain Current IDSS VDS = Rated BVDSS, VGS = 0V - - 1 µA
VDS = 0.8 x Rated BVDSS, TJ = 150oC - - 25 µA
Gate to Source Leakage Current IGSS VGS = ±20V - - ±100 nA
Drain to Source On Resistance (Note 2) rDS(ON) ID = 8A, VGS = -10V (Figure 7) - - 0.300 Ω
Turn-On Time tON VDD = -25V, ID ≈ 4A, RG = 9.1Ω, RL = 6.25Ω, - - 60 ns
VGS = -10V
Turn-On Delay Time td(ON) - 16 - ns
Rise Time tr - 30 - ns
Turn-Off Delay Time td(OFF) - 42 - ns
Fall Time tf - 20 - ns
Turn-Off Time tOFF - - 100 ns
Total Gate Charge Qg(TOT) VGS = 0 to -20V VDD = -40V, ID = 8A,RL = 5Ω, - - 80 nC
IG(REF) = -0.3mA
Gate Charge at -5V Qg(-10) VGS = 0 to -10V - - 40 nC
Threshold Gate Charge Qg(TH) VGS = 0 to -2V - - 2 nC
Thermal Resistance Junction to Case RθJC - - 3.125 oC/W

Thermal Resistance Junction to Ambient RθJA TO-251AA, TO-252AA - - 100 oC/W

TO-220AB 62.5 oC/W

Source to Drain Diode Specifications TC = 25oC Unless Otherwise Specified

PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS

Source to Drain Diode Voltage (Note 2) VSD ISD = -8A - - -1.5 V

Reverse Recovery Time trr ISD = -8A, dISD/dt = 100A/µs - - 125 ns

NOTE:
2. Pulse test: pulse width ≤ 300µs, Duty Cycle ≤ 2%.
3. Repetitive rating: pulse width is limited by maximum junction temperature.

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RFD8P05, RFD8P05SM, RFP8P05

Typical Performance Curves Unless Otherwise Specified

1.2 -10
POWER DISSIPATION MULTIPLIER

1.0
-8

ID, DRAIN CURRENT (A)


0.8
-6
0.6

-4
0.4

-2
0.2

0 0
0 25 50 75 100 125 150 175 25 50 75 100 125 150 175

TC , CASE TEMPERATURE (oC) TC, CASE TEMPERATURE (oC)

FIGURE 1. NORMALIZED POWER DISSIPATION vs CASE FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
TEMPERATURE CASE TEMPERATURE

10 100
If R = 0
IAS , AVALANCHE CURRENT (A) tAV = (L) (IAS) / (1.3 RATED BVDSS - VDD)
DC OPERATION If R ≠ 0
ID , DRAIN CURRENT (A)

tAV = (L/R) ln [(IAS*R) / (1.3 RATED BVDSS - VDD) + 1]


OPERATION IN THIS IDM
STARTING TJ = 25oC
AREA IS LIMITED BY rDS(ON)
STARTING TJ = 150oC
1 10

TC = 25oC
TJ = 175oC
0.1 1
-1 -10 -100 0.1 1 10 100
VDS , DRAIN TO SOURCE VOLTAGE (V) tAV, TIME IN AVALANCHE (ms)

FIGURE 3. FORWARD BIAS SAFE OPERATING AREA FIGURE 4. UNCLAMPED INDUCTIVE SWITCHING CAPABILITY

-20 20
IDS(ON), DRAIN TO SOURCE CURRENT (A)

PULSE DURATION = 80µs VGS = -10V PULSE DURATION = 80µs


DUTY CYCLE = 0.5% MAX VGS = -9V DUTY CYCLE = 0.5% MAX 25oC
TC = 25oC VDD = 15V
-16 16 175oC
ID, DRAIN CURRENT (A)

VGS = -8V

-12 12
-55oC
VGS = -7V
-8 8

VGS = -6V
-4 4
VGS = -5V
VGS = -4V
0 0
0 -2 -4 -6 -8 -10 0 -3 -6 -9 -12 -15
VDS, DRAIN TO SOURCE VOLTAGE (V) VGS , GATE TO SOURCE VOLTAGE (V)

FIGURE 5. SATURATION CHARACTERISTICS FIGURE 6. TRANSFER CHARACTERISTICS

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RFD8P05, RFD8P05SM, RFP8P05

Typical Performance Curves Unless Otherwise Specified

3.0 1.50
PULSE DURATION = 80µs VGS = VDS, ID = -250µA
DUTY CYCLE =0.5% MAX
NORMALIZED ON RESISTANCE

2.5 VGS = -10V, ID = -8A 1.25

THRESHOLD VOLTAGE
NORMALIZED GATE
2.0 1.00

1.5 0.75

1.0 0.50

0.5 0.25

0 0
-50 0 50 100 150 200 -50 0 50 100 150 200
TJ , JUNCTION TEMPERATURE (oC) TJ , JUNCTION TEMPERATURE (oC)

FIGURE 7. NORMALIZED DRAIN TO SOURCE ON FIGURE 8. NORMALIZED GATE THRESHOLD VOLTAGE vs


RESISTANCE vs JUNCTION TEMPERATURE JUNCTION TEMPERATURE

2.0 1000
ID = -250µA VGS = 0V, f = 1MHz
CISS = CGS + CGD
NORMALIZED DRAIN TO SOURCE

CRSS = CGD
800
COSS ≈ CDS + CGS
BREAKDOWN VOLTAGE

C, CAPACITANCE (pF)
1.5

600
CISS
1.0
400

COSS
0.5
200

CRSS

0 0
-50 0 50 100 150 200 0 -5 -10 -15 -20 -25
TJ , JUNCTION TEMPERATURE (oC) VDS , DRAIN TO SOURCE VOLTAGE (V)

FIGURE 9. NORMALIZED DRAIN TO SOURCE BREAKDOWN FIGURE 10. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE
VOLTAGE vs JUNCTION TEMPERATURE

-50 -10
VDS , DRAIN TO SOURCE VOLTAGE (V)

GATE
VGS , GATE TO SOURCE VOLTAGE (V)

VDD = BVDSS VDD = BVDSS


SOURCE
VOLTAGE
-37.5 -8
RL = 6.25Ω
IG(REF) = 0.3mA
VGS = 10V
-25 -6
0.75BVDSS
0.50BVDSS
0.25BVDSS
-12.5 -4
DRAIN TO SOURCE
VOLTAGE -2

0 0
I I
20 G(REF) TIME (µs) 80 G(REF)
IG(ACT) IG(ACT)

NOTE: Refer to Application Notes AN7254 and AN7260.


FIGURE 11. NORMALIZED SWITCHING WAVEFORMS FOR CONSTANT GATE CURRENT

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RFD8P05, RFD8P05SM, RFP8P05

Test Circuits and Waveforms

VDS
tAV

L 0

VARY tP TO OBTAIN
REQUIRED PEAK IAS RG
-
VDD
+

0V DUT VDD
tP IAS
VGS
IAS VDS
tP
0.01Ω
BVDSS

FIGURE 12. UNCLAMPED ENERGY TEST CIRCUIT FIGURE 13. UNCLAMPED ENERGY WAVEFORMS

tON tOFF

td(ON) td(OFF)

tr tf
0
RL 10% 10%

DUT - VDS
VDD 90% 90%
RG
VGS + VGS
0
10%

50% 50%
PULSE WIDTH
90%

FIGURE 14. SWITCHING TIME TEST CIRCUIT FIGURE 15. RESISTIVE SWITCHING WAVEFORMS

VDS VDS
Qg(TH)
RL 0

VGS= -1V

VGS -VGS VGS= -5V


-
VDD Qg(-5)
+
VGS= -10V
DUT VDD

Ig(REF)
Qg(TOT)

0
Ig(REF)

FIGURE 16. GATE CHARGE TEST CIRCUIT FIGURE 17. GATE CHARGE WAVEFORMS

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RFD8P05, RFD8P05SM, RFP8P05

All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com

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