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GT30J324

TOSHIBA Insulated Gate Bipolar Transistor Silicon N Channel IGBT

GT30J324
High Power Switching Applications
Unit: mm
Fast Switching Applications

· The 4th generation


· Enhancement-mode
· Fast switching (FS): Operating frequency up to 50 kHz (reference)
High speed: tf = 0.05 µs (typ.)
Low switching loss : Eon = 1.00 mJ (typ.)
: Eoff = 0.80 mJ (typ.)
· Low saturation voltage: VCE (sat) = 2.0 V (typ.)
· FRD included between emitter and collector

Maximum Ratings (Ta = 25°C)

Characteristics Symbol Rating Unit

Collector-emitter voltage VCES 600 V


Gate-emitter voltage VGES ±20 V
JEDEC ―
DC IC 30
Collector current A JEITA ―
1 ms ICP 60
TOSHIBA 2-16C1C
Emitter-collector forward DC IF 30
A Weight: 4.6 g (typ.)
current 1 ms IFM 60
Collector power dissipation
PC 170 W
(Tc = 25°C)
Junction temperature Tj 150 °C
Storage temperature range Tstg −55 to 150 °C

Thermal Characteristics

Characteristics Symbol Max Unit

Thermal resistance (IGBT) Rth (j-c) 0.735 °C/W


Thermal resistance (diode) Rth (j-c) 1.90 °C/W

Equivalent Circuit

Collector

Gate

Emitter

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Electrical Characteristics (Ta = 25°C)

Characteristics Symbol Test Condition Min Typ. Max Unit

Gate leakage current IGES VGE = ±20 V, VCE = 0 ― ― ±500 nA


Collector cut-off current ICES VCE = 600 V, VGE = 0 ― ― 1.0 mA
Gate-emitter cut-off voltage VGE (OFF) IC = 3 mA, VCE = 5 V 3.5 ― 6.5 V
Collector-emitter saturation voltage VCE (sat) IC = 30 A, VGE = 15 V ― 2.0 2.45 V
Input capacitance Cies VCE = 10 V, VGE = 0, f = 1 MHz ― 4650 ― pF

Turn-on delay time td (on) ― 0.09 ―

Rise time tr ― 0.07 ―

Turn-on time ton Inductive Load ― 0.24 ―


Switching time µs
Turn-off delay time td (off) VCC = 300 V, IC = 30 A ― 0.30 ―

Fall time tf VGG = +15 V, RG = 24 Ω ― 0.05 ―


(Note 1)
Turn-off time toff ― 0.43 ―
(Note 2)
Turn-on switching
Eon ― 1.00 ―
loss
Switching loss mJ
Turn-off switching
Eoff ― 0.80 ―
loss
Peak forward voltage VF IF = 30 A, VGE = 0 ― ― 3.8 V
Reverse recovery time trr IF = 30 A, di/dt = −100 A/µs ― 60 ― ns

Note 1: Switching time measurement circuit and input/output waveforms

VGE
90%
10%
0
-VGE

IC L VCC IC
90% 90%
RG
VCE VCE 10% 10% 10% 10%
0
td (off) td (on)
tf tr
toff ton

Note 2: Switching loss measurement waveforms

VGE
90%
0 10%

IC

VCE 5%
0

Eoff Eon

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IC – VCE VCE – VGE


60 20
Common emitter Common emitter
10

(V)
Tc = −40°C
50 Tc = 25°C 20 15
16
(A)

VCE
40 9
IC

Collector-emitter voltage
12
Collector current

30

8
20 60

VGE = 8 V 30
4
10
IC = 10 A

0 0
0 1 2 3 4 5 0 4 8 12 16 20

Collector-emitter voltage VCE (V) Gate-emitter voltage VGE (V)

VCE – VGE VCE – VGE


20 20
Common emitter Common emitter
(V)

(V)

Tc = 25°C Tc = 125°C
16 16
VCE

VCE
Collector-emitter voltage

Collector-emitter voltage

12 12

8 8
30 30
60
60
4 4

IC = 10 A IC = 10 A

0 0
0 4 8 12 16 20 0 4 8 12 16 20

Gate-emitter voltage VGE (V) Gate-emitter voltage VGE (V)

IC – VGE VCE (sat) – Tc


60 4
Common emitter Common emitter
Collector-emitter saturation voltage

50 VCE = 5 V VGE = 15 V
60
(A)

3
40
VCE (sat) (V)
IC
Collector current

30
30 2

20
IC = 10 A
1
10 25

Tc = 125°C
−40
0 0
0 4 8 12 16 20 −60 −20 20 60 100 140

Gate-emitter voltage VGE (V) Case temperature Tc (°C)

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Switching time ton, tr, td (on) – RG Switching time ton, tr, td (on) – IC
10 3
Common emitter Common emitter
VCC = 300 V VCC = 300 V
(µs)

VGG = 15 V VGG = 15 V

(µs)
3 IC = 30 A RG = 24 Ω
1 : Tc = 25°C
: Tc = 25°C
ton, tr, td (on)

: Tc = 125°C

ton, tr, td (on)


: Tc = 125°C
(Note 1) (Note 1)
1
0.3

0.3 ton
ton
Switching time

Switching time
0.1
0.1 td (on)
td (on)

tr 0.03
0.03 tr

0.01 0.01
1 3 10 30 100 300 1000 0 5 10 15 20 25 30

Gate resistance RG (Ω) Collector current IC (A)

Switching time toff, tf, td (off) – RG Switching time toff, tf, td (off) – IC
10 10
Common emitter Common emitter
VCC = 300 V VCC = 300 V
VGG = 15 V VGG = 15 V
(µs)
(µs)

3 IC = 30 A 3 RG = 24 Ω
: Tc = 25°C : Tc = 25°C
: Tc = 125°C
toff, tf, td (off)
toff, tf, td (off)

: Tc = 125°C
1 (Note 1) 1 (Note 1)

toff

0.3 0.3 td (off)


toff
tf
Switching time
Switching time

td (off)
0.1 0.1

0.03 tf 0.03

0.01 0.01
1 3 10 30 100 300 1000 0 5 10 15 20 25 30

Gate resistance RG (Ω) Collector current IC (A)

Switching loss Eon, Eoff – RG Switching loss Eon, Eoff – IC


30 3
Common emitter
VCC = 300 V
VGG = 15 V
Eon
(mJ)

(mJ)

IC = 30 A 1
10
: Tc = 25°C
: Tc = 125°C
(Note 2)
Eon, Eoff

Eon, Eoff

3 Eon 0.3

Eoff
Switching loss

Switching loss

1 0.1

Eoff Common emitter


VCC = 300 V
VGG = 15 V
0.3 0.03 RG = 24 Ω
: Tc = 25°C
: Tc = 125°C
(Note 2)
0.1 0.01
1 3 10 30 100 300 1000 0 5 10 15 20 25 30

Gate resistance RG (Ω) Collector current IC (A)

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C – VCE VCE, VGE – QG


10000 500 20
Common emitter
RL = 10 Ω

(V)
3000 Cies Tc = 25°C

(V)
400 16

VCE
(pF)

Gate-emitter voltage VGE


1000

Collector-emitter voltage
Capacitance C

300 12
200
300 300

200 8
100 VCE = 100 V
Common emitter Coes
VGE = 0 100 4
30 f = 1 MHz
Cres
Tc = 25°C
10 0 0
0.1 0.3 1 3 10 30 100 300 1000 0 40 80 120 160 200

Collector-emitter voltage VCE (V) Gate charge QG (nC)

IF – VF trr, Irr – IF
60 10 1000
Common collector
(A)

50 VGE = 0

(ns)
Irr
(A)

3
Reverse recovery current Irr

300

trr
40
Forward current IF

Reverse recovery time


30 1 100
trr

20
25 Common collector
0.3 30
di/dt = −100 A/µs
10 Tc = 125°C VGE = 0
: Tc = 25°C
−40
: Tc = 125°C
0 0.1 10
0 0.6 1.2 1.8 2.4 3.0 3.6 0 5 10 15 20 25 30

Forward voltage VF (V) Forward current IF (A)

Safe Operating Area Reverse Bias SOA


100 100
IC max (pulsed)*
50 µs*
IC max (continuous)
30 30
100 µs*
(A)

(A)

10 10
IC

IC

DC operation
Collector current

Collector current

3 3
1 ms*
*: Single pulse
1 Tc = 25°C 1
Curves must be
derated linearly
0.3 0.3
with increase in Tj ≤ 125°C
10 ms*
temperature. VGE = 15 V
RG = 24 Ω
0.1 0.1
1 3 10 30 100 300 1000 1 3 10 30 100 300 1000

Collector-emitter voltage VCE (V) Collector-emitter voltage VCE (V)

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rth (t) – tw
102
(°C/W)

101
FRD
rth (t)

100
Transient thermal resistance

IGBT
10−1

10−2

10−3

Tc = 25°C
10−4
10−5 −4 −3 −2 −1 0
10 10 10 10 10 101 102

Pulse width tw (s)

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RESTRICTIONS ON PRODUCT USE 000707EAA

· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..

· The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.

· The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.

· The information contained herein is subject to change without notice.

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