KX Tgd210ag1 PDF

ORDER NO.
KM41410868CE
Telephone Equipment
Caller ID Compatible Model No. KX-TGD210AG1
KX-TGD212AG1
KX-TGDA20AG1
Digital Cordless Phone
B: Black Version
(for Argentina)
KX-TGDA20 KX-TGD210
(Handset) (Base Unit)
(Charger Unit)
Configuration for each model

Model No Base Unit Handset Charger Unit
KX-TGD210 1 (TGD210) 1 (TGDA20)
KX-TGD212 1 (TGD210) 2 (TGDA20) 1
KX-TGDA20 1 (TGDA20) 1
© Panasonic System Networks Co., Ltd. 2014

Unauthorized copying and distribution is a violation
of law.
KX-TGD210AG1/KX-TGD212AG1/KX-TGDA20AG1
WARNING
This service information is designed for experienced repair technicians only and is not designed for use by the general
public. It does not contain warnings or cautions to advise non-technical individuals of potential dangers in attempting
to service a product. Products powered by electricity should be serviced or repaired only by experienced professional
technicians. Any attempt to service or repair the product or products dealt with in this service information by anyone
else could result in serious injury or death.
IMPORTANT SAFETY NOTICE

There are special components used in this equipment which are important for safety. These parts are marked by
in the Schematic Diagrams, Circuit Board Diagrams, Exploded Views and Replacement Parts List. It is essential that
these critical parts should be replaced with manufacturer’s specified parts to prevent shock, fire or other hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING

If lead free solder was used in the manufacture of this product, the printed circuit boards will be marked PbF.
Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.
When this mark does appear, please read and follow the special instructions described in this manual on the
use of PbF and how it might be permissible to use Pb solder during service and repair work.
L When you note the serial number, write down all 11 digits. The serial number may be found on the bottom of the unit.
L The illustrations in this Service Manual may vary slightly from the actual product.
2
TABLE OF CONTENTS
PAGE PAGE
1 Safety Precautions----------------------------------------------- 4 11.1.3. Charger Unit ------------------------------------------ 42
1.1. For Service Technicians --------------------------------- 4 11.2. How to Replace the Handset LCD------------------- 43
2 Warning -------------------------------------------------------------- 4 12 Measurements and Adjustments -------------------------- 44
2.1. Battery Caution--------------------------------------------- 4 12.1. Equipment Required ------------------------------------ 44
2.2. About Lead Free Solder (PbF: Pb free)-------------- 4 12.2. The Setting Method of JIG----------------------------- 44
2.2.1. Suggested PbF Solder ------------------------------ 5 12.2.1. Connections (Base Unit) -------------------------- 44
2.3. Discarding of P. C. Board-------------------------------- 5 12.2.2. Connections (Handset) ---------------------------- 45
3 Specifications ----------------------------------------------------- 6 12.2.3. How to install Batch file into P.C. ---------------- 46
4 Technical Descriptions ----------------------------------------- 7 12.2.4. Commands-------------------------------------------- 46
4.1. US-DECT Description ------------------------------------ 7 12.3. Adjustment Standard (Base Unit) -------------------- 47
4.1.1. TDD Frame Format ---------------------------------- 7 12.3.1. Bottom View ------------------------------------------ 47
4.1.2. TDMA system------------------------------------------ 7 12.4. Adjustment Standard (Handset) ---------------------- 48
4.1.3. Signal Flowchart in the Radio Parts-------------- 8 12.4.1. Component View ------------------------------------ 48
4.2. Block Diagram (Base Unit_Main)---------------------- 9 12.5. Things to Do after Replacing IC or X'tal ------------ 49
4.3. Block Diagram (Base Unit_RF Part) -----------------10 12.5.1. How to download the data ------------------------ 49
4.4. Circuit Operation (Base Unit) -------------------------- 11 12.6. Frequency Table------------------------------------------ 51
4.4.1. BBIC (Base Band IC: IC501) --------------------- 11 13 Miscellaneous---------------------------------------------------- 52
4.4.2. EEPROM (IC611) ------------------------------------ 11 13.1. How to Replace the Flat Package IC --------------- 52
4.4.3. Power Supply Circuit/Reset Circuit--------------12 13.1.1. Preparation-------------------------------------------- 52
4.4.4. Telephone Line Interface---------------------------14 13.1.2. How to Remove the IC ----------------------------- 52
4.4.5. Parallel Connection Detect Circuit/Auto 13.1.3. How to Install the IC -------------------------------- 53
Disconnect Circuit -----------------------------------15 13.1.4. How to Remove a Solder Bridge ---------------- 53
4.4.6. Calling Line Identification (Caller ID)/Call 13.2. Terminal Guide of the ICs, Transistors and
Waiting Caller ID -------------------------------------16 Diodes ------------------------------------------------------ 54
4.5. Block Diagram (Handset)-------------------------------18 13.2.1. Base Unit ---------------------------------------------- 54
4.6. Circuit Operation (Handset)----------------------------19 13.2.2. Handset ------------------------------------------------ 54
4.6.1. Outline --------------------------------------------------19 14 Schematic Diagram -------------------------------------------- 55
4.6.2. Power Supply Circuit/Reset Circuit--------------19 14.1. For Schematic Diagram -------------------------------- 55
4.6.3. Charge Circuit ----------------------------------------19 14.1.1. Base Unit (Base Unit (Main)) --------------------- 55
4.6.4. Battery Low/Power Down Detector--------------19 14.1.2. Handset (Handset (Main)) ------------------------ 55
4.6.5. Speakerphone ----------------------------------------19 14.2. Base Unit (Main) ----------------------------------------- 56
4.7. Signal Route -----------------------------------------------20 14.2.1. KX-TGD210------------------------------------------- 56
5 Location of Controls and Components ------------------22 14.3. Handset (Main) ------------------------------------------- 58
6 Installation Instructions ---------------------------------------22 15 Printed Circuit Board ------------------------------------------ 61
7 Operating Instructions-----------------------------------------22 15.1. Base Unit (Main) ----------------------------------------- 61
8 Test Mode ----------------------------------------------------------23 15.1.1. Component View ------------------------------------ 61
8.1. Engineering Mode ----------------------------------------23 15.1.2. Bottom View ------------------------------------------ 62
8.1.1. Base Unit ----------------------------------------------23 15.2. Handset----------------------------------------------------- 63
8.1.2. Handset ------------------------------------------------25 15.2.1. Component View ------------------------------------ 63
9 Service Mode -----------------------------------------------------27 15.2.2. Bottom View ------------------------------------------ 64
9.1. How to Clear User Setting (Handset Only)---------27 16 Exploded View and Replacement Parts List ----------- 65
10 Troubleshooting Guide ----------------------------------------28 16.1. Cabinet and Electrical Parts (Base Unit) ----------- 65
10.1. Troubleshooting Flowchart -----------------------------28 16.1.1. KX-TGD210------------------------------------------- 65
10.1.1. Check Power------------------------------------------29 16.2. Cabinet and Electrical Parts (Handset)------------- 66
10.1.2. Check Record ----------------------------------------30 16.3. Cabinet and Electrical Parts (Charger Unit) ------- 67
10.1.3. Check Playback -------------------------------------31 16.4. Accessories and Packing Materials ----------------- 68
10.1.4. Check Battery Charge ------------------------------31 16.4.1. KX-TGD210AG1------------------------------------- 68
10.1.5. Check Link---------------------------------------------32 16.4.2. KX-TGD212AG1------------------------------------- 69
10.1.6. Check the RF part -----------------------------------34 16.5. Replacement Parts List--------------------------------- 70
10.1.7. Registering a Handset to the Base Unit--------38 16.5.1. Base Unit ---------------------------------------------- 70
10.1.8. Deregistering a Handset ---------------------------38 16.5.2. Handset ------------------------------------------------ 71
10.1.9. Check Handset Transmission --------------------39 16.5.3. Charger Unit ------------------------------------------ 72
10.1.10. Check Handset Reception-------------------------39 16.5.4. Accessories and Packing Materials ------------ 72
10.1.11. Check Caller ID --------------------------------------39 16.5.5. Screws ------------------------------------------------- 72
11 Disassembly and Assembly Instructions ---------------40 16.5.6. Fixtures and Tools----------------------------------- 72
11.1. Disassembly Instructions -------------------------------40
11.1.1. Base Unit ----------------------------------------------40
11.1.2. Handset ------------------------------------------------41
3
1 Safety Precautions
1.1. For Service Technicians
• Repair service shall be provided in accordance with repair technology information such as service manual so as to
prevent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
• ICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2 Warning
2.1. Battery Caution
1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacture’s Instructions.
2.2. About Lead Free Solder (PbF: Pb free)

Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50 °F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700 °F ± 20 °F (370 °C ± 10 °C).
• Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 °F (600 °C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
Component Component
pin
Remove all of the
excess solder
Solder
(Slice View)
4
2.2.1. Suggested PbF Solder

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer's specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
0.3 mm X 100 g 0.6 mm X 100 g 1.0 mm X 100 g
2.3. Discarding of P. C. Board

When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.
5
3 Specifications
N Standard: N Bit rate:
DECT 6.0 (Digital Enhanced Cordless 1,152 kbit/s
Telecommunications 6.0) N Modulation:
N Number of channels: GFSK (Gaussian Frequency Shift Keying)
60 Duplex Channels
N RF transmission power:
N Frequency range:
1.91 GHz to 1.93 GHz 115 mW (max.)
N Duplex procedure: N Voice coding:
TDMA (Time Division Multiple Access) ADPCM 32 kbit/s
N Channel spacing:
1,728 kHz
Base Unit Handset Charger
Power source AC Adaptor Rechargeable Ni-MH battery AC Adaptor
(PNLV226AG0Z, 220–240 V AC, AAA (R03) size (1.2 V 400 mAh) (PNLV233AGAZ, 220–240 V AC,
50/60 Hz) 50/60 Hz)
Receiving Method Super Heterodyne Super Heterodyne
Oscillation Method PLL synthesizer PLL synthesizer
Detecting Method Quadrature Discriminator Quadrature Discriminator
Tolerance of OSC Frequency 13.824 MHz ±100 Hz 10.368 MHz ±100 Hz
Modulation Method Frequency Modulation Frequency Modulation
ID Code 40 bit 40 bit
Ringer Equivalence No. (REN) 0.1B
Dialing Mode Tone (DTMF)/Pulse
Redial Up to 48 digits
Speed Dialer Up to 32 digits (Phonebook)
Power Consumption Standby: Approx. 0.6 W (*1) 6 days at Standby, Standby: Approx. 0.1 W,
Maximum: Approx. 3.2 W (*1) 10 hours at Talk Maximum: Approx. 1.8 W
Operating Conditions 0 °C - 40 °C (32 °F – 104 °F) 0 °C - 40 °C (32 °F – 104 °F) 0 °C - 40 °C (32 °F – 104 °F)
20 % – 80 % relative air humidity 20 % – 80 % relative air humidity 20 % – 80 % relative air humidity
(dry) (dry) (dry)
Dimensions (W x D x H) Approx. 143 mm x 103 mm x 48 mm(*1) Approx. 48 mm x 30 mm x 168 mm Approx. 72 mm x 72 mm x 45 mm
Approx. 143 mm x 103 mm x 48 mm(*2)
Mass (Weight) Approx. 140 g (*1) Approx. 130 g Approx. 100 g
Approx. 170 g (*2)
Note for Service:

• Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.
• Analog telephone connection: Telephone Line
6
4 Technical Descriptions
4.1. US-DECT Description
The frequency range of 1.92 GHz-1.93 GHz is used. Transmitting and receiving carrier between base unit and handset is same
frequency. Refer to Frequency Table (P.51).
4.1.1. TDD Frame Format

5 ms 5 ms
Up Link ( Handset -> Base Unit ) Down Link ( Base Unit -> Handset )
RX1 RX2 RX3 RX4 RX5 RX6 TX1 TX2 TX3 TX4 TX5 TX6
DATA rate : 1.152 Mbps

417 µs (available) 417 µs (blind)
4.1.2. TDMA system

This system is the cycles of 10 ms, and has 6 duplex paths, but maximum duplex communication path is 5 because of dummy
bearer use.
In 1 slot 417 μs, the 10 ms of voice data is transmitted.
• 2 - Handsets Link
Traffic Bearer Dummy bearer
Base unit RX1 RX2 RX3 RX4 RX5 RX6 TX1 TX2 TX3 TX4 TX5 TX6
Handset 1
(Stand by)
Handset 2 TX RX
(Link)
Handset 3 TX RX
(Link)
Traffic Bearer
A link is established between base unit and handset.
The state where duplex communication is performed.
Handset doesn't make up duplex in no free RF channels because of interference. (*1)
Dummy Bearer
Base unit sends Dummy-data to the all stand-by state handsets.
Handsets receive that data for synchronization and monitoring request from the base unit.
Base unit doesn't send Dummy bearer in no free RF channels because of interference. (*1)
Note:
(*1) It is a feature under FCC 15 regulation and for interference avoidance.
In the case of checking RF parts, it is better in least interference condition.
7
4.1.3. Signal Flowchart in the Radio Parts

Reception
A voice signal from TEL line is encoded to digital data "TXDATA" by BBIC (IC501) in a base unit.
Then TXDATA goes to RF PART and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a selected antenna.
As for a handset RF, RF signal is received in one antenna.

BBIC down-converts to 864 kHz IF signal from RX signal and demodulates it to digital data "RXDATA".
BBIC (IC1) converts RXDATA into a voice signal and outputs it to speaker.
Transmission
A voice signal from microphone is encoded to digital data "TXDATA" by BBIC (IC1) in a handset.
Then TXDATA goes to RF PART, and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a antenna.
As for a base unit RF, RF signal is received in two antennas.

BBIC (IC501) compares RF signal levels and selects the antenna to be used. Then BBIC down-converts to 864 kHz IF signal
from RX signal in the selected antenna, and demodulates it to digital data "RXDATA".
BBIC (IC501) converts RXDATA into a voice signal and outputs it to TEL line.
8
4.2.
Operational P.C. Board
Q141
RLY
KEYS Q161 R151,R152 R131, R133 D101

L1T
SIDE TONE INUSE INUSE
CIRCUIT DETECT 2 DETECT 1 L1R
ANT1 TEL JACK

X501
13.824 MHz
Q171
SP
RECEIVE DCP
AMP
DCM
Q111
DC JACK
3
LOUT BELL
LIN DETECT
HOOK
RF_PART DCIN 2
SPOUTP
SPOUTN
ANS_LED
KEY 1
MSG_LED
DCIN 1
KEY C, D, E
BELL
HSMIP
RXp HSMIN
RXn IC302
IC501 VBAT 3.0 V
VCCPA
TXp BBIC VBAT_APU REGULATOR
Block Diagram (Base Unit_Main)
TXn VCC_IF
9
VCC_FE
VCC_VCO
RSTN RESET
DOUBOUT 3.0V
SCL, SDA
WP
STM/CKM
DL,CS
VCCA
CLK,DO
IC601 IC611 R371
VCC R372
FLASH EEPROM
VBAT MEMORY MEMORY
CHARGE_CONTACT
VDD +
KX-TGD210/212 BLOCK DIAGRAM (Base Unit_Main)

4.3. Block Diagram (Base Unit_RF Part)

TXp
TXn
ANT1
RXp
RXn
KX-TGD210/212 BLOCK DIAGRAM (Base Unit_RF Part)
10
4.4. Circuit Operation (Base Unit)

General Description:
(BBIC, Flash Memory, EERROM) is a digital speech/signal processing system that implements all the functions of speech
compression, record and playback, and memory management required in a digital telephone answering machine.
The BBIC system is fully controlled by a host processor. The host processor provides activation and control of all that functions
as follows.
TDD & TDMA ADPCM

Digital
with FHSS
Speech Analog TEL
Processor ADPCM Processor Front Line
RF part End Interface
&
Host CPU
Caller ID
Modem Multi-
plexer
BBIC (IC501)
Digital TAM System *1
EEPROM IC611
4.4.1. BBIC (Base Band IC: IC501)

• Voice Message Recording/Play back
The BBIC system uses a proprietary speech compression technique to record and store voice message in Flash Memory.
An error correction algorithm is used to enable playback of these messages from the Flash Memory.
• DTMF Generator
When the DTMF data from the handset is received, the DTMF signal is output.
• Synthesized Voice (Pre-recorded message)
The BBIC implements synthesized Voice, utilizing the built in speech detector and a Flash Memory, which stored the vocabulary.
• Caller ID demodulation
The BBIC implements monitor and demodulate the FSK/DTMF signals that provide CID information from the Central Office.
• Digital Switching
The voice signal from telephone line is transmitted to the handset or the voice signal from the handset is transmitted to the
Telephone line, etc. They are determined by the signal path route operation of voice signal.
• Block Interface Circuit
RF part, LED, Key scan, Speaker, Telephone line.
4.4.2. EEPROM (IC611)

Following information data is stored.
• Settings
ex: message numbers, ID code, Flash Time, Tone/Pulse
11
4.4.3. Power Supply Circuit/Reset Circuit

The power supply voltage from AC adaptor is converted to VBAT (3.0V) in IC302. And +3.0V for peripherals and analog part is
insulated from VBAT by Doubler of BBIC.
Circuit Operation:
VBAT +3.0V
IC302 VBAT IC501 IC601

5.5V pin 15
pin 10
3.0V FLASH
AC Adaptor RSTN(Reset) DOUBLER OUT
REGULATOR For peripherals
pin 54 BBIC
STM/CKM
IC611
VDDC (1.2V)
pin 57
pin 9 EEPROM
RF Part
Receive
Amp.
ANS LED
MSG LED
VBAT
VDDC (1.2 V)
Reset (RSTN)
(IC501_54 pin)
Startmonitor
(IC501 57pin)
(CKM/STM)
BBIC chip initialize
12
4.4.3.1. Charge Circuit

The voltage from the AC adaptor is supplied to the charge circuits.
R371
+5.5V
R372
F301 DCP
D362
DCM
CHARGE+
D361
C351
( )
CHARGE-
13
4.4.4. Telephone Line Interface

Telephone Line Interface Circuit:
Function
• Bell signal detection
• ON/OFF hook and pulse dial circuit
• Side tone circuit
Bell signal detection and OFF HOOK circuit:
In the idle mode, Q141 is open to cut the DC loop current and decrease the ring load. When ring voltage appears at the Tip (T)
and Ring (R) leads (When the telephone rings), the AC ring voltage is transferred as follows:
T → R111 → C111 → Q111 → BBIC pin 5 [BELL]
When the CPU (BBIC) detects a ring signal, Q141 turns on, thus providing an off-hook condition (active DC current flow through
the circuit). Following signal flow is the DC current flow.
T → D101 → Q141 → Q161 → R163 → D101 → P101 → R
ON HOOK Circuit:
Q141 is open, Q141 is connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an on-
hook condition.
Pulse Dial Circuit:
Pin 6 of BBIC turns Q141 ON/OFF to make the pulse dialing.
Side Tone Circuit:
Basically this circuit prevents the TX signal from feeding back to RX signal. As for this unit, TX signal feed back from Q161 is
canceled by the canceller circuit of BBIC.
+3.0V
R160 *Q141
820
R176
R168
4.7k
*R162
47k
NC
27k
1k
Q161
C161
R141
10u
C
B
10M
C164
R165
E
1000p
C167
100k
C176 1u
C142 K0.01u
R175
3.9k
25V
C163 NC
R142
2.7k
R131
*D143
R172 C173 R177 R164 R161

*D142
680k
NC
0.1u 1k 2.7k 100k

C175 C101 680p
0.022u
C171
560p R151
100k Q142 D101
L1T
0.033u
C
Q171
C178
B
K0.01u
1 2
0.01u
130k
330k
300V
E
39
NC
2.2k
220
*SA102
4 3
C168
R163
R133
R152
C152
*SA101
C132
R145
R171
C102 680p *P101 L1R
NC
NC
*C115
C184
SA103
2
1
*R115
NC
1u
C186
C181
1
NC
10p
2
NC
Pin 28 of IC501
R121 390k C121 680p
R122 390k C122 680p
VDDC
Hook
NC
NC
Pin 6 of IC501
R111
R112
100k
100k
K
K
D153 NC
+3.0V
Pin 16 of IC501
C124
C123
C120
D133
A
1000p
0.047u
0.047u
R114
47k
4
BELL
RA151
Pin 5 of IC501
C111
C112
1k
Q111
1
2
Pin 25 of IC501
Pin 24 of IC501
10k
Pin 18 of IC501
Pin 17 of IC501
K0.68u
D113
C113
R113
A
14
4.4.5. Parallel Connection Detect Circuit/Auto Disconnect Circuit

Function:
In order to disable call waiting and stutter tone functions when using telephones connected in parallel, it is necessary to have a
circuit that judges whether a telephone connected in parallel is in use or not. This circuit determines whether the telephone
connected in parallel is on hook or off hook by detecting changes in the T/R voltage.
Circuit Operation:
Parallel connection detection when on hook:
When on hook, the voltage is monitored at pin 17 of IC501. There is no parallel connection if the voltage is
0.54 V or higher, while a parallel connection is deemed to exist if the voltage is lower.
Parallel connection detection when off hook:

When off hook, the voltage is monitored at pin 18 of IC501; the presence/absence of a parallel connection is determined by
detecting the voltage changes.
If the Auto disconnect function is ON and statuses are Hold, receiving ICM, OGM transmitting, BBIC disconnects the line after
detecting parallel connection is off hook.
Q141
Q161
R141
R142
R131
Pin 18 of IC501 C101

DCIN2
D101
RA151 R151 3 2
R163
C132
Q142
R152 4 1
C152
SA101
L1T
R133
R145
L1R
C102 TEL JACK
Pin 17 of IC501
DCIN1
P101
HOOK RA151
Pin 6 of IC501
15
4.4.6. Calling Line Identification (Caller ID)/Call Waiting Caller ID

Function:
Caller ID
The caller ID is a chargeable ID which the user of a telephone circuit obtains by entering a contract with the telephone company
to utilize a caller ID service. For this reason, the operation of this circuit assumes that a caller ID service contract has been
entered for the circuit being used. The data for the caller ID from the telephone exchange is sent during the interval between the
first and second rings of the bell signal. The data from the telephone exchange is a modem signal which is modulated in an FSK
(Frequency Shift Keying) * format. Data "1" is a 1200 Hz sine wave, and data "0" is a 2200 Hz sine wave. There are two types of
the message format which can be received: i.e. the single message format and plural message format. The plural message
format allows to transmit the name and data code information in addition to the time and telephone number data.
*: Also the telephone exchange service provides other formats.
Single message format

1st Ring 2nd Ring
2 sec Silent interval 4 sec 2 sec
0.5 s 575 ms min 0.5 s
DATA
STD Ring / 20 Hz
Tip-Ring 0.1 Vrms
70 Vrms
A DATA in
1200 Hz 2200 Hz
=DATA "1" =DATA "0 "
B DATA out
1 bit=833 µs
month day hour minute number

04 15 16 35 2013487000
Plural message format

1st Ring 718 ms
0.5 s 2nd Ring
2 sec
DATA
DATA CODE NAME month day hour minute number

201 John Smith 04 16 16 35 2013487000
16
Call Waiting Caller ID

Calling Identity Delivery on Call Waiting (CIDCW) is a CLASS service that allows a customer, while off-hook on an existing call,
to receive information about a calling party on a waited call. The transmission of the calling information takes place almost
immediately after the customer is alerted to the new call so he/she can use this information to decide whether to take the new
call.
Function:
The telephone exchange transmits or receives CAS and ACK signals through each voice RX/TX route. Then FSK data and
MARK data pass the following route.
Telephone Line → P101 → C121, C122 → R121, R122 → IC501 (25, 24).
If the unit deems that a telephone connected in parallel is in use, ACK is not returned even if CAS is received, and the
information for the second and subsequent callers is not displayed on the portable handset display.
R121 C121
BBIC L1T Telephone "FSK"

25 SA101 Line
IC501 C120 R122 C122 L1R data
24
P101
17
4.5.
35
SPEAKER RXn ANT1
37 Speech Burst 1
Decoding Decoding
21 D/A RXp
RECEIVER Speech Burst 2
Encoding ANT1
22 Encoding
17 A/D
MIC ADPCM TXp
18 Codec RF 87
Analog PLL
Front Filter
MOD/DEMOD TXn
End DSP 86
BMC
CHARGE(+) CHARGE_DET 34
CHARGE
CHARGE CIRCUIT
CONTACTS Q2, Q3, Q4, CHARGE_CTRL 33
Q9, R8
7 XTAL
SCL 66 X1
EEPROM
10.368
IC7 SDA 67
Block Diagram (Handset)
8 MHz
BATTERY
VBAT 32
BATTERY ON SWITCH
TERMINAL CPU 46
BATT- R45
1.8 V
24
18
CP3V
1.8 V LDO_CTRL 57, 58, 59, 60 ROWS
Q1
CD 65
RESET 76 KEYPAD
11, 12, 13, 14, 55 COLUMNS
CSB 73
LCD
SDA 63 CP 3.0 V
SCL 64 47, 48, 51, 53 QSPI-IO 0-3
BBIC Charge QSPI QSPI
52 QSPI-SCK
IC1 Pump Control 49 QSPI-CS FLASH MEMORY
77 IC4
LCD-BACK LIGHT
Reset
61 44 45
KEY LED
CP 4V
Reset
Pin 71
CP3V
KX-TGDA20 BLOCK DIAGRAM (Handset)
4.6. Circuit Operation (Handset)

4.6.1. Outline
Handset consists of the following ICs as shown in Block Diagram (Handset) (P.18).
• DECT BBIC (Base Band IC): IC1
- All data signals (forming/analyzing ACK or CMD signal)
- All interfaces (ex: Key, Detector Circuit, Charge, DC/DC Converter, EEPROM, LCD, RF Power Amp.)
- PLL Oscillator
- Detector
- Compress/Expander
- Reception
- Integrated 1.9 GHz PA for DECT
• QSPI FLASH MEMORY: IC4
- Main Program D/L Area
• EEPROM: IC3
- Temporary operating parameters (for RF, etc.)
4.6.2. Power Supply Circuit/Reset Circuit

Circuit Operation:
When power on the Handset, the voltage is as follows;
BATTERY(2.2 V ~ 2.6 V: BATT+) → F1 → Q1 (1.8 V), IC1-44pin (3.0V)
The Reset signal generates IC1 (71 pin) and 1.8 V.
Battery +
1.8 V
Reset
(IC1_71pin)
4.6.3. Charge Circuit

Circuit Operation:
When charging the handset on the Base Unit, the charge current is as follows;
Q2
DC+(5.5 V) → R371 → R372 → D362 → CHARGE+(Base) → CHARGE+(Handset) → R8 → Q3 → F1 → BATTERY+...
Battery...
BATTERY- → R45 → GND → CHARGE-(Handset)→ CHARGE-(Base) → GND → DC-(GND)
In this way, the BBIC on Handset detects the fact that the battery is charged.
The charge current is controlled by switching Q9 of Handset.
Refer to Fig.101 in Power Supply Circuit/Reset Circuit (P.12).
4.6.4. Battery Low/Power Down Detector

Circuit Operation:
“Battery Low” and “Power Down” are detected by BBIC which check the voltage from battery.
The detected voltage is as follows;
• Battery Low
Battery voltage: V(Batt) 2.25 V ± 50 mV
The BBIC detects this level and " " starts flashing.
• Power Down
Battery voltage: V(Batt) 2.0 V ± 50 mV
The BBIC detects this level and power down.
4.6.5. Speakerphone
The hands-free loudspeaker at SP+ and SP- is used to generate the ring alarm.
19
4.7. Signal Route

SIGNAL ROUTE IN 䊻㻌 ROUTE 䊻㻌 OUT
HANDSET TX MIC (+) - C13 - IC1 (17) IC1(86) C859 - ANT to BASE
MIC (–) - C11 - IC1 (18) IC1(87)
---ANT. - <BASE_UNIT_RF_RX_ROUTE> - IC501(46/47 - 28) - C184 - Q161 - Q141
- D101 - P101 - T/R(TEL LINE)
HANDSET RX T/R(TEL LINE) - P101 - D101 - Q141 - R165 - R177 - C173 - Q171 - C178
- IC501(16 - 44/45) - <BASE_UNIT_RF_TX_ROUTE> - ANT. ---
from BASE UNIT ANT 1 IC1 (1) IC1 (21) - RECEIVER (+)
IC1 (2) IC1 (22) - RECEIVER (–)
HANDSET MIC (+) - C13 - IC1 (17) IC1(86) C859 - ANT to BASE
SP-Phone TX MIC (–) - C11 - IC1 (18) IC1(87)
---ANT. - <BASE_UNIT_RF_RX_ROUTE> - IC501(46/47 - 28) - C184 - Q161 - Q141
- D101 - P101 -T/R(TEL LINE)
HANDSET T/R(TEL LINE) - P101 - D101 - Q141 - R165 - R177- C173 - Q171 - C178 -R178
SP-Phone RX - IC501(16-44/45) - <BASE_UNIT_RF_TX_ROUTE> - ANT. ---
from BASE UNIT ANT –– IC1 (1) ––– IC1 (35) - SP (–)
– IC1 (2) – – IC1 (37) - SP (+)
GREETING MIC (+) - C13 - IC1 (17) IC1(86) C859 - ANT to BASE
RECORDING MIC (–) - C11 - IC1 (18) IC1(87)
---ANT. - <BASE_UNIT_RF_RX_ROUTE> - IC501(46/47- 73/74) - IC601
GREETING PLAY IC601 - IC501(73/74 - 28) - C184 - Q161 - Q141 - D101 - P101
TO TEL LINE
- T/R(TEL LINE)
ICM RECORDING T/R(TEL LINE) - P101 - D101 - Q141 - R165 - R177- C173 - Q171 - C178 - R178
- IC501(16 - 73/74) - IC601
ICM PLAY TO IC601 - IC501(73/74 - 29/31) - SPEAKER

SPEAKER
DTMF SIGNAL IC501(28) - C184 - Q161 - Q141 - D101 - P101 - T/R(TEL LINE)
TO TEL LINE
CALLER ID T/R(TEL LINE) - P101 - C121/C122 - R121/R122 - IC501(24/25)
BELL DETECTION T/R(TEL LINE) - P101 - R111/R112 - C111/C112 - Q111 - IC501(5)
Note:
: inside of Handset
20
RF part signal route

SIGNAL ROUTE IN 䊻㻌 ROUTE 䊻㻌 OUT
HANDSET RF IC1(86/87) - C859 - ANT

[ TX_ROUTE ]
HANDSET RF ANT - IC(1/2)

[ RX_ROUTE ]
BASE UNIT RF IC501(44/45) - C819 - C872 - ANT

[ TX_ROUTE ]
BASE UNIT RF ANT - C872 - C895 - IC501(46/47)

[ RX_ROUTE ]
Note:
: inside of Handset
21
5 Location of Controls and Components

Refer to the Operating Instructions.
Note:
You can download and refer to the Operating Instructions (Instruction book) on TSN Server.
6 Installation Instructions
Note:
7 Operating Instructions
Note:
22
8 Test Mode
8.1. Engineering Mode
8.1.1. Base Unit
Important:
Make sure the address on LCD is correct when entering new data. Otherwise, you may ruin the unit.
Soft keys
{OFF } (Off)
Navigator key/
? (Volume) key/
(Phonebook)/
CID (Caller ID) key/
REDIAL (Redial) key/
{ } {TALK:Talk }
Dial keypad
{FLASH}
{CALL WAIT} (Call wait)
H/S key operation H/S LCD

1). Press { MENU }.
2). Select "Initial Setup" using {^}or{V}

then press {OK } .
3). Select "Line Setup" using {^}or{V}

then press {OK } or {>}.
4). Enter "7", "2", "6", "2", "7", "6", "6", "4".
Note: 7262 7664 = PANA SONI
(see letters printed on dial keys)
Service Mode
5). Select "Write EEP" using {^} or{V} Read EEP
then press {OK } or {>}. Write EEP
Get S/W Ver.
OK
Set Addr.:
Default Data
6). Enter " ", " ", " ", " " (Address). (*1)
C OK
7). Enter " ", " " (New Data). (*1) Set Addr.:
New Data
8). Press {OK } , a long confirmation beep C OK

will be heard. Set Addr.:
____ __
9). Press (off) to return to standby mode.

After that, turn the base unit power off and then power on.
23
Frequently Used Items (Base Unit)

ex.)
Items Address Default Data New Data Remarks

C-ID (FSK) sensitivity 06 DE/06 DD 00/28 00/1C 00/14 When hex changes from “00/28” to “00/1C” or
(3 dB up) (6 dB up) “00/14”, gain increases by 3 dB or 6 dB.
C-ID (DTMF) sensitivity 06 F8/06F7 00/01 0B/4C 0F/F6 When hex changes from “00/01” to “0B/4C” or
(3 dB up) (6 dB up) “0F/F6”, gain increases by 3 dB or 6 dB.
Frequency 00 07 / 00 08 00/01 - - Use these items in a READ-ONLY mode to
ID 00 02 ~ 00 06 Given value - - confirm the contents. Careless rewriting may
cause serious damage to the computer system.
Bell length 03 D4 3C (6 sec) (*3) 1E (3 sec) 14 (2 sec) This is time until bell stops ringing.
(Unit: 100 msec)
Note:
(*1) When you enter the address or New Data, please refer to the table below.
Desired Number (hex) Input Keys Desired Number (hex) Input Keys
0 0 A [R] + 0
1 1 B [R] + 1
. . C [R] + 2
. . D [R] + 3
. . E [R] + 4
9 9 F [R] + 5
(*2)
Bell length 3C (hex) = 60 (dec) → 60 × 100 msec = 6000 msec (6 sec)
24
8.1.2. Handset
Important:
Make sure the address on LCD is correct when entering new data. Otherwise, you may ruin the unit.
Soft keys
{OFF } (Off)
Navigator key/
?(Volume) key/
(Phonebook)/
CID (Caller ID) key/
REDIAL (Redial) key/ { } {TALK:Talk }
Dial keypad
{FLASH}
{CALL WAIT} (Call wait)
H/S key operation H/S LCD

1). Press { MENU }.
2). Select "Initial Setup" using {^}or{V}

then press {OK } .
3). Enter "7", "2", "6", "2", "7", "6", "6", "4".
Note: 7262 7664 = PANA SONI
(see letters printed on dial keys)
Service Mode
4). Select "Write EEP" using {^} or{V} Read EEP
then press {OK } or {>}. Write EEP
Get S/W Ver.
OK
Set Addr.:
Default Data
5). Enter " ", " ", " ", " " (Address). (*1)
C OK
6). Enter " ", " " (New Data). (*1) Set Addr.:
New Data
7). Press {OK } , a long confirmation beep C OK

will be heard. Set Addr.:
____ __
8). Press (off) to return to standby mode.

After that, turn the base unit power off and then power on.
25
Frequently Used Items (Handset)

ex.)
Items Address Default Data New Data Possible Adjusted Possible Adjusted Remarks
Value MAX (hex) Value MIN (hex)
Battery Low 00 09 70 - - -
Frequency 00 07 / 00 08 70/02 - - - (*2)
ID 00 02 ~ 00 06 Given value - - -
Note:
(*1) When you enter the address or New Data, please refer to the table below.
Desired Number (hex.) Input Keys Desired Number (hex.) Input Keys
0 0 A [Flash] + 0
1 1 B [Flash] + 1
. . C [Flash] + 2
. . D [Flash] + 3
. . E [Flash] + 4
9 9 F [Flash] + 5
(*2) Use these items in a READ-ONLY mode to confirm the contents. Careless rewriting may cause serious damage to the
handset.
26
9 Service Mode
9.1. How to Clear User Setting (Handset Only)
Handset
Press 2 , 5 , 8 , 0 simultaneously until a beep sound is heard. Then single handset is initialized.
(The contents of user setting are reset to factory default)
*Usage time is not cleared.
27
10 Troubleshooting Guide
10.1. Troubleshooting Flowchart
FLOW CHART
Not working
Power ON Base Unit Check Power
OK
Not playback
Playback Pre-Message Check Playback
OK
Not record
Record Check Record
OK
Link
No link
No charge
Battery Charge Check Battery Charge
OK
OK
Check Link
NG
Range Check the RF part
OK
No voice
Handset Voice Transmission Check Handset Transmission
OK
No voice
Handset Voice Reception Check Handset Reception
OK
Caller ID Error
Caller ID Reception Check Caller ID
Cross Reference:
Check Power (P.29)
Check Playback (P.31)
Check Record (P.30)
Check Battery Charge (P.31)
Check Link (P.32)
Check the RF part (P.34)
Check Handset Transmission (P.39)
Check Handset Reception (P.39)
Check Caller ID (P.39)
28
10.1.1. Check Power

10.1.1.1. Base Unit
Is the AC Adaptor inserted into AC outlet? (*1)
NO
Is output voltage of AC adaptor 5.5 V? Check AC Adaptor.
YES
NO
Check VDDC (1.2 V): Test Point [VDDC] Check Power Supply Circuit.
OK
NO
RSTN: Reset = "High"? Check Reset Circuit.
YES
NO
Check Xtal CLK = 13.824 MHz? Check X501.
YES
Check BBIC.
Cross Reference: Note:

Power Supply Circuit/Reset Circuit (P.12) BBIC is IC501.
(*1) Refer to Specifications (P.6) for part number and
supply voltage of AC adaptor.
(*2) Refer to Base Unit (Main) (P.61).
10.1.1.2. Handset
Is the battery inserted BATT+ and BATT-?
YES
NO
Is the voltage of BATT+ 2.3 V more? Check F1 is not open.
YES
YES
Check the battery and around BATT+ and
BATT- are not shorted.
NO
Is the voltage of +1.8V about 1.8 V? Check Power Supply Circuit/Reset Circuit .
YES
NO
Is the voltage of CP3V about 3.0 V?
YES
Is the voltage of CP4V about 4.0V ? NO
(When LED is On) Check BBIC (IC1).
YES
NO
Does BBIC (IC1: 7) oscillate at 10.368 MHz? Check X1.
YES
Check BBIC (IC1).
Cross Reference:
Power Supply Circuit/Reset Circuit (P.12)
29
10.1.2. Check Record

10.1.2.1. Base Unit
A) Not record Incoming Message
NO
Check Bell signal. Check Telephone Line Interface
[Bell].
OK
NO
Does the unit catch line? Check Telephone Line Interface
[OFF HOOK].
YES
NO
Check Line In: Pin 16 of BBIC. Check ICM Recording in Signal Route.
OK
Check Auto Disconnect Circuit.

OK
Check Parallel Connection Detection

Circuit.
OK
Check BBIC and Flash Memory.

Signal Route (P.20) Flash Memory is IC601.
Telephone Line Interface (P.14) BBIC is IC501.
Parallel Connection Detect Circuit/Auto Disconnect
Circuit (P.15)
30
10.1.3. Check Playback

10.1.3.1. Base Unit
NO
Check VDDC (1.2 V): Test Point [VDDC] Check Power Supply Circuit.
OK
NO
Check output of BBIC (Pin 29, 31). Check BBIC and Flash Memory.
OK
Check Speaker and its surroundings.

Power Supply Circuit/Reset Circuit (P.12) Flash Memory is IC601.
BBIC is IC1.
(*1) Refer to Base Unit (Main) (P.61).
10.1.4. Check Battery Charge

10.1.4.1. Base Unit
Plug in the AC Power source.
Charge Handset on Base Unit.
NO
Is the voltage of two charge contacts about Check Charge Circuit of Base Unit.
3 V or more?
OK
YES
Check Handset.
Check Charge Contacts at
Base Unit from mechanical point of view.
Cross Reference:
Charge Circuit (P.13)
10.1.4.2. Handset
NO
Is Check Power OK? Check Power of Handset.
YES
NO
Is BBIC (IC1: 34) high at charge state? Check Charge Circuit.
Cross Reference:
Check Power (P.29)
10.1.4.3. Charger Unit

Plug in the AC Power source.
Charge Handset on Charger Unit.
NO
Is the voltage of two charge contacts about Check Charge Circuit of Charger Unit.
3 V or more?
OK
YES
Check Handset.
Check Charge Contacts at Charger Unit
from mechanical point of view.
Cross Reference:
31
10.1.5. Check Link

10.1.5.1. Base Unit
Does Base Unit make link with normal working YES

Base Unit is OK. Check Handset.
Handset?
NO
NO
Is the voltage of VBAT about 3.0 V? Check around Power Supply Circuit.
YES
Is the voltage of VDDC about 1.2 V? NO
YES
NO
Is the voltage of +3.0V about 3.0 V? Adjust +3.0V voltage to 3.0 V. *1
YES OK
Does the RF clock (CLK) oscillate at 13.824 MHz in NO Check around X501 and RF module and adjust
Base Unit Test Mode? clock frequency.*2
YES
Check the RF part
Cross Reference:
Note:
*1 How to adjust +3.0V:
Execute the command "VDA"
Refer to Things to Do after Replacing IC or X'tal (P.49) for Base Unit.
*2 How to adjust the frequency of X501:
To see the frequency, execute the command “SFR“, then check the TP_CKM (IC501-57pin).
To adjust frequency, send command “SFR “ until the frequency counter becomes13.824 MHZ±55HZ.
32
10.1.5.2. Handset
Does Handset make link with Base Unit? YES

Handset is OK. Check Base Unit.
(Correct working unit)
NO
NO
Is the voltage of "1.8V" about 1.8 V? Adjust 1.8V voltage to 1.8 V.
YES OK NO
Check around Power Supply Circuit/Reset Circuit .
NO
Is the voltage of CP3V about 3.0 V?
YES
NO
Is the voltage of CP4V about 4.0V? Check BBIC (IC1)
(When LED is ON)
YES
NO
Is the voltage of CP2.8V about 2.8 V? Check D3
YES
NO
Does the RF clock (CLK) oscillate: 10.368 MHz Check around X1 and adjust clock frequency.
in Handset Test Mode?
YES
Check the RF part.
Cross Reference:
Note:
(*1) Refer to Troubleshooting by Handset (P.31)
To see the frequency, execute the command “SFR“, then check the TP_CKM (IC1-55pin).
To adjust frequency, send command “SFR “ until the frequency counter becomes10.368 MHz±55HZ.
Refer to Things to Do after Replacing IC or X'tal (P.50) for Handset.
33
10.1.6. Check the RF part

10.1.6.1. Finding out the Defective part
1. Prepare Regular HS(*1) and Regular BU(*2).
2. a. Re-register regular HS (Normal mode) to base unit (to be checked).
If this operation fails in some ways, the base unit is defective.
b. Re-register handset (to be checked) to regular BU (Normal mode).
If this operation fails in some ways, the handset is defective.
After All the Checkings or Repairing

1. Re-register the checked handset to the checked base unit, and Regular HS to Regular BU.
START
No Registration of Registration of No
Base unit is defective Regular HS to handset to Handset is defective
base unit Regular BU
Yes Yes
(other checkings)
Registration of Regular HS to Regular BU
Registration of handset to base unit

(checked ones)
Note:
(*1) HS: Handset
(*2) BU: Base Unit
34
10.1.6.2. RF Check Flowchart

Each item (1 ~ 6) of RF Check Flowchart corresponds to Check Table for RF part (P.36).
Please refer to the each item.
Start
1 2
Link NG Control NG Check BBIC interface parts.
confirmation signal
Normal confirmation (RF Block <->BBIC on BU/HS P.C.B)
OK OK
3
X'tal
NG
Frequency Adjust X'tal Frequency. (*1)
confirmation
OK
4
NG
TX confirmation Check TX Block.
OK
5
NG
RX confirmation Check RX Block.
OK
6
Range NG
confirmation TEST RANGE Check.
Normal
OK
GOOD
Note:
(*1) Refer to Check Link (P.32).
35
10.1.6.3. Check Table for RF part
No. Item BU (Base Unit) Check HS (Handset) Check

1 Link Confirmation Normal 1. Register Regular HS to BU (to be 1. Register HS (to be checked) to Regular
checked). BU.
HS, BU Mode [Normal Mode] 2. Press [Talk] key of the Regular HS to 2. Press [Talk] key of the HS to establish link.
establish link.
2 X'tal Frequency confirmation Check X'tal Frequency. Check X'tal Frequency.
(13.824000 MHz ±100 Hz) (10.368000 MHz ±100 Hz)
HS, BU Mode: [Adjustment]
3 TX confirmation 1. Place Regular HS 15 cm away from a 1. Place Regular BU 15 cm away from a
checked BU. checked HS.
Regular HS (BU) Mode: 2. Confirm "TXDATA" waveform of BU (*1) 2. Confirm "TXDATA" waveform of HS (*2)
[Test RX Mode] and “RXDATA“ waveform of Regular HS by and "RXDATA" waveform of Regular BU by
Digital Oscilloscope. Digital Oscilloscope.
BU (HS) Mode:
[Test TX_Burst Mode]
4 RX confirmation 1. Place Regular HS 15 cm away from a 1. Place Regular BU 15 cm away from a
checked BU. checked HS.
Regular HS (BU) Mode: 2. Confirm "RXDATA" waveform of BU (*1) 2. Confirm "RXDATA" waveform of HS (*2)
[Test TX_Burst Mode] and “TXDATA“ waveform of Regular HS by and "TXDATA" waveform of Regular BU by
Digital Oscilloscope. Digital Oscilloscope.
BU (HS) Mode:
[Test RX Mode]
5 Range Confirmation Normal 1. Register Regular HS to BU (to be 1. Register HS (to be checked) to Regular
checked). BU.
HS, BU Mode: [Normal Mode] 2. Press [Talk] key of the Regular HS to 2. Press [Talk] key of the HS to establish link.
establish link. 3. Compare the range of the HS (being
3. Compare the range of the BU (being checked) with that of the Regular HS.
checked) with that of the Regular BU.
Note:
(*1) Adjustment Standard (Base Unit) (P.47)
(*2) Adjustment Standard (Handset) (P.48)
36
10.1.6.4. TEST RANGE Check

Circuit block which range is defective can be found by the following check.
Item BU (Base Unit) Check HS (Handset) Check

Range Confirmation TX TEST 1. Register Regular HS to BU (to be checked). 1. Register HS (to be checked) to Regular BU.
(TX Power check)
2. Set TX Power of the BU and the Regular HS 2. Set TX Power of the HS and the Regular BU
HS, BU setting according to CHART1. according to CHART1.
Checked unit: Low TX power (*1)
Regular unit: High TX power (*1) 3. At distance of about 20m between HS and BU, 3. At distance of about 20m between HS and BU,
Link OK = TX Power of the BU is OK. Link OK = TX Power of the HS is OK.
No Link = TX Power of the BU is NG. No Link = TX Power of the HS is NG.
Range Confirmation RX TEST 1. Register Regular HS to BU (to be checked). 1. Register HS (to be checked) to Regular BU.
(RX sensitivity check)
2. Set TX Power of the BU and the Regular HS 2. Set TX Power of the Checking HS and the Reg-
HS, BU setting according to CHART1. ular BU according to CHART1.
Checked unit: High TX power (*1)
Regular unit: Low TX power (*1) 3. At distance of about 20m between HS and BU, 3. At distance of about 20m between HS and BU,
Link OK= RX Sensitivity of the BU is OK. Link OK= RX Sensitivity of the HS is OK.
No Link = RX Sensitivity of the BU is NG. No Link = RX Sensitivity of the HS is NG
CHART1: Setting of TX Power and RX Sensitivity in Range Confirmation TX TEST, RX TEST
BU (to be checked) Regular_HS

TX Power TX Power
BU (Base Unit) TX Power Check Low High
BU (Base Unit) RX Sensitivity Check High Low
HS (to be checked) Regular_BU

TX Power TX Power
HS (Handset) TX Power Check Low High
HS (Handset) RX Sensitivity Check High Low
Note:
(*1) Refer to Commands (P.46).
37
10.1.7. Registering a Handset to the Base Unit

1 Handset:
{MENU} # 1 3 0
2 Base unit:
Press and hold {LOCATOR} for about 5 seconds.
L If all registered handsets start ringing, press {LOCATOR} again to stop, then
repeat this step. (KX-TGD212)
L The next step must be completed within 90 seconds.
3 Handset:
Press {OK}, then wait until a long beep sounds.
10.1.8. Deregistering a Handset

1 {MENU} # 1 3 1
L All handsets registered to the base unit are displayed.
^
2 { V } : Select the handset you want to cancel. i {SELEC.}
3 {^V } : “ Sí ” i {SELEC.} i {OFF}
38
10.1.9. Check Handset Transmission
Check MIC of handset.
Check handset Tx in Signal Route.
Cross Reference:
Signal Route (P.20)
10.1.10. Check Handset Reception
Check speaker of handset.
Check handset Rx in Signal Route.
Cross Reference:
Signal Route (P.20)
Note:
When checking the RF part, Refer to Check the RF part
(P.34).
10.1.11. Check Caller ID

BASE UNIT
Did bell ring? NO Check bell signal detection in
(Message indicator Telephone Line Interface.
blinks)
YES
Check Calling Line Identification (Caller ID)/

Call Waiting Caller ID.
Cross Reference:
Telephone Line Interface (P.14)
Calling Line Identification (Caller ID)/Call Waiting Caller
ID (P.16)
Note:
• Make sure the format of the Caller ID service of the
Telephone company that the customer subscribes to.
• It is also recommended to confirm that the customer is really
a subscriber of the service.
39
11 Disassembly and Assembly Instructions

11.1. Disassembly Instructions
11.1.1. Base Unit
11.1.1.1. KX-TGD210
ձ Remove the 4 screws to remove ձ 4 screws
the cabinet cover.
ղ Remove the solders.
ղ Solders
ճ Remove the main P.C. board.
ճ Main P.C. board
40
11.1.2. Handset
ձ Remove the 2 screws. ձ 2 screws
ղ Insert a plastic card.

(Ex. Used SIM card etc.)
between the cabinet body Cabinet body
and the cabinet cover, then
pull it along the gap to open
the cabinet.
Cabinet cover
ճ Likewise, open the other

side of the cabinet.
մ Remove the cabinet cover Cabinet cover

by pushing it upward.
շ Screw
յ Remove the solders.
յ Solders
ն Remove the solders to remove

the 2 charge terminals.
Main P.C. board
Remove the screw to remove

ն Solders
շ
the Main P. C. board.
2 charge terminals
41
11.1.3. Charger Unit

ձ Cabinet cover
ձ Remove the cabinet cover.
AC Adaptor
ղ Remove the solders to remove

the AC adaptor.
ղ Solders
ճ Remove the 2 charge terminals.
ճ 2 charge terminals
42
11.2. How to Replace the Handset LCD

Note:
The illustrations are simplified in this page.
They may differ from the actual product.
P. C. board
Vertical Interval
Tolerance
Peel off the FFC (Flexible Flat Cable) from

the LCD, in the direction of the arrow. Take 0.2 mm
care to ensure that the foil on the P.C. board
is not damaged.
Horizontal Interval
0.2 mm Tolerance
If interval tolerance between center lines
is less than 0.2 mm, it is o.k.
New LCD
OK
Fit the heatseal of a new LCD.
NG
(Inclined)
Tip of Soldering Iron

(Part No. PQZZ430PIR)
Rubber of Soldering Iron
(Part No. PQZZ430PRB)
Heatweld with the tip of the soldering
iron about 5 to 8 seconds NG
(in case of 60W soldering iron).
(Vertical interval tolerance is
more than 0.2 mm.)
NG
(Horizontal interval tolerance is
more than 0.2 mm.)
43
12 Measurements and Adjustments

This chapter explains the measuring equipment, the JIG connection, and the PC setting method necessary for the measurement in
Troubleshooting Guide (P.28)
12.1. Equipment Required

• Digital multi-meter (DMM): it must be able to measure voltage and current.
• Oscilloscope.
• Frequency counter: It must be precise enough to measure intervals of 1 Hz (precision; ±4 ppm)
Hewlett Packard, 53131A is recommended.
• DECT tester: Rohde & Schwarz, CMD 60 is recommended.
This equipment may be useful in order to precisely adjust like a mass production.
12.2. The Setting Method of JIG

<Preparation> Note:
• Serial JIG cable: PQZZ1CD300E* *: If you have the JIG Cable for TCD500 series
• PC which runs in DOS mode (PQZZ1CD505E), change the following values of
• Batch file CD-ROM for setting: PNZZGD210AG1 resistance. Then you can use it as a JIG Cable for both
TCD300 and TCD500 series. (It is an upper compatible JIG
Cable.)
Resistor Old value (kΩ) New value (kΩ)

R2 22 3.3
R3 22 3.3
R4 22 4.7
R7 4.7 10
12.2.1. Connections (Base Unit)

1 Connect the AC adaptor.
2 Connect the JIG Cable GND (black).
3 Connect the JIG Cable RX (red) and TX (yellow).
JIG Cable
3 UTX (yellow)
UTX
2 UGND (black) To Serial Port
URX (COM port 1*)
UGND
3 URX (red)
PC
DC JACK
1
AC adaptor
Base unit P. C. board

Note:
*: COM port names may vary depending on what your PC calls it.
44
12.2.2. Connections (Handset)

1Connect the DC Power or Battery to BATT+ and BATT-.
2Connect the JIG cable GND (black) to GND.
3Connect the JIG cable UTX (yellow) to UTX and URX (red) to URX.
3 URX (red)
To Serial Port
3 UTX (yellow)
UTX (com port 1*)
URX
2 GND (black)
BATT+
GND
JIG Cable
1 DC Power
BATT-
or Battery
PC
Handset P. C. board
Note:
*: COM port names may vary depending on what your PC calls it.
45
12.2.3. How to install Batch file into P.C.
1. Insert the Batch file CD-ROM into CD-ROM drive and

copy PNZZTG**** folder to your PC (example: D drive).
<Example for Windows>
2. Open an MS-DOS mode window. On your computer, click [Start], select Programs
(All Programs for Windows XP/Windows Server 2003),
then click
MS-DOS Prompt. (for Windows 95/Windows 98)
Or
Accessories-MS-DOS Prompt. (for Windows Me)
Or
Command Prompt. (for Windows NT 4.0)
Or
Accessories-Command Prompt.
(for Windows 2000/Windows XP/Windows Server 2003)
3. At the DOS prompt, type "D:" (for example) to select the
drive, then press the Enter key.
<Example>
4. Type "CD 㪳PNZZTG****", then press the Enter key.
5. Type "SET_COM=X", then press the Enter key C: >Documents and Settings>D:
(X: COM port number used for the serial connection on your PC). D: >>CD >PNZZTG****
D: >PNZZTG**** >SET_COM=X
D: >PNZZTG****>READID
6. Type "READID", then press the Enter key. 00 52 4F A8 A8
䊶If any error messages appear, change the port number or D: >PNZZTG****>DOSKEY
䇭check the cable connection. D: >PNZZTG****>
䊶If any value appear, go to next step.
7. Type "DOSKEY", then press the Enter key. <Example: error happens>
C: >Documents and Settings>D:

D: >>CD >PNZZTG****
D: >PNZZTG**** >SET_COM=X
D: >PNZZTG****>READID
‫ޓ‬CreateFile error
ERROR 10: Can't open serial port
D: >PNZZTG ****>
Note:
• “*****” varies depending on the country or models.
12.2.4. Commands
See the table below for frequently used commands.
Command name Function Example

rdeeprom Read the data of EEPROM Type “rdeeprom 00 00 FF”, and the data from address
“00 00” to “FF” is read out.
readid Read ID (RFPI) Type “readid”, and the registered ID is read out.
writeid Write ID (RFPI) Type “writeid 00 18 E0 0E 98”, and the ID “0018 E0 0E
98” is written.
hookoff Off-hook mode on Base Type “hookoff”.
hookon On-hook mode on Base Type “hookon”.
getchk Read checksum Type “getchk”.
wreeprom Write the data of EEPROM Type “wreeprom 01 23 45”. “01 23” is address and “45”
is data to be written.
46
12.3. Adjustment Standard (Base Unit)

When connecting the simulator equipment for checking, please refer to below.
12.3.1. Bottom View

Frequency Counter (*1)
* Send command "SFR", then

the frequency output on this TP.
Oscilloscope (*2)
* Start Monitor
UTX +5.5V
C171
C167
URX UGND
PNLB2317Z
R168
R164
C173
R172
PCB
C175
C178
Q171
R171
R175
C176
IC611
ANT1_S-GND
R176
ANT1_Short
RA611
Spectrum Analyzer
TMS
TD0
C611
+3.0V
R112
L1R
TDI
TCK
RTCK
C112
BRN
VDDC
R115
R114
R111
SA101
TEL
Q111
STM/CKM/P15
C111 LT1
R113
C515 YLW
IC601 C115
C113
RSTN
D113
GAP1
ANT1
C601
C120 VREF
- GRY
DCM
C513
VCCA
5.5V
DC
DC
F301
DCP
C321
R371 + PUR
IC302
R372
R322
C342
+
C351
R321
CHG
ORG
BLU
-
A +
SP
-
Volt Meter
Oscilloscope
Note:
(*1) is referred to No.2 of Check Table for RF part (P.36)
(*2) is referred to Power Supply Circuit/Reset Circuit (P.12)
47
12.4. Adjustment Standard (Handset)

When connecting the simulator equipment for checking, please refer to below.
12.4.1. Component View

After measure do not forget to remove the wire.
When measure RF, short "ANT-Short" and "ANT-Short-GND" with copper wire which length 5mm.
Oscilloscope
ANT-Short
ANT-Short-GND
LCD_RESET
LCD_SCL
UE
LCD_SID
LCD_CS
LCD_CD
BL
AN
W
T1
LE
_T
AF VOLT METER
P
E
NG
C62 C64 C96 C77 C76
RA
C92 C94 C95
O
C61 C63 C65 C91 C93
40
ER
IV
R55
D21
CE
O
C70
RE
RA
R52
R53
R54
R51
Spectrum Analyzer
NG
E
C71
G
D22
RE
CP3V
EN
C79
C73 D14 BLUE
SP-PHONE_SPEAKER
R76
RA5
R77
100
C72 D13
C78
AF VOLT METER
C69 ORANGE
C52
15 H
C56
C57
STM C55
C53 C29
4
1.8V
R60 C30 IC4 C41
15 H
CP+3.0V
C44
RST C191 C99
JTAG R61
IC1 C59 C98
100
C45
DC Volt Meter
CP4V
C860 C46 C190
C36 R1
CP3V
C863 C22 Q1 1.8V

C47 C13 C11
C859 C43
C862 R20
Oscilloscope
C12
R23 RA7
1.8V
STB_E
–
R15
KEY_LED
X1
Q6
RA3
RA2
C1
CKM
+
* Send command "SFR", then
C866
the frequency output on this TP.
STB_D
Frequency Counter
POWER
PNLB2319Z
PbF
KIN_3
STB_C
47
MIC Load
1.1 kHz
STB_A STB_B MIC- +

OSC
MIC+ +
47
KIN_2 MIC+ RCV-
AF VOLT METER
CHG_CTRL
40
MIC- RCV+
Q9
Q4
R6
Q2
R2 C19 KIN_1
R9
R8 C15 R45
CHG+
Oscilloscope
Q3
URX UTX
DC POWER SUPPLY
C6
F1
VBAT GND
VBAT BATT+ BATT-

2.6V
KIN_4
GND
CHG-
R7
A C5
DC VOLT METER
48
12.5. Things to Do after Replacing IC or X'tal

If repairing or replacing EEPROM and X'tal, it is necessary to download the required data such as Programming data or adjustment
data, etc. in memory.
The set doesn't operate if it is not executed.
12.5.1. How to download the data

12.5.1.1. Base Unit
First, operate the PC setting according to The Setting Method of JIG(P.44).
Then download the appropriate data according to the following procedures.
Items How to download/Required adjustment

EEPROM (IC611) Adjusted parameter data is stored in memory. 1) Change the address “0001” of EEPROM to “AA” to download
(country version batch file, default batch file, the data.
etc.) 2) Default batch file: Execute the command “default.bat”.
3) Country version batch file: Execute the command
“TGD21VEUS_WW_RevXXX_YYY.bat” (KX-TGD210)(*1)
4) Clock adjustment
X'tal (X501) System clock Clock adjustment data is in EEPROM, adjust the data again
after replacing it.
1) Apply 5.5V between DCP ad DCM with DC power.
2) Input Command "sendchar sfr", then you can confirm the
current value.
3) Check X'tal Frequency.(13.824 MHz ± 100 Hz).
4) If the frequency is not 13.824 MHz ± 100 Hz, adjust the
frequency of CLK executing the command "sendchar sfr xx xx
(where xx is the value)" so that the reading of the frequency
counter is 13.824000 MHz ± 15 Hz.
Note:
(*1) WW: country code, XXX_YYY: revision number
“XXX_YYY” vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The Setting
Method of JIG (P.44).
49
12.5.1.2. Handset
First, operate the PC setting according to The Setting Method of JIG (P.44).
Then download the appropriate data according to the following procedures.
Items How to download/Required adjustment

EEPROM (IC7) Adjusted parameter data is 1) Default batch file: Execute the command “default.bat”.
stored in memory. 2) Default batch file (remaining): Execute the command
(country version batch file, “TGDA20US_DEF_RevXXX_YYY.bat”. (*2)
default batch file, etc.) 3) Country version batch file: Execute the command
“TGDA20US_WW_RevXXX_YYY.bat”.(*2)
4) Clock adjustment
5) 2.35 V setting and battery low detection
Battery Monitor Check - 1) Apply 2.25 V between BATT+ and BATT-.
2) Execute the command
sendchar PAD
sendchar LED 0
sendchar CRX 0 1
sendchar AD1
It assumes that the return value is XX.
a) 6c XX 71: No need to adjust
b) XX: 6A ~ 6B: Need to adjust
XX: 72 ~ 74: Need to adjust
Write AD value of 2.25 V to EEPROM.
ex) read data: XX = 6A, write data:YY = 6A
read data: XX =73, write data: YY = 73
EEPROM = 0009 (Low Voltage) write “YY“
Execute the command “wreeprom 00 09 01 YY“.
EEPROM = 000A (No Voltage) write “YY - 1D“
Execute the command “xwreeprom 00 0A 01 ZZ“.
Note:
No Voltage writing data limit is “00“.
c) XX: 00 ~ 69: Reject
XX: 75 ~ FF: Reject
Battery Low Confirmation - 1) Apply 2.40 V between BATT+ and BATT-.
2) Confirm that there is no flashing of Battery lcon.
3) Apply 2.25 V ± 0.08 V between BATT+ and BATT-.
4) Confirm that there is flashing of Battery lcon.
Battery Clock Adjustment CLK 1) Apply 2.6 V between BATT+ and BATT- with DC power.
(X1) 2) Input Command “sendchar sfr“, then you can confirm the current value.
3) Check X’tal Frequency. (10.368 MHz ± 100 Hz).
4) If the frequency is not 10.368 MHz ± 100 Hz, adjust the frequency of CLK
execute in the command “sendchar sfr xx xx (where xx is the value)“ so that the
reading of the frequency counter is 10.368000 MHz ± 5 Hz.
Note:
(*2) WW: country code, XXX_YYY: revision number
“XXX_YYY” vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The Setting
Method of JIG (P.44).
50
12.6. Frequency Table
Ch. (hex) TX/RX Frequency (MHz)

Channel 0 00 1928.448
Channel 1 01 1926.720
Channel 2 02 1924.992
Channel 3 03 1923.264
Channel 4 04 1921.536
51
13 Miscellaneous
13.1. How to Replace the Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a
soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
13.1.1. Preparation
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700 °F ± 20 °F (370 °C ± 10 °C)
Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with
less experience could overheat and damage the PCB foil.
• Flux
Recommended Flux: Specific Gravity → 0.82.
Type → RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (PbF: Pb free) (P.4)
13.1.2. How to Remove the IC

1. Put plenty of solder on the IC pins so that the pins can be completely covered.
Note:
If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.
2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC pins.
When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder is
left at the joint on the board, the new IC will not be attached properly.
52
13.1.3. How to Install the IC

1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.
*Check the accuracy of the IC setting with the corresponding soldering foil.
2. Apply flux to all pins of the FLAT PACKAGE IC.
3. Solder the pins, sliding the soldering iron in the direction of the arrow.
13.1.4. How to Remove a Solder Bridge

1. Lightly resolder the bridged portion.
2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.
53
13.2. Terminal Guide of the ICs, Transistors and Diodes

13.2.1. Base Unit
4
Cathode C
(Reverse View) 5
8
1 88 67 B
66
2 1
4 E
3 1
Anode
22 45
23 44
2SC6054JSL
C0DBEYY00102 DY2J25000L C2HBCY000151 PNWIGD220LAH B1ABDM000001
C Cathode
E Anode Cathode
E C Anode
C B
B
2SA1776P DSC7003S0L DA2J10100L B0EDER000009 B0ECKM000008
13.2.2. Handset
5 1
8 B
(Reverse View) (Reverse View)
E
89 pin Cathode
4 88 67
1 (GND)
B1ADGE000012 1 66 Anode
B1ABGE000011
B1ADCF000040 22 45
23 44
C3FBLY000162 2SC6054JSL
PNWIGDA20LAR UNR9216J0L C1CB00003837 B3ACB0000216
54
14 Schematic Diagram
14.1. For Schematic Diagram
14.1.1. Base Unit (Base Unit (Main))
Notes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.
Important Safety Notice:

Components identified by mark have special characteristics important for
safety. When replacing any of these components, use only the manufacture's
specified parts.
2. The schematic diagrams may be modified at any time with the development of new technology.
14.1.2. Handset (Handset (Main))

Notes:
1. DC voltage measurements are taken with an oscilloscope or a tester with a ground.
2. The schematic diagrams may be modified at any time with the development of new technology.
55
14.2. Base Unit (Main)

14.2.1. KX-TGD210
RF Block
ANT1
ANT-
2
Pattern
MSL
Wm=0.4mm
1
ANT1_Short GND C872 Lm=10mm

RXn
1.3p C895
2p
C863
C820
C873 C871
1.5p
1.5p
2.7n
L803
ANT1_S-GND 2p 1.5p
SHORT3 SHORT
SHORT6
15p
C874
SHORT1
SHORT
SHORT2
GND GND SHORT
RXp
GND
SHORT
GND GND GND GND GND
W 0.2mm W 0.15mm
L 3.8mm L 6.2mm SL SL SL GND
1st layer 1st layer MSL
W=0.3mm W=0.3mm W=0.3mm W=0.25
C819 L=12.45mm L=6.95mm L=6.5mm L=2mm
TXp
10p
Tx-balun
C810
1.5p
SL SPN (1)
W=0.3 MSL
W=0.25
L=40mm L=2mm SPP (2)
K
SL
C478 NC
C477 NC
NC
NC
open-stub open-stub open-stub
SHORT
TXn
W=0.2mm SL SHORT4
L=20mm SL SL
D473
D472
W=2.9mm
A
W=2.0mm W=2.2mm
L=3.8mm L=10.8mm L=5.0mm Pre-matching
SHORT5
VBAT
SHORT
C811
10p
X501
GND (3)
10p
13.824M
TXn
C508
TXp
RXp (4)
RXn
(5)
TO RF BLOCK (6)
10u
C513 2.2u
VBAT
C511
(7)
44
43
42
41
40
39
38
(8)
TXn
TRSW_n
ANT
VCC_FE
VDD_IF
VCC_IF
VDD_APU
45
46 TXp
47 RXp
48 RXn
49 GND_RF (9)
*WBX01 NC 50 TRSW_p
GND ANT_n
PARALLEL WIRE 51
52 ATST_n
53 ATST_p
54 TEST
+3.0V RSTN 55 RSTN
C515
1u
56 NC
VBAT STM/CKM/P15 C516 0.1u 57 VCC_VCO
*R507
NC
9 58 GPIO[27]
KEYIN2 C517 0.1u 59 VDDUSB
KEYIN2 DM_USB/GPI28
KEYS_C
KEYS_C 60
KEYIN1 C518 0.1u 61 DP_USB/GPI29
KEYIN1 VDDC1
KEYS_E
KEYS_E JTAG_TDO 62
KEYIN3 JTAG_TDI 63 JTAG_TDO
KEYIN3 JTAG_TDI (10)
KEYS_D JTAG_TCK 64
GPIO[1]/SDA_IIC
GPIO[0]/SCL_IIC
KEYS_D JTAG_TCK
ANS_LED *R651 NC JTAG_TMS 65
JTAG_RTCK 66 JTAG_TMS
MSG_LED JTAG_RTCK
ANS_LED
10k
10k
10k
10k
LED_VDD VDDC GPIO[2]

GPIO[3]
GPIO[4]
GPIO[5]
GPIO[6]
NC
NC
NC
1 *Q651 +3.0V
R506
R502
R503
R504
NC
(11)
67
68
69
70
71
72
*R652 NC 73
*C650
*C651
*C652
MSG_LED (12)
2 1
*Q652
*SW1 NC
MSG_LED
EEP_SDA
ANS_LED
EEP_SCL
EEP_WP
SPI_DI
(13)
URX
UTX
JTAG_TDO
RTCK JTAG_RTCK
JTAG_TCK
JTAG_TMS
JTAG_TDI
*C601 NC
(14)
*IC601 (15)
NC
UGND
URX
TMS
UTX
TCK
TDI
1 *CS VCC8 (16)

2 *HOLD/IO37
DO/IO1 (17)
3 *WP/IO2 CLK 6 (18)
4 GND DI/IO0 5 (19)
(20)
(21)
NC: No Components
56
+3.0V
R160
Rx Tx Q141
REFERENCE
E
1XX : TEL LINE
820
R176
3XX : POWER, CHARGE
R162
27k
R165 27k
NC
C167 R168
1k
B
1000p 4.7k
Q161 4XX : MIC, SP
C161
R141
10u
C 5XX : BBIC
B
10M
C164
E 6XX : FLASH, EEPROM, KEY, LCD
100k
C142 K0.01u
C176 1u
2.7k (3216)
7XX : FOR DK/BT
R175
3.9k
D142 25V
R142
NC
K
R131
8XX : RF
C173
D143
R172 680k R177 R164
A
0.1u 1k 2.7k
C175 560p C101 680p
R151
0.033u
0.022u
C171
100k Q142 D101
C L1T
K0.01u
Q171 B 1 2
0.01u
330k
130k
(1) (YELLOW)
SA101 270V
39
2.2k
E
C178
2
4 3
(2)
R171
R163
R133
R152
C152
220
C132
R145
1
+5.5V C102 680p L1R
(GREEN)
C115 P101 22
R331
68k
NC 1
C331 NC
C184
R115
R332
1u
33k
C181
NC
NC
(3)
12p
R121 390k C121 680p
R122 390k C122 680p

C509
(4) Caller ID +5.5V +5.5V

!
(5) F301
(6) 3.0A DCP
VDDC
HOOK
1u
R111
R112
R371
100k
100k
+3.0V
D133
C510
C120
1
C507
2.2u
0.047u
0.047u
R372
(7) 1000p
R114
DCM
1
47k
BELL
C111
C112
1SR154
+3.0V+3.0V
A
Q111
D362
VCCA
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
(8) R501 10 CHG+
K
VBAT_APU
XIN
XOUT
DCINS
PWM0
PWM1
SPOUTP
VCCPA
SPOUTN
LOUT
HSSPOUTP
MPWR
HSMIP
HSMIN
MIP
10k
K
K0.68u
VREF VCCA
D113
C113
C505 10u CHARGE+
R113
A
22
MIN 21 C506
VCCA 20 1u
C351
VREF
D361
1u
19
NC
(9) DCIN3/LIN1 RA151
18 4 CHARGE-
1
Bell
A
DCIN2 17 3.0V
DCIN1 16 2 3
DCIN0/LIN0 15 1k
DOUBOUT 14
*IC501 DOUBCAPP1 VBAT +5.5V
C503
13
10u
GND
DOUBCAPP 12 C504 1u
DOUBCAPN 11 C521 1u IC302
DOUBCAPN1 10 L501 2
VBAT OUT1 IN 3
9 C502 C501 100n 4
COREOUT OUT2
8 10u 0.1u
330u
R322
0.1u
100
VDDC2 ADJ
6.3
7
1u
GPIO[26] 6 HOOK 1
GPIO[25] 5 BELL
C342
C321
C341
GPIO[24] 4 KEYS_E
R321
(10)
140
GPIO[23] 3 KEYS_D
GPIO[22] 2 KEYS_C
GPIO[21] 1 UTX
GPIO[20] VDDC URX
GPIO[10]
GPIO[11]
GPIO[12]
GPIO[13]
GPIO[14]
GPIO[15]
GPIO[16]
GPIO[17]
GPIO[18]
GPIO[19]
VDDIO1
VDDIO2
GPIO[7]
GPIO[8]
GPIO[9]
VDDC
+3.0V
(11)
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
R510
(12)
10k
1.2V
C519
0.1u
C520
0.1u
SPI_CLK
SPI_DO
SPI_CS
SPI_DO KEYIN1
SPI_DI KEYIN2
SPI_CS KEYIN3
(13)
SPI_CLK
EEP_WP
EEP_SCL
EEP_SDA
+3.0V +3.0V
RA611
C611 0.1u 3.3k
(14)
(15)
5
8
7
6
*IC611
(16)
1
2
3
4
1 A0 VCC8 ZA1
(17) 2
NC
A1 WP7
10 9 8 7
PNLB2317ZA-GW
(18) 3 A2 SCL 6 HAK_CL1
11 6
(19) 4 GND SDA 5 PCB
GND 12 5
(20) RE1
(21) 1 2 3 4
GND
NC: No Components
KX-TGD210AG1 SCHEMATIC DIAGRAM (Base Unit_Main)
57
14.3. Handset (Main)

Charge Current VBAT
VBAT
!
F1 2.5A
BATT+
C6
K0.1u (1)
C1
(2)
GND
SOCp 6.3V
BATT- 220u
R45 C15
0.1 J39p SHORT
SOCn GND
To Battery
OJ4
GND
* When "SFR" command is executed,
13.824MHz frequency will be output.
EEP_WP
LCD_CD
LCD_SCL
LCD_SID
KEY_LED
KIN_1
KIN_2
KIN_3
KIN_4
STB_F
Q2
C19
K1000p
CHG+
R9 R2
30k 30k
CHG+
C5 R84.3 CP3V
R7 (3216)
K0.1u 820 Q3
To Charge
Terminal C69
Q4
GND K0.1u CKM
RA5
CHG- 1 A0 3.3k
VCC 8 (3)
R6
GND 10k 2 A1 WP 7 (4)
Q9 3 A2 SCL 6 C57 (5)
4 VSS K0.1u
SDA 5
GND
CHARGE_CTRL GND
IC7 +1.8V GND
STM
CHARGE_DET
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
+1.8V
(6)
P0_3/SCL2/URX2
P0_4/SPI_EN
P0_5/SPI_CLK
P0_6/SPI_DO
P0_7/SPI_DI/PWM1
P2_6/WTF_IN
P1_1/INT1/LE
P1_2/INT2/SK
P1_3/INT3/SIO
P1_4/INT4/TDOD
P1_5/INT5/RDI/VDDE
P2_7/BXTAL
VDD1
QSPI_IO0
QSPI_SCK
QSPI_IO3
R60 R61
1k 67 P0_2/SDA2/UTX2
NC
68 P0_1/URX/PWM0
UTX 69 P0_0/UTX
70 VDD2
URX C44 71 *RSTn
JTAG K0.1u RST72 JTAG
LCD_CS 73 P2_5/PCM_FSC/SF
GND
EEP_WP 74 P2_4/SCL1/PCM_DO/DP3
GND 75 P2_3/SDA1/PCM_DI/DP2
LCD_RESET
LCD_LED0
76
77
P2_2/PCM_CLK/CLK100 IC1
WLED_CUR_0
78 GND
WLED_CUR_1
79 P2_1/ECZ2/PWM1/LED4
80 P2_0/ECZ1/PWM0/LED3
for TGC Not Used Not Used Not Used Not Used Not Used 81 LDORF_CTRL
C45 82
P3_5/RINGOUT/RINGING
K0.1u VDD3
for TGD
TX _RF 83 RFP0n
SHARP 0 AST FLASH SP LEFT C46 84
TO RF BLOCK 10p RF_SUPPLY2
85 RF_SUPPLY_PA
KIN_4
P3_4/PARADET
RF_TXn 86 RF_TXn
RF_SUPPLY1
for TGC Not Used Not Used Not Used SOFT_A1 87
P3_2/CIDINp
RF_TXp RF_TXp
P3_6/RINGn
P3_7/RINGp
AVD_XTAL
88 RFP2 AVS_XTAL
REF_RES
RF_RXn
RF_RXp
VREFp
for TGD
XTAL2
3 2 1 UP SOFT_A2 89 XTAL1
RFP1
RFP0
RF_RXn VBAT
RF_RXp
KIN_3
(7)
10
C43 D10p 11
12
13
14
15
16
1
2
3
4
5
6
7
8
9
for TGC Not Used

F56k
R20
Not Used Not Used Not Used Not Used C866 (8)
C47
K0.1u
1u
Not Used
GND RX _RF
for TGD
TALK1 X1
6 5 4 INT 10.368M
TALK2 GND
KIN_2
for TGC Not Used Not Used Not Used SOFT_C1
1Vp-p
for TGD 9 8 7 DOWN SOFT_C2 RIGHT
KIN_1 0.85V
0V
STB_C
STB_D
STB_C
STB_D
STB_A
STB_B
STB_E
STB_B
STB_E
STB_F
(9)
KEY_LED
LCD_CD
LCD_SID
LCD_RESET
LCD_SCL
LCD_LED0
LCD_CS
CP4V CP3V
LCD B/L LED KEY B/L LED
(TGD = White) (TGC = Amber) (TGC/TGD = Amber)
*LED3 Amber
(WP = NC)
C63 NC R53 3.3k
C62 NC R52 10k
C64 NC R54 330
C65 NC R55 330

C61 NC R51 10k
+
*LED9
*LED8
*LED7
*LED4 .
*LED1 .
*LED2 .
*LED6 .
*WLED C92 C94

16V K1u 16V K1u
*LED5
- C96
16V K1u
16V K1u
K1u
*C77 *C76 C91
C93
C95
NC NC 16V K1u
*RA1 *RA2 *RA3
NC 680 680
GND GND
GND
1 LCD
2 LCD
3 LCD
4 LCD
5 LCD
6 LCD
7 LCD
8 LCD
9 LCD
10 LCD
11 LCD
12 LCD
13 LCD
14 LCD
15 LCD
*R15
*Q6
1.5k
VLCD
VB0+
VB1+
VSS
VSS
CS1
SCK
SDA
GND
VDD
RES
GND
VB0-
VB1-
NC: No Components
A0
GND
58
(1)
(2)
RF BLOCK
RX-balun *open-stub
MSL SLx2
W=0.170mm W1=0.2mm
L=3.6mm L1=3.3mm MSL
ANT-Short 50 ohm line S=0.125mm W2=0.7mm W=0.25mm
OJ5
L=2mm
SHORT
ANT-Short-GND L=2mm L2=5.0mm
RF_RXn
ANT1_TP
C863
GND
C862
1.8p
1.5p
GND
MSL RX_RF
W=0.25mm
OJ1 L=2mm
50 ohm line SHORT
RF_RXp
Total L=4mm
OJ7
SHORT
+1.8V MSL
SL SL
W=0.3mm W=0.3mm GND GND W=0.25mm
C859 L=6.95mm L=6.5mm L=5mm
RF_TXn
IC4 10p TX-balun
SL
C860
C56
1.1p
K1u 1 *CS VCC 8 open-stub open-stub open-stub W=0.3mm MSL
2 DO/IO1 7 C41 SL SL SL SL L=39.0mm W=0.25mm TX_RF
K0.1u W=0.2mm W=2.9mm W=2.0mm W=2.2mm OJ2 L=5mm
*HOLD/IO3 L=2.8mm L=10.8mm L=5.0mm
3 *WP/IO2 CLK 6 L=20.0mm SHORT
RF_TXp
GND 4 GND DI/IO0 5 LPF
GND
(3) POWER
for TGC VBAT
(4)
(5) OJ3
SHORT
Not Used open-stub

CP4V
CP4V SL
Not Used W=0.6mm
L=20.0mm
CP3V
OFF1
C52 K1u
OFF2
C55 for TGD
50
49
48
47
46
45
D10p GND CP3V

(6)
VDDIO_QSPI
QSPI_CS
QSPI_IO1
QSPI_IO2
P1_6/PON
CP_VOUT2
C53
K2.2u
CP_VOUT1 44 C30
K1u GND
CP_C2y 43
VBAT
CP_VBAT2 42
C191
CP_C1y 41 C29 K1u
CP_C2x 40 K1u VBAT
39 C59
CP_C1x
CP_VBAT1 38 K1u Sp-phone RX C72 D13
37 NC NC
P3_0/DP0/PAOUTn +
VDDPA 36 C73 D14 SP-PHONE_SPEAKER
35 NC NC
P3_1/DP1/PAOUTp -
34 CHARGE_DET
P1_7/CHARGE C98 C99 R76 R77
33 CHARGE_CTRL D10p SL
CHARGE_CTRL D10p 1 1
32 C79 C78 W=0.15mm
VBAT L=6.3mm :3.6nH + 0.4nH
31 C190 K2200p K2200p
DC_CTRL
DC_I 30 K0.1u GND GND GND GND FbB"C
29 SOCn GND GND GND GND 9mm2 :1.75pF
DC_SENSE
SOCn 28 C36 LC
27 J39p SOCp
SOCp
P1_0/INT0/ADC1 26
25 STB_A
P3_3/ADC0
CIDOUT/MICn
24 R110k
CIDINn/MICp
LDO_CTRL
VDD/AVD 23 (MAX500mA)
VREFm
+1.8V
LSRp
LSRn
MICh
1.8V
C22 Q1
(7) 1.8V K1u
RCV+
17
18
19
20
21
22
C70 D21
GND RECEIVER+ 68p NC
+
(8) C71 D22
68p NC
RECEIVER
C13 K0.1u
C11 K0.1u
-
GND RECEIVER-
RCV- SL
Handset RX W=0.15mm
L=6.3mm :3.6nH + 0.4nH
GND GND FbB"C

R23 GND GND 9mm2 :1.75pF
MIC_POWER 1k
RA7 820
2 3
1 4 C12
K2.2u
MIC+
GND MICp
MIC AP1
MICn
MIC-
Handset TX/Sp-phone TX
(9)
ZA1 NC
10 9 8 7
11 6
Test Pattarn for Pattern Test Pattarn for Carbon PNLB2319xx-LV
12 5
HAK_CL1 CARBON_CL1
*PCB
1 2 3 4
RE1
GND
NC: No Components
KX-TGDA20AG1 SCHEMATIC DIAGRAM (Handset_Main)
59
Memo
60
15 Printed Circuit Board

15.1. Base Unit (Main)
ANS_LED
MSG_LED
LED_VDD
KEYS_C
KEYS_E
KEYS_D
KEYIN2
KEYIN1
KEYIN3
R163
C161
R652
R651 C152 R151 R160 C164
C652
C650 C651 Q651
Q652
R152
PNLB2317Z
C142
R162
R165 R177
D143
D142
Q161
PCB
Q141
R133
R131 P101
Q142
C184
R142
C132
R145
R141
- +
C102
R502
C519
R504
R503
D101 C520
R510
C101
~ ~ R506
SW1
C502
C518
R507
C501
L501
C517
IC501
C504
C516
L803
C874
C521
C122
C121
C895
D133
C871
C872
C873
C503
C863
C819
RA151
C820
R122
R121
C506
C505
C181
10
C8
R501 R332
C511
C331
C507
R331 C510
C509 C508
X501
C341
C811
+ -
D361
D362
D472 D473
C477 C478
HAK_CL1
KX-TGD210 MAIN BOARD (Base Unit (Component View))
61
15.1.2. Bottom View

for JIG
}
UTX
URX
UGND
UTX +5.5V
C171
C167
URX UGND
PNLB2317Z
R168
R164
C173
R172
PCB
C175
C178
Q171
R171
R175
C176
IC611
ANT1_S-GND
R176
ANT1_Short
RA611
TMS
TD0
C611
+3.0V
+3.0V
R112
L1R
TDI
TCK
RTCK
C112
BRN
VDDC VDDC R115
R114
R111
SA101
TEL
STM/CKM/P15 Q111
C111 LT1
STM/CKM
R113
C515 YLW
IC601 C113 C115
RSTN
D113
GAP1
ANT1
C601
C120 VREF
- GRY
DCM
C513
VCCA
DC
!
F301
DCP
C321
R371 + PUR
IC302
R372
R322
C342
+
C351
R321
CHG
ORG
BLU
-
A +
SP
-
KX-TGD210 MAIN BOARD (Base Unit (Bottom View)
62
15.2. Handset
ANT-Short
ANT-Short-GND
LCD_RESET
LCD_SCL
UE
LCD_SID
LCD_CS
LCD_CD
BL
AN
W
T1
LE
_T
P
E
NG
C62 C64 C96 C77 C76
RA
C92 C94 C95
O
C61 C63 C91
O
C65 C93
RA
NG
R55
D21
E
ER
C70
R52
R53
R54
R51
IV
CE
RE
C71
D22
G
CP3V
RE
EN
C79
C73 D14 BLUE
SP-PHONE_SPEAKER
R76
RA5
R77
C72 D13
C78
C69 ORANGE
C52
C56
C57
STM C55
C53 C29
R60 C30 IC4 C41

C44
RST C191 C99
JTAG R61
C45 IC1 C59 C98
CP4V
C860 C46 C190
C36 R1
C863 C22 Q1 1.8V

C47 C13 C11
C859 C43
C862 R20
C12
R23 RA7
STB_E
–
R15
KEY_LED
X1
Q6
RA3
RA2
C1
CKM
+
C866
STB_D
POWER
PNLB2319Z
PbF
KIN_3
STB_C
STB_A STB_B
KIN_2 MIC+ RCV-
CHG_CTRL
MIC- RCV+
Q9
Q4
R6
Q2
R2 C19 KIN_1
R9
R8 C15 R45
CHG+
CHG (+)
Q3 URX
URX UTX
UTX for JIG
C6
F1
GND
VBAT GND
BATTERY
BATT+ BATT+ BATT-
BATT-
KIN_4
CHG-
R7
CHG (-)
A C5
KX-TGDA20 HANDSET BOARD (Component View)
63
15.2.2. Bottom View
LCD
UP
LEFT RIGHT
DOWN
LED3 LED5
LED2 LED1
LED4 LED6
CARBON_CL1
A
MIC
KX-TGDA20 HANDSET BOARD (Bottom View)
64
16 Exploded View and Replacement Parts List

16.1. Cabinet and Electrical Parts (Base Unit)
16.1.1. KX-TGD210
4 3
PCB1
Ref.No. Figure
A
2.6 x 8mm
65
16.2. Cabinet and Electrical Parts (Handset)

CUSHION RUBBER
*STICK IT WITHIN THE FRAMEWORK ON P.C.B.
E104
E103
104
E102
E101
115
103 105
102 E105
101
116 117
MIC100
PCB100
106
107
114
112
110
109 113 (*3)
108
(*2)
105
Battery cover
111
Spacer (No.113)
Stick it between
Ref.No. Figure ribs.
B
φ 2× 8 mm Put it in the center.
Note:
(*1) This cable is fixed by welding. Refer to How to Replace the Handset LCD (P.43).
(*2) The rechargeable Ni-MH battery HHR-4MY is available through sales route of Panasonic.
(*3) Attach the SPACER (No. 113) to the exact location described above.
66
16.3. Cabinet and Electrical Parts (Charger Unit)
200
200-1
200-5
200-3
200-2
200-4
67
16.4. Accessories and Packing Materials

16.4.1. KX-TGD210AG1
A4
A3
A2 A1
P1
68
16.4.2. KX-TGD212AG1
A103
A101
A104
A102
P101
69
16.5. Replacement Parts List 16.5.1.2. Main P.C. Board Parts

1. RTL (Retention Time Limited) Note:
(*1) When replacing IC601, C611 or X501, make the
Note:
The “RTL” marking indicates that its Retention Time is adjustment using PNZZGD210AG1. Refer to How to
Limited. download the data (P.49) of Things to Do after
When production is discontinued, this item will Replacing IC or X'tal (P.49).
continue to be available only for a specific period of (*2) When replacing IC501, refer to How to Replace the
time. Flat Package IC (P.52).
This period of time depends on the type of item, and
the local laws governing parts and product retention. Safety Ref. Part No. Part Name & Description Remarks
No.
At the end of this period, the item will no longer be
PCB1 PNWPGD210AGH MAIN P.C.BOARD ASS'Y
available. (RTL)
2. Important safety notice (ICs)
Components identified by the mark indicates special IC302 C0DBEYY00102 IC
IC501 C2HBCY000141 IC (*2)
characteristics important for safety. When replacing any
IC611 PNWIGD220LAH IC (EEPROM)(*1)
of these components, only use specified manufacture's (TRANSISTORS)
parts. Q111 2SC6054JSL TRANSISTOR(SI) S
3. The S mark means the part is one of some identical parts. Q141 B1ACGP000008 TRANSISTOR(SI) S
Q142 B1ABDM000001 TRANSISTOR(SI) S
For that reason, it may be different from the installed part.
Q161 DSC7003S0L TRANSISTOR(SI)
4. ISO code (Example: ABS-94HB) of the remarks column Q171 2SC6054JSL TRANSISTOR(SI) S
shows quality of the material and a flame resisting grade (DIODES)
about plastics. D101 B0EDER000009 DIODE(SI) S
5. RESISTORS & CAPACITORS D113 DA2J10100L DIODE(SI)
D133 DA2J10100L DIODE(SI)
Unless otherwise specified;
D142 DY2J25000L DIODE(SI)
All resistors are in ohms (Ω) k=1000Ω, M=1000kΩ D362 B0ECKM000008 DIODE(SI)
All capacitors are in MICRO FARADS (μF) p=μμF (COILS)
*Type & Wattage of Resistor L501 G1CR10J00010 COIL
L803 G1C2N7Z00009 COIL
Type (RESISTOR ARRAYS)
ERC:Solid ERX:Metal Film PQ4R:Chip RA151 EXB24V102JX RESISTOR ARRAYS
ERDS:Carbon ERG:Metal Oxide ERS:Fusible Resistor RA611 EXB28V332JX RESISTOR ARRAYS S
ERJ:Chip ER0:Metal Film ERF:Cement Resistor (VARISTOR)
SA101 J0LE00000047 VARISTOR
Wattage
(RESISTORS)
10,16:1/8W 14,25:1/4W 12:1/2W 1:1W 2:2W 3:3W
R111 PQ4R10XJ104 100k S
*Type & Voltage Of Capacitor R112 PQ4R10XJ104 100k S
Type R113 ERJ3GEYJ103 10k S
ECFD:Semi-Conductor ECCD,ECKD,ECBT,F1K,ECUV:Ceramic R114 ERJ2GEJ473 47k S
ECQS:Styrol ECQE,ECQV,ECQG:Polyester R121 ERJ3GEYJ394 390k S
ECUV,PQCUV, ECUE:Chip ECEA,ECST,EEE:Electlytic R122 ERJ3GEYJ394 390k S
ECQMS:Mica ECQP:Polypropylene R131 PQ4R18XJ106 10M S
R133 ERJ3GEYJ334 330k S
Voltage
ECQ Type ECQG ECSZ Type Others R142 PQ4R18XJ272 2.7k S
ECQV Type R145 ERJ2GEJ222 2.2k S
1H:50V 05:50V 0F:3.15V 0J :6.3V 1V :35V R151 ERJ2GEJ104 100k S
2A:100V 1:100V 1A:10V 1A :10V 50,1H:50V R152 ERJ2GEJ134X 130k S
2E:250V 2:200V 1V:35V 1C :16V 1J :16V R160 ERJ3GEYJ821 820 S
2H:500V 0J:6.3V 1E,25:25V 2A :100V
R163 D0GG390JA007 39
16.5.1. Base Unit R164 ERJ3GEYJ272 2.7k S
16.5.1.1. Cabinet and Electrical Parts R168 ERJ3GEYJ472 4.7k S
R171 ERJ2GEJ221 220 S
R172 ERJ2GEJ684 680k S
Safety Ref. Part No. Part Name & Description Remarks R175 D0GA392JA015 3.9k S
No. R176 ERJ2GEJ102 1k S
1 PNKM1547W3 CABINET BODY ABS-HB R177 ERJ2GEJ102 1k S
2 K2ECYZ000002 JACK, DC R321 ERJ2RKF1400 140 S
3 PQJJ1T039H JACK, MODULAR R322 ERJ2RKF1000 100 S
4 PNKE1321Z3 CASE, CHARGE TERMINAL PS-HB R331 ERJ2RKF6802 68k S
5 PNJT1191Z CHARGE TERMINAL R332 ERJ2RKF3302 33k S
6 PNBC1562Z1 BUTTON, LOCATOR R371 ERJ8GEYJ1R0 1 S
7 PNKF1327Y2 CABINET COVER PS-HB R372 ERJ8GEYJ1R0 1 S
8 PQHA10023Z RUBBER PARTS, FOOT R501 ERJ3GEYJ100 10 S
CUSHION R502 ERJ2GEJ103 10k S
70
Safety Ref. Part No. Part Name & Description Remarks Safety Ref. Part No. Part Name & Description Remarks
No. No.
R510 ERJ2GEJ103 10k S 106 PNBC1560Y2 BUTTON, VOLUME KEY ABS-HB
(CAPACITORS) 107 PNJK1228W KEYBOARD SWITCH
C101 F1K2H681A008 680p S 108 PNMH1308Z GUIDE, SPEAKER
C102 F1K2H681A008 680p S 109 L0AD02A00026 SPEAKER
C111 F1J2A473A024 0.047 110 PNHS1502Z SPACER, SPEAKER NET
C112 F1J2A473A024 0.047 111 PQJC10056W BATTERY TERMINAL
C113 PQCUV1A684KB 0.68 112 PNKF1328Y2 CABINET COVER ABS-HB
C120 ECUE1H102KBQ 0.001 113 PNHS1079Z SPACER, BATTERY
C121 F1K2H681A008 680p S 114 PNKK1038X1 LID, BATTERY ABS-HB
C122 F1K2H681A008 680p S
C132 ECUV1H103KBV 0.01 16.5.2.2. Main P.C. Board Parts
C142 ECUV1H103KBV 0.01 Note:
C152 ECUE1C103KBQ 0.01 (*1) Reconfirm the model No. written on the handset's name
C161 F1K1E1060001 10
plate when replacing PCB100. Because the model No. of
C167 ECUV1H102KBV 0.001
C171 ECUV1C223KBV 0.022
the optional handset may differ from the included handset.
C173 ECUE1A104KBQ 0.1 (*2) When replacing IC7 or X1, make the adjustment
C175 ECUE1H561KBQ 560p using PNZZGD210AG1. Refer to How to download the
C176 ECUE0J105KBQ 1 data (P.49) of Things to Do after Replacing IC or X'tal
C178 ECUV1C333KBV 0.033
(P.49).
C184 ECUV1C105KBV 1
C321 ECUV1C105KBV 1 (*3) When replacing the handset LCD, See How to
C341 F2G0J331A146 330 Replace the Handset LCD (P.43).
C342 ECUE1A104KBQ 0.1 (*4) When replacing IC1, refer to How to Replace the Flat
C351 ECUV1C105KBV 1
Package IC (P.52).
C501 ECUE1A104KBQ 0.1
C502 ECJ1VB0G106M 10 S
C503 ECJ1VB0G106M 10 S Safety Ref. Part No. Part Name & Description Remarks
C504 ECUE0J105KBQ 1 No.
C505 ECJ1VB0G106M 10 S PCB100 PNWPDA20AG1R MAIN P.C.BOARD ASS'Y
C506 ECUE0J105KBQ 1 (RTL) (*1)
C507 ECUV0J225KBV 2.2 (ICs)
C508 ECUE1H100DCQ 10p IC1 C1CB00003837 IC (*4)
C509 ECUE1H120JCQ 12p IC4 C3FBLY000162 IC
C510 ECUE0J105KBQ 1 IC7 PNWIGDA20LAR IC (EEPROM)(*2)
C511 ECJ1VB0G106M 10 S (TRANSISTORS)
C513 ECUV0J225KBV 2.2 Q1 B1ADGE000012 TRANSISTOR(SI)
C515 ECUE0J105KBQ 1 Q2 B1ADCF000040 TRANSISTOR(SI)
C516 ECUE1A104KBQ 0.1 Q3 B1ABGE000011 TRANSISTOR(SI)
C517 ECUE1A104KBQ 0.1 Q4 B1ADCF000040 TRANSISTOR(SI)
C518 ECUE1A104KBQ 0.1 Q6 2SC6054JSL TRANSISTOR(SI) S
C519 ECUE1A104KBQ 0.1 Q9 UNR9216J0L TRANSISTOR(SI) S
C520 ECUE1A104KBQ 0.1 (LEDS)
C521 ECUE0J105KBQ 1 LED1 B3ACB0000216 LED
C611 ECUE1A104KBQ 0.1 LED2 B3ACB0000216 LED
C810 F1G1H1R5A765 1.5p LED3 B3ACB0000216 LED
C811 ECUE1H100DCQ 10p LED4 B3ACB0000216 LED
C819 ECUE1H100DCQ 10p LED5 B3ACB0000216 LED
C820 F1G1H1R5A765 1.5p LED6 B3ACB0000216 LED
C863 F1G1H1R5A765 1.5p (RESISTOR ARRAYS)
C871 F1G1H1R5A765 1.5p RA2 EXB28V681JX RESISTOR ARRAYS
C872 F1G1H1R3A765 1.3p RA3 EXB24V681JX RESISTOR ARRAYS
C873 F1G1H2R0A765 2p RA5 EXB28V332JX RESISTOR ARRAYS S
C874 ECUE1H150JCQ 15p RA7 EXB24V821JX RESISTOR ARRAYS
C895 F1G1H2R0A765 2p (RESISTORS)
(OTHERS) R1 ERJ2GEJ103 10k S
F301 K5H302Y00003 FUSE R2 ERJ2GEJ303 30k S
P101 D4DAY220A022 THERMISTOR R6 ERJ2GEJ103 10k S
SW1 K0H1BA000259 SPECIAL SWITCH R7 ERJ2GEJ821 820 S
X501 H0J138500011 CRYSTAL OSCILLATOR R8 ERJ8GEYJ4R3V 4.3 S
(*1) R9 ERJ2GEJ303 30k S
R15 D0GA152JA021 1.5k S
16.5.2. Handset R20 D0GA563ZA006 56k
R23 ERJ2GEJ102 1k S
16.5.2.1. Cabinet and Electrical Parts R45 D0GBR10JA113 0.1
Safety Ref. Part No. Part Name & Description Remarks R53 ERJ2GEJ332 3.3k S
No. R54 ERJ2GEJ331 330 S
101 PNGP1328Z2 PANEL, LCD PMMA-HB R55 ERJ2GEJ331 330 S
102 PNYE1128Z TAPE, DOUBLE SIDED R61 ERJ2GEJ102 1k S
103 PNKM1549Y3 CABINET BODY ABS-HB R76 ERJ2GEJ1R0 1 S
104 L0AD01A00029 RECEIVER R77 ERJ2GEJ1R0 1 S
105 PNYE1129Z SPACER, CUSHION LCD
71
Safety Ref. Part No. Part Name & Description Remarks 16.5.3. Charger Unit
No.
(CAPACITORS)
C1 EEE0JA221WP 220
16.5.3.1. Cabinet
C5 ECUV1C104KBV 0.1
C6 ECUV1C104KBV 0.1 Safety Ref. Part No. Part Name & Description Remarks
C11 ECUE1A104KBQ 0.1 No.
C12 ECUV0J225KBV 2.2 200 PNLC1056S1 CHARGER UNIT ASS'Y
C13 ECUE1A104KBQ 0.1 without NAME PLATE
C15 ECUE1H390JCQ 39p (RTL)(for KX-TGD212AG1)
C19 ECUE1H102KBQ 0.001 200-1 PNKM1550Y3 CABINET BODY PS-HB
C22 ECUE0J105KBQ 1 200-2 PNJT1147Z CHARGE TERMINAL
C29 ECUE0J105KBQ 1 200-3 PNKF1279Z1 CABINET COVER PS-HB
C30 ECUV1A105KBV 1 200-4 PQHA10023Z RUBBER PARTS, FOOT
CUSHION
C36 ECUE1H390JCQ 39p
200-5 PNLV233AGAZ AC ADAPTOR
C43 ECUE1H100DCQ 10p
C44 ECUE1A104KBQ 0.1 16.5.4. Accessories and Packing Materials
C46 ECUE1H100DCQ 10p 16.5.4.1. KX-TGD210AG1
C47 ECUE0J105KBQ 1
C52 ECUE0J105KBQ 1
C53 ECUV1A225KBV 2.2 Safety Ref. Part No. Part Name & Description Remarks
No.
A1 PNLV226AG0Z AC ADAPTOR
C56 ECUE0J105KBQ 1
C57 ECUE1A104KBQ 0.1 A2 PQJA10075Z CORD, TELEPHONE
C59 ECUE0J105KBQ 1 A3 PNKE1054Z1 HANGER, BELT CLIP ABS-HB
C69 ECUE1A104KBQ 0.1 A4 PNKL1001Y1 WALL MOUNT ADAPTOR ABS-HB
C70 ECUE1H680JCQ 68p P1 PNPK3840001Z GIFT BOX
C71 ECUE1H680JCQ 68p
C78 ECUE1H222KBQ 0.0022 16.5.4.2. KX-TGD212AG1
C79 ECUE1H222KBQ 0.0022
C91 ECUV1C105KBV 1
C92 ECUV1C105KBV 1 Safety Ref. Part No. Part Name & Description Remarks
No.
C93 ECUV1C105KBV 1
A101 PNLV226AG0Z AC ADAPTOR
C94 ECUV1C105KBV 1
A102 PQJA10075Z CORD, TELEPHONE
C95 ECUV1C105KBV 1
A103 PNKE1054Z1 HANGER, BELT CLIP ABS-HB
C96 ECUE0J105KBQ 1
A104 PNKL1001Y1 WALL MOUNT ADAPTOR ABS-HB
P101 PNPK3841001Z GIFT BOX
C191 ECUE0J105KBQ 1 16.5.5. Screws
C860 F1G1H1R1A765 CERAMIC CAPACITOR
Safety Ref. Part No. Part Name & Description Remarks
No.
A XTB26+8GFJ TAPPING SCREW
B XTB2+8GFJ TAPPING SCREW
(OTHERS)
F1 K5H252Y00002 FUSE
X1 H0J103500038 CRYSTAL OSCILLATOR
16.5.6. Fixtures and Tools
(*2) Note:
MIC100 L0CBAY000053 BUILT IN-MICROPHONE S (*1) See Equipment Required (P.44), and The Setting
E101 L5DYBYY00067 LIQUID CRYSTAL DISPLAY Method of JIG (P.44)
(*3)
E102 PNHR1953Z TRANSPARENT PLATE PMMA-HB
(*2) When replacing the Handset LCD, See How to
E103 PNHR1951Z GUIDE, LCD ABS-HB Replace the Handset LCD (P.43)
E104 PQHG10729Z RUBBER PARTS, RECEIVER
E105 PNHX1263Z COVER, LCD
E106 PNVE1002Z BATTERY TERMINAL
No.
E107 PNJT1195Z CHARGE TERMINAL (L)
PQZZ1CD300E JIG CABLE (*1)
E108 PNJT1196Z CHARGE TERMINAL (R)
PNZZGD210AG1 BATCH FILE CD-ROM (*1)
16.5.2.3. LED Board Parts PQZZ430PIR TIP OF SOLDERING IRON
(*2)
PQZZ430PRB RUBBER OF SOLDERING IRON
(*2)
No.
WLED B3AFB0000370 LED S
RAD
KXTGD210AG1
KXTGD212AG1
KXTGDA20AG1
72

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Configuration for each model

© Panasonic System Networks Co., Ltd. 2014

IMPORTANT SAFETY NOTICE

IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING

• ICs and LSIs are vulnerable to static electricity.

2.2. About Lead Free Solder (PbF: Pb free)

2.2.1. Suggested PbF Solder

0.3 mm X 100 g 0.6 mm X 100 g 1.0 mm X 100 g

2.3. Discarding of P. C. Board

Note for Service:

4.1.1. TDD Frame Format

DATA rate : 1.152 Mbps

4.1.2. TDMA system

Traffic Bearer Dummy bearer

4.1.3. Signal Flowchart in the Radio Parts

As for a handset RF, RF signal is received in one antenna.

As for a base unit RF, RF signal is received in two antennas.

Operational P.C. Board

KEYS Q161 R151,R152 R131, R133 D101

ANT1 TEL JACK

KX-TGD210/212 BLOCK DIAGRAM (Base Unit_Main)

4.3. Block Diagram (Base Unit_RF Part)

KX-TGD210/212 BLOCK DIAGRAM (Base Unit_RF Part)

4.4. Circuit Operation (Base Unit)

TDD & TDMA ADPCM

4.4.1. BBIC (Base Band IC: IC501)

4.4.2. EEPROM (IC611)

4.4.3. Power Supply Circuit/Reset Circuit

IC302 VBAT IC501 IC601

BBIC chip initialize

4.4.3.1. Charge Circuit

4.4.4. Telephone Line Interface

R172 C173 R177 R164 R161

0.1u 1k 2.7k 100k

C102 680p *P101 L1R

R121 390k C121 680p

R122 390k C122 680p

4.4.5. Parallel Connection Detect Circuit/Auto Disconnect Circuit

Parallel connection detection when off hook:

Pin 18 of IC501 C101

4.4.6. Calling Line Identification (Caller ID)/Call Waiting Caller ID

Single message format

month day hour minute number

Plural message format

DATA CODE NAME month day hour minute number

Call Waiting Caller ID

BBIC L1T Telephone "FSK"

4.6. Circuit Operation (Handset)

4.6.2. Power Supply Circuit/Reset Circuit

4.6.3. Charge Circuit

4.6.4. Battery Low/Power Down Detector

4.7. Signal Route

ICM PLAY TO IC601 - IC501(73/74 - 29/31) - SPEAKER

CALLER ID T/R(TEL LINE) - P101 - C121/C122 - R121/R122 - IC501(24/25)

BELL DETECTION T/R(TEL LINE) - P101 - R111/R112 - C111/C112 - Q111 - IC501(5)

RF part signal route

HANDSET RF IC1(86/87) - C859 - ANT

HANDSET RF ANT - IC(1/2)

BASE UNIT RF IC501(44/45) - C819 - C872 - ANT

BASE UNIT RF ANT - C872 - C895 - IC501(46/47)

5 Location of Controls and Components

H/S key operation H/S LCD