PRACTICAL 1

Objective: To Study The Various Design steps and related Terminology for PCB.

Theory: A printed circuit board, or PCB, is used to mechanically support and electrically connect
electronic components using conductive pathways, tracks or signal traces etched from copper sheets
laminated onto a non-conductive substrate. It is also referred to as printed wiring board (PWB) or
etched wiring board.

Its main purpose is to eliminate wires from a distributed electrical circuits. Basically a PCB is a copper
claded bakelite sheet (any insulating material), used to mask a circuit by placlng layout followed by
etching method.

TYPES OF PCB:

1. Single layer : Single copper layered and components are placed on one side.
2. Double layer: Components can be mounted on both side of PCB.
3. Multi layer: It can have multiple copper layers(generally 4). Different power-plans and ground –
plans.

MATERIAL USED:

Conducting layers:
Made up of thin copper foil.
Insulating layers:
dielectric are typically laminated together with epoxy resin prepreg.
Dielectric used:
Some of these dielectrics are polytetrafluoroethylene (Teflon), FR-4, FR-1, CEM-1 or CEM-3
Industry PCB: PCB industry are FR-2 (Phenolic cotton paper), FR-3 (Cotton paper and epoxy), FR-4
(Woven glass and epoxy), FR-5 (Woven glass and epoxy), etc.

TERMINOLOGY:

Tracks: Tracks are fine copper lines on PCB, obtained after etching these are substitute of wires that
carry current.
Pads: Pads are the round nodes on the tracks where holes are to be drillel for companent mounting
and drilling.As a simple rule of thumb, the pad shouldbe at least 1.8 times the diameter of the hole,

Vias: These are through holes in multiple layer PCBs used to connect the tracks to the conducting planes
in the intermediate layer.

PCB designing Steps

[1] Circuit designing and Simulation: For his purpose we can use, OrCAD, CircuitMaker etc simulating
tools. On this we can use SPICE tools to run DC analysis, DC analysis and Transient analysis and generate
Netlist.

[2] Layout Designing: For this we can use OrCAD, PCB wizard, PCB Express, PCB Elegance etc various
PCB layout designing Software tools.

[3] Methods For Transfering Layout on Copper clad Sheet:-

Large volume

 Silk screen printing–the main commercial method.

 Photographic methods–used when fine linewidths are required.

Small volume

 Print onto transparent film and use as photomask along with photo-sensitized boards. (i.e. pre-
sensitized boards), then etch. (Alternatively, use a film photoplotter).
 Laser resist ablation: Spray black paint onto copper clad laminate, place into CNC laser plotter. The
laser raster-scans the PCB and ablates (vaporizes) the paint where no resist is wanted. Etch. (Note:
laser copper ablation is rarely used and is considered experimental.)
 Use a CNC-mill with a spade-shaped (i.e. 45-degree) cutter or miniature end-mill to route away the
undesired copper, leaving only the traces.

Hobbyist

 Laser-printed resist: Laser-print onto transparency film, heat-transfer with an iron or modified
laminator onto bare laminate, touch up with a marker, then etch.
 Other labor-intensive techniques exist, only suitable for one-off boards (vinyl film and resist, non-
washable marker, and others).

[4] Etching Methods:- Chemical etching is done with ferric chloride, ammonium persulfate, or
sometimes hydrochloric acid. For PTH (plated-through holes), additional steps of electroless deposition
are done after the holes are drilled, then copper is electroplated to build up the thickness, the boards
are screened, and plated with tin/lead. The tin/lead becomes the resist leaving the bare copper to be
etched away.
[5]Drilling:- After the layout mask is transferred the Pads are drilled for component mounting. Using
drill bits with the lelp of drill machine.drill bits arespirally threaded, hi-speed steel (HSS) or mild steel.

[6] Component mounting: Before this all the loose components must be tested carefully. Now place
the components through the holes and cut the extra leads after soldering.

[7] Soldering: Soldering is a process in which two or more metal items are joined together by melting
and flowing a filler metal (solder) into the joint, the filler metal having a lower melting point than the
workpiece. Soldering differs from welding in that soldering does not involve melting the work pieces.

Three forms of soldering:

1. soft soldering, which originally used a tin-lead alloy as the filler metal,
2. silver soldering, which uses an alloy containing silver,
3. brazing which uses a brass alloy for the filler.

Solderinjg Materials:

Common solder alloys are mixtures of tin and lead, respectively:

 63/37: melts at 183 °C (361 °F) (eutectic: the only mixture that melts at a point, instead of over a
range)
 60/40: melts between 183–190 °C (361–374 °F)
 50/50: melts between 185–215 °C (365–419 °F)
 Tin –Antimony- 5%(Sb)
 Tin-Lead-Antimony-30-50%
 Tin -Silver- 3.5%(Ag)
 Tin-Lead-Silver-97%(Pb),2%(Ag),1%(Sn)
 Tin-Zinc-8.9%(Zn),91%(Sn)

Impurities:

 Copper should be kept below 0.28%. It raises melting-point of solder.

 Iron should be less than 1%.
 Zinc

Flux: The purpose of flux is to facilitate the soldering process. The obstacle to a successful solder joint is
an impurity at the site of the union, e.g. dirt, oils or oxidation. The impurities can be removed by
mechanical cleaning or by chemical means, but the elevated temperatures required to melt the filler
metal (the solder) encourages the work piece (and the solder) to re-oxidize. This effect is accelerated as
the soldering temperatures increase and can completely prevent the solder from joining to the
workpiece. Flux acts as a reducing ajent and helps to prevent oxidation during the soldering process.

Materials: Charcoal is used in early days. But the most common type of flux used in electronics (soft
soldering) was rosin-based(obtained from pine tree)
 Experiment 2

Object: To Obtain the PCB layout for the simulated circuit of “astable multivibrator using IC-555” , using
layout designing software tool.
Theory: The circuit designed and circuit designed and simulated on circuit maker is now required to be
converted into PCB layout. For this we are using PCB wizard which is more user friendly in comparision
to other famous layout designing software tools like OrCAD, PCB express, PCB elegance,etc.

Astable multivibrater is a free running pulse generator. In our circuit an LED is connects at o/p.
Which blinks in accordance with on and off period?

Procedure:

Step 1:
 Open the PCB wizard workspace.
 Go to toolbar
 Go to gallery
 Mark Circuit symbol
 Select and place Battery & ground from <Power
supplies>.
 Select capacitor and resisters from <Passive
components>.
 Select & place LED from<Output componen

Step 2: Take the wire tool and interconnect the component

as the design requires.

Step3: Go to toolbar, click on tools> convert>”Design to

printed circuit board”.

A wizard will start. Now tick the default parameters(Shape

& Size of PCB, Thickness of tracks &grids; selection for
circuit components, required to be included in PCB layout)

After clicking few next’s, PCB wizard starts to find the

optimum circuit layout in terms of minimum PCB space
with satisfactory performance.
Step 4: Now we get four Layout views as shown below:

(a) Normal View (b)Artwork (c) Unpopulated view (d) Real world view

Step 5: Take out the printout of the artwork on Glossy paper using Laser printer(Don’t use Deskjet printer)

PCB LAYOUT (Artwork)

Result: This Art work is the required layout that can be transfer on the copper clad sheet.
 Experiment no: 3

OBJECT- Layout design transfer on litharge film and copper clad Bakelite sheet by machine method.

APPARUTUS REQUIRED-

1. PCB shearing machine

2. Photo contact printer (PCB art film maker)

3- Photo resists dip coating machine

4. Ultra violet exposure unit

5. Drilling machine.

6. Etching machine

PROCEDURE-

[1] Photo contact printer-

Operation-

1) Use a glass cleaner that leaves no residual film on the glass careful not to scratch the glass.
2) Place the art work film flat on the top of the glass. The emulsion of the film flat should face the
emission or the contact duplicating film.
3) Place a sheet contacting or duplicating film selected from the lit arch film. In the contact frame
with the emulsion of the film facing the slight source.
4) Slowly lower load and clamp after using light pressure on top and switch on illuminated switch.
5) Press the push button switch to required exposing time- expose the film. Unclamped load and
remove film for further processing keep the master film.(trace paper) in a clean envelop for
further use
6) Now dissolve the film into part – A solution (sodium carbonate) and part-B solution (butyl
collusive) solution.
7) Keep the film into part A , part B solution until the circuit is visible .
8) When the circuit is visible remove the film from part A and part B solution, placed it in water.
Now remove the film from water and put it in the fixes for 2 or 3 sec.
9) Now your lit arch film is ready for further processing.
 [2] PHOTO -RESIST DIP COATING MACHINE :-

Dip coating machine is used for coating of liquid photo resist on PCB .

OPERATION :-

1) First ensure that work area is a dark room and tank has been filled with liquid photo resist .
2) Clamp PCB firmly on hangs provided.
3) Ensure machine is plugged in switch on down movement switch. The motor will come on
and the PCB will be lowered into the uncovered resist tank.
4) When board reaches the bottom , the limit switch will stop downward movement.
5) Switch on the up movement switch after a minuet and bring the PCB up to the starting
mark.
6) After excess photo resist drips off unclamped board for further processing.

[3]:- PCB curing (oven) machine –

This machine is use for curing wet photo resist on PCB‘s

OPERATION:- 1) Clamped the PCB to the oven lid firmly lower in to producer chamber so
that it sits firmly.
2) Switch on producer mains and see that the main indicating lamp (red) glows.
Air circulating fan is start.
3) Switch on the temperature switch (yellow) after the heater to switch ON
4) The copper-clad Bakelite sheet the extra copper from the copper clad sheet . Machine is
filled completely with Ferrric chloride (Fecl3)

[4]:- Ultra-Violet Exposure unit –

U-V Exposure unit is used to transfer layout on the copper clad Bakelite sheet.

Operation :-

1) Unclamped and lift lids unlatch and lift the top glass slowly and look at rest position.
Ensure glass is clean before setting the clad sheet and the film for transfer .
2) Now put the film and copper clad sheet to the center of glass as possible.
 3) Start power switch ON to start unit.
4) If the film is placed on the top side starts the top u-v tubes or vice-versa.
5) Set the processor time knob from 0to10mm
6) It start the exposing the photo resist coated PCB .The timer will automatically count
down to zero.
7) After the tone has lapsed the UV light will automatically switch off.
8) Unclamp load and remove PCB for further processing .Keep film in a clean envelope for
further use.
9) Now put the copper clad sheet in developer(AgNO3)until the circuit is visible in sheet.
10) The circuit is visible on clad sheet put it in blue dye.

[5] ETCHING MACHINE-

Etching machine is used for a removing extra copper from the copper-clad sheet .machine is filled
completely with ferric chloride Fecl3

Operation:

1) Clamp the PCB which is to be etched onto the figure connected to the lid of the machine
once it is securely clamped lower the tank. So that lid fit properly.
2) Switch on the power supply so that the etching start .since thousand of bubbles are created
by compressed air.
3) The board to be etched is suspended in this foam particularly fast and uniform etching now
left the PCB holder to see the position of etching.
4) After etching ,the layout design is transferred on the copper clad sheet
5) Now your PCB is ready for drilling.

[6] Drilling Machine-

Operation:

1) Switch-on the power supply.

2) Adjust NOB position to desired
3) Now press the drill bit in drilling spindle.
4) Now make holes on the pads by pressing the handle.
5) Now PCB is ready to fabricate the circuit components.

Result: Layout Design is transferred on Lith-Film and Copper clad sheet.And PCB is ready for component
mounting.
 Practical No. 4

Object: Transfer the PCB Layout on the copper clad sheet using “Hot Iron Method”.

Theory: A hobbyist can also transfer the PCB layout obtained from on the copper clad Bakelite sheet
without using various lab instruments(As discussed in previous practical),bu using Hot Iron method as
discussed below

This method works on the fact that the ink of the laser printer or photocopier machine can be transferred
from a glossy paper on to the other surface (copper clad sheet) under the application of high temperature.

Procedure:

Step1: Take the printout of circuit Step2: Cut out your layout Step3: Place the copper clad
layout on Glossy paper using according to your PCB size. Bakelite sheet, place the layout on
Laser printer. it and place an another paper on it
so that it couldn’t stick with the iron

Step5: Now cooldown the PCB

Step4:By applying the heat using
hot iron the Ink can be transferred
ot copper clad sheet.
with water and remove the
paper.Now we can see the
layout has been traced.
Step6: Using Permanent Marker
we redraw the layout The ink of the
permanent marker acts as a
photoresist, that prevents the
circuit layout (desired copper part)
from the etching agent.
Step 7: Take the 60% solution of
FeCl3 solution in Hot water. And
place the PCB in this for 20
minutes.
Step 8:Soldering
(a) Now we use 25watts
soldering iron (for electronics
purpose) and stand.
Result: The PCB is ready To use after fabrication.
Step8: After removal the copper
we scrub gently and wash it. We
can remove marker ink using
benzene thinner. PCB is ready to
drill,
(b) The solder is alloy of til and
lead.
Step9: With the help of electric
driller machine and drill BIT we
can make precise holes.
(C) Flux avoides oxidation, and
facilatets soldering.