Integrated circuit

An integrated circuit or monolithic integrated circuit (also referred to as an IC, a

chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip")
of semiconductor material, normally silicon. The integration of large numbers of
tiny transistors into a small chip results in circuits that are orders of magnitude
smaller, cheaper, and faster than those constructed of discreteelectronic components.
The IC's mass production capability, reliability and building-block approach to
circuit design has ensured the rapid adoption of standardized ICs in place of designs
using discrete transistors. ICs are now used in virtually all electronic equipment and
have revolutionized the world of electronics. Computers, mobile phones, and other
Erasable Programmable Read-Only
digital home appliances are now inextricable parts of the structure of modern
Memory (EPROM) integrated circuits.
societies, made possible by the small size and low cost of ICs. These packages have a transparent
window that shows thedie inside.
Integrated circuits were made practical by mid-20th-century technology
The window is used to erase the
advancements in semiconductor device fabrication. Since their origins in the 1960s, memory by exposing the chip to
the size, speed, and capacity of chips have progressed enormously, driven by ultraviolet light.
technical advances that fit more and more transistors on chips of the same size - a
modern chip may have several billion transistors in an area the size of a human
fingernail. These advances, roughly following Moore's law, make computer chips of
today possess millions of times the capacity and thousands of times the speed of the
computer chips of the early 1970s.

ICs have two main advantages over discrete circuits: cost and performance. Cost is
low because the chips, with all their components, are printed as a unit by
photolithography rather than being constructed one transistor at a time. Furthermore,
packaged ICs use much less material than discrete circuits. Performance is high
Integrated circuit from an EPROM
because the IC's components switch quickly and consume comparatively little power memory microchip showing the
because of their small size and close proximity. The main disadvantage of ICs is the memory blocks, the supporting
high cost to design them and fabricate the required photomasks. This high initial circuitry and the fine silver wires
cost means ICs are only practical whenhigh production volumesare anticipated. which connect the integrated circuit
die to the legs of the packaging.

Contents
Terminology
Invention
Advances
Design
Types
Manufacturing Synthetic detail of an integrated
Fabrication circuit through four layers of
Packaging planarized copper interconnect,
Chip labeling and manufacture date down to the polysilicon (pink), wells
(greyish), and substrate (green)
Intellectual property
Other developments
Generations
 SSI, MSI and LSI
VLSI
ULSI, WSI, SOC and 3D-IC
Silicon labelling and graffiti
ICs and IC families
See also
References
Further reading
External links

Terminology
An integrated circuit is defined as:[1]

A circuit in which all or some of the circuit elements are inseparably associated and electrically interconnected so that
it is considered to be indivisible for the purposes of construction and commerce.

Circuits meeting this definition can be constructed using many different technologies, including thin-film transistors, thick-film
technologies, or hybrid integrated circuits. However, in general usage integrated circuit has come to refer to the single-piece circuit
construction originally known as amonolithic integrated circuit.[2][3]

Arguably, the first examples of integrated circuits would include the Loewe 3NF.[4] Although far from a monolithic construction, it
certainly meets the definition given above.

Invention
Early developments of the integrated circuit go back to 1949, when German engineer Werner Jacobi (Siemens AG)[5] filed a patent
for an integrated-circuit-like semiconductor amplifying device[6] showing five transistors on a common substrate in a 3-stage
amplifier arrangement. Jacobi disclosed small and cheap hearing aids as typical industrial applications of his patent. An immediate
commercial use of his patent has not been reported.

The idea of the integrated circuit was conceived by Geoffrey Dummer (1909–2002), a radar scientist working for the Royal Radar
Establishment of the British Ministry of Defence. Dummer presented the idea to the public at the Symposium on Progress in Quality
Electronic Components in Washington, D.C. on 7 May 1952.[7] He gave many symposia publicly to propagate his ideas and
unsuccessfully attempted to build such a circuit in 1956.

A precursor idea to the IC was to create small ceramic squares (wafers), each containing a single miniaturized component.
Components could then be integrated and wired into a bidimensional or tridimensional compact grid. This idea, which seemed very
promising in 1957, was proposed to the US Army by Jack Kilby and led to the short-lived Micromodule Program (similar to 1951's
Project Tinkertoy).[8][9][10] However, as the project was gaining momentum, Kilby came up with a new
, revolutionary design:the IC.

Newly employed by Texas Instruments, Kilby recorded his initial ideas concerning the integrated circuit in July 1958, successfully
[11] In his patent application of 6 February 1959,[12] Kilby
demonstrating the first working integrated example on 12 September 1958.
described his new device as "a body of semiconductor material … wherein all the components of the electronic circuit are completely
integrated."[13] The first customer for the new invention was theUS Air Force.[14]

Kilby won the 2000 Nobel Prize in Physics for his part in the invention of the integrated circuit.[15] His work was named an IEEE
Milestone in 2009.[16]
Half a year after Kilby, Robert Noyce at Fairchild Semiconductor developed a new
variety of integrated circuit, more practical than Kilby's implementation. Noyce's
design was made of silicon, whereas Kilby's chip was made of germanium. Noyce
credited Kurt Lehovec of Sprague Electric for the principle of p–n junction isolation,
a key concept behind the IC.[17] This isolation allows each transistor to operate
independently despite being parts of the same piece of silicon.

Fairchild Semiconductor was also home of the first silicon-gate IC technology with
self-aligned gates, the basis of all modern CMOS computer chips. The technology Jack Kilby's original integrated circuit
was developed by Italian physicist Federico Faggin in 1968. In 1970, he joined Intel
in order to develop the first single-chip central processing unit (CPU)
microprocessor, the Intel 4004, for which he received the National Medal of Technology and Innovation in 2010. The 4004 was
designed by Busicom's Masatoshi Shima and Intel's Ted Hoff in 1969, but it was Faggin's improved design in 1970 that made it a
reality.[18]

Advances
Advances in IC technology, primarily smaller features and larger chips, have allowed the number of transistors in an integrated circuit
to double every two years, a trend known as Moore's law. This increased capacity has been used to decrease cost and increase
functionality. In general, as the feature size shrinks, almost every aspect of an IC's operation improves. The cost per transistor and the
switching power consumptionper transistor go down, while the memory capacity and speed go up, through the relationships defined
by Dennard scaling.[19] Because speed, capacity, and power consumption gains are apparent to the end user, there is fierce
competition among the manufacturers to use finer geometries. Over the years, transistor sizes have decreased from 10s of microns in
the early 1970s to 10 nanometers in 2017 [20] with a corresponding million-fold increase in transistors per unit area. As of 2016,
typical chip areas range from a few squaremillimeters to around 600 mm2, with up to 25 milliontransistors per mm2.[21]

The expected shrinking of feature sizes, and the needed progress in related areas was forecast for many years by the International
Technology Roadmap for Semiconductors (ITRS). The final ITRS was issued in 2016, and it is being replaced by the International
Roadmap for Devices and Systems.[22]

Initially, ICs were strictly electronic devices. The success of ICs has led to the integration of other technologies, in the attempt to
obtain the same advantages of small size and low cost. These technologies include mechanical devices, optics, and sensors.

Charge-coupled devices, and the closely relatedactive pixel sensors, are chips that are sensitive to light. They have
largely replaced photographic film in scientific, medical, and consumer applications. Billions of these devices are now
produced each year for applications such as cellphones, tablets, and digital cameras. This sub-field of ICs won the
Nobel prize in 2009.
Very small mechanical devices driven by electricity can be integrated onto chips, a technology known as
microelectromechanical systems. These devices were developed in the late 1980s [23] and are used in a variety of
commercial and military applications. Examples includeDLP projectors, inkjet printers, and accelerometers and
MEMS gyroscopes used to deploy automobileairbags.
Since the early 2000s, the integration of optical functionalityoptical
( computing) into silicon chips has been actively
pursued in both academic research and in industry resulting in the successful commercialization of silicon based
integrated optical transceivers combining optical devices (modulators, detectors, routing) with CMOS based
electronics.[24] Integrated optical circuitsare also being developed.
Integrated circuits are also being developed forsensor applications in medical implants or other bioelectronic
devices.[25] Special sealing techniques have to be applied in such biogenic environments to avoid corrosion or
biodegradation of the exposed semiconductor materials.[26]
As of 2018, the vast majority of all transistors are fabricated in a single layer on one side of a chip of silicon in a flat 2-dimensional
planar process. Researchers have produced prototypes of several promising alternatives, such as:

various approaches to stacking several layers of transistors to make athree-dimensional integrated circuit, such as
through-silicon via, "monolithic 3D",[27] stacked wire bonding,[28] etc.
transistors built from other materials:graphene transistors, molybdenite transistors, carbon nanotube field-effect
transistor, gallium nitride transistor, transistor-like nanowire electronic devices, organic field-effect transistor, etc.
 fabricating transistors over the entire surface of a small sphere of silicon.[29][30]

modifications to the substrate, typically to make flexible

" transistors" for a flexible display or other flexible electronics,
possibly leading to a roll-away computer.

Design
The cost of designing and developing a complex integrated circuit is quite high, normally in the multiple tens of millions of
dollars.[31] This only makes economic sense if production volume is high, so the non-recurring engineering (NRE) costs are spread
across typically millions of production units.

Modern semiconductor chips have billions of components, and are too complex to be designed by hand. Software tools to help the
designer are essential. Electronic Design Automation (EDA), also referred to as Electronic Computer-Aided Design (ECAD),[32] is a
category of software tools for designing electronic systems, including integrated circuits. The tools work together in a design flow
that engineers use to design and analyze entire semiconductor chips.

Types
Integrated circuits can be classified into analog,[33] digital[34] and mixed signal[35]
(both analog and digital on the same chip).

Digital integrated circuits can contain anywhere from one[36] to billions[21] of logic
gates, flip-flops, multiplexers, and other circuits in a few square millimeters. The
small size of these circuits allows high speed, low power dissipation, and reduced
manufacturing cost compared with board-level integration. These digital ICs,
typically microprocessors, DSPs, and microcontrollers, work using boolean algebra A CMOS 4511 IC in a DIP
to process "one" and "zero" signals.

Among the most advanced integrated circuits are the microprocessors or "cores",
which control everything from computers and cellular phones to digital microwave
ovens. Digital memory chips and application-specific integrated circuits (ASICs) are
examples of other families of integrated circuits that are important to the modern
information society.

In the 1980s, programmable logic devices were developed. These devices contain
circuits whose logical function and connectivity can be programmed by the user,
rather than being fixed by the integrated circuit manufacturer. This allows a single
chip to be programmed to implement different LSI-type functions such as logic The die from an Intel 8742, an 8-bit
gates, adders and registers. Current devices called field-programmable gate arrays microcontroller that includes a CPU
(FPGAs) can (as of 2016) implement the equivalent of millions of gates in parallel running at 12 MHz, 128 bytes of
and operate up to 1 GHz.[37] RAM, 2048 bytes of EPROM, and I/O
in the same chip
Analog ICs, such as sensors, power management circuits, and operational amplifiers,
work by processing continuous signals. They perform functions like amplification,
active filtering, demodulation, and mixing. Analog ICs ease the burden on circuit designers by having expertly designed analog
circuits available instead of designing a difficult analog circuit from scratch.

ICs can also combine analog and digital circuits on a single chip to create functions such as A/D converters and D/A converters. Such
mixed-signal circuits offer smaller size and lower cost, but must carefully account for signal interference. Prior to the late 1990s,
radios could not be fabricated in the same low-cost CMOS processes as microprocessors. But since 1998, a large number of radio
chips have been developed using CMOS processes. Examples include Intel's DECT cordless phone, or 802.11 (Wi-Fi) chips created
by Atheros and other companies.[38]

Modern electronic component distributorsoften further sub-categorize the huge variety of integrated circuits now available:
 Digital ICs are further sub-categorized as logic ICs,memory chips, interface ICs (level shifters, serializer/deserializer,
etc.), Power Management ICs, and programmable devices.
Analog ICs are further sub-categorized as linear ICs and RF ICs.
mixed-signal integrated circuitsare further sub-categorized as data acquisition ICs (including A/D converters, D/A
converter, digital potentiometers) and clock/timing ICs.

Manufacturing

Fabrication
The semiconductors of the periodic table of the chemical elements were identified as
the most likely materials for a solid-state vacuum tube. Starting with copper oxide,
proceeding to germanium, then silicon, the materials were systematically studied in
the 1940s and 1950s. Today, monocrystalline silicon is the main substrate used for
ICs although some III-V compounds of the periodic table such as gallium arsenide
are used for specialized applications like LEDs, lasers, solar cells and the highest-
speed integrated circuits. It took decades to perfect methods of creating crystals
without defects in thecrystalline structure of the semiconducting material.

Semiconductor ICs are fabricated in a planar process which includes three key
process steps – imaging, deposition and etching. The main process steps are
supplemented by doping and cleaning.
Rendering of a small standard cell
Mono-crystal silicon wafers (or for special applications, silicon on sapphire or with three metal layers (dielectric has
been removed). The sand-colored
gallium arsenide wafers) are used as the substrate. Photolithography is used to mark
structures are metal interconnect,
different areas of the substrate to be doped or to have polysilicon, insulators or metal with the vertical pillars being
(typically aluminium or copper) tracks deposited on them. contacts, typically plugs of tungsten.
The reddish structures are polysilicon
Integrated circuits are composed of many overlapping layers, each gates, and the solid at the bottom is
defined by photolithography, and normally shown in different colors.
Some layers mark where various dopants are dif fused into the substrate the crystalline silicon bulk.
(called diffusion layers), some define where additional ions are
implanted (implant layers), some define the conductors (polysilicon or
metal layers), and some define the connections between the conducting layers (via or contact layers). All
components are constructed from a specific combination of these layers.
In a self-aligned CMOS process, a transistor is formed wherever the gate layer (polysilicon or metal) crosses a
diffusion layer.
Capacitive structures, in form very much like the parallel conducting plates of a traditional electrical capacitor
, are
formed according to the area of the "plates", with insulating material between the plates. Capacitors of a wide range
of sizes are common on ICs.
Meandering stripes of varying lengths are sometimes used to form on-chip resistors, though most logic circuits do
not need any resistors. The ratio of the length of the resistive structure to its width, combined with its sheet resistivity
,
determines the resistance.
More rarely, inductive structures can be built as tiny on-chip coils, or simulated bygyrators.
Since a CMOS device only draws current on the transition between logic states, CMOS devices consume much less current than
bipolar devices.

A random-access memory is the most regular type of integrated circuit; the highest density devices are thus memories; but even a
microprocessor will have memory on the chip. (See the regular array structure at the bottom of the first image.) Although the
structures are intricate – with widths which have been shrinking for decades – the layers remain much thinner than the device widths.
The layers of material are fabricated much like a photographic process, although light
waves in the visible spectrum cannot be used to
"expose" a layer of material, as they would be too large for the features. Thus photons of higher frequencies (typically ultraviolet) are
used to create the patterns for each layer. Because each feature is so small, electron microscopes are essential tools for a process
engineer who might bedebugging a fabrication process.
Each device is tested before packaging using automated test equipment (ATE), in a
process known as wafer testing, or wafer probing. The wafer is then cut into
rectangular blocks, each of which is called a die. Each good die (plural dice, dies, or
die) is then connected into a package using aluminium (or gold) bond wires which
are thermosonically bonded[39] to pads, usually found around the edge of the die. .
Thermosonic bonding was first introduced by A. Coucoulas which provided a
reliable means of forming these vital electrical connections to the outside world.
After packaging, the devices go through final testing on the same or similar ATE
used during wafer probing. Industrial CT scanning can also be used. Test cost can
account for over 25% of the cost of fabrication on lower-cost products, but can be
negligible on low-yielding, larger, or higher-cost devices.

As of 2016, a fabrication facility (commonly known as a semiconductor fab) can

cost over US$8 billion to construct.[40] The cost of a fabrication facility rises over
time (Rock's law) because of increased complexity of new products. Today, the most
advanced processes employ the following techniques:

The wafers are up to 300 mm in diameter (wider than a common dinner Schematic structure of a CMOS chip,
plate). as built in the early 2000s. The
As of 2016, a state of the art foundry can produce 14 nm transistors, as graphic shows LDD-MISFET's on an
implemented by Intel, TSMC, Samsung, and Global Foundries. The next SOI substrate with five metallization
step, to 10 nm devices, is expected in 2017.[41] layers and solder bump for flip-chip
Copper interconnects where copper wiring replaces aluminium for bonding. It also shows the section for
interconnects. FEOL (front-end of line), BEOL
Low-K dielectric insulators. (back-end of line) and first parts of
Silicon on insulator (SOI). back-end process.
Strained silicon in a process used by IBM known as strained silicon
directly on insulator (SSDOI).
Multigate devices such as tri-gate transistors being manufactured byIntel from 2011 in their 22 nm process.

Packaging
The earliest integrated circuits were packaged in ceramicflat packs, which continued
to be used by the military for their reliability and small size for many years.
Commercial circuit packaging quickly moved to the dual in-line package (DIP), first
in ceramic and later in plastic. In the 1980s pin counts of VLSI circuits exceeded the
practical limit for DIP packaging, leading to pin grid array (PGA) and leadless chip
carrier (LCC) packages. Surface mount packaging appeared in the early 1980s and
became popular in the late 1980s, using finer lead pitch with leads formed as either
gull-wing or J-lead, as exemplified by the small-outline integrated circuit (SOIC)
package – a carrier which occupies an area about 30–50% less than an equivalent
A Soviet MSI nMOS chip made in
DIP and is typically 70% thinner. This package has "gull wing" leads protruding 1977, part of a four-chip calculator
from the two long sides and a lead spacing of 0.050 inches. set designed in 1970[42]

In the late 1990s, plastic quad flat pack (PQFP) and thin small-outline package
(TSOP) packages became the most common for high pin count devices, though PGA packages are still used for high-end
microprocessors.

Ball grid array (BGA) packages have existed since the 1970s. Flip-chip Ball Grid Array packages, which allow for much higher pin
count than other package types, were developed in the 1990s. In an FCBGA package the die is mounted upside-down (flipped) and
connects to the package balls via a package substrate that is similar to a printed-circuit board rather than by wires. FCBGA packages
allow an array of input-output signals (called Area-I/O) to be distributed over the entire die rather than being confined to the die
periphery. BGA devices have the advantage of not needing a dedicated socket, but are much harder to replace in case of device
failure.

Intel transitioned away from PGA toLand Grid Array (LGA) and BGA beginning in 2004, with the last PGA socket released in 2014
for mobile platforms. AMD as of 2018 uses PGA packages on mainstream desktop processors[43] , BGA packages on mobile
processors[44] , and high-end desktop and server microprocessors use LGA packages
[45] .

Traces going out of the die, through the package, and into the printed circuit board have very different electrical properties, compared
to on-chip signals. They require special design techniques and need much more electric power than signals confined to the chip itself.

When multiple dies are put in one package, the result is a System in Package, or SiP. A multi-chip module, or MCM, is created by
combining multiple dies on a small substrate often made of ceramic. The distinction between a big MCM and a small printed circuit
board is sometimes fuzzy.

Chip labeling and manufacture date

Most integrated circuits are large enough to include identifying information. Four common sections are the manufacturer's name or
logo, the part number, a part production batch number and serial number, and a four-digit date-code to identify when the chip was
manufactured. Extremely small surface mount technology parts often bear only a number used in a manufacturer's lookup table to
find the chip characteristics.

The manufacturing date is commonly represented as a two-digit year followed by a two-digit week code, such that a part bearing the
code 8341 was manufactured in week 41 of 1983, or approximately in October 1983.

Intellectual property
The possibility of copying by photographing each layer of an integrated circuit and preparing photomasks for its production on the
basis of the photographs obtained is a reason for the introduction of legislation for the protection of layout-designs. The
Semiconductor Chip Protection Act of 1984 established intellectual property protection for photomasks used to produce integrated
circuits.[46]

A diplomatic conference was held at Washington, D.C., in 1989, which adopted a Treaty on Intellectual Property in Respect of
Integrated Circuits (IPIC Treaty).

The Treaty on Intellectual Property in respect of Integrated Circuits, also called Washington Treaty or IPIC Treaty (signed at
TRIPS agreement.[47]
Washington on 26 May 1989) is currently not in force, but was partially integrated into the

National laws protecting IC layout designs have been adopted in a number of countries, including Japan,[48] the EC,[49] the UK,
Australia, and Korea.[50]

Other developments
Future developments seem to follow the multi-core multi-microprocessor paradigm, already used by Intel and AMD multi-core
processors. Rapport Inc. and IBM started shipping the KC256 in 2006, a 256-core microprocessor. Intel, as recently as February–
August 2011, unveiled a prototype, "not for commercial sale" chip that bears 80 cores. Each core is capable of handling its own task
independently of the others. This is in response to heat-versus-speed limit, that is about to be reached using existing transistor
technology (see: thermal design power). This design provides a new challenge to chip programming.Parallel programming languages
[51]
such as the open-sourceX10 programming language are designed to assist with this task.

Generations
In the early days of simple integrated circuits, the technology's large scale limited each chip to only a few transistors, and the low
degree of integration meant the design process was relatively simple. Manufacturing yields were also quite low by today's standards.
As the technology progressed, millions, then billions[52] of transistors could be placed on one chip, and good designs required
thorough planning, giving rise to the field ofElectronic Design Automation, or EDA.

Name Signification Year Transistors number[53] Logic gates number[54]

SSI small-scale integration 1964 1 to 10 1 to 12
MSI medium-scale integration 1968 10 to 500 13 to 99
LSI large-scale integration 1971 500 to 20 000 100 to 9999
VLSI very large-scale integration 1980 20 000 to 1 000 000 10 000 to 99 999
ULSI ultra-large-scale integration 1984 1 000 000 and more 100 000 and more

SSI, MSI and LSI

The first integrated circuits contained only a few transistors. Early digital circuits containing tens of transistors provided a few logic
gates, and early linear ICs such as the Plessey SL201 or the Philips TAA320 had as few as two transistors. The number of transistors
in an integrated circuit has increased dramatically since then. The term "large scale integration" (LSI) was first used by IBM scientist
Rolf Landauer when describing the theoretical concept; that term gave rise to the terms "small-scale integration" (SSI), "medium-
scale integration" (MSI), "very-large-scale integration" (VLSI), and "ultra-large-scale integration" (ULSI). The early integrated
circuits were SSI.

SSI circuits were crucial to early aerospace projects, and aerospace projects helped inspire development of the technology. Both the
Minuteman missile and Apollo program needed lightweight digital computers for their inertial guidance systems. Although the
Apollo guidance computerled and motivated integrated-circuit technology,[55] it was the Minuteman missile that forced it into mass-
production. The Minuteman missile program and various other Navy programs accounted for the total $4 million integrated circuit
market in 1962, and by 1968, U.S. Government space and defense spending still accounted for 37% of the $312 million total
production.

The demand by the U.S. Government supported the nascent integrated circuit market until costs fell enough to allow IC firms to
penetrate first the industrial and eventually the consumer markets. The average price per integrated circuit dropped from $50.00 in
1962 to $2.33 in 1968.[56] Integrated circuits began to appear in consumer products by the turn of the decade, a typical application
being FM inter-carrier sound processing in television receivers.

The first MOS chips were small-scale integration chips forNASA satellites.[57]

The next step in the development of integrated circuits, taken in the late 1960s, introduced devices which contained hundreds of
transistors on each chip, called "medium-scale integration" (MSI).

In 1964, Frank Wanlass demonstrated a single-chip 16-bit shift register he designed, with an incredible (at the time) 120 transistors
on a single chip.[57][58]

MSI devices were attractive economically because while they cost a little more to produce than SSI devices, they allowed more
complex systems to be produced using smaller circuit boards, less assembly work (because of fewer separate components), and a
number of other advantages.

Further development, driven by the same economic factors, led to "large-scale integration" (LSI) in the mid-1970s, with tens of
thousands of transistors per chip.

The masks used to process and manufacture SSI, MSI and early LSI and VLSI devices (such as the microprocessors of the early
1970s) were mostly created by hand, often using Rubylith-tape or similar.[59] For large or complex ICs (such as memories or
processors), this was often done by specially hired layout people under supervision of a team of engineers, who would also, along
with the circuit designers, inspect and verify the correctness and completeness of each mask. However, modern VLSI devices contain
so many transistors, layers, interconnections, and other features that it is no longer feasible to check the masks or do the original
[60]
design by hand. The engineer depends on computer programs and other hardware aids to do most of this work.

Integrated circuits such as 1K-bit RAMs, calculator chips, and the first microprocessors, that began to be manufactured in moderate
quantities in the early 1970s, had under 4,000 transistors. True LSI circuits, approaching 10,000 transistors, began to be produced
around 1974, for computer main memories and second-generation microprocessors.

Some SSI and MSI chips, likediscrete transistors, are still mass-produced, both to maintain old equipment and build new devices that
require only a few gates. The7400 series of TTL chips, for example, has become ade facto standard and remains in production.

VLSI
The final step in the development process, starting in the 1980s and continuing
through the present, was "very-large-scale integration" (VLSI). The development
started with hundreds of thousands of transistors in the early 1980s, and continues
beyond ten billion transistors as of 2016.

Multiple developments were required to achieve this increased density.

Manufacturers moved to smaller design rules and cleaner fabrication facilities, so
that they could make chips with more transistors and maintain adequate yield. The
path of process improvements was summarized by the International Technology
Roadmap for Semiconductors (ITRS), which has since been succeeded by the
International Roadmap for Devices and Systems (IRDS). Design tools improved
enough to make it practical to finish these designs in a reasonable time. The more Upper interconnect layers on anIntel
energy-efficient CMOS replaced NMOS and PMOS, avoiding a prohibitive increase 80486DX2 microprocessor die
in power consumption.

In 1986 the first one-megabitRAM chips were introduced, containing more than one million transistors. Microprocessor chips passed
the million-transistor mark in 1989 and the billion-transistor mark in 2005.[61] The trend continues largely unabated, with chips
[62]
introduced in 2007 containing tens of billions of memory transistors.

ULSI, WSI, SOC and 3D-IC

To reflect further growth of the complexity, the term ULSI that stands for "ultra-large-scale integration" was proposed for chips of
more than 1 million transistors.[63]

Wafer-scale integration (WSI) is a means of building very large integrated circuits that uses an entire silicon wafer to produce a single
"super-chip". Through a combination of large size and reduced packaging, WSI could lead to dramatically reduced costs for some
systems, notably massively parallel supercomputers. The name is taken from the term Very-Large-Scale Integration, the current state
of the art when WSI was being developed.[64]

A system-on-a-chip (SoC or SOC) is an integrated circuit in which all the components needed for a computer or other system are
included on a single chip. The design of such a device can be complex and costly, and building disparate components on a single
piece of silicon may compromise the efficiency of some elements. However, these drawbacks are offset by lower manufacturing and
assembly costs and by a greatly reduced power budget: because signals among the components are kept on-die, much less power is
required (see Packaging).[65]

A three-dimensional integrated circuit (3D-IC) has two or more layers of active electronic components that are integrated both
vertically and horizontally into a single circuit. Communication between layers uses on-die signaling, so power consumption is much
lower than in equivalent separate circuits. Judicious use of short vertical wires can substantially reduce overall wire length for faster
operation.[66]
Silicon labelling and graffiti
To allow identification during production most silicon chips will have a serial number in one corner. It is also common to add the
manufacturer's logo. Ever since ICs were created, some chip designers have used the silicon surface area for surreptitious, non-
functional images or words. These are sometimes referred to aschip art, silicon art, silicon graffiti or silicon doodling.

ICs and IC families

The 555 timer IC
The 741 operational amplifier
7400 series TTL logic building blocks
4000 series, the CMOS counterpart to the 7400 series (see also:74HC00 series)
Intel 4004, the world's first microprocessor, which led to the famous8080 CPU and then the IBM PC's 8088, 80286,
486 etc.
The MOS Technology 6502 and Zilog Z80 microprocessors, used in manyhome computers of the early 1980s
The Motorola 6800 series of computer-related chips, leading to the68000 and 88000 series (used in some Apple
computers and in the 1980s CommodoreAmiga series)
The LM-series of analog integrated circuits

See also
Integrated circuit development
Integrated injection logic
Ion implantation
Monolithic microwave integrated circuit
Multi-threshold CMOS
Photonic integrated circuit
Silicon-germanium
Sound chip
SPICE

References
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Further reading
Veendrick, H. J. M. (2017).Nanometer CMOS ICs, from Basics to ASICs. Springer. ISBN 978-3-319-47595-0.
Baker, R. J. (2010). CMOS: Circuit Design, Layout, and Simulation(3rd ed.). Wiley-IEEE.ISBN 978-0-470-88132-3.
Marsh, Stephen P. (2006). Practical MMIC design. Artech House. ISBN 978-1-59693-036-0.
Camenzind, Hans (2005).Designing Analog Chips(PDF). Virtual Bookworm. ISBN 978-1589397187. Archived from
the original (PDF) on June 12, 2017. "Hans Camenzind invented the 555 timer"
Hodges, David; Jackson, Horace; Saleh, Resve (2003).Analysis and Design of Digital Integrated Circuits . McGraw-
Hill. ISBN 978-0-07-228365-5.
Rabaey, J. M.; Chandrakasan, A.; Nikolic, B.(2003). Digital Integrated Circuits(2nd ed.). Pearson. ISBN 0-13-
090996-3.
Mead, Carver; Conway, Lynn (1980). Introduction to VLSI systems. Addison Wesley Publishing Company. ISBN 978-
0-201-04358-7.

External links
General
 The first monolithic integrated circuits
A large chart listing ICs by generic numberincluding access to most of the datasheets for the parts.
The History of the Integrated Circuitat Nobelprize.org
Patents

US3,138,743 – Miniaturized electronic circuit –J. S. Kilby

US3,138,747 – Integrated semiconductor circuit device – R. .FStewart
US3,261,081 – Method of making miniaturized electronic circuits – J. S. Kilby
US3,434,015 – Capacitor for miniaturized electronic circuits or the like – J. S. Kilby
Integrated circuit die manufacturing

IC Die Photography – A gallery of IC die photographs

Zeptobars – Yet another gallery of IC die photographs
Silicon Chip Wafer Fab Mailbag on YouTube – A look at some equipment and wafers used in the manufacturing of
silicon chip wafers

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