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Bill L. Schmidt
Silicon Graphics Computer Systems
Mountainview, California 94039
(’2+9+’
from the above equations, the fin efficiency qf can be com-
‘p= k
‘1) puted, assuming negligible heat dissipation through the
edge surfaces [11], as
h~ = j Re Pr113 — (2)
Dh
tanh m H
~f =
mH (7)
where A w and AC are the wetted surface area and the cross
sect ional area of the channel, respectively, and K is the to- with
tal dynamic resistance coefficient accounting for the pres-
sure losses due to entrance and exit effects. The K values I
can be estimated from the plots provided in [7] or [8]. R e (8)
‘ is the Reynolds number based on the bulk mean channel
flow velocity um and the hydraulic diameter Dh. Pr is the
Prandtl number, and k is the thermal conductivity of the where H and t are the fin height and the fin thickness, and
fluid. kf is the thermal conductivity of the fin material. The fin
thermal resistance then becomes
However, the above heat transfer coefficient is defined
based on the temperature difference between the channel
wall and the bulk flow: (9)
Q.on+L where Af is the fin surface area, and the overall heat sink
h~=T (3)
.–T~ thermal resistance R can be easily computed from the fol-
lowing thermal network expression:
Therefore, in order to determine the effective heat trans-
fer coefficient based on the temperature difference between
the channel wall and the inlet flow (Tw – Tin), one needs to
use the following expression, which is developed by balanc-
ing the total heat transfer into the fluid with the enthalpy with
‘ =
[2+ir+Rba8e (lo)
I
increase in the flow from the inlet to the outlet of the chan-
nel:
h =
rhcp {1 – ezp[(h~Aw)/(~cp)]}
(4)
J%=& (11)
Aw 6P
R’a~~ = _ (12)
kfAp
where m is the mass flow rate, and C is the specific heat.
p
The modeling also incorporates the accepted correlations where Nf is the number of fins, A p the projected area of
for the Nusselt number from [9]. In forced convection from the heat sink base plate and 6 the thickness of the bzwe
parallel plates, it must be determined whether the plates plate.
I
%er Thermoanemometer
Series 470 Velocity
Flow Measurements
Straightener Entrance Exit
250CFM Blower
Controlled with
Variable Rheostat
FIJ!g
22–186–A
:%5Eq —
Power Supply
Figure 3: Experimental test set-up.
ameter hole which was drilled 3.18 mm deep and filled these configurations were termed open and confined flow
with thermal grease and thin copper wire. The thermal respectively. The confined test setup had a 3.8 mm g a p
grease used was silicon based with a thermal conductivity around the heat sink allowed for air flow.
of 0.004 W/mK. The thermocouples were calibrated to
within O. l°C of each other. A Yokogawa chart logger was
used to record the temperatures throughout the experi-
ment, including the startup transient response and steady-
state equilibrium.
127 mm by 1830 ~m long. The 250 CFM (li8 Liters/sec.) ++++++++ ++++
++++*+++ +++++
blower was controlled using a variable rheostat. The volu- +++++++ +++++
metric air flow was not monitored since the local air veloc- i- +
+ IA
Exiting ‘
-
F“--s=~FY-”-----”-&az”m”
1~
Air Flow >;’
(In/s)
2 ............................. . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...* . . . . . . . . . . . . . . . .
; ,.
: .
:; ,., .
1 . . . . . . . . . . ...* . . . . . . . . . . . .......................... .......................
,,
,.,
,.,
0
o 1 2 3 4 5 o 1 2 3 4 5
Entering Air Velocity
Air Flow (m/s)
(In/s)
Figure 5: Dynamic correlation of effective air flow through Figure 6: The comparative thermal resistance for open air
a heat sink placed in an open flow configuration. flow testing.
1
I
I
The effect of testing in an open flow is shown in Figure
5, where significant flow bypass is seen with the elliptical
heat sink. This is of no surprise since the cross-section of
I
Heat Sink Type
[ this heat sink represents more of an obstruction for airflow. 4 Elliptical Pin
Also, the cross-cuts induced more flow bypass than the : - Cross-Cut Pin
I straight fin, suggesting increased turbulence and pressure ............. . . . . . . . . . . . . . . . . .~ ~ Straight Fin
drop. For ail heat sinks, the largest amount of bypass is
~r
at an air velocity between 0.5 and 1.0 m/s. This low-
flow phenomenon has been reported and leads to a design
! optimization analysis that is similar to the analysis used in
t determining the natural convection optimum fin spacing. :\
. ..-. . . .
The overall thermal performance of each heat sink in
open flow is shown in Figure 6 where the thermal resis-
tance, defined as (TW – Tin)/Q , is the power independent
A
:\
temperature relation of heat sink performance. Due to
minimal flow bypass already seen with the straight fin, it
is of no surprise that this heat sink was cooler. Also seen is 1 a
equal thermal performance between the elliptical pin and 0 1 I
F..-
60 ~- * Q.=(1.o) ,, 40 + open (0.5)
-9- open (2.0) :; 4 Open(l.o)
. + open (4.0) + open (2.0)
“ +. conf(o.5) ‘~ 35 + open (4.0)
50 : - 0 - Conf(l.o) “---”-- -“”’--”--”-----”---”~”” ----------- + conf(o.5)
I 1~
- + conf(2.o) /’ Conf(l.o) ~
30 ‘-”-” -0- conf(2.o) “-j ‘-”---”--”---” , ‘-”-””-------”
: + conf(4.o) +;
40 . . . . . . . . . . . . ...>..... . . . . . . . . . . . . ,. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . + conf(4.o) ~;
25 ................................................. .......................
[lb?
p....... . . . ..f . . . . . . ..f . . . . + . . . f....
‘‘f
..............................
kg n
#
, 9 2 0 ....................................... . . . . . . . . . . . . . . . . ....................
[ 1//
‘7 AA’7R
“i! 15 . . . . . . . . . . . . . . . . . . . . . . . . . .:. . . . . .d
. . . . ................................
20 p . . . . . -. ~ . . . . . . . f.y . . . . . ..i
-
“3”-”---”””--” 10 b------------F--#-,
. . . . . . . . . . . -Y
10 /lzw
5 -------------------------------- ---
}
Q Q
(watt) (watt)
Figure 8: Forced convection performance of elliptical pin Figure 9: Forced convection performance of straight fin
i
fin heat sink based upon entering air velocity into the test heat sink based upon entering air velocity into the test
chamber for both open and confined flow configurations. chamber for both open and confined flow configurations.
.
flow where the velocity through each heat sink is the same. 80 f 1 , 4
Once again, the straight fin performed best. This was an I
(Air Velocity, mk)
unexpected result, but can be explained by looking at the 70
overall heat sink efficiency. Much emphasis in heat sink ■ Exp (0.5) I
design is spent looking at fin efficiency. However, with + Theory (1 .0)
increasing heat flux in microelectronic applications, the ef- 60
+ Theory (2.0)
ficiency of how fins conduct laterally may have been over-
looked. The straight fin allows for an improved lengthwise 50
conduction path other than just through the base. Both A Exp (4.0)
pinned versions have an overall higher conduction resis- 40
tance, since the pins directly over the 25.4 mm square heat I
1
source are at a higher temperature than the surrounding I
30
outer pins, Further testing including infrared spectroscopy 1 I