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Casting Analysis - 2

Solidification and cooling


Surface tension
Gas solubility and porosity

ver. 1

ME 6222: Manufacturing Processes and Systems 1


Prof. J.S. Colton © GIT 2011
Overview
• Processes
• Analysis
– Melting
– Pouring
– Solidification and cooling
– Surface tension
– Gas solubility and porosity
• Defects
• Design rules
• Economics

ME 6222: Manufacturing Processes and Systems 2


Prof. J.S. Colton © GIT 2011
Temperature vs. Time

Temperature
pouring

melting solidification

removal
initial
time

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Prof. J.S. Colton © GIT 2011
Heat Transfer Mechanisms
• Conduction
• Convection
– to a limited extent via h
• Radiation
– eb = sT4

ME 6222: Manufacturing Processes and Systems 4


Prof. J.S. Colton © GIT 2011
1D Conduction Heat Transfer

T T
y 2
 2
t x
x
T = temperature
t = time
2l  = thermal diffusivity

ME 6222: Manufacturing Processes and Systems 5


Prof. J.S. Colton © GIT 2011
Thermal Diffusivity ()


k

conductivity
  c density  specific heat 

2
  length
time

ME 6222: Manufacturing Processes and Systems 6


Prof. J.S. Colton © GIT 2011
Characteristic Time Constant (t)
y
2
l
t~
x

2l

l = characteristic dimension

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Prof. J.S. Colton © GIT 2011
Solidification

Temperature
pouring

melting solidification

removal
initial
time

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Prof. J.S. Colton © GIT 2011
Solidification time – Insulating mold
• Assumptions
– no thermal resistance at mold-metal
interface
– no temperature gradients in metal
– mold is semi-infinite medium with uniform
and invariant properties with temperature
gradients
– liquid metal conducts better than mold
material
• also compare thermal diffusivities, 

ME 6222: Manufacturing Processes and Systems 9


Prof. J.S. Colton © GIT 2011
Insulating mold
T
Air Mold Solid Liquid
Tmelting

T0

x=0

ME 6222: Manufacturing Processes and Systems 10


Prof. J.S. Colton © GIT 2011
Insulating mold

• To solve this we will equate heat flux into the


mold with that required to solidify the casting

q q
   
 A moldx 0  A casting

ME 6222: Manufacturing Processes and Systems 11


Prof. J.S. Colton © GIT 2011
Insulating mold
Conduction heat transfer equations

q T
  k mold Fourier’s law
A x

 2T 1 T 1D heat conduction

x 2  mold t
kmold
 mold  Thermal diffusivity
 mold cmold

ME 6222: Manufacturing Processes and Systems 12


Prof. J.S. Colton © GIT 2011
Insulating mold
Solution to 1D heat conduction eqn
 
T x, t   Tmelting  To  Tmelting   erf 
x 
2  t 
 mold 
2  
 
x
x3 x5 x7
erf  x  
2
 0
exp  2
u du   x     
  3  1! 5  2! 7  3! 

differentiating to obtain the temperature gradient

T Tmelting  T0   x2 
 exp  
x  mold t  4 mold t 
 
ME 6222: Manufacturing Processes and Systems 13
Prof. J.S. Colton © GIT 2011
Insulating mold
heat flux at the mold-metal interface

q T
    kmold
 A mold x0 x x 0

substitution yields

q
  
kmold  mold cmold
t

Tmelting  T0 
 A mold x0

effusivity(e)  kc
ME 6222: Manufacturing Processes and Systems 14
Prof. J.S. Colton © GIT 2011
Insulating mold
if the metal is cast at its melting temperature, then
the heat entering the mold is the latent heat of fusion

dQ dV dS
 castingDH f  castingDH f A
dt dt dt
• DHf = latent heat of fusion
• V = volume of solidified metal
• A = area of mold-metal interface
• S = thickness of solidified metal (x)

ME 6222: Manufacturing Processes and Systems 15


Prof. J.S. Colton © GIT 2011
Insulating mold
• Corresponding heat flux

q dS
    castingDH f
 A casting dt

ME 6222: Manufacturing Processes and Systems 16


Prof. J.S. Colton © GIT 2011
Insulating mold

• heat flux away from mold-metal interface = heat flux


to mold-metal interface due to solidification
q q
   
 A moldx 0  A casting
• so

k mold  mold cmold


Tmelting  T0   castingDH f dS
t dt
• Integrating from S = 0 and t = 0 to S = S and t = t

ME 6222: Manufacturing Processes and Systems 17


Prof. J.S. Colton © GIT 2011
Insulating mold

2  Tmelting  T0 
 k
S  mold cmold t
  castingDH f  mold

and S = V/A

- characteristic heat transfer length

ME 6222: Manufacturing Processes and Systems 18


Prof. J.S. Colton © GIT 2011
Solidification time
   DH 
2  2
  c f

1   V
t  k  c  A 
 4  Tm  T0  m m m

• Subscripts
– c = casting
– m = mold
• DHf = latent heat of solidification
• Tm = metal melting temperature
• T0 = initial mold temperature
ME 6222: Manufacturing Processes and Systems 19
Prof. J.S. Colton © GIT 2011
Inclusion of Superheating

• Increase latent heat of solidification DHf


by cpDT
– First approximation

   c DH f  c p DT   1
2
 V 
2

t      
 4  Tm  T0  km  mcm  A 

ME 6222: Manufacturing Processes and Systems 20


Prof. J.S. Colton © GIT 2011
Solidification time – Ex. 5-1

• You are sand casting a magnesium part with


dimensions of 10 cm by 10 cm by 2.5 cm.
The environment temperature is 25oC.
• Determine the time for the part to solidify if
the metal is poured at its melting point.
• Determine the time for the part to solidify if
the metal is poured at 50oC above its melting
point, so as to alleviate the potential problem
of short shots.

ME 6222: Manufacturing Processes and Systems 21


Prof. J.S. Colton © GIT 2011
Solidification time – Ex. 5-2
Material Specific heat Density Thermal
(kJ/kg-oC) (kg/m3) conductivity
(W/m-K)
Sand (solid) 1.16 1500 0.6

Magnesium 1.07
(solid) 1700 156

Melting point Latent heat of Specific heat


(oC) solidification (kJ/kg-K)
(kJ/kg)
Magnesium 650 384 1.38
(liquid)

ME 6222: Manufacturing Processes and Systems 22


Prof. J.S. Colton © GIT 2011
Solidification time – Ex. 5-3
• N.B. solidification is a phase change
that occurs at the melting point
• Insulating mold:
– kmold = 0.6 << kcasting = 156 W/m-K
– mold = 3.4 x 10-7 << casting = 6.6 x 10-5 m2/s
• Solidification time:
   DH 
2  2
  c f

1   V
t  k  c  A 
 4  Tm  T0  m m m

ME 6222: Manufacturing Processes and Systems 23
Prof. J.S. Colton © GIT 2011
Solidification time – Ex. 5-4

• DHf = 384 kJ/kg


• c = 1700 kg/m3
• Tm = 650oC
• To = 25oC
• km = 0.6 x 10-3 kW/m-K
• m = 1500 kg/m3
• cm = 1.16 kJ/kg-K

ME 6222: Manufacturing Processes and Systems 24


Prof. J.S. Colton © GIT 2011
Solidification time – Ex. 5-5

• V = 0.1 x 0.1 X 0.025 = 2.5 x 10-4 m3


• A = 2 x (0.1 x 0.1) + 4 X (0.1 x 0.025) =
0.03 m2
• (V/A) = 8.33 x 10-3 m
• (V/A)2 = 6.94 x 10-5 m2

ME 6222: Manufacturing Processes and Systems 25


Prof. J.S. Colton © GIT 2011
Solidification time – Ex. 5-6

• So

   1700 384 2 
t   3
1
 6.94  105

 4  650  25  0.6  10  1500 1.16 

• t = 57 s

ME 6222: Manufacturing Processes and Systems 26


Prof. J.S. Colton © GIT 2011
Solidification time – Ex. 5-7
• Now, we have to take into account
cooling the liquid from (650 + 50)oC to
650oC
• So, the latent heat of solidification (DHf)
will be increased by cpDT

   c DH f  c p DT  2 1  V 
2

t      
 4  Tm  T0  km  mcm  A 
ME 6222: Manufacturing Processes and Systems 27
Prof. J.S. Colton © GIT 2011
Solidification time – Ex. 5-8

• For liquid magnesium


– cp = 1.38 kJ/kg-K
– DT = 50oC
• So
DHf = Hf + cpDT
= 384 + 1.38 x 50 = 453 kJ/kg

ME 6222: Manufacturing Processes and Systems 28


Prof. J.S. Colton © GIT 2011
Solidification time – Ex. 5-9
   c DH f  c p DT  2 1  V 
2

t      
 4  Tm  T0  km  mcm  A 

   1700 4532 
t   3
1
 6.94  105

 4  650  25  0.6  10  1500 1.16

t = 79 s (a bit slower)

ME 6222: Manufacturing Processes and Systems 29


Prof. J.S. Colton © GIT 2011
Solidification time – Ex. 5-10

• In both cases, we need to be careful


that the part does not freeze before
filling the mold (short shot).
• To be conservative, complete the pour
in 79 – 57 = 22 s
– superheating-allowed time

ME 6222: Manufacturing Processes and Systems 30


Prof. J.S. Colton © GIT 2011
Dimensions of a semi-infinite mold
• How big does a mold need to be to be
considered semi-infinite?
• We need T(L,t) = To
– where L = mold thickness
T
Tmelting Air Mold Solid Liquid

T0
x
L
x=0
ME 6222: Manufacturing Processes and Systems 31
Prof. J.S. Colton © GIT 2011
Semi-infinite mold
 
T x, t   Tmelting  To  Tmelting   erf 
x 
2  t 
 mold 
• Governing equation
• Reaches equilibrium when bracketed
term in erf() = 2 1.005
1
0.995

• Hence 0.99

 x  0.985

 2
0.98

2  t 
0.975
0.97

 mold 
0.965
0.96
1.4 1.6 1.8 2 2.2 2.4 2.6

ME 6222: Manufacturing Processes and Systems 32


Prof. J.S. Colton © GIT 2011
Semi-infinite mold

• Using the example before


• Tsand = 20 C
• Tsolidification = 650 C
• sand = 3.3 x 10-7 m2/s
• Time = 57 s, 79 s

ME 6222: Manufacturing Processes and Systems 33


Prof. J.S. Colton © GIT 2011
Semi-infinite mold
• So for t = 57 s
7
L  2  2  3.4 10 m / s  57s  18mm
2

• T = 79 s, L = 21 mm
• So, the mold needs to be at least that
thick for the semi-infinite mold assumption
to hold

ME 6222: Manufacturing Processes and Systems 34


Prof. J.S. Colton © GIT 2011
Conducting mold

• We can perform a similar analysis for


when the mold conducts as well as the
metal being cast and the interface
resistance dominates.
• Die casting is an example.

ME 6222: Manufacturing Processes and Systems 35


Prof. J.S. Colton © GIT 2011
Conducting mold
T
Air Mold Solid Liquid
Tmelting

T0

x=0

ME 6222: Manufacturing Processes and Systems 36


Prof. J.S. Colton © GIT 2011
Conducting mold

• To solve this we will equate heat flux into the


mold with that required to solidify the casting

q q
   
 A moldx 0  A casting

ME 6222: Manufacturing Processes and Systems 37


Prof. J.S. Colton © GIT 2011
Conducting mold
• Assumptions
– Mold-casting interface resistance
dominates
hinterface lcasting kcasting
Bi #  1 or hinterface 
kcasting S

ME 6222: Manufacturing Processes and Systems 38


Prof. J.S. Colton © GIT 2011
Conducting mold

• You should also check to see if the


mold is not insulating
– kmold ~ kcasting
– mold ~ casting
• If Biot and insulating mold tests are not
conclusive, mold may be relatively insulating
and it must also meet this condition
km mcm
h 2
interface 
t
ME 6222: Manufacturing Processes and Systems 39
Prof. J.S. Colton © GIT 2011
Conducting mold
Heat flux across the mold-metal interface into the
mold (Fourier’s law)
q
   hTM  T0 
 A  x 0

Heat flux due to solidification of casting

q dS
   castingDH f
 A casting dt

ME 6222: Manufacturing Processes and Systems 40


Prof. J.S. Colton © GIT 2011
Conducting mold
• heat flux away from mold-metal interface =
heat flux to mold-metal interface due to
solidification
q q
   
 A moldx 0  A casting

hTM  T0   casting DH f
dS
dt
• Integrating from S=0 and t=0 to S=S and t=t

ME 6222: Manufacturing Processes and Systems 41


Prof. J.S. Colton © GIT 2011
Conducting mold

TM  T0
S h t
 castingDH f

also S = V/A

ME 6222: Manufacturing Processes and Systems 42


Prof. J.S. Colton © GIT 2011
Conducting mold

casting DH f V
t
hTM  T0  A

ME 6222: Manufacturing Processes and Systems 43


Prof. J.S. Colton © GIT 2011
Inclusion of Superheating
• Increase latent heat of solidification DHf
by cpDT
– First approximation

 casting DH f  c p DT  V
t
h TM  T0  A

ME 6222: Manufacturing Processes and Systems 44


Prof. J.S. Colton © GIT 2011
Solidification time – Ex. 6-1
• You are die casting a magnesium part with
dimensions of 10 cm by 10 cm by 2.5 cm.
The initial iron mold is at 25oC. The overall
heat transfer coefficient is 200 W/m2-K
• Determine the time for the part to solidify if
the metal is poured at its melting point.
• Determine the time for the part to solidify if
the metal is poured at 50oC above its melting
point, so as to alleviate the potential problem
of short shots.

ME 6222: Manufacturing Processes and Systems 45


Prof. J.S. Colton © GIT 2011
Solidification time – Ex. 6-2
Material Specific heat Density Thermal
(kJ/kg-K) (kg/m3) conductivity
(W/m-K)
Iron (solid) 0.7 7900 73

Magnesium 1.07
(solid) 1700 156

Melting point Latent heat of Specific heat


(oC) solidification (kJ/kg-K)
(kJ/kg)
Magnesium 650 384 1.38
(liquid)

ME 6222: Manufacturing Processes and Systems 46


Prof. J.S. Colton © GIT 2011
Solidification time – Ex. 6-3

• DHf = 384 kJ/kg


• c = 1700 kg/m3
• Tm = 650oC
• To = 25oC
• km = 73 W/m-K
• m = 7900 kg/m3
• cm = 0.7 kJ/kg-K

ME 6222: Manufacturing Processes and Systems 47


Prof. J.S. Colton © GIT 2011
Solidification time – Ex. 6-4

• V = 0.1 x 0.1 X 0.025 = 2.5 x 10-4 m3


• A = 2 x (0.1 x 0.1) + 4 X (0.1 x 0.025) =
0.03 m2
• (V/A) = 8.33 x 10-3 m

ME 6222: Manufacturing Processes and Systems 48


Prof. J.S. Colton © GIT 2011
Solidification – Ex. 6-5
• Conducting mold? kcasting
hinterface 
S
156 kcasting
hinterface  200  3
 18,727  Yes!
8.33  10 S
• Insulating mold?

– kmold = 73 ~ 156 W/m-K = kcasting


– mold = 1.32 x 10-5 ~ 6.6 x 10-5 m2/s = casting

– Not insulating

ME 6222: Manufacturing Processes and Systems 49


Prof. J.S. Colton © GIT 2011
Solidification time – Ex. 6-6
• Solidification time
casting DH f V
t
• So hTM  T0  A

1700  384 3
t  8 .33  10
200  10 3  650  25

• t = 43.5 s

ME 6222: Manufacturing Processes and Systems 50


Prof. J.S. Colton © GIT 2011
Solidification time – Ex. 6-7

• Now, we have to take into account


cooling the liquid from (650 + 50)oC to
650oC
• So, the latent heat of solidification (DHf)
will be increased by cpDT

ME 6222: Manufacturing Processes and Systems 51


Prof. J.S. Colton © GIT 2011
Solidification time – Ex. 6-8

• For liquid magnesium


– cp = 1.38 kJ/kg-K
– DT = 50oC
• So
DHf = Hf + cpDT
= 384 + 1.38 x 50 = 453 kJ/kg

ME 6222: Manufacturing Processes and Systems 52


Prof. J.S. Colton © GIT 2011
Solidification time – Ex. 6-9

• So

1700  453 3
t  8 .33  10
200  10 3  650  25

t = 51.3 s (a bit slower)

ME 6222: Manufacturing Processes and Systems 53


Prof. J.S. Colton © GIT 2011
Solidification time – Ex. 6-10

• In both cases, we need to be careful


that the part does not freeze before
filling the mold (short shot).
• To be conservative, complete pour in
51.3 – 43.5 = 7.8 s
– superheating-allowed time

ME 6222: Manufacturing Processes and Systems 54


Prof. J.S. Colton © GIT 2011
Relatively insulating molds

• If the  test and the Biot number test


are not conclusive:

km mcm
h 2
interface 
t

• Where does it come from?

ME 6222: Manufacturing Processes and Systems 55


Prof. J.S. Colton © GIT 2011
Fourier’s law

q
 hequivalent  DT
A

1 1 t t
  
hequivalent hinterface ecasting emold

effusivity(e)  kc

ME 6222: Manufacturing Processes and Systems 56


Prof. J.S. Colton © GIT 2011
Effect of effusivity

• Consider casting aluminum in steel and


sand molds.
• Do the properties of the mold matter?

ME 6222: Manufacturing Processes and Systems 57


Prof. J.S. Colton © GIT 2011
Effect of effusivity
• Assume:
• hinterface for liquid metal = 1500 W/m2K
• hinterface for solid metal = 500 W/m2K
effusivity(e)  kc
• ealuminum(solid) = 22,000 J/m2Ks0.5
• ealuminum(liquid) = 24,000 J/m2Ks0.5
• esteel = 8,700 J/m2Ks0.5
• esand = 1,020 J/m2Ks0.5

ME 6222: Manufacturing Processes and Systems 58


Prof. J.S. Colton © GIT 2011
Effect of effusivity

• Determine hequivalent for four cases


• Aluminum in steel:
– 1 s, aluminum liquid
– 9 s, aluminum solid
• Aluminum in sand:
– 1 s, aluminum liquid
– 100s, aluminum solid
• sand molds cool slower

ME 6222: Manufacturing Processes and Systems 59


Prof. J.S. Colton © GIT 2011
Aluminum / steel mold
• t = 1 s, liquid aluminum
1 1 1 1 1 1
    
hequivalent 1,500 24,000 8,700 1215 hinterface

• t = 9 s, solid aluminum
1 1 3 3 1 1
    
hequivalent 500 22,000 8,700 463 hinterface

ME 6222: Manufacturing Processes and Systems 60


Prof. J.S. Colton © GIT 2011
Aluminum / sand mold
• t = 1 s, liquid aluminum

1 1 1 1 1
   
hequivalent 1,500 24,000 1,020 592

• t = 100 s, solid aluminum


1 1 10 10 1
   
hequivalent 500 22,000 1,020 330

ME 6222: Manufacturing Processes and Systems 61


Prof. J.S. Colton © GIT 2011
Effect of effusivity

• So, we can see that effusivity


overwhelms the interface resistance for
a sand (insulating) mold, but has little
effect on a steel (conducting) mold.

ME 6222: Manufacturing Processes and Systems 62


Prof. J.S. Colton © GIT 2011
km mcm
Relatively insulating mold h 2
interface 
t
• Steel mold, t = 1 s, liquid aluminum
2
– yes 8700
1500 2 
1
• Steel mold, t = 10 s, solid aluminum
2
8700
– yes 500 2 
10
• Sand mold, t = 1 s, liquid aluminum
– no 1500 21020 2
1
• Sand mold, t = 100 s, solid aluminum
– no
2
1020
500 2 
100
ME 6222: Manufacturing Processes and Systems 63
Prof. J.S. Colton © GIT 2011
Relatively Insulating

• We can see that the steel mold is not


relatively insulating, and meets the
criteria for a conducting mold
• We can see that the sand mold is
relatively insulating, and meets the
criteria for an insulating mold.

ME 6222: Manufacturing Processes and Systems 64


Prof. J.S. Colton © GIT 2011
Fluidity

• Archaic measure of viscosity and


cooling
• Distance metal flows before freezing

ME 6222: Manufacturing Processes and Systems 65


Prof. J.S. Colton © GIT 2011
Fluidity

ME 6222: Manufacturing Processes and Systems 66


Prof. J.S. Colton © GIT 2011
Non-isothermal flow
• Flow rate characteristic time constant:
– t = 1/t ~ V/Lx
• Heat transfer rate characteristic time constant:
– t = 1/t ~ /Lz2

Flow rate V  L2z V  Lz Lz


~  
Heat transferrate   Lx  Lx
• Small numbers give short shots
– thick runners or risers needed
– ratio should be greater than one for filling

ME 6222: Manufacturing Processes and Systems 67


Prof. J.S. Colton © GIT 2011
Non-isothermal flow

Magnesium
1 cm
10 cm/s
10 cm
Flow rate 10cm / s  0.5cm 0.5cm
~ 2
  0.36
Heat transferrate 0.7cm / s 10cm

So, a short shot may occur, as the flow rate


is smaller than the heat transfer rate.

ME 6222: Manufacturing Processes and Systems 68


Prof. J.S. Colton © GIT 2011
Chvorinov’s Rule

• Used to estimate solidification time


– for insulating molds
   DH 
2  2
 c 1  
V
t  k(V/A)2 t  f

 4  Tm  T0  k  c  A 
 m m m

– k = constant
• function of cast material, mold material, heat transfer
coefficients
– V = volume
– A = surface area
ME 6222: Manufacturing Processes and Systems 69
Prof. J.S. Colton © GIT 2011
Comparison of Shapes with Same
Volume

2
Shape Area Volume (V/A) (V/A)
cube 6 1 0.167 0.028
cylinder 5.54 1 0.181 0.033
sphere 4.84 1 0.207 0.043

ME 6222: Manufacturing Processes and Systems 70


Prof. J.S. Colton © GIT 2011
Risers

• Purpose: to supply metal to part to


make up for shrinkage, preventing voids
• Design issues:
– Risers must freeze after part
– Risers must feed a volume of metal equal
to the part’s shrinkage

ME 6222: Manufacturing Processes and Systems 71


Prof. J.S. Colton © GIT 2011
Use for riser design – insulating mold
2 2
V  V 
   
 A  riser  A casting

• So that riser freezes after casting


– Otherwise, shrinkage or porosity can result

ME 6222: Manufacturing Processes and Systems 72


Prof. J.S. Colton © GIT 2011
Riser design – insulating mold
• Insulated risers allow for smaller
dimensions
– Saves metal
• E.g., a riser insulated so it cools n times
slower than the casting (n>1)

2 2
V  V 
n     
 A  riser  A casting

ME 6222: Manufacturing Processes and Systems 73


Prof. J.S. Colton © GIT 2011
Riser design – conducting mold

• Similar to insulating mold

casting DH f V
t
hTM  T0  A
so
V  V 
n     
 A riser  A casting

ME 6222: Manufacturing Processes and Systems 74


Prof. J.S. Colton © GIT 2011
Riser design – Ex. 7-1
• You are casting housings for an alternator. The
housing is made from magnesium. For heat transfer
purposes, the casting can be considered to have V/A
= 5 mm. The mold is an insulating one.
• The part needs to have risers designed for it. The
risers have additional insulation that doubles their
cooling time and should be cylindrical. The risers will
be 50 mm in height. The tops of the risers are
insulated, so they do not transfer heat to the
environment. The risers are on the runner, so that
you do not need to subtract the riser-part interface
area from the heat transfer area.
• Determine their diameter.

ME 6222: Manufacturing Processes and Systems 75


Prof. J.S. Colton © GIT 2011
Riser design – Ex. 7-2

• Here we use
2 2
V  V 
n     
 A  riser  A casting

V 
• We are given    5mm
 A casting

V 
• So we need to find  
 A  riser

ME 6222: Manufacturing Processes and Systems 76


Prof. J.S. Colton © GIT 2011
Riser design – Ex. 7-3

Ariser  2Rh  2R  50  100R


Vriser  R 2h  R 2  50  50R 2
(top and bottom do not transfer heat)
So

V 
2
V 
2
 50R  2
2 2 R 7.07mm
n      2  5
 A  riser  A casting  100R  D14.14mm

ME 6222: Manufacturing Processes and Systems 77


Prof. J.S. Colton © GIT 2011
Riser design – Ex. 7-4

• The number of risers is immaterial to


this calculation. It is necessary to
determine the amount of material that
must be delivered to make up for the
shrinkage, as well as the distance the
material needs to flow in the part.

ME 6222: Manufacturing Processes and Systems 78


Prof. J.S. Colton © GIT 2011
Cooling below melting point

Temperature
pouring

melting solidification

removal
initial
time

ME 6222: Manufacturing Processes and Systems 79


Prof. J.S. Colton © GIT 2011
1D, Lumped-capacity HT (1)
Bodies without temperature gradients:
Biot number (Bi)= hl/k << 1
h = heat transfer coefficient
y
T
semi-infinite plate

x
2l Ti

ME 6222: Manufacturing Processes and Systems 80


Prof. J.S. Colton © GIT 2011
1D, Lumped-capacity HT (2)

• First Law formulation of lumped-


capacity model (pure thermal
system):
Heat transfer =
Increase in Internal Heat Content

Q1 2  U 2  U1

ME 6222: Manufacturing Processes and Systems 81


Prof. J.S. Colton © GIT 2011
First Law Formulation

dQ  Ah  T  T   dt  VcdT
heat transfer = internal energy change
• t = time
• T = temperature ( = source or sink)
• V = volume
• A = area
• h = heat transfer coefficient
•  = density
• c = specific heat

ME 6222: Manufacturing Processes and Systems 82


Prof. J.S. Colton © GIT 2011
Heat Transfer Time

Solving for time (t)

Vc  T  T1 
t ln  
Ah  T  T2 
Note: k drops out because of assumption of
negligible temperature gradients.

ME 6222: Manufacturing Processes and Systems 83


Prof. J.S. Colton © GIT 2011
1D Heat Transfer - Ex. 8-1

• You are interested in cooling a 0.5


in. thick plate of copper from
T=500oC to T=50oC.

• It is cooled such that the overall


heat transfer coefficient (h) is 200
W/m2-K, and the “sink”
temperature is 20oC.

ME 6222: Manufacturing Processes and Systems 84


Prof. J.S. Colton © GIT 2011
1D Heat Transfer - Ex. 8-2

How long will it take to cool the plate


down?

ME 6222: Manufacturing Processes and Systems 85


Prof. J.S. Colton © GIT 2011
1-D Heat Transfer - Ex. 8-3
Assume the plate can be modeled
as an infinite plate.
– Note: V/A = l (if l<< plate width and
length), because we are only interested
in half of the plate, by symmetry
• Copper data:
– density () = 8,970 kg/m3
– conductivity (k) = 393 W/m-K
– specific heat (c) = 385 J/kg-K

ME 6222: Manufacturing Processes and Systems 86


Prof. J.S. Colton © GIT 2011
1-D Heat Transfer - Ex. 8-4

hl 200 * 0.00635
Biot #  
k 393
 0.00323  1

ME 6222: Manufacturing Processes and Systems 87


Prof. J.S. Colton © GIT 2011
1-D Heat Transfer - Ex. 8-5

Vc  T  T1 
t ln  
Ah  T  T2 

0.00635 8,970 385  20  500 


t  ln 
200  20  50 
 304 s  5 mins

ME 6222: Manufacturing Processes and Systems 88


Prof. J.S. Colton © GIT 2011
Bodies with Temperature Gradients

• Biot number (Bi)= hl/k >> 1


– More difficult, use Heisler charts

y
T  T  2
   2 
t  x 
q Bi-1
x

2l Fo
ME 6222: Manufacturing Processes and Systems 89
Prof. J.S. Colton © GIT 2011
Surface Tension

• Can be used to determine how well a


material wets and flows into the mold

Poor wetting Good wetting

ME 6222: Manufacturing Processes and Systems 90


Prof. J.S. Colton © GIT 2011
Surface Tension (g) [mJ/m2]

• Bubbles F
r
DP  = 2  r g
r2
DP = 2g/r F
q
• Capillary
r
2r gcosq  gr2h h

gh = 2g cosq / r
(like a pressure term)

ME 6222: Manufacturing Processes and Systems 91


Prof. J.S. Colton © GIT 2011
Surface Tension

• Surface may be either:


– wetting, which helps filling
• convex meniscus
– non-wetting, which hinders filling
• concave meniscus

ME 6222: Manufacturing Processes and Systems 92


Prof. J.S. Colton © GIT 2011
Surface Tension

• We can calculate the pressure needed


to squash a bubble.
• We can calculate how much “extra”
force (pressure) is necessary to fill very
small cavities.

ME 6222: Manufacturing Processes and Systems 93


Prof. J.S. Colton © GIT 2011
Sievert’s Law

S  k pg

– S = solubility
– k = constant
– pg = partial pressure of gas over melt

ME 6222: Manufacturing Processes and Systems 94


Prof. J.S. Colton © GIT 2011
Sievert’s Law constants

• Different constants for solid and liquid


metals
• Can’t have more than the solid
concentration in the liquid or bubbles
will form

ME 6222: Manufacturing Processes and Systems 95


Prof. J.S. Colton © GIT 2011
Sievert’s Law – Ex. 8-1

• Calculate the percentage of hydrogen


gas porosity of a copper casting, if the
partial pressure of hydrogen in contact
with the molten copper is 0.5 atm.
• Determine the maximum hydrogen
partial pressure required to eliminate
gas porosity.

ME 6222: Manufacturing Processes and Systems 96


Prof. J.S. Colton © GIT 2011
Sievert’s Law – Ex. 8-2

• Concentration of hydrogen in liquid


copper at melting point and one atm
hydrogen = 5.17 cm3/100 g Cu
• Concentration of hydrogen in solid at
melting point and one atm hydrogen =
3.1 cm3/100 g Cu

ME 6222: Manufacturing Processes and Systems 97


Prof. J.S. Colton © GIT 2011
Sievert’s Law – Ex. 8-3

• First determine Sievert’s Law constant –


k
• From the problem definition
– [H]liquid = 5.17 cm3 / 100 g Cu
– [H]solid = 3.1 cm3 / 100 g Cu
• Copper density = 9 g/cm3

ME 6222: Manufacturing Processes and Systems 98


Prof. J.S. Colton © GIT 2011
Sievert’s Law – Ex. 8-4
• So
H liquid 5.17 1
k   5.17 cm / 100 g / atm
3 2
pg 1
• and at 0.5 atm
H liquid  5.17 0.5  3.66cm / 100 g 3

• also
H solid  3.1cm 3
/ 100 g
ME 6222: Manufacturing Processes and Systems 99
Prof. J.S. Colton © GIT 2011
Sievert’s Law – Ex. 8-5

• Then
3.66 – 3.1 = 0.56 [cm3 / 100 g Cu] of
hydrogen will form gas porosity (this
represents the gas which is not soluble)
• the volume of 100 g of Cu
= 100 g / (9 g/cm3)
= 11.11 [cm3/100 g Cu]

ME 6222: Manufacturing Processes and Systems 100


Prof. J.S. Colton © GIT 2011
Sievert’s Law – Ex. 8-6

• So, the total volume of gas and metal


= 11.11 + 0.56 = 11.67 [cm3/100 g Cu]
• So the gas porosity
= gas volume / (volume of gas + metal)
= 0.56 [cm3/100 g Cu] / 11.67 [cm3/100 g Cu]
= 0.05 = 5%

ME 6222: Manufacturing Processes and Systems 101


Prof. J.S. Colton © GIT 2011
Sievert’s Law – Ex. 8-7

• There cannot be a higher concentration


of gas in the liquid than [H]solid, or
bubbles will form upon solidification
• So,
3.1cm / 100g  5.17
3
pg
• which gives
pg = 0.36 atm

ME 6222: Manufacturing Processes and Systems 102


Prof. J.S. Colton © GIT 2011
Data for Solid Materials
Room Temperature
Material Specific heat Density Thermal
(kJ/kg-oC) (kg/m3) conductivity
(W/m-oC)
Sand 1.16 1500 0.60
Aluminum 0.90 2700 222
Nickel 0.44 8910 92.1
Magnesium 1.03 1740 156
Copper 0.38 8960 394
Iron 0.46 7870 75.4
Steel 0.434 7832 59

ME 6222: Manufacturing Processes and Systems 103


Prof. J.S. Colton © GIT 2011
Data for Liquid Metals at Tm
Material Melting Density Latent heat Thermal Specific Viscosity
point (oC) (kg/m3) of conductivity heat (C) (m)
solidification (W/m-oC) (kJ/kg-oC) (mPa-s)
(fusion) (Hf)
(kJ/kg)

Aluminum 660 2390 396 94 1.05 4.5

Nickel 1453 7900 297 0.73 4.1

Magnesium 650 1585 384 139 1.38 1.24

Copper 1083 7960 220 49.4 0.52 3.36

Iron 1537 7150 211 0.34 2.2

ME 6222: Manufacturing Processes and Systems 104


Prof. J.S. Colton © GIT 2011
Summary

• Analysis
– Melting
– Pouring
– Solidification and cooling
– Surface tension
– Gas solubility and porosity

ME 6222: Manufacturing Processes and Systems 105


Prof. J.S. Colton © GIT 2011
ME 6222: Manufacturing Processes and Systems 106
Prof. J.S. Colton © GIT 2011

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