Liberty Port-ZTE-ZXWM-M920 Product Description PDF

ZXWM M920
Backbone DWDM Equipment

Product Description
Version:V5.10P01
ZTE CORPORATION
No. 55, Hi-tech Road South, ShenZhen, P.R.China
Postcode: 518057
Tel: +86-755-26771900
Fax: +86-755-26770801
URL: http://support.zte.com.cn
E-mail: support@zte.com.cn
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Revision History
Revision No. Revision Date Revision Reason
R1.1 2013-12-20 Add CX21 subrack, CX31 subrack, EQG2 board and EHG1 board.
R1.0 2012-12-15 First release
Serial Number: SJ-20130318152421-001
Publishing Date: 2013-12-20(R1.1)
SJ-20130318152421-001|2013-12-20(R1.1) ZTE Proprietary and Confidential

Contents
About This Manual ......................................................................................... I
Chapter 1 Product Orientation and Application ...................................... 1-1
1.1 ZTE WDM Product Family .................................................................................. 1-1
1.2 Networking Application ....................................................................................... 1-2
1.2.1 Point-to-Point Network.............................................................................. 1-2
1.2.2 Chain Network ......................................................................................... 1-2
1.2.3 Ring Network ........................................................................................... 1-2
1.2.4 Ring-Chain Network ................................................................................. 1-3
1.2.5 Tangent Ring Network .............................................................................. 1-3
1.2.6 Cross Network ......................................................................................... 1-4
1.2.7 Mesh Network.......................................................................................... 1-4
1.3 Network Element Type........................................................................................ 1-4
1.3.1 OTM Configurations ................................................................................. 1-4
1.3.2 FOADM Configurations........................................................................... 1-12
1.3.3 ROADM Configurations .......................................................................... 1-16
1.3.4 OLA Configurations ................................................................................ 1-24
Chapter 2 Product Characteristics ........................................................... 2-1

2.1 Technology Characteristics ................................................................................. 2-1
2.1.1 Forward Error Correction Functions ........................................................... 2-1
2.1.2 APSD/APR Function................................................................................. 2-1
2.1.3 Erbium-Doped Fiber Amplifier (EDFA) ...................................................... 2-2
2.1.4 Distributed RAMAN Amplification .............................................................. 2-2
2.1.5 Intelligent ROADM.................................................................................... 2-2
2.1.6 Performance Monitoring Function .............................................................. 2-3
2.1.7 Electrical Cross-Connect Function............................................................. 2-3
2.1.8 RPOA Technology .................................................................................... 2-4
2.2 Upgrade and Maintenance Characteristics ........................................................... 2-4
Chapter 3 System Functions ..................................................................... 3-1

3.1 Line Transmission Function ................................................................................ 3-1
3.1.1 Transmission Capacity.............................................................................. 3-1
3.1.2 Channel Rate........................................................................................... 3-1
3.1.3 Channel Spacings .................................................................................... 3-2
3.1.4 Transmission System Codes..................................................................... 3-2

3.2 Automatic Power Optimization Function............................................................... 3-5
3.2.1 OMS Power Management......................................................................... 3-5
3.2.2 OCH Power Management ......................................................................... 3-6
3.3 IWF Function ..................................................................................................... 3-6
3.4 Wavelength Tunable Function ............................................................................. 3-6
3.5 Performance Monitoring Function ........................................................................ 3-7
3.6 Chromatic Dispersion Compensation ................................................................... 3-8
3.7 Service Functions............................................................................................... 3-8
3.7.1 Service Access Function........................................................................... 3-8
3.7.2 Service Convergence Function.................................................................. 3-9
3.8 Communication and Supervision Function ......................................................... 3-10
3.8.1 Supervisory Channels............................................................................. 3-10
3.8.2 Communication Functions........................................................................3-11
3.9 Alarm Monitoring Function ................................................................................ 3-12
3.9.1 External Alarm Input and Output Function................................................ 3-12
3.9.2 Internal Alarm Monitoring Function .......................................................... 3-12
3.10 Protection Functions ....................................................................................... 3-13
3.10.1 SNP 1+1 Protection .............................................................................. 3-13
3.10.2 Cross-Connect Board 1+1/2:2/4:2 Protection.......................................... 3-13
3.10.3 OMS 1+1 Protection ............................................................................. 3-14
3.10.4 OCH 1+1 Protection ............................................................................. 3-16
3.10.5 Two-Fiber Bidirectional OCH Shared Protection ..................................... 3-16
3.10.6 Chain Network-Based Electrical Layer 1+1 Wavelength Protection .......... 3-17
3.10.7 Ring Network-based Electrical Layer Two-Fiber Bidirectional Channel
Shared Protection ................................................................................. 3-19
3.10.8 Protection Capability for EMS Channel .................................................. 3-20
3.11 Clock Management Function ........................................................................... 3-20
3.12 Clock Time Synchronization Function .............................................................. 3-20
Chapter 4 Hardware Architecture ............................................................. 4-1

4.1 Cabinet.............................................................................................................. 4-1
4.2 Board ................................................................................................................ 4-2
Chapter 5 Software Architecture............................................................... 5-1

5.1 Software Architecture Overview .......................................................................... 5-1
5.2 EMS Software.................................................................................................... 5-1
5.3 NE Control and Processing Software ................................................................... 5-3
5.4 Board Software .................................................................................................. 5-4
5.5 Communication Protocols and Interfaces ............................................................. 5-4
II

Chapter 6 Technical Specifications .......................................................... 6-1
6.1 Requirements on Operating Wavelength.............................................................. 6-1
6.1.1 Allocation of Continuous Wavelengths ....................................................... 6-1
6.1.2 Allocation of Uncontinuous Wavelengths.................................................... 6-5
6.2 Service Access and Convergence Subsystem Specifications ................................ 6-7
6.2.1 Board Types ............................................................................................ 6-7
6.2.2 2.5 G Board Specifications........................................................................ 6-7
6.2.3 10 G Board Specifications......................................................................... 6-8
6.2.4 40G Board Specifications.......................................................................... 6-9
6.2.5 100 G Board Specifications..................................................................... 6-10
6.3 Optical Mux/DeMux Subsystem Specifications ...................................................6-11
6.3.1 SOAD Board Specifications .....................................................................6-11
6.3.2 OMU Board Specifications ...................................................................... 6-12
6.3.3 ODU Board Specifications ...................................................................... 6-14
6.3.4 ODUB Board Specifications .................................................................... 6-14
6.3.5 OCI Board Specifications ........................................................................ 6-15
6.3.6 VMUX Board Specifications .................................................................... 6-16
6.3.7 VMUXB Board Specifications .................................................................. 6-16
6.3.8 SSDM Board Specifications .................................................................... 6-17
6.3.9 SOGMD Board Specifications ................................................................. 6-18
6.3.10 WBU Board Specifications ................................................................... 6-18
6.3.11 WSU Board Specifications .................................................................... 6-19
6.3.12 WBM Board Specifications.................................................................... 6-21
6.3.13 PDU Board Specifications ..................................................................... 6-22
6.4 Optical Amplification Subsystem Specifications ................................................. 6-23
6.4.1 SEOA Board Specifications..................................................................... 6-23
6.4.2 EOA Board Specifications....................................................................... 6-26
6.4.3 DRA Board Specifications....................................................................... 6-31
6.4.4 LAC Board Specifications ....................................................................... 6-32
6.5 Optical Layer Management Subsystem Specifications ........................................ 6-33
6.5.1 OPM Board Specifications ...................................................................... 6-33
6.5.2 EOPM Board Specifications .................................................................... 6-34
6.5.3 OWM Board Specifications ..................................................................... 6-35
6.5.4 EOWM Board Specifications ................................................................... 6-35
6.6 Protection Subsystem Specifications ................................................................. 6-35
6.6.1 SOP Board Specifications....................................................................... 6-35
6.6.2 SOPCS Board Specifications .................................................................. 6-36
III

6.6.3 SOPMS Board Specifications.................................................................. 6-37
6.7 Supervision Subsystem Specifications............................................................... 6-38
6.7.1 SOSCB Board Specifications .................................................................. 6-38
6.7.2 CCP Board Specifications....................................................................... 6-39
6.8 RPOA Subsystem Specifications....................................................................... 6-39
6.8.1 Applicable Transmission Codes............................................................... 6-39
6.8.2 RPOA Subsystem Optical Specifications ................................................. 6-40
6.9 DCM Technical Specifications ........................................................................... 6-40
6.10 Environment Specifications ............................................................................. 6-42
6.10.1 Power Supply Requirement................................................................... 6-43
6.10.2 Storage Environment ............................................................................ 6-43
6.10.3 Transportation Environment .................................................................. 6-44
6.10.4 Operational Environment ...................................................................... 6-46
6.11 Electro Magnetic Compatibility Requirements ................................................... 6-47
6.12 Weight Power Consumption Dimensions.......................................................... 6-48
6.12.1 Power Consumption Specifications........................................................ 6-48
6.12.2 Dimensions and Weight ........................................................................ 6-51
Appendix A Standards and Recommendations ..................................... A-1

Figures............................................................................................................. I
Tables ............................................................................................................ III
Glossary .......................................................................................................VII
IV

About This Manual
Purpose
This manual provides information about the ZXWM M920Backbone DWDM Equipment.
The ZXWM M920 system is designed for long-haul transmission in backbone-networks

and supports the 160/192 10 Gb/s or 80/96 40 Gb/s system.
What is in This Manual

This manual contains the following chapters:
Chapter Summary
1, Product Orientation and Describes the product Orientation, networking application and
Application network element type of the ZXWM M920.
2, Product Characteristics Describes the product characteristics of the ZXWM M920 system,
including technical characteristics, and upgrade and maintenance
characteristics.
3, System Functions Describes system configuration, networking modes, and configuration

example of the ZXWM M920 equipment.
4, Hardware Architecture Describes the hardware architecture and functional subsystems of the
ZXWM M920equipment.
5, Software Architecture Describes the software architecture, including board software, NE

control and processing software, EMS software, communication
protocol, and interfaces of the ZXWM M920 equipment.
6, Technical Specifications Describes system operating wavelength, technical specifications of

board, environment specifications and weight power consumption
dimensions of the ZXWM M920 equipment.
Appendix A, Standards and Describes the Standards and Recommendations of the ZXWM M920
Recommendations equipment.
Conventions
This manual uses the following typographical conventions:
Typeface Meaning
Italics Variables in commands. It may also refer to other related manuals and documents.
Bold Menus, menu options, function names, input fields, option button names, check boxes,
drop-down lists, dialog box names, window names, parameters, and commands.
Constant Text that you type, program codes, filenames, directory names, and function names.
width

Typeface Meaning
[] Optional parameters.
{} Mandatory parameters.
| Separates individual parameters in a series of parameters.
Danger: indicates an imminently hazardous situation. Failure to comply can result in

death or serious injury, equipment damage, or site breakdown.
Warning: indicates a potentially hazardous situation. Failure to comply can result in

serious injury, equipment damage, or interruption of major services.
Caution: indicates a potentially hazardous situation. Failure to comply can result in

moderate injury, equipment damage, or interruption of minor services.
Note: provides additional information about a particular topic.
II

Chapter 1
Product Orientation and
Application
Table of Contents
ZTE WDM Product Family ..........................................................................................1-1
Networking Application ...............................................................................................1-2
Network Element Type ...............................................................................................1-4
1.1 ZTE WDM Product Family

ZTE WDM equipments meet the application requirements of MAN/LAN (from the core
layer, the convergence layer, to the access layer), toll network, and trunk network. They
provide user with transmission solutions with different capability and different transmission
distance.
Figure 1-1 shows the ZTE WDM product family, including ZXWM M920, ZXMP M820,
ZXMP M720 and ZXMP M600.
Figure 1-1 ZTE WDM Product Family
l ZXWM M920 is a new-generation optical network product. It combines advanced

transmission technologies, such as trunk network large capacity and long-haul
transmission, with high equipment integration technology. It is applicable to
international, national, inter-province, and intra-province trunk; local switching
network; and various private networks.
1-1

ZXWM M920 Product Description
l ZXMP M820 is an intelligent WDM equipment. It can upload the WSON control
platform. It is applicable to local networks with various scales and the metro core
network.
l ZXMP M720 is a multi-transmission platform compact WDM equipment, which is
applicable to the core layer, convergence layer, and access layer of MAN/LAN.
It is applied in the construction of trunk WDM network with small capability and
medium-long transmission distance.
l ZXMP M600 is applicable to the convergence layer, access layer of large-scale MAN,
and all layers of small-medium MAN. It is applied in the construction of LAN with the
short distance.
1.2 Networking Application

1.2.1 Point-to-Point Network
For the point-to-point network, see Figure 1-2.
Figure 1-2 Point-to-Point Network Application
1.2.2 Chain Network

For the chain network, see Figure 1-3.
Figure 1-3 Chain Network Application
1.2.3 Ring Network

For the ring network, see Figure 1-4.
1-2

Chapter 1 Product Orientation and Application
Figure 1-4 Ring Network Application
1.2.4 Ring-Chain Network

For the ring-chain network, see Figure 1-5.
Figure 1-5 Ring-chain Network Application
1.2.5 Tangent Ring Network

For the tangent ring network, see Figure 1-6.
Figure 1-6 Tangent Ring Network Application
1-3

1.2.6 Cross Network

Figure 1-7 shows an application example of cross network consisting of ZXWM M920
FOADM, OLA, and OTM equipment.
Figure 1-7 CROSS NETWORK APPLICATION
1.2.7 Mesh Network

Among network applications, when optical directions supported by node devices are not
fewer than four, the Mesh network mode can be used. When traffic scheduling demand
is available at multiple directions, the Mesh network application can perform automatic
connection configurations to meet cross-direction service protection and multiple-direction
network management.
1.3 Network Element Type

1.3.1 OTM Configurations
Function and Principle Diagram
OTMs are used at terminal nodes of optical lines to add or drop services. The function
diagram is shown in Figure 1-8.
1-4

Figure 1-8 OTM Equipment Operating Principle Diagram
Board Configurations
OTM configurations are described as follows by taking a 96channel system as an
example.
l If SOTU10G boards are used, the OTM equipment is configured with six subracks
and two cabinets. For the subracks and boards configurations, see Figure 1-9 and
Figure 1-10.
1-5

Figure 1-9 OTM Equipment Configuration (96-Channel SOTU10G Cabinet 1)
Note:
Parts of optical transponder boards and convergence boards are not contained in the
diagram.
1-6

Figure 1-10 OTM Equipment Configuration (96-Channel SOTU10G Cabinet 2)
l If EOTU10G boards are used, the OTM equipment is configured with ten subracks
and three cabinets. For the subrack and board configurations, see Figure 1-11, Figure
1-12, and Figure 1-13.
1-7

Figure 1-11 OTM Equipment Configuration (96-Channel EOTU10G Cabinet 1)
1-8

1-9

Fiber Connections
The fiber connections in a 96-channel OTM equipment are shown in Figure 1-14.
1-10

Figure 1-14 Optical Connections in OTM Equipment (96-Channel)
Configuration Description
For the configuration description of the OTM equipment, refer to Table 1-1.
Table 1-1 Configuration Description
Configuration Requirements Description
To implement the Each OMU/ODU board occupies 4 slots.

multiplexing/demultiplexing
of channels,
To implement the optical Each EONA board occupies 4 slots

amplification, Each SEOBA board occupies 1 slot.
The EOBAH board can be used to replace the SEOBA board to
meet the requirements for high output power.
The EOBAH board occupies 4 slots.
For the 8/16/32/40/48 channel when SEOBA or SEOPA boards are not configured, the
system, SSDM board can be used for the multplexing/demultiplexing of
1550/1510 nm wavelengths.
For the 80/96/160/176/192 the OCI board and OBM board are used in the 80/96/160/176/192
channel system, channel system.
the 80-channel system can also use OMU80/ODU80 boards to
implement wavelength multiplexing/demulitplexing.
1-11

To implement the OCH/OMS 1+1 if the OCH/OMS 1+1 protection is required, the SOP boards
protection, should be configured. The configuration positions of SOP boards
and optical fiber connections should be determined according
to the protection types.
To implement the OCH 1:N if the OCH 1:N protection is required, OMCP boards should be
protection, configured between the user equipment and OTU boards.
For the dispersion compensation the DCM plug-in boxes and DCM modules should be configured
after a long-haul transmission, according to the fiber types and the requirements.
To implement the aggregation, any OTU (SOTU10G/EOTU10G) board displayed in Figure

1-14 can be replaced by the aggregate board (SRM41, SRM42,
DSAC, DSAF, FCA, MQT3 or SMUB board).
1.3.2 FOADM Configurations

Fixed Optical Add/Drop Multiplexers (FOADMs) are used at intermediate nodes of optical
lines to add/drop part of services and pass through the rest of services. The function
diagram is shown in Figure 1-15.
Figure 1-15 FOADM Equipment Operating Principle Diagram
FOADM nodes can add/drop optical signals with fixed wavelengths.
1-12

Cabinet and Subrack Configurations

The FOADM equipment is configured with only one cabinet consisting of one master
subrack and three slave subracks.
Cabinet configurations of the FOADM equipment supporting bidirectional add/drop of eight
wavelengths are shown in Figure 1-16 and Figure 1-17.
Figure 1-16 FOADM Equipment Configuration (SOTU10G)
1-13

Figure 1-17 FOADM Equipment Configuration (EOTU10G)
Fiber Connections
Fiber connections in the FOADM equipment supporting unidirectional add/drop of eight
wavelengths are shown in Figure 1-18.
1-14

Figure 1-18 FOADM Equipment Fiber Connections (Unidirectional Add/Drop of Eight

Wavelengths)
SOGMD boards can also be used in the FOADM equipment to implement the
multiplexing/demultiplexing of a group of wavelengths. The fiber connections are shown
in Figure 1-19.
Figure 1-19 FOADM Equipment Fiber Connections (Configured with SOGMD Boards)
1-15

For the configuration description of the FOADM equipment, see Table 1-2.
Required Boards Each SOAD board occupies one slot, and supports the
transmission/receipt of optical signals in only one direction, that
is, both IN and OUT interfaces of an SOAD board are connected
to the same site.
To add/drop more wavelengths, each SOAD board can add/drop fixed one to four wavelength
signals. If the add/drop function is required for more wavelengths,
SOAD boards and OMU/ODU boards are needed to be
cascaded.
To implement the OCH/OMS the SOP boards should be installed, and positions and optical
1+1 protection or electrical-layer connections of the SOP boards should be determined according
service board redundancy 1+1 to the protection mode.
protection,
To implement the OCH 1:N OMCP boards should be added between user equipment and
protection, optical transponder boards.
To implement the OMS or OCH the SOPMS or SOPCS boards should be added, and fiber
ring protection, connection relations should be determined according to the
protection mode.
For the dispersion compensation DCM plug-in boxes should be installed, and dispersion
after long-distance transmissions compensation modules should be configure d as required.
To implement the aggregation, an OTU board shown in Figure 1-19 should be replaced with an
aggregate board (SRM41, SRM42, DSAC or SAUC board).
1.3.3 ROADM Configurations

Equipment Features
The ROADM equipment supports the following features:
l Wavelength reconstruction in two directions and in multiple directions.
l Adding/dropping local wavelengths: adding/dropping local fixed wavelengths,
adding/dropping any local wavelength at any port, and adding/dropping/broadcasting
any direction-irrelevant wavelength.
Cabinet, Subrack and Board Configuration

The ROADM equipment is configured with only one cabinet consisting of one master
subrack and three slave subracks.
Boards: WBU/WBM/WSU/PDU
1-16

Fiber Connections
Figure 1-20 illustrates a two-dimension fiber connections diagram of the ROADM
equipment configured with WBM.
Figure 1-20 Fiber Connections in ROADM Equipment (Configured with WBM Boards)

equipment configured with WBU.
Figure 1-21 Fiber Connections in ROADM Equipment (Configured with WBU Boards)
1-17


equipment configured with WSU.
Figure 1-22 Fiber Connections in ROADM Equipment (Configured with WSU Boards)
Figure 1-23 illustrates a three-dimension fiber connections diagram of the ROADM

equipment.
Figure 1-23 Fiber Connections in ROADM Equipment (Three Dimensions)
Figure 1-24 illustrates a nine-dimension fiber connections diagram of the ROADM

equipment.
1-18

Figure 1-24 Fiber Connections in ROADM Equipment (Nine Dimensions)
1. Each SEOBA board occupies one slot. Each EONA board occupies four slots. Each
WBU/WSU/WBM board occupies four slots.
2. If OCH/OMS 1+1 protection or electrical-layer service board redundancy 1+1 protec-
tion is required, SOP boards should be added, and positions and optical connections
of the SOP boards should be determined according to the protection mode.
3. If OCH 1:N protection is required, OMCP boards should be added between user
equipment and optical transponder boards.
4. If OMS or OCH ring protection is required, SOPMS or SOPCS boards should be added,
and fiber connection relations should be determined according to the protection mode.
5. If dispersion compensation is required for the OADM equipment after long-haul
transmissions, DCM plug-in boxes should be added, and dispersion compensation
modules should be configured as required.
6. If the SOGMD board is configured in network, the black wavelengths in SOGMD
boards cannot be occupied.
7. When the ROADM equipment is configured, if only the add/drop function is required,
WBU boards should be configured, drop wavelengths should be fixed, and each WBU
board should be configured on direction A and B.
8. When the ROADM equipment is configured, if the add/drop function as well as port
configuration are required, WSUD boards should be configured.
1-19

9. When the ROADM equipment is configured, if the add/drop function, port configuration,
and service broadcast are required, WSUA boards should be configured.
10. When the ROADM equipment is configured, if the add function and pass-through
function are required, WBM boards should be configured.
11. When the ROADM equipment is configured, if couplers are required for the power
isolation, PDU boards should be configured.
ROADM Network Relevances

For the direction/wavelength correlations, refer to Table 1-3.
Table 1-3 Direction/Wavelength Correlation
Item Description
Direction relevance Services in add channels on the local node cannot be sent to any
direction.
Direction irrelevance Services in add channels on the local node can be sent to any
direction.
Wavelength relevance Services cannot be sent to an OTU-type board through any drop
channel on the local node.
Wavelength irrelevance Services can be sent to an OTU-type board through any drop
channel on the local node.
ROADM Network Relevance Implementation Schemes

l For the implementation of direction relevance and wavelength relevance, see Figure
1-25.
1-20

Figure 1-25 Direction Relevance and Wavelength Relevance
l For the implementation of direction irrelevance and wavelength relevance, see Figure
1-26.
1-21

Figure 1-26 Direction Irrelevance and Wavelength Relevance
l For the implementation of direction irrelevance and wavelength irrelevance, see

Figure 1-27.
1-22

Figure 1-27 Direction Irrelevance and Wavelength Irrelevance
l For the implementation of direction relevance and wavelength irrelevance, see Figure
1-28.
1-23

Figure 1-28 Direction Relevance and Wavelength Irrelevance
1.3.4 OLA Configurations

Optical Line Amplifiers (OLAs) are used to compensate optical signals power after
a long-distance transmission. Dispersion Compensation Modules (DCMs) can be
configured as required. The OLA equipment without DCM and with DCM are respectively
shown in Figure 1-29 and Figure 1-30.
1-24

Figure 1-29 Function Diagram of OLA Equipment (Without DCMs)
Figure 1-30 Function Diagram of OLA Equipment (With DCMs)
Board configurations of the OLA equipment with single-channel rate are described as
follows:
l The single-channel rate is 2.5 Gbit/s.
The OLA equipment with single-channel rate at 2.5 Gbit/s is shown in Figure 1-31.
1-25

Figure 1-31 OLA Equipment Configuration (2.5 Gbit/s)
l The single-channel rate is 10 Gbit/s.

EOLA equipments at 10 Gbit/s always combine EONA boards and DCMs to implement
the amplification and dispersion compensation of optical signals. The OLA equipment
with single-channel rate at 10 Gbit/s is shown in Figure 1-32.
Figure 1-32 OLA Equipment Configuration (10 Gbit/s)
Fiber Connections
l Fiber connections in the OLA equipment at 2.5 Gbit/s are shown in Figure 1-33.
Figure 1-33 OLA Equipment Fiber Connections (2.5 Gbit/s)
l Fiber connections in the OLA equipment at 10 Gbit/s are shown in Figure 1-34.
1-26

Figure 1-34 OLA Equipment Fiber Connection (10 Gbit/s)
For the OLA equipment configuration description, refer to Table 1-4.
Requirements
Required Boards Each EONA board occupies four slots.

The EOLAD board can serve as EOLA board
When the transmission rate DCMs are used to implement dispersion compensation. DCMs should
is 10 Gbit/s or 40 Gbit/s, be selected according to the fiber type and the actual distance that
needs dispersion compensation.
1-27

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1-28

Chapter 2
Product Characteristics
Table of Contents
Technology Characteristics.........................................................................................2-1
Upgrade and Maintenance Characteristics .................................................................2-4
2.1 Technology Characteristics

2.1.1 Forward Error Correction Functions
The ZXWM M920 system uses Forward Error Correction (FEC) technology, which has the
following advantages:
l Improves the error-tolerance capability of transmitted signals

l Reduces the system requirement on the signal-to-noise ratio
l Extends the transmission distance
There are four types of FEC functions: Ordinary FEC , AFEC (Advanced Forward Error
Correction) , HD-FEC (Hard Decision Forward Error Correction) , and SD-FEC (Soft
Decision Forward Error Correction) , refer to Table 2-1.
Table 2-1 FEC List
Item Description
FEC Type Ordinary FEC AFEC SD-FEC
Frame structure G.709 G.975 G.709
Traffic rate 2.5 G 2.660 Gbit/s Unavailable Unavailable
STM-64 10.709 Gbit/s 10.709 Gbit/s Unavailable
10 GE 11.100 Gbit/s 11.100 Gbit/s Unavailable
40 G 43.018 Gbit/s 43.018 Gbit/s Unavailable
100 G Unavailable Unavailable 120.520 Gbit/s
OSNR 5 dB to 6 dB 7 dB to 9 dB <12.5 dB
2.1.2 APSD/APR Function

The ZXWM M920 system supports two modes of Automatic Power Control (APC)
functions: Automatic Power ShutDown (APSD) and Automatic Power Reduction (APR).
2-1

When no optical input power is detected by a detection board that has the optical
performance detection function, the detection board sends a message to the SNP
board. The SNP board takes control of the execution board (such as an EOA board) to
automatically reduce or shut down the power, so as to prevent eye injuries by a laser.
After the fault is removed, the original board power can be recovered automatically or
manually.
2.1.3 Erbium-Doped Fiber Amplifier (EDFA)

The ZXWM M920 system uses EDFA technology to improve the transmission distance. It
provides the following benefits:
l Greatly reduces the cost of optical regeneration.

l High gain, low noise, large bandwidth, high output power, high pump efficiency, low
insertion loss, and insensitivity for polarization.
2.1.4 Distributed RAMAN Amplification

In the Optical Transport Network (OTN)/Wavelength-Division Multiplexing (WDM) system
with ultra-long-haul transmission distances, using only the EDFA technology to implement
the amplification accumulates spontaneous radiation and restricts the performance of
the system. The ZXWM M920 system uses a Distributed RAMAN Amplification (DRA)
board to effectively improve the optical-amplification performance of the ultra-long-haul
transmission system through the combination of EDFA and DRA technologies (the
combination of EOA board and DRA board).
2.1.5 Intelligent ROADM

The ZXWM M920 system provides an intelligent Reconfigurable Optical Add/Drop
Multiplexer (ROADM). An intelligent ROADM is composed of a Power Distribution Unit
(PDU) and a Wavelength Selective Switch Unit (WSU). The intelligent ROADM improves
the flexibility of the WDM network. Thus, the operator can remotely and dynamically
control the wavelength transmission path, and effectively reduce the operation and
maintenance costs. The detailed functions provided by intelligent ROADM are as follows:
l Provides add/drop of local optical signals.

l Supports service broadcast.
l Supports wavelength scheduling from up to nine optical directions.
l Supports any combinations between wavelength-relevance (wavelength-related,
wavelength-unrelated) and direction-relevance (direction-related,
direction-unrelated), including:
wavelength-related, direction-related;
wavelength-related, direction-unrelated;
wavelength-unrelated, direction-related;
wavelength-unrelated, direction-unrelated.
2-2

Chapter 2 Product Characteristics
2.1.6 Performance Monitoring Function

l The ZXWM M920 system provides an optical performance monitoring unit. This unit
is responsible for measuring parameters of each optical channel, including the optical
power, central wavelength and Optical Signal-Noise Ratio (OSNR), and sending these
data to the EMS, in which users can view the performance data in a list or in a graph.
l The optical transponder unit supports performance monitoring and overhead
processing function. It can locate the faults and fault types according to the following
access signals:
For OTN signals: detects performance and alarm messages, including Loss
Of Frame (LOF) alarm, Bit Interleaved Parity (BIP-8), the overhead Trail Trace
Identifier (TTI), corrected bit error count, uncorrectable frame count, OTUk-AIS,
ODUk-AIS, ODUk-OCI, ODUk-LCK, PM-BIP8, ODUk-PT.
For SDH signals: monitors RS_BBE(B1) and J0 bytes.
For GE signals: monitors the packet error count, packet error ratio, and Generic
Framing Procedure (GFP) performance.
l The boards on the main optical path use the power collection and monitoring
technology with great dynamic range and high accuracy. With the technology, the
power measurement error is less than 1 dB and the system performance can be truly
reflected.
2.1.7 Electrical Cross-Connect Function

The electrical cross-connect function of the ZXWM M920 system is divided into centralized
electrical cross-connect and distributed electrical cross-connect.
Centralized Electrical cross-connect

By using a cross-connect board and the backplane together, the centralized electrical
cross-connect function implements flexible, time-slot cross-connect scheduling of
time-slot frames on the backplane. After the scheduling, one or one group of time-slot
frames are demultiplexed on the service board to restore the service. The centralized
electrical cross-connect system is based on synchronous time division scheduling, which
is applicable to large-scale scheduling systems. The centralized electrical cross-connect
system has the following features:
l The cross-connect capacity is 0.8 TB, 1.6 TB, and 3.2 TB.
l The cross-connect granularities are ODU0, ODU1, ODU2 and ODU3.
l This function crossconnects services to different wavelengths and directions.
l This function supports the access of 100M to 1.25G, FE/GE/10GE/40GE/100GE,
STM-1/STM-4/STM-16/STM-64/STM-256, FC400/800, FC200/400/800, and ODUk
(where k = 0/1/2/2e/3/3e1/3e2) services.
l As an unblocked network, the cross-connect network supports broadcasting and
Ethernet clock-transparent transmission functions.
2-3

Distributed Electrical cross-connect

By using a backplane, the distributed electrical cross-connect function implements
cross-connect scheduling of frames. After the scheduling, the frame is demultiplexed
on the service board in the distributed cross-connect group to restore the service. The
granularity of the distributed electrical cross-connect system is fine, and the configuration
mode is flexible. The distributed electrical cross-connect system has the following
features:
l A single subrack can be configured with up to six distributed cross-connect groups.
The cross-connect capacity and the access capacity of each group are 80 GB.
l The cross-connect granularities are ODU0/ODU1.
l This function implements access to the service with a rate of 100 Mbit/s to 4.25 Gbit/s
through board combinations.
2.1.8 RPOA Technology

The ZXWM M920 system uses the Remotely Pumped Optical Amplifier (RPOA)
technology, which is an ultra-long-distance transmission technology.
In the RPOA system, a segment of Erbium-Doped Fiber (EDF) is inserted in transmission
optical cables, which provides pumped light at a far-end site to amplify optical signals.
The RPOA system was developed to implement ultra-long, single-span transmission when
no power supply is available in the system.
It usually applies in the following cases:
l No power supply is available, or regenerator sites cannot be established when optical

cables cross over straits or adjacent seas, or pass through depopulated areas (such
as deserts, marshes and forests).
l The construction and maintenance of regenerator sites is difficult in remote areas due
to territorial limits.
RPOA supports the following applications:
l Unidirectional pump application through the same fiber

l Unidirectional pump application through different fibers
l Bidirectional pump application through two fibers
2.2 Upgrade and Maintenance Characteristics

Master and Slave Subracks
The ZXWM M920 system supports the master/slave subrack installation.
One Network Element (NE) of the equipment is installed in only one master subrack. The
master subrack can support multiple slave subracks. For the details of slave subracks
supported by a single master subrack in the ZXWM M920 system, refer to Table 2-2.
2-4

Chapter 2 Product Characteristics
Table 2-2 Maximum Number of Slave Subracks for a Single Master Subrack
Subrack Type Number of Master Subracks Maximum Number of Slave Subracks
CX20 1 15
CX30 1 15
CX50 1 15
NX4 1 15
DX41 1 15
CX51 1 15
Supervisory Channel Compatibility

The optical and electrical supervisory channels of the ZXWM M920 system can be
connected to and communicate with those of other OTN equipment.
Smooth Expansion and Scalability

The ZXWM M920 system has the following smooth capacity expansion and scalability:
l A ZXWM M920 system transmitting 100 Gbit/s, 40 Gbit/s, 10 Gbit/s and 2.5 Gbit/s
services can be updated to a 100 Gbit/s system.
l A ZXWM M920 system has an architecture that can be updated to a 192 channel
system.
Online Upgrade
The ZXWM M920 system supports online upgrades as follows:
l Online upgrade of the network-element-management software and embedded
software of each board in the ZXWM M920 system without traffic interruption
l Online upgrade a system transmitting less than 96 channels to a 96channel system.
Pluggable Optical Module

For service signals at the rate of 40 Gbit/s (STM-256/OTU3), the CFP + MSA300PIN optical
modules are supported.
For service signals at the rate of 10 Gbit/s (STM-64/OC-192/10GE/OTU2), 10Gigabit
Small Form-Fator Pluggable optical modules (XFP) and SFP+ optical modules are
supported.
For service signals with the rate of 2.5 Gbit/s or below, the optical interfaces at the client
side support Small Form-Factor Pluggable optical modules (SFP).
Pluggable-optical modules support the position-detection for optical modules.
2-5

2-6

Chapter 3
System Functions
Table of Contents
Line Transmission Function........................................................................................3-1
Automatic Power Optimization Function .....................................................................3-5
IWF Function..............................................................................................................3-6
Wavelength Tunable Function ....................................................................................3-6
Performance Monitoring Function...............................................................................3-7
Chromatic Dispersion Compensation..........................................................................3-8
Service Functions.......................................................................................................3-8
Communication and Supervision Function................................................................3-10
Alarm Monitoring Function........................................................................................3-12
Protection Functions.................................................................................................3-13
Clock Management Function ....................................................................................3-20
Clock Time Synchronization Function .......................................................................3-20
3.1 Line Transmission Function

3.1.1 Transmission Capacity
Wavelength Capacity
The ZXWM M920 system can be configured as a transmission system with a maximum
of 96 channels. The wavelength capacity of each channel can reach a maximum of 100
Gbit/s.
Channel Rate
The ZXWM M920 system supports single-channel rates at 100 Gbit/s, 40 Gbit/s, 10 Gbit/s,
and 2.5 Gbit/s.
Channel Spacings
The ZXWM M920 system uses the Dense Wavelength Division Multiplexing (DWDM)
technology. It supports channel spacings of 50 GHz and 100 GHz.
3.1.2 Channel Rate

The ZXWM M920 system supports single-channel rates at 100 Gbit/s, 40 Gbit/s, 10 Gbit/s,
and 2.5 Gbit/s.
3-1

3.1.3 Channel Spacings

The ZXWM M920 system uses the Dense Wavelength Division Multiplexing (DWDM)
technology. It supports channel spacings of 50 GHz and 100 GHz. In a 10 G/100 G hybrid
transmission system, guard bands may be needed if the transmission distance is long.
3.1.4 Transmission System Codes

The ZXWM M920 system is classified into the following systems:
l 40channel system, at 2.5 Gbit/s
l 40/48channel system, at 10 Gbit/s
For descriptions of the above transmission systems, refer to Table 3-1, Table 3-2, Table
3-3, Table 3-4, Table 3-5, Table 3-6, Table 3-7, Table 3-8, and Table 3-9.
Table 3-1 Transmission System at 102.5 Gbit/s
Transmission Code Cross-Segment Loss (dB) Target Distance (km)
-FEC (OSNR>20dB) 136 1144
233 2132
331 3124
1023 1092
FEC-RAMAN (OSNR>15dB) 141 1164
238 2152
336 3144
2025 20100
FEC+RAMAN 141 1180

(OSNR>15dB)
242 2168
340 3160
2028 20112
3-2

Chapter 3 System Functions
Table 3-2 Transmission Codes Supported by the 40/4810 Gbit/s System
Transmission Code Cross-Segment Loss Target Distance (km) Remark

Pattern (dB)
AFEC NRZ 161 1244 RPOA, 4010 Gbit/s
149 1196 DRA, 4010 Gbit/s
157 1228 RPOA, 4810 Gbit/s
148 1192 DRA, 4810 Gbit/s
3022 3088 -
1230 12120 -
AFEC RZ 164 1256 RPOA, 4010 Gbit/s
152 1208 DRA, 4010 Gbit/s
160 1240 RPOA, 4810 Gbit/s
151 1204 DRA, 4810 Gbit/s
5022 5088 -
1830 18120 -

Pattern (dB)
AFEC NRZ 145 1180 DRA, 8010 Gbit/s
144 1176 DRA, 9610 Gbit/s
2022 2088 -
830 8120 -
AFEC RZ 148 1192 DRA, 8010 Gbit/s
147 1188 DRA, 9610 Gbit/s
3022 3088 -
1230 12120 -
3-3


Pattern (dB)
AFEC DPSK 147 1188 DRA, 4040 Gbit/s
146 1184 DRA, 4840 Gbit/s
2222 2288 -
530 5120 -
1230 12120 DRA

Pattern (dB)
AFEC DPSK 144 1176 DRA, 8040 Gbit/s
143 1172 DRA, 9640 Gbit/s
1622 1688 -
330 3120 -
630 6120 DRA
Table 3-6 Transmission Codes Supported by the 80100 Gbit/s System (G.652 + DCM)

Pattern (dB)
SD+FEC+PM-QPSK 1x45 1x180 DRA, 80x100Gbit/s
16x22 16x88 -
4x30 4x120 -
7x30 7x120 DRA
Table 3-7 Transmission Codes Supported by the 80100 Gbit/s System (G.652 - DCM)

Pattern (dB)
20x22 20x88 -
4x30 4x120 -
7x30 7x120 DRA
3-4

Table 3-8 Transmission Codes Supported by the 80100 Gbit/s System (G.655 + DCM)

Pattern (dB)
10x22 10x88 -
3x30 3x120 -
6x30 6x120 DRA
Table 3-9 Transmission Codes Supported by the 80100 Gbit/s System (G.655 - DCM)

Pattern (dB)
12x22 12x88 -
3x30 3x120 -
6x30 6x120 DRA
3.2 Automatic Power Optimization Function

The ZXWM M920 system uses the Automatic Power Optimization (APO) technology to
provide the automatic power management function at the OMS layer and OCH layer.
l OMS power management: to establish and maintain the optimal status of aggregate
optical power at the OMS layer.
l OCH power management: to establish and maintain the equalization of optical power
at the OCH layer.
3.2.1 OMS Power Management

The power management at the OMS layer is based on the power management domain.
A power management domain is a multiplex section, that is, the Optical Multiplex Section
(OMS) between two Optical Terminal Multiplexers (OTMs) , two Fixed Optical Add/Drop
Multiplexers (FOADMs) or Reconfigurable Optical Add/Drop Multiplexer (ROADMs).
The OMS power management function ensures that the difference between gains and
corresponding line losses in the same multiplex section is constant.
In an actual optical channel, when the difference between its gain and line loss meets the
triggering condition specified by the power management function, the power optimization
will start. When the gain-loss difference reaches a value meeting the power requirement,
the power optimization will end.
3-5

The OMS power management function can only be implemented with the cooperation of
certain boards and the EMS.
3.2.2 OCH Power Management

The ZXWM M920 system provides the power management function at the Optical Channel
(OCH) layer. The OCH layer is the line side of the optical transponder unit, which connects
various signals ( PDH, SDH, and ATM).
There are two types of OCH power management.

l Fixed power compensation
A fixed equalization filter in an Erbium-Doped Fiber Amplifier (EDFA) is used to ensure

the flatness of gain spectrum.
l Dynamic channel power management
Dynamic gain equalization technology and power pre-equalization technology are

used to adjust the optical power of each channel to guarantee the optical power
equalization of each channel at the optical receiving end.
3.3 IWF Function

The frequency drift has little impact on a DWDM system with channel spacing at 100
GHz. But it has an impact on a DWDM system reliability with higher channel rate and
less channel spacing, such as an 80/96 channel system with channel spacing at 50 GHz.
The ZXWM M920 system provides two modes to ensure the system reliability.
l The system with 100 GHz channel spacing uses automatic power control, temperature
feedback, and internal wavelength feedback, which are implemented by optical
transponder boards.
l The system with 50 GHz channel spacing uses internal wavelength feedback and
external wavelength feedback, which improves stability and accuracy of wavelength
control.
Internal wavelength feedback: It is implemented by optical transponder boards.
External wavelength feedback: It is implemented by the Integrated Wavelength

Feedback (IWF) function. The IWF function uses integrated detection and
ordered adjustment to implement the wavelength feedback control. OWM
boards, OMU boards, OTU boards, SNP boards, and EMS work together to
implement the IWF function.
3.4 Wavelength Tunable Function

Traditional DWDM systems use fixed wavelength lasers as light sources, which only
output fixed wavelengths complying with ITU-T G.694.1 recommendation. Fixed
wavelength lasers cannot be fully utilized when they are used as standby light sources,
3-6

which causes the operation costs. The development of light source technology uses a
tunable wavelength laser to meet the requirements for multi-wavelength tuning.
The tunable wavelength laser refers to a laser module that can be controlled to output
different wavelengths in a certain bandwidth. The channel quantity and channel spacing
of the output wavelengths meet the specifications of ITU-T G.694.1. With the application
of tunable wavelength lasers, wavelengths can be selected dynamically for signals in a
DWDM system according to the actual application of wavelengths. Especially when the
system uses standby light sources, using tunable wavelength lasers can improve the
utilization ratio of wavelengths.
Some service boards of the ZXWM M920system support both fixed wavelength output
and tunable wavelength output. Table 3-10 lists the boards supporting wavelength tuning
function and their tuning ranges (relationship among operating band, channel quantity and
channel spacing).
Table 3-10 Boards Supporting the Wavelength Tunable Function
Board Type Operating Band Channel Quantity @Channel Spacing
100 G board (with FEC or AFEC)
TS4/CS4 Full C band 40 CH@100 GHz

80/96 CH@50 GHz
TD2C/TS2C/LS3/LO2/L- Full C band 40 CH@100 GHz

Q2/MQA1/MQA2 80/96 CH@50 GHz
EOTU10G/EOTU10GB/ Full C band 40 CH@100 GHz

SOTU10G/SRM41/ 80/96 CH@50 GHz
LO2/FCA/FCAG
2.5 G board (with FEC)
SOTU2.5G C band 4/8/16CH@100 GHz

(Continuous wavelengths)
2.5 G board (without FEC)
SRM42 C band 4/8/16CH@100 GHz

(Continuous wavelengths)
3.5 Performance Monitoring Function

l The ZXWM M920 system provides an optical performance monitoring unit. This unit
is responsible for measuring parameters of each optical channel, including the optical
power, central wavelength and Optical Signal-Noise Ratio (OSNR), and sending these
data to the EMS, in which users can view the performance data in a list or in a graph.
3-7

l The optical transponder unit supports performance monitoring and overhead

processing function. It can locate the faults and fault types according to the following
access signals:
For OTN signals: detects performance and alarm messages, including Loss
Of Frame (LOF) alarm, Bit Interleaved Parity (BIP-8), the overhead Trail Trace
Identifier (TTI), corrected bit error count, uncorrectable frame count, OTUk-AIS,
ODUk-AIS, ODUk-OCI, ODUk-LCK, PM-BIP8, ODUk-PT.
For SDH signals: monitors RS_BBE(B1) and J0 bytes.
For GE signals: monitors the packet error count, packet error ratio, and Generic
Framing Procedure (GFP) performance.
l The boards on the main optical path use the power collection and monitoring
technology with great dynamic range and high accuracy. With the technology, the
power measurement error is less than 1 dB and the system performance can be truly
reflected.
3.6 Chromatic Dispersion Compensation

For the ZXWM M920 system used for 2.5 G-signal transmission, the dispersion tolerance
is 12800 ps (640 km). For the ZXWM M920 system used for 10 G-signal transmission, the
dispersion tolerance is 400 ps/800 ps (20 km/40 km). If the transmission distance is greater
than that mentioned above, the dispersion restriction should be taken into consideration.
40GTDC
The ZXWM M920 system provides dispersion compensation modules in DCM plug-in
boxes to compensate dispersion.
3.7 Service Functions

Service functions of ZXWM M920 system include three aspects: service access function,
service convergence function, and wavelength add/drop function.
3.7.1 Service Access Function

For the services admittable by the ZXWM M920 system, refer to Table 3-11.
Table 3-11 Services Admittable by the ZXWM M920 System
Service Description
Synchronous Digital Hierarchy (SDH) STM-1, STM-4, STM-16, STM-64, STM-256, OTU3,
services OTU3u, OTU3e, and OTU3f
Plesiochronous Digital Hierarchy E3 and E4

(PDH) Services
Synchronous Optical Network (SONET OC-3, OC-12, OC-48, OC-192, and OC-768
services
3-8

Service Description
Asynchronous Transfer Mode (ATM VC4, VC4-4c, and VC4-16c

services or Packet Over SONET/SDH
(POS) services
Ethernet services FE, GE, 10GE, 40GE, 100GE
SAN services ESCON, FICON, FC1/2/4/8, 2GFC, 4GFC, 10GFC
Other services Digital Video Broadcasting (DVB), FDDI, Fiber Connection

(FICON), High Definition Television (HDTV), and Enterprise
System Connection (ESCON)
3.7.2 Service Convergence Function

The ZXWM M920 system can multiplex low-rate signals into high-rate signals, and
demultiplex high-rate signals into low-rate signals. For the descriptions of service boards,
refer to Table 3-12.
Table 3-12 ZXWM M920 Service Aggregation Functions
Board Description
MQA1 Uses the data multiplexing technology to multiplex/demultiplex four channels of

ANY service signals into/from OTU1 signals.
MQA2 Uses the data multiplexing technology to multiplex/demultiplex four channels of

ANY service signals into/from OTU2 signals.
MJA Uses the data multiplexing technology to multiplex/demultiplex six channels of ANY
service signals into/from the backplane signals.
MOM2 Implements multiple services convergence to OTU boards. It cannot send services
to the backplane client side.
MQT3 Multiplexes/demultiplexes four channels of 10 G service signals (STM-64, OC-192,

10GbE or OTU2) into/from 40 G signals conforming to the ITU-T G.694.1.
ASMA Multiplexes/demultiplexes 24 channels of GE signals or one channel of 10 GE

signal into/from two channels of OTU2 signals.
SRM42 Multiplexes/demultiplexes four channels of STM-1 or STM-4 signals at each

tributary side into/from STM-16 signals at the aggregate side.
SRM41 Multiplexes/demultiplexes four channels of STM-16 signals at each tributary

side into/from STM-64 signals at the aggregate side. It supports SDH
synchronous convergence or OTN asynchronous convergence and FEC/AFEC
encoding/decoding. In addition, it complies with the ITU-T G.709.
FCA Multiplexes/demultiplexes two channels of 4G FC, four channels of 2G FC, or eight

channels of FC signals into/from OTU2 signals.
3-9

3.8 Communication and Supervision Function

3.8.1 Supervisory Channels
The monitoring subsystem of the ZXWM M920 system consists of SNP, CCP, SOSCB
and SEIA1/SEIA2 boards. The monitoring system contains Optical Supervisory Channel
(OSC) and Electric Supervisory Channel (ESC) to transmit the EMS and orderwire
information.
l For the descriptions of optical supervisory channels, refer to Table 3-13.
Table 3-13 ZXWM M920 Optical Supervisory Channel
Item Capability
Monitoring rate 100 Mbit/s
Monitoring direction The monitoring system supports 16 monitoring directions by in-

stalling four SOSCB boards, which can satisfy the monitoring
direction requirements.
Each SOSCB board supports monitoring on four directions. Multiple

SOSCB boards can be installed to support more monitoring direc-
tions.
When SOSCB boards serve for optical monitoring, slot 3 or slot 5 in

subrack 1 must be installed with an SOSCB board.
Compatibility The 100 M optical supervisory channels of the ZXWM M920 system can
communicate with the 100 M optical supervisory channels of the ZXMP
M820 system and ZXWM M920 system.
l For descriptions of electrical supervisory channels, refer to Table 3-14.
Table 3-14 ZXWM M920 Electrical Supervisory Channel
Item Capability
Monitoring rate The actual rate of an electrical supervisory channel depends on both
optical line rate and quantity of General Communication Channels
(GCCs). There are three groups of GCCs named as GCC0, GCC1, and
GCC2. When these three groups are used, the rate of an electrical
supervisory channel is as follows:
If the line rate is 10 G, the electrical supervisory channel rate is 3.9

Mbit/s.
If the line rate is 2.5 G, the electrical supervisory channel rate is 0.95
Mbit/s.
Monitoring direction The system supports 16 monitoring directions when enough service
boards supporting ESC are installed.
3-10

Item Capability
Compatibility The ESC electrical supervisory channel of the ZXWM M920 system can
communicate with the 100 M optical supervisory channels of the ZXMP
M820 system and the ZXWM M920 system.
3.8.2 Communication Functions

For the communication functions supported by the ZXWM M920 system, refer to Table
3-15:
Table 3-15 Communication Functions of the ZXWM M920 System
Communication Channel/Inter- Description

Type face
Communication Qx interface SNP boards report alarms and performances of NEs and
between NEs and subnetworks to the EMS through Qx interfaces and receive
the EMS commands and configurations sent from the EMS.
Communication 100 M The monitoring system uses the 100 M Ethernet technology
among NEs supervisory to encapsulate ECC data, orderwire voice data, APS data,
channel and transparent user channel data into IP data packets, and
then transmits and exchanges the information in Ethernet
data frames.
The monitoring system uses the Open Shortest Path First
(OSPF) protocol. When the network topology is changed,
a new routing table is automatically aggregated and built,
which guarantees smooth monitoring channels.
If the network span is too large and the line loss is too
high, monitoring signals can be accessed to OTU boards
supporting continuous-rate services to support the in-band
monitoring.
Electrical Information carried by the ESC is transmitted by overheads

supervisory in OTN service signals to implement the communication
channel between two NEs in a single span. Service boards
supporting the ESC function are SOTU2.5G and SOTU10G.
Note:
An RJ45 interface on the SEIA1/SEIA2 board can serve as a Qx interface. It is referred to
as J4 on the SEIA1 board front panel and J3 on the SEIA2 board front panel.
3-11

3.9 Alarm Monitoring Function

3.9.1 External Alarm Input and Output Function
The ZXWM M920 system supports the external alarm input and output functions.
l External alarm input function
Through the external alarm input interface on the SEIA1 board of the master subrack,
the equipment uses optical coupling isolation signals to access alarms input by the
external monitoring equipment, and displays the alarms on the EMS. The system can
access up to 10 channels of external alarms to monitor alarms, including fans, doors,
and temperature of external environment. The alarm type is configured in the EMS.
l External alarm output function
Through the alarm output, ring output, or cabinet indicator interface on the SEIA1
board, the equipment outputs alarm signals to column-head cabinets in the equipment
room, alarm indicator boards, or other monitoring units. The equipment alarm output
signal and ring output signal are the optical coupling isolation signal or the level drive
signal.
3.9.2 Internal Alarm Monitoring Function

The ZXWM M920 system supports monitoring of communication alarms, equipment
alarms, and ambient environment alarms. These alarms are described in Table 3-16.
Table 3-16 Alarm List
Alarm Type Alarm Item
Communication Optical power out-of-limit alarms, SDH service alarms, OTN service alarms,
alarm out-of-lock alarms, service bit error alarms, Trace Identifier Mismatch (TIM)
alarms, high reflection power alarms, high reflectance alarms.
Equipment alarm l Temperature-related alarms

Temperature out-of-limit alarm of lasers, boards and modules.
l Current-related alarms
Over-current alarm of lasers and cooler, laser bias current out-of-limit alarm,
pump laser bias over-current alarm.
l Board-related alarms
Laser/pump life alarm, laser fault alarm, M-Z modulator bias voltage
out-of-limit alarm, module failure alarm, module communication fault
alarm, DSP operation alarm, high pump reflection power alarm, high pump
reflectance alarm, laser failure alarm, board out-of-position alarm, board
mounting alarm, and fan fault alarm.
3-12

Alarm Type Alarm Item
Ambient Fire alarm, temperature alarm, and equipment room alarm.

environment alarm
This table only provides the alarm overview. Different boards have different alarms. For detailed
information about alarms of each board, refer to the Unitrans ZXWM M920 (V1.10) Intelligent Optical
Transmission Platform Maintenance Manual (Volume II) Alarm and Performance .
Communication alarms refer to the alarms directly affecting service layer. These alarms indicate
communication signals have interruption or degradation on some layer. Equipment alarms refer to
the alarms directly caused by faults of equipment or internal parts of the boards. Ambient environment
alarms refer to the alarms on environment.
3.10 Protection Functions

3.10.1 SNP 1+1 Protection
Protection Principles
The ZXWM M920 system is configured with two SNP boards (master/slave) to implement
the SNP 11 hot backup function.
The slave SNP board does not send data but receives data. When the master SNP
board does not work normally (such as power-off, reset or faults), the slave SNP board
is automatically switched to the master SNP board.
Application Characteristics
Both of the SNP boards work at the same time and they can be switched manually
or through EMS to ensure uninterrupted services, logical seamless upgrade of
cross-connection board, or seamless upgrade of cross-connect hardware.
SNP boards are the core boards for management and control in a ZXWM M920 system.
The ZXWM M920 system provides 1+1 hot backup for SNP boards to implement the
automatic service switching in case of fault occurrence to ensure the system reliability.
The CLK, CCP, PWD, and PWE boards also support the 1+1 protection.
3.10.2 Cross-Connect Board 1+1/2:2/4:2 Protection

Protection Principle
The ZXWM M920 system supports 1+1, 2:2, and 4:2 protections. The cross-connect
boards improve the system security and stability. For the ZXWM M920 system
cross-connect board protection principles, refer to Table 3-17.
3-13

Table 3-17 ZXWM M920 Cross-Connect Board Protection
Protection Type Applicable Description

Subarck
1+1 redundancy CX20 Two XCA boards are configured in a CX20 subrack to
protection implement the master/slave protection. The XCA boards
implement the 1+1 redundancy.
2:2 protection CX30 Four XCA boards are configured in a CX30 subrack to
implement the 2:2 protection. Two XCA boards are in
working status and the other two XCA boards are in
protection status.
4:2 pretection CX50/CX51 Six XCA boards are configured in a CX50/CX51 subrack
to implement the 4:2 protection. Four XCA boards are
in working status and the other two XCA boards are in
protection status.
Application Features
When a CX20 subrack is configured with two XCA boards, the two XCA boards implement
the 1+1 redundancy. If one of the two XCA boards is faulty, the service cross-connect is
not interrupted.
When a CX30 subrack is configured with four XCA boards, the four XCA boards implement
the 2:2 redundancy. If any two of the four XCA boards are faulty, the service cross-connect
is not interrupted.
When the CX50/CX51 subrack is configured with six XCA boards, the six XCA boards
implement the 4:2 redundancy. If any two of the four XCA boards are faulty, the service
cross-connect is not interrupted.
3.10.3 OMS 1+1 Protection

In the OMS 1+1 protection, lines of each segment are protected in 1+1 mode. According to
locations of amplification boards, OMS 1+1 protection can be classified into amplification
board shared configuration mode and amplification board redundancy configuration mode.
For the protection on a group of services, see Figure 3-1 and Figure 3-2.
3-14

Figure 3-1 OMS 1+1 Protection (Amplification Board Shared Configuration Mode)
Figure 3-2 OMS 1+1 Protection (Amplification Board Redundancy Configuration Mode)
l SOP boards monitor the main optical path. If the switching conditions are met, the
optical switch of SOP boards performs the protection switching.
l SOP board has two types: SOP1 and SOP2.
An SOP1 board can be used to protect a pair of bidirectional service signals.
In OMS 1+1 protection, the quantity of SOP1 boards configured should be
consistent with that of multiplex sections to be protected.
An SOP2 board can be used to protect two pairs of bidirectional service signals.
In OMS 1+1 protection, the quantity of SOP2 boards configured should be
consistent with half of the quantity of multiplex sections to be protected.
3-15

3.10.4 OCH 1+1 Protection

An SOP board implements the OCH 1+1 protection by selecting the best of the two
transmitted services. Bidirectional service signals are protected by an OTU board
for working channel and an OTU board for protection channel in each direction. This
configuration mode is also called "OTU redundancy configuration mode".
At the transmitting end, the signal is divided into two signals by a coupler in the SOP
board. Then, the two signals are respectively sent to two transmitter OTUs, occupying two
different channels for transmission.
At the receiving end, the selection circuit in the SOP board selects the better signal from
two signals. The protection mode is shown in Figure 3-3 (The protection for a group of
services is used as an example).
Figure 3-3 OCH 1+1 Protection (Chain Network)
Application
An SOP1 board can protect one group of bidirectional service signals. In OCH 1+1
protection, the quantity of SOP1 boards configured should be consistent with the quantity
of channels to be protected. An SOP2 board can protect two groups of bidirectional
service signals. In OCH 1+1 protection, the quantity of SOP2 boards configured should
be half of the quantity of channels to be protected.
Both the protection channel and working channel are carried by the same fiber. Therefore,
the OCH 1+1 protection in a chain network can be used for equipment, but not routes.
3.10.5 Two-Fiber Bidirectional OCH Shared Protection

In a two-fiber bidirectional OCH shared protection ring, the wavelength 1 in the outer ring
works as the working channel while 1 in the inner ring works as the protection channel.
3-16

Wavelengths of multiple unidirectional services can be reused in different spans in the

working channel, and the protection channel shares all the services in the working channel.
As shown in Figure 3-4, when a span is faulty, the services through this span are damaged.
As a result, the transmitting end executes the switching, and services are transmitted to
the protection route. The services at the receiving end are received through the protection
route.
Figure 3-4 Schematic Diagram of Two-Fiber Bidirectional OCH Shared Protection
The system uses the SOPCS board to control the the add channels by controlling the
access switch, which ensures that multiple services in the same working channel will not
conflict in the protection channel.
3.10.6 Chain Network-Based Electrical Layer 1+1 Wavelength

Protection
The purpose of chain network-based electrical layer 1+1 wavelength protection is to
protect traffic (42.5G) at the wavelength level. Cross connect subsystem boards serve to
implement electrical layer 1+1 wavelength protection. Figure 3-5 illustrates the electrical
layer 1+1 wavelength protection configuration at the line side.
3-17

Figure 3-5 Electrical Layer 1+1 Wavelength Protection Configuration at Line Side
For the system configurations, refer to Table 3-18.
Table 3-18 Description of Electrical Layer 1+1 Wavelength Protection Configuration
Location Description
Client side The protection granularity is the wavelength channel at line side. There is no
special requirement for the service access mode at the client side. Client-side
services are implemented by CO2, CQ2, CS3, CD3, and CS4 boards.
Line side at the Multiple channels of client service signals are duplicated into two same groups of
transmit end signals by the XCA board and these two groups of signals are then forwarded to
the corresponding line-side boards, typically to two different LO2, LQ2, LS3, and
LS4 boards at the line side. This configuration is equivalent to dual service boards
configured at the line side in case of 1+1 service protection at the client side.
Intermediate line At the intermediate node that a service travels by, the cross connect unit can
change the wavelength of the service.
Line side at Two independent LO2, LQ2, LS3, and LS4 boards are respectively configured as
receiving end working and protection boards. The working path and the protection path may be
path-correlated (sharing fiber/sharing cable) or path-uncorrelated (respectively
corresponding to the long path and the short path in two directions in a ring
network).
APS controller The SNP board serves as the APS controller to execute switching and restoration
commands to the APS executor board according to the information collected by
the APS detector board and protection protocols.
APS detector Line-side LO2, LQ2, LS3, and LS4 boards at the receiving end respectively act as
the APS detector boards for the working path and protection path.
APS executor The XCA board serves as the APS executor. APS controller board executes
APS commands to both the active and standby XCA boards to implement traffic
protection switching.
Compared with optical layer 1+1 OCH protection, the electrical layer 1+1 wavelength
protection has the following advantage and disadvantage:
3-18

l Advantage: This protection mode can support the centralized protection of multiple
services bundled in the same wavelength channel.
l Disadvantage: The protection switching cannot be triggered by faults generated in a
single sub-wavelength service, that is, it cannot support the protection based on the
service granularity.
3.10.7 Ring Network-based Electrical Layer Two-Fiber Bidirectional

Channel Shared Protection
The two-fiber bidirectional channel shared protection based on the ring network at
the electrical layer supports both the protection based on wavelength granularity or
sub-wavelength (service) granularity. Its protection principle is similar to that of optical
layer two-fiber bidirectional channel shared protection. The optical layer two-fiber
bidirectional channel shared protection is implemented by the OPCS board, while the
electrical layer one is implemented by cross-connect subsystem boards. The combination
of cross connect subsystem boards provides the same logical functions as the OPCS
board. Figure 3-6 shows the principle of electrical layer two-fiber channel shared
protection.
Figure 3-6 Electrical Layer Two-Fiber Bidirectional Channel Shared Ring Network
Protection Configuration
l Relationship between working path and protection path

The working path and the protection path are uncorrelated in electrical layer two-fiber
bidirectional channel shared ring. They respectively correspond to the short path and
the long path in the ring network.
l Protocol execution
It is necessary to execute the APS protocol in electrical layer two-fiber bidirectional
channel shared ring.
APS controller: The SNP board serves as the APS controller.
APS detector: Line-side LO2, LQ2, LS3, and LS4 boards at the receiving
end respectively act as the APS detector boards for the working path and the
3-19

protection path. Client-side CO2, CQ2, CS3, CD3, and CS4 boards act as the
detector board for service signals (STM-1/4/16), and the detection signals are
shared by working and protection channels.
APS executor: The SNP board sends APS commands to both the active and
standby XCA boards in the cross-connect subsystem to implement the traffic
protection switching.
l Features
Advantage: The protection granularity is flexible, which can be a sub-wavelength

traffic or aggregate wavelength signal. Either line fault or service signal fault can
trigger protection switching. The electrical layer two-fiber bidirectional channel
shared protection can implement cross-span protection with protection channel
shared on the whole ring.
Disadvantage: The implementation mechanism of this protection mode is
complex.
3.10.8 Protection Capability for EMS Channel

The ZXWM M920 system can configure EMS channel standby route. Standby routes refer
to Ethernet routes connecting SNP boards in NEs and the EMS computer. In practice,
network interfaces of standby routes can be connected to SEIA1/SEIA2 boards to provide
standby routes for monitoring channels. When the optical monitoring channel fails to work,
SNP boards can ensure the transmission and exchange of monitoring messages through
the standby route.
3.11 Clock Management Function

The ZXWM M920 system uses a separate clock board CLK to support the clock transfer
function and generate the system clock. The CLK board supports 1+1 backup, maintains
synchronization between master/slave output clocks and the system clock, and cooperates
with the system to implement seamless switching between the master clock board and the
slave clock board.
The external clock can be accessed from the clock panel or through an external clock
interface board.
l The ZXWM M920 system can extract clock sources from service boards, and use
them as the system clock sources.
l CLK clock boards support the three modes specified by ITU-T G.813: free running,
holdover, and automatic lock. The three modes can be configured in the EMS.
3.12 Clock Time Synchronization Function

OTN
3-20

l

l
IEEE 1588V2
The ZXWM M920 clock synchronization function supports transmitting clock
synchronization signals among subracks and networks. It has the following features:
l Supports the clock synchronization and the time synchronization to meet the
requirements for time synchronization accuracy.
l The physical-layer synchronization mechanism extracts clock from the serial
bit stream in physical channel of transmission link to implement the frequency
synchronization.
l The time synchronization complies with the IEEE 1588 V2 protocol. The ZXWM M920
system provides an out-of-band time synchronization interface between 1pps+TOD
and FE to implement the out-of-band time transmission.
l Uses the Best Master Clock (BMC) algorithm to select a clock. The BMC algorithm
compares the descriptions of two or more clocks, and selects the better one. The
Ordinary Clock (OC), Boundary Clock (BC ) , and Transparent Clock (TC) are
supported.
l Supports processing the Synchronization Status Message (SSM) and the delay
compensation.
l Supports the protection switch of active/standby clock sources.
Clock Synchronization
OTN2M BITSSDH

OTN
l
l OSC
Table 3-19
Table 3-19
CLK
2M BITSSDH
CLK

GE10GESOUT10G
10GEODU2e10GEODU2e

3-21

OTNSOSCB+TIS

SOSCBTIS
Time Synchronization
OTNOSCIEEE 1588V2

OTNSOSCB+TIS
/SOSCB+TIS SOSCB
3-22

Chapter 4
Hardware Architecture
Table of Contents
Cabinet ......................................................................................................................4-1
Board .........................................................................................................................4-2
4.1 Cabinet
Cabinet Type
The ZXWM M920 system uses a ZTE cabinet with a single front door, which complies
with European Telecommunication Standard Institute (ETSI) standards. For the cabinet
appearance, see Figure 4-1.
Figure 4-1 ZXWM M920 Cabinet
Cabinet Configuration
For the configurations of the ZXWM M920 cabinet, refer to Table 4-1.
4-1

Table 4-1 ZXWM M920 Cabinet Configuration
Cabinet Quantity
Dimensions
Power Subrack Module
(HWD)
Distribution
NX4/DX41 CX20/C- CX30/ CX50/C- CX4 DCM
mm
Box
X21 CX31 X51 Plug-in
Box
2000 600 1 3 0 0 0 0 1
300
1 0 3 0 0 0 1
1 0 0 -1 0 0 1
1 0 0 0 1 0 1
1 0 0 0 0 3 1
2200 600 1 4 0 0 0 0 1
300
1 0 4 0 0 0 1
1 0 0 1 0 0 1
1 0 0 0 1 0 1
1 0 0 0 0 4 1
2600 600 1 4 0 0 0 0 1
300
1 0 4 0 0 0 1
1 0 0 1 0 0 1
1 0 0 0 2 0 1
1 0 0 0 0 1 1
Note:
l The configuration of the subrack depends on the actual needs.Table 4-1 lists the
maximum numbers of the same type subracks.
l The Dispersion Compensation Module (DCM) plug-in box is optional. Table 4-1 lists
the recommended numbers of DCMs.
l You can install devices of other manufacturers in the cabinet, such as routers. The
outlines and dimensions of the devices should meet the installation requirements for
ZTE transmission equipment cabinets.
4.2 Board
For boards used in each ZXWM M920 subsystem, refer to Table 4-2.
4-2

Chapter 4 Hardware Architecture
Table 4-2 Subsystem Configurations
Subsystem Board/Module
Service access and EOTU10G, EOTU10GB, SOTU10G, TST3, SOTU2.5G, MQT3,

convergence subsystem ASMA, SRM41/42, FCA/FCAG, ASMB, TD2C, TS2C, TS4, MQA1,
MQA2, MJA, MOM2
Mux/DeMux subsystem OMU, ODU, ODUB,OCI, SSDM, VMUX, VMUXB, SOAD, SOGMD,
WBU, WSU, WBM, PDU,
Optical amplification SEOBA, SEOPA, SEOLA, EONA, EOBAH, LAC, DRA

subsystem
Monitoring subsystem SNP, SCC, SEIA1/SEIA2, CCP, SOSCB, TIS, ETI, EIC
Protection subsystem SOP, OMCP, SOPMS, SOPCS
Cross-connect subsystem XCA, CH1, LO2, CO2, LQ2, LD2B, CQ2, CLK, CS3, CD3, LS3,
CS4, LS4, EHG1, EQG2
Optical layer management OWM, OPM, EOPM, EOWM

subsystem
Power supply subsystem PWD, FCC, SPWA, SFANA, PWE
RPOA subsystem RPU, RGU
For the ZXWM M920 system architecture on the basis of functional modules, see Figure
4-2. The ZXWM M920 system is composed of nine functional subsystems. They are
independent from each other but operate in coordination.
Figure 4-2 ZXWM M920 System Architecture
4-3

Note:
In application, functional modules on each site should be configured as required.
The service flows between functional subsystems are described as follows:
l After service signals are received in the service access and convergence subsystem,
they are sent to the Mux/Demux subsystem for multiplexing. The multiplexed signals
are then sent to the optical amplifier subsystem for amplification. The amplified signals
are transmitted to the optical-fiber line.
After service signals are received in the service access and convergence subsystem,
they are sent to the optical amplifier subsystem for amplification. The amplified
optical signals are then sent to the Mux/Demux subsystem for demultiplexing. The
demultiplexed signals are sent to the service boards.
l To implement the service protection, the protection subsystem must be configured.
The protection subsystem can be located before or after the service access and
convergence subsystem.
l To switch services, the cross-connect subsystem must be configured. Client service
signals are accessed, switched, and aggregated at the cross-connect system, and
then sent to the optical-fiber line.
l To implement the ultra-long-haul single-span transmission, the RPOA subsystem
must be configured after the optical amplifier subsystem.
4-4

Chapter 5
Software Architecture
Table of Contents
Software Architecture Overview .................................................................................5-1
EMS Software ............................................................................................................5-1
NE Control and Processing Software..........................................................................5-3
Board Software ..........................................................................................................5-4
Communication Protocols and Interfaces ...................................................................5-4
5.1 Software Architecture Overview

The ZXWM M920 software architecture consists of a board software, NE control and
processing software, and EMS software. They are respectively operating on boards,
NE control processor boards, and EMS to implement the management and control for
boards, NEs and the whole network.
According to the hierarchical design, each layer of the ZXWM M920 software supports
specific functions and provides services for the upper layer. The software architecture is
shown in Figure 5-1.
Figure 5-1 ZXWM M920 Software Architecture
5.2 EMS Software

The ZXWM M920 system uses the U3 EMS software to manage and monitor NEs.
The network management software supports the fault management, performance
management, security management, configuration management, maintenance
management, and system management.
5-1

The EMS structure is shown in Figure 5-2.
Figure 5-2 EMS Structure
l Manager
It is also referred to as Server. Compared to Graphical User Interface (GUI), Manager

works as a Server. Through Qx interfaces, Manager sends management commands
to the corresponding NE control and processing software, receives messages from
NE control and processing software, and saves all the network management data
including the basic data of system management, configuration management, and
alarm maintenance in the database. Manager only saves management data in the
local network.
l Graphical User Interface (GUI)

It is also referred to as Client. The GUI provides graphical interfaces for users. The
users can implement configuration management, fault management, performance
management, security management, maintenance management and system
management in the GUI. The GUI does not save dynamic network management
data, which are retrieved from Database by Manager when the users use the GUI.
l Database
The Database stores data about information query, configuration and alarm for
interfaces and management functional modules. It also implements the processing
of data consistency.
5-2

Chapter 5 Software Architecture
5.3 NE Control and Processing Software

NE control and processing software is located on the Smart Node Processor (SNP) board
to manage, monitor and control the board operation status in the NE. As a communication
service unit between the network management system and boards, it implements control
and management for NEs. For the functions supported by the NE control and processing
software, refer to Table 5-1:
Table 5-1 NE Control and Processing Software Functions
Serial No. Function
1 Configures boards during power-on initialization of the NEs.
2 Monitors alarm and performance status of the operating NE, receives EMS monitoring
and configuration commands from gateway NE through Error Check and Correction
(ECC) interfaces, and reports command results, NE alarms and performance status.
Gateway NEs are connected with the EMS through Ox interfaces.
3 Controls APS, APR and WASON.
The structure of the NE control and processing software is shown in. For the functional
modules of the NE control and processing software, refer to Table 5-2:
Figure 5-3 Structure of the NE Control and Processing Software
Table 5-2 Functional Modules of the NE Control and Processing Software
Module Description
Embedded operation system The embedded operation system platform is responsible for public
platform resource management, and provides an application environment
independent from hardware.
Fault management module The fault management module collects and handles alarm.
Performance management The performance management module collects and handles

module performance events.
5-3

Module Description
Configuration management The configuration management module handles configuration

module requirements.
Master/slave switching module The master/slave switching module implements data

synchronization and switching between the master SNP and the
slave SNP boards to perform the 1+1 hot backup for SNP boards.
APS module The APS module implements protection switching function

according to the actual application of protection modes and the
equipment.
WASON module The WASON module controls boards to implement the WASON
function based on actual application of networks and the equipment.
APSD/APR module The APSD/APR module implements the APSD/APR function

according to the actual application of the equipment.
5.4 Board Software

The board software operates on each board to manage, monitor and control the operation
status of each board. It receives commands sent from the Network Element Management
System (EMS) through an agent on the SNP board, and then responds and takes actions
on the commands. It reports alarm and performance events of the board to the EMS.
The functions of board software include alarm and performance handling, configuration
management, communication management, board software online download, and
functional circuits driven.
5.5 Communication Protocols and Interfaces

For interfaces of the ZXWM M920 software system and their corresponding communication
protocols, refer to Table 5-3.
Table 5-3 ZXWM M920 Software System Interfaces
Interface Name Description
S interface It is the interface between the NE control and processing software and
the MCU, that is, the communication interface between the SNP board
and other boards.
5-4

Chapter 5 Software Architecture
Interface Name Description
Qx interface It is the interface between the NE control and processing software and the
Manager, that is, the interface between the SNP board and the computer
on which the EMS Server program operates. For the ZXWM M920 system,
Qx interface is located on the SEIA board. It complies with Transfer
Control Protocol (TCP)/Internet Protocol (IP) protocol, International
Telecommunication Union - Telecommunication Standardization Sector
(ITU-T) Q.811 and ITU-T Q.812 recommendations.
ECC interface It is the communication interface between NEs. The ECC interface uses
an optical monitoring channel for communication and supports the TCP/IP
protocol.
CTI interface It is the control interface in the NE, and implements APS, APR, and
WASON functions.
5-5

5-6

Chapter 6
Technical Specifications
Table of Contents
Requirements on Operating Wavelength ....................................................................6-1
Service Access and Convergence Subsystem Specifications .....................................6-7
Optical Mux/DeMux Subsystem Specifications ........................................................6-11
Optical Amplification Subsystem Specifications .......................................................6-23
Optical Layer Management Subsystem Specifications..............................................6-33
Protection Subsystem Specifications ........................................................................6-35
Supervision Subsystem Specifications .....................................................................6-38
RPOA Subsystem Specifications..............................................................................6-39
DCM Technical Specifications ..................................................................................6-40
Environment Specifications ......................................................................................6-42
Electro Magnetic Compatibility Requirements...........................................................6-47
Weight Power Consumption Dimensions ..................................................................6-48
6.1 Requirements on Operating Wavelength

6.1.1 Allocation of Continuous Wavelengths
l The spacing between wavelengths is 100 GHz when the ZXWM M920 system is
configured as a system with no more than 40 wavelengths in C band. Table 6-1 lists
the wavelengths allocated in a 40-channel system.
Table 6-1 Wavelength Allocation (40 Channels in C Band with Spacing at 100 GHz)
S/N Central Frequency Central S/N Central Frequency Central Wavelength

(THz) Wavelength (nm) (THz) (nm)
1 192.10 1560.61 21 194.10 1544.53
2 192.20 1559.79 22 194.20 1543.73
3 192.30 1558.98 23 194.30 1542.94
4 192.40 1558.17 24 194.40 1542.14
5 192.50 1557.36 25 194.50 1541.35
6 192.60 1556.55 26 194.60 1540.56
7 192.70 1555.75 27 194.70 1539.77
8 192.80 1554.94 28 194.80 1538.98
9 192.90 1554.13 29 194.90 1538.19
6-1

S/N Central Frequency Central S/N Central Frequency Central Wavelength

(THz) Wavelength (nm) (THz) (nm)
10 193.00 1553.33 30 195.00 1537.4
11 193.10 1552.52 31 195.10 1536.61
12 193.20 1551.72 32 195.20 1535.82
13 193.30 1550.92 33 195.30 1535.04
14 193.40 1550.12 34 195.40 1534.25
15 193.50 1549.32 35 195.50 1533.47
16 193.60 1548.51 36 195.60 1532.68
17 193.70 1547.72 37 195.70 1531.9
18 193.80 1546.92 38 195.80 1531.12
19 193.90 1546.12 39 195.90 1530.33
20 194.00 1545.32 40 196.00 1529.55
l The spacing between wavelengths is 50 GHz when the ZXWM M920 system
is configured as a system with 80 wavelengths in C band. Table 6-2 lists the
wavelengths allocated in the 80-channel system.
S/N Central Frequency Central Wavelength S/N Central Frequency Central Wavelength
(THz) (nm) (THz) (nm)
1 196.05 1529.16 41 194.05 1544.92
2 196.00 1529.55 42 194.00 1545.32
3 195.95 1529.94 43 193.95 1545.72
4 195.90 1530.33 44 193.90 1546.12
5 195.85 1530.72 45 193.85 1546.52
6 195.80 1531.12 46 193.80 1546.92
7 195.75 1531.51 47 193.75 1547.32
8 195.70 1531.90 48 193.70 1547.72
9 195.65 1532.29 49 193.65 1548.11
10 195.60 1532.68 50 193.60 1548.51
11 195.55 1533.07 51 193.55 1548.91
12 195.50 1533.47 52 193.50 1549.32
13 195.45 1533.86 53 193.45 1549.72
14 195.40 1534.25 54 193.40 1550.12
15 195.35 1534.64 55 193.35 1550.52
6-2

Chapter 6 Technical Specifications
S/N Central Frequency Central Wavelength S/N Central Frequency Central Wavelength
(THz) (nm) (THz) (nm)
16 195.30 1535.04 56 193.30 1550.92
17 195.25 1535.43 57 193.25 1551.32
18 195.20 1535.82 58 193.20 1551.72
19 195.15 1536.22 59 193.15 1552.12
20 195.10 1536.61 60 193.10 1552.52
21 195.05 1537.00 61 193.05 1552.93
22 195.00 1537.4 62 193.00 1553.33
23 194.95 1537.79 63 192.95 1553.73
24 194.90 1538.19 64 192.90 1554.13
25 194.85 1538.58 65 192.85 1554.54
26 194.80 1538.98 66 192.80 1554.94
27 194.75 1539.37 67 192.75 1555.34
28 194.70 1539.77 68 192.70 1555.75
29 194.65 1540.16 69 192.65 1556.15
30 194.60 1540.56 70 192.60 1556.55
31 194.55 1540.95 71 192.55 1556.96
32 194.50 1541.35 72 192.50 1557.36
33 194.45 1541.75 73 192.45 1557.77
34 194.40 1542.14 74 192.40 1558.17
35 194.35 1542.54 75 192.35 1558.58
36 194.30 1542.94 76 192.30 1558.98
37 194.25 1543.33 77 192.25 1559.39
38 194.20 1543.73 78 192.20 1559.79
39 194.15 1544.13 79 192.15 1560.20
40 194.10 1544.53 80 192.10 1560.61
l The spacing between wavelengths is 100 GHz/50 GHz when the ZXWM M920
system is configured as an extended C-band 48/96-channel system. Table 6-3 lists
the wavelengths allocated in such a system.
6-3

Table 6-3 Wavelength Allocation (48/96 Channels in Extended C Band with Spacing at 100 Ghz/50
Ghz)
S/N Sub- Nominal Nominal Central S/N Sub- Nominal Nominal

Band Central Wavelength Band Central Central
Frequency (nm) Frequency Wavelength
(THz) (THz) (nm)
1 C1002 196.05 1529.16 49 C1002 193.65 1548.11
2 C1001 196.00 1529.55 50 C1001 193.60 1548.51
3 C1002 195.95 1529.94 51 C1002 193.55 1548.91
4 C1001 195.90 1530.33 52 C1001 193.50 1549.32
5 C1002 195.85 1530.72 53 C1002 193.45 1549.72
6 C1001 195.80 1531.12 54 C1001 193.40 1550.12
7 C1002 195.75 1531.51 55 C1002 193.35 1550.52
8 C1001 195.70 1531.9 56 C1001 193.30 1550.92
9 C1002 195.65 1532.29 57 C1002 193.25 1551.32
10 C1001 195.60 1532.68 58 C1001 193.20 1551.72
11 C1002 195.55 1533.07 59 C1002 193.15 1552.12
12 C1001 195.50 1533.47 60 C1001 193.10 1552.52
13 C1002 195.45 1533.86 61 C1002 193.05 1552.93
14 C1001 195.40 1534.25 62 C1001 193.00 1553.33
15 C1002 195.35 1534.64 63 C1002 192.95 1553.73
16 C1001 195.30 1535.04 64 C1001 192.90 1554.13
17 C1002 195.25 1535.43 65 C1002 192.85 1554.54
18 C1001 195.20 1535.82 66 C1001 192.80 1554.94
19 C1002 195.15 1536.22 67 C1002 192.75 1555.34
20 C1001 195.10 1536.61 68 C1001 192.70 1555.75
21 C1002 195.05 1537 69 C1002 192.65 1556.15
22 C1001 195.00 1537.4 70 C1001 192.60 1556.55
23 C1002 194.95 1537.79 71 C1002 192.55 1556.96
24 C1001 194.90 1538.19 72 C1001 192.50 1557.36
25 C1002 194.85 1538.58 73 C1002 192.45 1557.77
26 C1001 194.80 1538.98 74 C1001 192.40 1558.17
27 C1002 194.75 1539.37 75 C1002 192.35 1558.58
28 C1001 194.70 1539.77 76 C1001 192.30 1558.98
29 C1002 194.65 1540.16 77 C1002 192.25 1559.39
6-4

S/N Sub- Nominal Nominal Central S/N Sub- Nominal Nominal

Band Central Wavelength Band Central Central
Frequency (nm) Frequency Wavelength
(THz) (THz) (nm)
30 C1001 194.60 1540.56 78 C1001 192.20 1559.79
31 C1002 194.55 1540.95 79 C1002 192.15 1560.2
32 C1001 194.50 1541.35 80 C1001 192.10 1560.61
33 C1002 194.45 1541.75 81 C1002 192.05 1561.02
34 C1001 194.40 1542.14 82 C1001 192.00 1561.42
35 C1002 194.35 1542.54 83 C1002 191.95 1561.83
36 C1001 194.30 1542.94 84 C1001 191.90 1562.24
37 C1002 194.25 1543.33 85 C1002 191.85 1562.64
38 C1001 194.20 1543.73 86 C1001 191.80 1563.05
39 C1002 194.15 1544.13 87 C1002 191.75 1563.46
40 C1001 194.10 1544.53 88 C1001 191.70 1563.87
41 C1002 194.05 1544.92 89 C1002 191.65 1564.27
42 C1001 194.00 1545.32 90 C1001 191.60 1564.68
43 C1002 193.95 1545.72 91 C1002 191.55 1565.09
44 C1001 193.90 1546.12 92 C1001 191.50 1565.5
45 C1002 193.85 1546.52 93 C1002 191.45 1565.91
46 C1001 193.80 1546.92 94 C1001 191.40 1566.32
47 C1002 193.75 1547.32 95 C1002 191.35 1566.73
48 C1001 193.70 1547.72 96 C1001 191.30 1567.14
C1001 and C1002 respectively refers to the first and second sub-bands in the extended C band. Each sub-band
contains 48 wavelengths with the spacing at 100 GHz.
6.1.2 Allocation of Uncontinuous Wavelengths

When the Mux/DeMux board is used in the system for wavelength multiplexing and
demultiplexing, some wavelengths cannot be used due to the technical limitation of
filters in the board. These wavelengths are called unavailable wavelengths or black
wavelengths.
In this case, the system works in C band at the spacing of 100 GHz. Although C band
includes 40 wavelengths, only 32 uncontinuous wavelengths of them can be used,
which are divided into four wavelength groups: red-red ribbon (RR), red-blue ribbon
(RB), blue-red ribbon (BR) and blue-blue ribbon (BB) together. Each group includes 8
wavelengths. We also call RR and RB together as red ribbon, BR and BB as blue ribbon.
Figure 6-1 illustrates the allocation of these uncontinuous wavelengths.
6-5

Figure 6-1 Allocation of Uncontinuous Wavelengths
Note:
21 represents the wavelength with the frequency 192.10 THz. 28 represents the
wavelength with the frequency 192.8 THz, and so on.
The detailed allocation of uncontinuous wavelengths is listed in Table 6-4. Wavelength

of 9, 10, 19, 20, 21, 22, 31 and 32 are marked grey in the table and are unavailable
wavelengths.
Table 6-4 Uncontinuous Wavelengths and Corresponding Central Frequencies
S/N Central Central S/N Central Central

Frequency Wavelength Frequency (THz) Wavelength (nm)
(THz) (nm)
1 192.10 1560.61 21 194.10 1544.53
2 192.20 1559.79 22 194.20 1543.73
3 192.30 1558.98 23 194.30 1542.94
4 192.40 1558.17 24 194.40 1542.14
5 192.50 1557.36 25 194.50 1541.35
6 192.60 1556.55 26 194.60 1540.56
7 192.70 1555.75 27 194.70 1539.77
8 192.80 1554.94 28 194.80 1538.98
9 192.90 1554.13 29 194.90 1538.19
10 193 1553.33 30 195 1537.40
11 193.10 1552.52 31 195.10 1536.61
12 193.20 1551.72 32 195.20 1535.82
13 193.30 1550.92 33 195.30 1535.04
14 193.40 1550.12 34 195.40 1534.25
15 193.50 1549.32 35 195.50 1533.47
16 193.60 1548.51 36 195.60 1532.68
6-6

S/N Central Central S/N Central Central

Frequency Wavelength Frequency (THz) Wavelength (nm)
(THz) (nm)
17 193.70 1547.72 37 195.70 1531.90
18 193.80 1546.92 38 195.80 1531.12
19 193.90 1546.12 39 195.90 1530.33
20 194 1545.32 40 196 1529.55
6.2 Service Access and Convergence Subsystem

Specifications
6.2.1 Board Types
For the ZXWM M920 system board types, refer to Table 6-5.
Table 6-5 Board Types
Type Board
2.5 G board SOTU2.5G/MQA1/MJA/CH1/DSAC/COM/COMB/SAUC/SMUB/SDSA/SR

M42/DSAF/DSAB/DSA/COM/COMB/EHG1
10 G board EOTU10G/EOTU10GB/SOTU10G/TD2C/TS2C/FCA/FCAG/SRM41/ASMA
/ASMB/MQA2/LO2//LD2B/CO2/CQ2/LQ2/LD2/CD2/EQG2
40 G board MQT3/TST3/CS3/CD3/LS3
100 G board TS4/CS4/LS4/MX2
6.2.2 2.5 G Board Specifications

Table 6-6 lists the interface specifications at the line side of the 2.5 G board
Table 6-6 Line-Side Interface Specifications of the 2.5 G Board
Item Unit Parameter
OTURn
Receiver sensitivity dBm 21 PIN
<-28 APD
Receiver reflection dB <27
Overload power dBm 0 PIN
9 APD
6-7

Item Unit Parameter
Wavelength range of input signal nm 1280 to 1565
OTUSn
Spectral Maximum -20 dB nm l 0.2EA MSA24pin

characteristics bandwidth l 0.5DM MSA24pin
l 1SFP
Minimum side mode dB 35

suppression ratio
Central frequency Nominal central THz 192.1 to 196.0

frequency
Central frequency GHz 12.5100 GHz

offset
Mean output power Maximum dBm 6
Minimum dBm 0
Minimum extinction ratio dB l +10EA

l 8.2DM MSA24pin/SFP
Dispersion tolerance ps/nm l 12800EA MSA24pin

l 6400DM MSA24pin
l 3600DM SFP
Eye diagram - In compliance with ITU T. G.957 or ITU

T. G.959.1 Recommendation
6.2.3 10 G Board Specifications

Table 6-7 lists the interface specifications at the line side of the 10 G board.
Table 6-7 Line-Side Interface Specifications of the 10 G Board
Item Unit Parameter
OTURn
Signal rate Gbi- 9.953 to 11.318

t/s
Receiver sensitivity dBm 14 PIN
21 APD
Receiver reflection dB -27
Overload power dBm >0 PIN
>9 APD
6-8

Item Unit Parameter
OTUSn
Spectral Maximum -20 dB nm <0.3NRZ-DPSK

charac- bandwidth
nm <0.4RZ-DPSK
teristics
suppression ratio
Cen- Nominal central THz In compliance with ITU-T G.694.1 Recommendation

tral fre- frequency
quency
Central frequency GHz 12.5100 GHz
offsetEOL
550 GHzOWM
Central frequency GHz 10100 GHz

offsetBOL
350 GHzOWM
Mean MSA300/XFP dBm 3 to 1

output NRZ-DPSK
power
MSA300RZ-DPSK dBm 5 to 2
Minimum extinction ratio dB 8.2
Disper- MSA300NRZ-DPSK ps/ 300 to 800

sion tol- nm
erance
MSA300RZ-DPSK ps/ 400 to 400
nm
Eye diagram - In compliance with ITU-T G.691 or ITU-T G.959.1

Recommendation
6.2.4 40G Board Specifications

Table 6-8 lists the interface specifications at the line side of the 40 G board.
Item Unit Parameter
OTURn
Signal rate Gbit/s 39.813 to 44.6
Receiver sensitivityEDFA dBm 15
Overload power dBm 1
OTUSn
6-9

Item Unit Parameter
Spectral characteristics Maximum -20 dB nm 0.7 P-DPSK

bandwidth
0.6 RZ-DQPSK
Minimum dB 35
side mode
suppression ratio
Central frequency Nominal central THz In compliance with ITU-T G.694.1

frequency Recommendation

offsetEOL
2.550 GHz

offsetBOL
1.550 GHz
Mean output power P-DPSK dBm 5 to 5
RZ-DQPSK dBm 9 to 3
Dispersion tolerance RZ-DQPSK ps/nm TBD
6.2.5 100 G Board Specifications

Table 6-9 lists the interface specification at the line side of the 100 G board.
Item Unit Parameter
OTURn
Signal rate Gbit/s 111.8 to 125.75
Receiver sensitivity dBm 15
Overload power dBm 1
dBm 20
(1dB OSNR ps/nm 70000 PM QPSK
(1dB OSNR ps 30 PM QPSK
6-10

Item Unit Parameter
Spectral characteristics Maximum -20 dB nm TBD

bandwidth
Minimum -3dB nm TBD

bandwidth

suppression ratio
Central frequency Nominal central THz In compliance with

frequency ITU-T G.694.1
Recommendation
Central frequency GHz 2.5

offsetEOL
Central frequency GHz 1.5

offsetBOL
Mean output power Maximum dBm 3PM-QPSK
Minimum dBm 5PM-QPSK
6.3 Optical Mux/DeMux Subsystem Specifications

6.3.1 SOAD Board Specifications
For the technical specifications of the SOAD2 board, refer to Table 6-10. For the technical
specifications of the SOAD4 board, refer to Table 6-11.
Table 6-10 Technical Specifications of the SOAD2 Board
Item Specification
Central frequency range (THz) 191.30 to 196.05 (CE band)
Add/drop channel quantity 2
1 dB bandwidth (Drop) (nm) > 0.2
20 dB bandwidth (Drop) (nm) < 1.20
Channel spacing (GHz) 100
Isolation (dB) IN-D1/D2@ Adjacent channel > 25
IN-D1/D2@ Non-adjacent channel > 35
IN-MID1@ Drop channel > 14
IN-OUT@ Drop channel > 28
Optical return loss (dB) > 40
6-11

Item Specification
Insertion loss (dB) Drop wavelength (IN-D1/D2) <3
Add wavelength (A1/A2-OUT) <3
Pass-through wavelength <4

(IN-OUT)
Polarization dependent loss (PDL) (dB) < 0.2
Polarization mode dispersion (PMD) (ps) < 0.1
Maximum allowed optical power (mW) < 500
Table 6-11 Technical Specifications of the SOAD4 Board
Item Specification
Central frequency range (THz) 191.30 to 196.05 (CE band)
Add/drop channel quantity 4
1 dB bandwidth (Drop) (nm) > 0.2 nm
20 dB bandwidth (Drop) (nm) <1.20 nm
Channel spacing (GHz) 100 GHz
Isolation (dB) IN-D1/D2/D3/D4@ Adjacent channel > 25
IN-D1/D2/D3/D4@ Non-adjacent > 35

channel
IN-MID1@ Drop channel > 14
IN-OUT@ Drop channel > 28
Insertion loss Drop wavelength (IN-D1/D2/D3/D4) < 4.0

(dB)
Add wavelength (A1/A2/A3/A4-OUT) < 4.0
Pass-through wavelength (IN-OUT) < 5.0
Directivity (dB) > 60
Maximum allowed optical power (mW) < 500
6.3.2 OMU Board Specifications

For the technical specifications of the 8/16/32-channel OMU board, refer to Table 6-12.
For the technical specifications of the 40/48/80-channel OMU board, refer to Table 6-13.
6-12

Table 6-12 Technical Specifications the OMU Board (8/16/32-Channel)
Item Specification
8Channel 16Channel 32-Channel OMU

OMU OMU
Coupler Coupler Coupler AWG TFF
Insertion loss (dB) < 11 < 14 < 17 < 10 < 10
Maximum insertion loss difference <3 <3 <3 <3 <3

between channels (dB)
Channel spacing (GHz) - - - 100 100
Optical return loss (dB) > 40 > 40 > 40 > 40 > 40
Operating wavelength range (nm) 1529 to 1561
Polarization Dependent Loss < 0.5 < 0.5 < 0.5 < 0.5 < 0.5
(PDL) (dB)
Polarization Mode Dispersion < 0.5 < 0.5 < 0.5 < 0.5 < 0.5
(PMD) (ps)
Temperature characteristic - - - - < 0.005

(nm/)
Table 6-13 Technical Specifications of the OMU Board (40/48/80-Channel)
Item Specification
40-Channel OMU 48-Channel OMU (80-Channel OMU)
Coupler AWG TFF AWG Coupler AWG
Insertion loss (dB) < 19 < 10 < 10 < 10 < 23 < 10
Maximum insertion loss <3 <3 <3 <3 < 3.5 <3
difference between
channels (dB)
Channel spacing (GHz) - 100 100 100 - 50
Optical return loss (dB) > 40 > 40 > 40 > 40 > 40 > 40
Operating wavelength 1529 to 1561 1529 to 1529 to 1561

range (nm) 1568
Polarization Dependent < 0.6 < 0.5 < 0.5 < 0.5 < 0.7 < 0.5
Loss (PDL) (dB)
Polarization Mode < 0.5 < 0.5 < 0.5 < 0.5 < 0.5 < 0.5
Dispersion (PMD) (ps)
Temperature characteristic - - < 0.005 - - -

(nm/)
6-13

6.3.3 ODU Board Specifications

For the technical specifications of the ODU board, refer to Table 6-14.
Table 6-14 Technical Specifications of the ODU Board
Item Specification
32-Channel ODU 40-Channel ODU 48-Channel 80-Channel

ODU ODU
AWG TFF AWG TFF AWG AWG
Insertion loss (dB) < 10 < 10 < 10 < 10 < 10 < 10
Maximum insertion <2 <2 <2 <2 <2 <2

loss difference
between channels
(dB)
Channel spacing - 100 100 100 100 50

(GHz)
Optical return loss > 40 > 40 > 40 > 40 > 40 > 40

(dB)
Operating wavelength 1529 to 1561 1529 to 1529 to 1529 to 1529 to 1568 1529 to 1561
range (nm) 1561 1561 1561
Isolation between > 25 > 25 > 25 > 25 > 25 > 25

adjacent channels
(dB)
Isolation between > 30 > 30 > 30 > 30 > 30 > 30

non-adjacent channels
(dB)
Polarization < 0.5 < 0.5 < 0.5 < 0.5 < 0.5 < 0.5
Dependent Loss (PDL)
(dB)
Polarization Mode < 0.5 < 0.5 < 0.5 < 0.5 < 0.5 < 0.5
Dispersion (PMD) (ps
)
Temperature - < 0.005 - < 0.005 - -

characteristic (nm/)
1 dB bandwidth (nm) > 0.2 > 0.2 > 0.2 > 0.2 > 0.2 > 0.2
6.3.4 ODUB Board Specifications

For the technical specifications of the ODUB board, refer to Table 6-15.
6-14

Table 6-15 Technical Specifications of the ODUB Board
Item Specifications (40-Channel)
Insertion loss (dB) <10
Maximum insertion loss difference between channels (dB) <2
Isolation of adjacent channel (dB) > 25
Isolation of non-adjacent channel (dB) > 30
Polarization Dependent Loss (PDL) (dB) < 0.5
Polarization Mode Dispersion (PMD) (ps) < 0.5
Temperature characteristics (nm/) -
1 dB bandwidth (nm) > 0.2
6.3.5 OCI Board Specifications

For the technical specifications of the OCI board, refer to Table 6-16.
Table 6-16 Technical Specifications of the OCI Board (50 GHz to 100 GHz)
Item Specification Remark
C-band operating wavelength range (nm) 1529 to 1561 -
CE-band operating wavelength range 1529 to 1568 -

(nm)
Input channel spacing (GHz) 100 Multiplexing procedure
Output channel spacing (GHz) 50 Multiplexing procedure
Insertion loss (dB) < 2.5 Input signal 10 Gbit/s
<3 Input signal 40 Gbit/s
Maximum insertion loss difference (dB) <1 -
Isolation (dB) > 25 Demultiplexing procedure
Return loss (dB) > 40 -
Polarization Dependent Loss (PDL) (dB) < 0.5 -
Polarization Mode Dispersion (PMD) (ps) < 0.5 -
6-15

6.3.6 VMUX Board Specifications

For the technical specifications of the VMUX board, refer to Table 6-17.
Table 6-17 Technical Specifications of the VMUX Board
Item Specification
Channel quantity 40/48
Operating wavelength range (nm) 40-channel: 1529 to 1561
48-channel: 1529 to 1568
-1 dB bandwidth (nm) > 0.2
Insertion loss (dB) < 8 (attenuation is 0)
Polarization mode dispersion (PMD) (ps) 0.5
Polarization dependent loss (PDL) (dB) 0.8
Channel adjustment range (dB) 0 to 10
VOA adjustment precision (dB) 0.5
6.3.7 VMUXB Board Specifications

For the technical specifications of the VMUXB board, refer to Table 6-18.
Table 6-18 Technical Specifications of the VMUXB Board
Item Specification
Channel quantity 40
Operating wavelength range (nm) 40-channel: 1529 to 1561
-1 dB bandwidth (nm) > 0.2
Insertion loss (dB) < 8 (attenuation is 0)
Polarization mode dispersion (PMD) (ps) 0.5
Polarization dependent loss (PDL) (dB) 0.8
Channel adjustment range (dB) 0 to 10
VOA adjustment precision (dB) 0.5
6-16

6.3.8 SSDM Board Specifications

For the technical specifications of the SSDMT board, refer to Table 6-19. For the technical
specifications of the SSDMR board, refer to Table 6-20.
Table 6-19 Technical Specifications of the SSDMT Board
Item Specification
Operating wavelength CE band 1529 to 1568

range (nm)
Insertion loss (dB) INOUT < 1.5
SINOUT < 1.5
Isolation (dB) INOUT (@SIN) > 12
SINOUT (@IN) > 20
Polarization Dependent < 0.2

Loss (PDL) (dB)
Input optical power < 500

(mW)
6-17

Table 6-20 Technical Specifications of the SSDMR Board
Item Specification
Operating wavelength range (nm) CE band 1529 to 1568
Insertion loss (dB) INOUT < 1.5
INSOUT < 1.5
Isolation (dB) INOUT (@SOUT) > 12
INSOUT (@OUT) > 40
Polarization Dependent Loss (PDL) < 0.2

(dB)
Input optical power (mW) < 500
6.3.9 SOGMD Board Specifications

For the technical specifications of the SOGMD board, refer to Table 6-21.
Table 6-21 Technical Specifications of the SOGMD Board
Item Specification
Operating wavelength range (nm) 1529 to 1561 (C band)
Insertion loss (dB) INRRO < 2.5
INRBO < 2.5
INBRO < 2.5
INBBO < 2.5
RRIOUT < 2.5
RBIOUT < 2.5
BRIOUT < 2.5
BBIOUT < 2.5
Isolation (dB) >12
Optical reflectance (dB) < 40
Maximum optical power (mW) < 500
6.3.10 WBU Board Specifications

For the technical specifications of the WBU board, refer to Table 6-22.
6-18

Table 6-22 Technical Specifications of the WBU Board
Item Specification
50
Channel quantity 40 (channel spacing: 100 GHz)
80(channel spacing: 50 GHz)
Insertion loss of A1-OUT <2

WBU/AD1 (dB)
IN-D1 <4
EXIN-OUT < 14
IN-EXOUT <4
Insertion loss of A1-OUT < 12

WBU/AD2 (dB)
A2-OUT <2
IN-D1 < 12
IN-D2 <2
EXIN-OUT < 18
IN-EXOUT < 12
Attenuation adjustment range (dB) 0 to 15
Attenuation adjustment precision (dB) < (0.5 or 10% of the configured value, select
the larger one)
Blocking extinction ratio (dB) > 35
Return loss (dB) > 40
Maximum total optical input power (dBm) 25
Maximum single-channel optical input power 16

(dBm)
6.3.11 WSU Board Specifications

There are two types of WSU boards: WSUD board and WSUA board.
For the technical specifications of the WSUD board, refer to Table 6-23.
Table 6-23 Technical Specifications of the WSUD Board
Item Specification
Wavelength range (nm) 1529 to 1561 (C band)
6-19

Item Specification
50
80(channel spacing: 50 GHz)
Insertion loss WSUD/MA1 A1-OUT <2

(dB)
IN-D1-D8 <8
EXIN-OUT <9
IN-EXOUT <8
WSUD/MA2 A1-OUT < 10
A2-OUT <2
IN-D1-D8 <8
EXIN-OUT < 16
IN-EXOUT <8
WSUD/E <8
Attenuation adjustment range (dB) 0 ~ 15
Attenuation adjustment precision (dB) <1.00 ~ 10 dB
<1.5>10 dB
Maximum total optical input power (dBm) < 25
For the technical specifications of the WSUA board, refer to Table 6-24.
Table 6-24 Technical Specifications of the WSUA Board
Item Specification
50
80 (channel spacing: 50 GHz)
6-20

Item Specification
Insertion loss WSUA/MD1 IN-D1 <2

(dB)
A1-A8-OUT <8
EXIN-OUT <8
IN-EXOUT <9
WSUA/MD2 IN-D1 <2
IN-D2 < 10
A1-A8-OUT <8
EXIN-OUT <8
IN-EXOUT < 16
WSUA/E <8
Attenuation adjustment range (dB) 0 ~ 15
Attenuation adjustment precision (dB) <1.00 ~ 10 dB
<1.5>10 dB
Maximum total optical input power (dBm) < 25
6.3.12 WBM Board Specifications

For the technical specifications of the WBM board, refer to Table 6-25.
Table 6-25 Technical Specifications of the WBM Board
Item Specification
Insertion loss (dB) An-OUT (n=140) <8
IN-DROP <7
EXIN-OUT < 13
IN-EXOUT <3
Attenuation adjustment range (dB) 0 to 15
Attenuation adjustment precision (dB) < (0.5 or 10% of the configured value, select the
greater one between them)
6-21

6.3.13 PDU Board Specifications

For the technical specifications of the PDU-4-x board, refer to Table 6-26. For the technical
specifications of the PDU-5-x board, refer to Table 6-27. For the technical specifications
of the PDU-8-x board, refer to Table 6-28. For the technical specifications of the PDU-9-x
board, refer to Table 6-29. For the technical specifications of the PDU-16-1 board, refer to
Table 6-30.
Table 6-26 Technical Specifications for the PDU-4-x Board
Item Specification
Operating wavelength range (nm) 1529 to 1568 (CE band)
Insertion loss (dB) INxOx-1/2/3/4 < 8.0
Item Specification
Insertion loss (dB) INxOx-1/2/3/4 < 12.0
INxDx < 4.0
Item Specification
Insertion loss (dB) INxOx-1/2/3/4/5/6/7/8 < 11.0
Item Specification
Insertion loss (dB) INxOx-1/2/3/4/5/6/7/8 < 15.0
INxDx < 4.0
6-22

Item Specification
Insertion loss (dB) INO-1/2/3/4/5/6/7/8 < 14.0

/9/10/11/12/13/14/15/16
6.4 Optical Amplification Subsystem Specifications

6.4.1 SEOA Board Specifications
SEOBA Board Specifications
For the technical specifications of the SEOBA board with 40/80-channel in the C band,
Table 6-31 Technical Specifications of the 40/80-Channel C-Band SEOBA Board
Item Specification (40/80-Channel)
SEOBA17/17 SEOBA22/20
40-Channel 80-Channel 40-Channel 80-Channel
Operating wavelength range (nm) 1529 to 1561 1529 to 1561
Total input power range (dBm) 32 to 0 32 to 2
Channel input power range (dBm) 32 to 16 32 to 19 32 to 18 32 to 21
Total output power range (dBm) 2 to 17 5 to 17 1 to 20 2 to 20
Maximum total output power 17 20

(dBm)
Noise figure (dB) <6 <6
Polarization Dependent Loss < 0.5 < 0.5

(PDL) (dB)
Pump leakage at input (dBm) < 30 < 30
Pump leakage at output (dBm) < 30 < 30
Input return loss (dB) > 40 > 40
Output return loss (dB) > 40 > 40
Nominal gain (dB) 17 22
6-23

SEOBA17/17 SEOBA22/20
Maximum allowed input > 30 > 30

reflectance (dB)
Maximum allowed output > 30 > 30

reflectance (dB)
Gain flatness (dB) 1 1
Gain response time while < 10 < 10

adding/reducing channels (stable
status) (ms)
Polarization Mode Dispersion < 0.5 < 0.5

(PMD) (ps)
SEOPA Board Specifications

For the technical specifications of the SEOPA board with 40/80-channel in the C band,
Table 6-32 Technical Specifications of the 40/80-Channel C-Band SEOPA Board
SEOPA17/17 SEOPA22/17 SEOPA27/17
40-Cha- 80-Cha- 40-Cha- 80-Chan- 40-Chan- 80-Chan-

nnel nnel nnel nel nel nel
Operating wavelength 1529 to 1561 1529 to 1561 1529 to 1561

range (nm)
Total input power range 35 to 0 35 to 4 35 to 10

(dBm)
Channel input power 35 to 35 to 35 to 35 to 23 35 to 26 35 to 29

range (dBm) 16 19 20
Total output power range 2 to 17 5 to 17 2 to 17 5 to 17 2 to 17 5 to 17

(dBm)
Maximum total output 17 17 17

power (dBm)
Noise figure (dB) < 5.5 < 5.5 < 5.5
Polarization Dependent < 0.5 < 0.5 < 0.5

Loss (PDL) (dB)
Pump leakage at input < 30 < 30 < 30

(dBm)
6-24

SEOPA17/17 SEOPA22/17 SEOPA27/17
40-Cha- 80-Cha- 40-Cha- 80-Chan- 40-Chan- 80-Chan-

nnel nnel nnel nel nel nel
Pump leakage at output < 30 < 30 < 30

(dBm)
Input return loss (dB) > 40 > 40 > 40
Output return loss (dB) > 40 > 40 > 40
Nominal gain (dB) 17 22 27
Maximum allowed input > 30 > 30 > 30

reflectance (dB)
Maximum allowed output > 30 > 30 > 30

reflectance (dB)
Gain flatness (dB) 1 1 1
Gain response time while < 10 < 10 < 10

adding/reducing channels
(stable status) (ms)
Polarization Mode < 0.5 < 0.5 < 0.5

SEOLA Board Specifications

For the technical specifications of the SEOLA board with 40/80-channel in the C band,
Table 6-33 Technical Specifications of the 40/80-Channel C-Band SEOLA Board
SEOLA22/20
40-Channel 80-Channel
Total input power range (dBm) 35 to 2
Channel input power range (dBm) 35 to 18 35 to 21
Total output power range (dBm) 1 to 20 2 to 20
Maximum total output power (dBm) 20
Noise figure (dB) <6
Pump leakage at input (dBm) < 30
Pump leakage at output (dBm) < 30
6-25

SEOLA22/20
40-Channel 80-Channel
Input return loss (dB) > 40
Output return loss (dB) > 40
Nominal gain (dB) 22
Maximum allowed input reflectance (dB) > 30
Maximum allowed output reflectance (dB) > 30
Gain flatness (dB) 1
Gain response time while adding/reducing < 10

channels (stable status) (ms)
6.4.2 EOA Board Specifications

The EOA board technical specifications are compatible with 2.5 Gbit/s, 10 Gbit/s, 40 Gbit/s
and 100 Gbit/s systems, which enables smooth transition from the 2.5 Gbit/s, 10 Gbit/s
system, and 40 Gbit/s system to the 100 Gbit/s system.
EOBAH Board Specifications

l 40/80-Channel C-band EOBAH board
For the technical specifications of the 40/80-channel C-band EOBAH board, refer to
Table 6-34. The single-channel power of 32-channel EOBAH board is 1 dB higher
than that of the corresponding 40-channel EOBAH board.
Table 6-34 Technical Specifications of the 40/80-Channel C-Band EOBAH Board
EOBAH27/26 EOBAH24/24
Operating wavelength range 1529 to 1561 (C band) 1529 to 1561 (C band)

(nm)
Total input power range 32 to 2 32 to 3

(dBm)
Channel input power range 32 to 17 32 to 13 32 to 13 32 to 16

(dBm)
Channel output power range 7 to 13 4 to 10 5 to 11 2 to 8

(dBm)
6-26

EOBAH27/26 EOBAH24/24
Total output power range 7 to 26 4 to 26 5 to 24 2 to 24

(dBm)
Maximum total output power 26 24

(dBm)
Noise figure (dB) <6 <6
Polarization Dependent < 0.5 < 0.5

Loss (PDL) (dB)
Pump leakage at input < 30 < 30

(dBm)
Pump leakage at output < 30 < 30

(dBm)
Input return loss (dB) > 40 > 40
Output return loss (dB) > 40 > 40
Channel gain (dB) 27 24
Maximum allowed input > 30 > 30

reflectance (dB)
Maximum allowed output > 30 > 30

reflectance (dB)
Gain flatness (dB) 1 1
Gain response time while < 10 < 10

Polarization Mode < 0.5 < 0.5

l 48/96-channel CE-band EOBAH board
For the technical specifications of the 48/96-channel CE-band EOBAH board, refer to
Table 6-35.
6-27

Table 6-35 Technical Specifications of the 48/96-Channel CE-Band EOBAH Board
EOBAH23/21 EOBAH26/24 EOBAH28/26
48-Channel 96-Channel 48-Channel 96-Channel 48-Channel 96-Channel
Operating 1529 to 1568 (CE band) 1529 to 1568 (CE band) 1529 to 1568 (CE band)
wavelength range
(nm)
Total input power 32 to 1 32 to 1 32 to 1

range (dBm)
Channel input power 32 to 16 32 to 19 32 to 16 32 to 19 32 to 16 32 to 19

range (dBm)
Channel output 1 to 7 2 to 4 4 to 10 1 to 7 6 to 12 3 to 9
power range (dBm)
Total output power 1 to 21 2 to 21 4 to 24 1 to 24 6 to 26 3 to 26

range (dBm)
Maximum total 21 24 26
output power (dBm)
Noise figure (dB) <6 <6 <6
Polarization < 0.5 < 0.5 < 0.5

Dependent Loss
(PDL) (dB)
Pump leakage at < 30 < 30 < 30

input (dBm)
Pump leakage at < 30 < 30 < 30

output (dBm)
Input return loss > 40 > 40 > 40

(dB)
Output return loss > 40 > 40 > 40

(dB)
Channel gain (dB) 23 26 28
Maximum allowed > 30 > 30 > 30

input reflectance
(dB)
Maximum allowed > 30 > 30 > 30

output reflectance
(dB)
6-28

EOBAH23/21 EOBAH26/24 EOBAH28/26
48-Channel 96-Channel 48-Channel 96-Channel 48-Channel 96-Channel
Gain response < 10 < 10 < 10

time while
adding/reducing
channels (stable
status) (ms)

Dispersion (PMD)
(ps)
EONA Board Specifications

l 40/80-channel C-band EONA board
For the technical specifications of the 40/80-channel C-band EONA board, refer to
Table 6-36. The single-channel power of 32-channel EONA board is 1 dB higher than
that of the corresponding 40-channel EONA board.
Table 6-36 Technical Specifications of the 40/80-Channel C-Band EONA Board
EONA25/20 EONA33/20 EONA27/24
40-Chan- 80-Chan- 40-Chan- 80-Channel 40-Chan- 80-Chan-

nel nel nel nel nel
Operating wavelength range 1529 to 1561 (C band) 1529 to 1561 (C band) 1529 to 1561 (C band)
(nm)

(dBm)
Channel input power range 35 to 18 35 to 21 35 to 26 35 to 29 35 to 16 35 to 19

(dBm)
Channel output power range 1 to 7 2 to 4 1 to 7 2 to 4 5 to 11 2 to 8

(dBm)
Total output power range 1 to 20 -2 to 20 1 to 20 -2 to 20 5 to 24 2 to 24

(dBm)
Maximum total output power 20 20 24

(dBm)
Polarization dependent loss < 0.5 < 0.5 < 0.5

(PDL) (dB)
Pump leakage at input (dBm) < 30 < 30 < 30
6-29

40-Chan- 80-Chan- 40-Chan- 80-Channel 40-Chan- 80-Chan-

nel nel nel nel nel

(dBm)

reflectance (dB)

reflectance (dB)
Gain response time while <10 <10 <10


l 48/96-channel CE-band EONA board
For the technical specifications of the 48/96-channel CE-band EONA board, refer to
Table 6-37.
Table 6-37 Technical Specifications of the 48/96-Channel CE-Band EONA Board
48-Chan- 96-Channel 48-Chan- 96-Chan- 48-Chan- 96-Chan-

nel nel nel nel nel
Operating wavelength range 1529 to 1568 (CE band) 1529 to 1568 (CE band) 1529 to 1568 (CE band)
(nm)

(dBm)
Channel input power range 35 to 21 35 to 24 35 to 29 35 to 32 35 to 19 35 to 22

(dBm)
Channel output power range 1 to 7 2 to 4 1 to 7 2 to 4 5 to 11 2 to 8

(dBm)
6-30

48-Chan- 96-Channel 48-Chan- 96-Chan- 48-Chan- 96-Chan-

nel nel nel nel nel
Total output power range 1 to 21 2 to 21 1 to 21 2 to 21 5 to 24 2 to 24

(dBm)
Maximum total output power 21 21 24

(dBm)
Polarization dependent loss < 0.5 < 0.5 < 0.5

(PDL) (dB)
Pump leakage at input (dBm) < 30 < 30 < 30

(dBm)

reflectance (dB)

reflectance (dB)
Gain response time while <10 <10 <10

Polarization Mode Dispersion < 0.5 < 0.5 < 0.5

(PMD) (ps)
6.4.3 DRA Board Specifications

The DRA board uses RAMAN amplifiers to amplify optical signals. For its technical
specifications, refer to Table 6-38.
Table 6-38 Technical Specifications of the DRA Board
Item Specification
Pump wavelength and quantity (nm/piece) C band: 2 to 3
CE band: 2 to 3
6-31

Item Specification
Pump power (dBm) 29
Total output power (dBm) 12
C/CE band gain (G.652) (dB) 10/10
C/CE band gain (LEAF) (dB) 12/12
C/CE band gain (TW RS) (dB) 13/13
C/CE band equivalent noise figure (G.652) (dB) 0/0
C/CE band equivalent noise figure (LEAF) (dB) 1/1
C/CE band equivalent noise figure (TW RS) (dB) 1.5/1.5
Polarization dependent gain (dB) < 0.5
Temperature stability (pm/) < 500
In actual application, both EDFA and RAMAN amplifiers are used to amplify optical signals,
meaning the EOA and DRA boards combine to amplify optical signals. The technical
specifications for the combination of EOA and DRA boards are listed in Table 6-39.
Table 6-39 Technical Specifications of the EOA and DRA Board Combination
Item Specification
1529 to 1568 (CE band)
Maximum total output power (dBm) 20
Noise figure (dB) <3
Pump leakage at output (dBm) < 30
Input return loss (dB) > 40
Output return loss (dB) > 40
Maximum allowed input reflectance (dB) > 30
Maximum allowed output reflectance (dB) > 30
Gain flatness (dB) 1
Gain response time while adding/reducing channels <10

6.4.4 LAC Board Specifications

For the technical specifications of the LAC board, refer to Table 6-40.
6-32

Table 6-40 Technical Specifications of the LAC Board
Item Unit Specification
Wavelength range (band) (nm) nm 1529 to 1561 (C band)
1529 to 1568 (CE band)
Optical input power detection range (dBm) dBm -30 ~ 0 / -30 ~ +20
Optical output power detection range (dBm) dBm -30 ~ 0 / -30 ~ +18
Attenuation adjustment precision (dB) dB 0.5
Attenuation adjustment step length (dB) dB 0.2
Attenuation adjustment range (dB) dB 20
Attenuation adjustment rate (dB/s) dB/s 10
6.5 Optical Layer Management Subsystem

Specifications
6.5.1 OPM Board Specifications
For the technical specifications of the OPM board with channel spacing of 50 GHz, refer
to Table 6-41. For the technical specifications of the OPM board with channel spacing of
100 GHz, refer to Table 6-42.
Table 6-41 Technical Specifications of the OPM Board (50 GHz)
Item Specification
1529 to 1568 (CE band)
Wavelength detection precision (nm) 0.05
Input power range (dBm) 45 to 15
Power detection precision (dBm) 1.5
OSNR range (dB) 25
OSNR detection precision (dB) 1.5
Input return loss (dB) 30
Table 6-42 Technical Specifications of the OPM Board (100 GHz)
Item Specification
1529 to 1568 (CE band)
6-33

Item Specification
Wavelength detection precision (nm) 0.1
OSNR range (dB) 25
6.5.2 EOPM Board Specifications

For the technical specifications of the EOPM board with channel spacing of 50 GHz, refer
to Table 6-43. For the technical specifications of the EOPM board with channel spacing of
100 GHz, refer to Table 6-44.
Table 6-43 Technical Specifications of the EOPM Board (50 GHz)
Item Specification
1570 to 1605 (L band)
1529 to 1568 (CE band)
Wavelength detection range (nm) 0.05
OSNR range (dB) 25
Signal detection time (s) 1
Table 6-44 Technical Specifications of the EOPM Board (100 GHz)
Item Specification
1570 to 1605 (L band)
1529 to 1568 (CE band)
Wavelength detection range (nm) 0.1
6-34

Item Specification
OSNR range (dB) 25
Signal detection time (s) 1
6.5.3 OWM Board Specifications

For the technical specifications of the OWM board, refer to Table 6-45.
Table 6-45 Technical Specifications of the OWM Board
Item Specification
Wavelength detection range (nm) 1529 to 1561 (C band)
1529 to 1568 (CE band)
Optical input power of single wavelength (dBm) 45 to 15
Wavelength offset capture range (GHz) 10 to +10
Wavelength offset control precision (GHz) > 5
6.5.4 EOWM Board Specifications

For the technical specifications of the EOWM board, refer to Table 6-46.
Table 6-46 Technical Specifications of the EOWM Board
Item Specification
Wavelength detection range (nm) 1529 to 1561 (C band)
1529 to 1568 (CE band)
Optical input power (dBm) 45 to 15
Wavelength offset capture range 10 to +10

(GHz)
Wavelength offset alarm range (GHz) > 5
6.6 Protection Subsystem Specifications

6.6.1 SOP Board Specifications
For the technical specifications of the SOP board, refer to Table 6-47.
6-35

Table 6-47 Technical Specifications of the SOP Board
Item Specification
Operating wavelength Range (nm) 1280 to 1625
1510 to 1625 1280 to 1510
Insertion Loss (dB) T1_IT1_O1 < 4.4 < 5.0
T2_IT2_O1 < 4.4 < 5.0
T1_IT1_O2 < 4.4 < 5.0
T2_IT2_O2 < 4.4 < 5.0
R1_I1 R1_O < 2.1 < 2.7
R2_I1 R2_O < 2.1 < 2.7
R1_I2 R1_O < 2.1 < 2.7
R2_I2 R2_O < 2.1 < 2.7
Polarization dependent loss (dB) < 0.2
Optical input power (mW) < 200
Switching time (ms) 50
6.6.2 SOPCS Board Specifications

For the technical specifications of the SOPCS board, refer to Table 6-48.
Table 6-48 Technical Specifications of the SOPCS Board
Operating wavelength range nm 1260-1620
1510-1620nm 1260-1510nm
Insertion loss API BPO dB <2.1 <2.7
APIBOUT dB <2.7 <3.3
AWIAOUT dB <2.1 <2.7
AIN AWO dB <4.4 <5.0
AINBPO dB <5.1 <5.7
BIN BWO dB <4.4 <5.0
BINAPO dB <5.1 <5.7
BWIBOUT dB <2.1 <2.7
BPIAOUT dB <2.7 <3.3
6-36

BPIAPO dB <2.1 <2.7
Return loss dB >40
Polarization dependent loss dB <0.3
Optical input power mW <200
Switching time ms <50
Table 6-49
Item
(nm) 1260 to 1620 1510 to 1620 1260 to 1510
API BPO < 2.1 < 2.7
APIBOUT < 2.7 < 3.3
AWIAOUT < 2.1 < 2.7
AIN AWO < 4.4 < 5.0
AINBPO < 5.1 < 5.7
BIN BWO < 4.4 < 5.0
BINAPO < 5.1 < 5.7
BWIBOUT < 2.1 < 2.7
BPIAOUT < 2.7 < 3.3
BPIAPO < 2.1 < 2.7
(dB) > 40 - -
(dB) < 0.3 - -
(mW) < 200 - -
(ms) < 50 - -
6.6.3 SOPMS Board Specifications

For the technical specifications of the SOPMS board, refer to Table 6-50.
Table 6-50 Technical Specifications of the SOPMS Board
Operating wavelength range nm 1510 to 1610
6-37

Insertion loss APIBPO dB <3.2
AWIAOUT dB <1.7
BWIBOUT dB <1.7
BPIAPO dB <3.2
AINAWO dB <1.7
BINBWO dB <1.7
APIAWO dB <3.2
AWIAPO dB <3.2
AINBPO dB <1.7
BPIAOUT dB <1.7
BWIBPO dB <3.2
BPIBWO dB <3.2
BINAPO dB <1.7
APIBOUT dB <1.7
Return loss dB >40
Polarization dependent loss dB <0.3
Optical input power mW <200
Switching time ms <50
6.7 Supervision Subsystem Specifications

6.7.1 SOSCB Board Specifications
The SOSCB board supports 100-Mbps optical supervisory channels. For the technical
specifications of the SOSCB board, refer to Table 6-51.
Table 6-51 Technical Specifications for the SOSCB Board
Item Specification
Optical signal type 100BASE-FX
Operating wavelength (nm) 151010
Signal code pattern 4B/5B
Supervision rate (Mbit/s) 100
Signal transmit power (dBm) 5 to 0 1 to 6 +4
Minimum receiver sensitivity (dBm) 34 35 43
6-38

6.7.2 CCP Board Specifications

For the CCP board technical specifications, refer to Table 6-52.
Table 6-52 CCP Board Technical Specifications
Item Specification
Optical signal type 1000BASE-FX
Working wavelength (nm) 1310
Signal code pattern 8B/10B
Supervision rate (Mbit/s) 1000
Optical signal transmit power (dBm) -8`-2 3
Minimum receiver sensitivity (dBm) 20
6.8 RPOA Subsystem Specifications

6.8.1 Applicable Transmission Codes
The RPOA subsystem is designed for ultra-long-haul transmission. It only supports the
transmission over a single span because the Signal-to-Noise Ratio (SNR) of the system
decreases greatly if fibers are too long.
Because the amplification range of the EDF does not include 1510-nm wavelength and the
supervisory information cannot be transmitted over a long distance, the RPOA subsystem
needs an independent service wavelength to transfer supervision signals.
Table 6-53 describes the transmission codes supported by RPOA subsystem over a single
span. Note that the system capacity listed in the table already includes a supervisory
channel.
Table 6-53 Transmission Codes Supported by the RPOA Subsystem (over a Single
Span)
Fiber Type Single-Span Line Attenuation (dB) Maximum System Capacity

(Gbit/s)
G.652 fiber 73 4 2.5
72 8 2.5
69 16 2.5
63 40 2.5
67 4 10
67 8 10
67 16 10
63 40 10
6-39

Fiber Type Single-Span Line Attenuation (dB) Maximum System Capacity

(Gbit/s)
G.655 fiber 68.5 4 2.5
67 8 2.5
64 16 2.5
63 40 2.5
66 4 10
66 8 10
66 16 10
63 40 10
6.8.2 RPOA Subsystem Optical Specifications

For the RPOA subsystem optical specifications, refer to Table 6-54.
Table 6-54 RPOA Subsystem Optical Specifications
Item RPOA Subsystem with a GFF RPOA Subsystem without GFF
Amplification range (nm) 1529 to 1561 1546 to 1561
Noise figure (dB) < 7 (within the amplification range) < 7 (within the amplification range)
Gain (dB) > 17 > 17
Gain flatness (dB) <2 <2
Optical input power (dBm) -44 to -18 -44 to -18
Optical output power (dBm) -30 to +2 -34 to 8
Operating temperature -40 to 65 (RGU), -10 to 60 (RPU) -40 to 65 (RGU), -10 to 60 (RPU)
range (C)
Storage temperature range -40 to 85 -40 to 85

(C)
The RPOA subsystem without Gain Flatness Filter (GFF) meets the requirements of the system with up to 16 wav
elengths, while the RPOA subsystem with a GFF meets the requirements of systems with up to 40 wavelengths.
6.9 DCM Technical Specifications

DCM optical modules are classified into two types according to different principles: DCM
based on Dispersion Compensation Fiber (DCF) and DCMs based on fiber brag grating.
For descriptions for DCM technical specifications, refer to Table 6-55 and Table 6-56.
6-40

Table 6-55 DCM Technical Specifications (G.652 Optical Fiber)
Type Typical Maximum Disper- Polar- Polariza- Maximum Working

Compen- Insertion sion ization tion De- Input Wave-
sation Loss (dB) Slope Mode dis- pendent Optical length
Distance Compen- persion Loss (dB) Power Range
(km) sation (ps) (dBm) (nm)
Ratio
DCM for 10 3 90% to 0.3 0.5 20 1525 to

G.652(10 110% 1565
km)
DCM for 20 4 90% to 0.4 0.5 20 1525 to

G.652(20 110% 1565
km)
DCM for 40 5 90% to 0.6 0.5 20 1525 to

G.652(40 110% 1565
km)
DCM for 60 7 90% to 0.7 0.5 20 1525 to

G.652(60 110% 1565
km)
DCM for 80 8 90% to 0.8 0.5 20 1525 to

G.652(80 110% 1565
km)
DCM for 100 9 90% to 0.9 0.5 20 1525 to

G.652(10 110% 1565
0km)
DCM for 120 11 90% to 1.0 0.5 20 1525 to

G.652(12 110% 1565
0km)
1. Maximum input optical power refers to the maximum input optical power that the module can bear
when it is not damaged.
Table 6-56 DCM Technical Specifications (G.655 LEAF Optical Fiber)
Type Typical Maximum Disper- Polar- Polariza- Maximum Working

Compen- Insertion sion ization tion De- Input Wave-
sation Loss (dB) Slope Mode dis- Optical length
6-41

Distance Compen- persion pendent Power Range

(km) sation (ps) Loss (dB) (dBm) (nm)
Ratio
DCM for 20 4 80% to 0.45 0.3 20 1525 to

G.655 120% 1565
LEAF(20
km)
DCM for 40 5 80% to 0.6 0.3 20 1525 to

G.655 120% 1565
LEAF(40
km)
DCM for 60 6 80% to 0.75 0.3 20 1525 to

G.655 120% 1565
LEAF(60
km)
DCM for 80 7 80% to 0.8 0.3 20 1525 to

G.655 120% 1565
LEAF(80
km)
DCM for 100 8 80% to 0.9 0.3 20 1525 to

G.655 120% 1565
LEAF(100
km)
DCM for 120 9 80% to 1.0 0.3 20 1525 to

G.655L- 120% 1565
EAF(120
km)
DCM for 240 4 80% to 1.5 0.25 23 1528 to

G.655 120% 1568
LEAF
FBG(240
km)
1. Maximum input optical power refers to the maximum input optical power that the module can bear
when it is not damaged.
6.10 Environment Specifications

The environment requirements for the ZXWM M920 equipment can be classified into three
aspects: storage environment, transportation environment, and operational environment.
6-42

6.10.1 Power Supply Requirement

For the power supply requirements of the ZXWM M920 system, refer to Table 6-57.
Table 6-57 Power Supply Requirements
Input voltage: Allowable fluctuation range:
48 VDC 60 VDC to 40 VDC
60 VDC 70 VDC to 50 VDC
6.10.2 Storage Environment

Climate Requirement
The climate requirements for the ZXWM M920 equipment are described in Table 6-58.
Table 6-58 Climate Requirements (Storage Environment)
Item Specifications
Altitude 4000 m
Air pressure 70 kPa to 106 kPa
Temperature 40 to +70
Temperature variance ratio 1 /min
Relative humidity 5% to 100%
Solar radiation 1120 W/s2
Heat radiation 600 W/s2
Wind speed 20 m/s
Waterproof Requirement
l Keep the equipment indoors.
l Ensure that there is no water on the storage room floor, so that the water will not leak
on the packing container of the equipment. Furthermore, the storage position should
be far away from leaking surfaces such as automatic fire fighting equipment and the
heating system.
l If the equipment must be stored outside, the requirements are listed as follows:
Ensure that the packing box of the equipment is in good condition without any
damage.
Waterproofing measures should be taken to prevent rain from leaking into the
packing box of the equipment.
Ensure that there is no water on the floor where the equipment is placed.
Do not expose the packing box to direct sunlight.
6-43

Ecological Environment
l Avoid the propagation of microorganism, such as fungi or mould.
l Ensure that no rodents (such as mouse) enter the equipment.
Air Cleanness Requirement

l There should be no explosive, electrically conductive, magnetically conductive or
corrosive dust in the equipment room.
l The concentrations of mechanical activity materials are described in Table 6-59.
l The concentrations of chemical activity materials are described in Table 6-60.
Table 6-59 Concentrations of Mechanical Activity Materials (Storage Environment)
Mechanical Activity Material Content
Suspended dust 5.00 mg/m3
Degraded dust 20.0 mg/m2h
Sand 300 mg/m3
Table 6-60 Concentrations of Chemical Activity Materials (Storage Environment)
Chemical Activity Material Content
SO2 0.30 mg/m3
H2S 0.10 mg/m3
NO2 0.50 mg/m3
NH3 1.00 mg/m3
Cl2 0.10 mg/m3
HCI 0.10 mg/m3
HF 0.01 mg/m3
O3 0.05 mg/m3
6.10.3 Transportation Environment

Climate Requirement
The climate requirements for the ZXWM M920 equipment are described in Table 6-61.
Table 6-61 Climate Requirements
Item Specifications
Altitude 4000 m
6-44

Item Specifications
Temperature 40 to +70
Temperature variance ratio 1 /min
Relative humidity 5% to 100%
Wind speed 20 m/s
Water-Proof Requirement
l Ensure that the packing box of the equipment is in good condition without any
damages.
l Waterproofing measures should be taken to prevent rain from leaking into the packing
box of the equipment.
l Ensure that there is no water in the transportation tools.
l Prevent rodents (such as mouse) from entering the equipment.

Table 6-62 Concentrations of Mechanical Activity Materials (Transportation

Environment)
Suspended dust No special requirements
Degraded dust 3.0 mg/m2h
Sand 100 mg/m3
Table 6-63 Concentrations of Chemical Activity Materials (Transportation Environment)
SO2 0.30 mg/m3
H2S 0.10 mg/m3
NO2 0.50 mg/m3
NH3 1.00 mg/m3
6-45

Cl2 0.10 mg/m3
HCI 0.10 mg/m3
HF 0.01 mg/m3
O3 0.05 mg/m3
6.10.4 Operational Environment

Climate Requirements
The climate requirements for the ZXWM M920 equipment are described in Table 6-64 and
Table 6-65.
Table 6-64 Requirements for Temperature and Humidity (Operational Environment)
Item Specification
Ambient temperature Long term operation: 0 C to +45 C
Short term operation: 5 C to +50 C
Relative humidity (35 C) Long term operation: 10% to 90%
Short term operation: 5% to 95%
The temperature and humidity are measured 1.5 m above the floor and 0.4 m in front of the equipm
ent.
Short term operation means that the equipment operates continuously for no more than 96 hours and
operates for no more than 15 days in one year.
Table 6-65 Requirements for Other Climate Factors (Operational Environment)
Item Specifications
Altitude 4000 m
Temperature variance ratio 30 /h
Wind speed 5 m/s
l Prevent rodents (such as mouse) from entering the equipment.
6-46


Table 6-66 Concentrations of Mechanical Activity Materials (Operational Environment)
Suspended dust 0.2 mg/m3
Degraded dust 15 mg/m2h
Sand 100 mg/m3
Dust particle 3105 /m3
Table 6-67 Concentrations of Chemical Activity Materials (Operational Environment)
SO2 0.30 mg/m3
H2S 0.10 mg/m3
NO2 0.50 mg/m3
NH3 3.00 mg/m3
Cl2 0.10 mg/m3
HCI 0.10 mg/m3
HF 0.01 mg/m3
O3 0.05 mg/m3
NOx 0.5 mg/m3
6.11 Electro Magnetic Compatibility Requirements

Electro-Magnetic Compatibility
For the Electro-Magnetic Compatibility (EMC) specifications of the ZXWM M920 system,
Table 6-68 EMC Specifications
Test Item Standard
Electrostatic discharge immunity GB/T 17626.2 or IEC 61000-4-2
Immunity to radiation from radio GB/T 17626.3 or IEC 61000-4-3

frequency electromagnetic field
6-47

Test Item Standard
Electrical fast transient burst immunity GB/T 17626.4 or IEC 61000-4-4
Surge immunity GB/T 17626.5 or IEC 61000-4-5
Radio frequency filed conductivity GB/T 17626.6 or IEC 61000-4-6

immunity
Radiation Interference GB 9254 or CISPR 22
Conducted Interference GB 9254 or CISPR 22
Electro-Magnetic Interference
Electro-magnetic Interference (EMI) specifications of the ZXWM M920 system include
conducted disturbance and radiated disturbance, which comply with CISPR 22 (A-level
ITE).
6.12 Weight Power Consumption Dimensions

6.12.1 Power Consumption Specifications
For the power consumption specifications of boards and units of the ZXWM M920system,
Table 6-69 Boards and Unit Power Consumption
Board/Unit Maximum Power Maximum Power Consumption

)
Consumption (25 ) (W)
(55
(W)
Board ASMA 80 85
ASMB 80 85
CQ2 85 91
CLK 15 17
CO2 90 98
CH1 55 61
TD2C 28 30
TS2C 18 20
CCP 20 23
EONA 25 38
EOBAH 30 45
EOTU10G 28 39
EOTU10GB 28 39
6-48


)
(55
(W)
FCAG 40 50
FCA 40 50
DSA 25 38
DSAF 22 33
SRM42 20 30
SRM41 33 50
SAUC 32 38
SMUBC 40 48
SMUBL 40 48
FCC 9 10
LO2 90 98
LQ2 85 91
LD2B 53 64
LACG/LACT 3 4
MQT3 120 150
COMB 35 38
COM 32 38
CSUB 12 14
LD2 28 39
CD2 28 39
CS3 68 80
CD3 101 111
LS3 (2slot) 84 (DPSK) 92 (DPSK)

93 (DQPSK) 102 (DQPSK)
LS3 (1slot) 80 (DPSK) 88 (DPSK)

86 (DQPSK) 95 (DQPSK)
EHG1 105 120
EQG2 95 110
CS4 115 135
LS4 140 151
TS4 179 189
MQA1 38 40
6-49


)
(55
(W)
MQA2 38 40
MJA 38 40
MOM2 53 70
MX2 175 185
OPM 5 6
OMCP 5 6
OWM 3 4
EOWM 10 12
EOPM 10 12
OMU 3 (TFF or coupler) 4 (TFF or coupler)

13.2 (AWG) 16 (AWG)
ODU 3 (TFF) 4 (TFF)

13.2 (AWG) 16 (AWG)
OCI 3 4
PWD 10 15
PDU 3 4
SOTU2.5G 24 27
SOTU10G 25 30
SOPCS 3 4
SOPMS 3 4
SRM42 20 30
SRM41 33 50
SOGMD 5 6
SOAD2 4 5
SOAD4 5 6
SEOBA 14 20
SEOPA 11 15
SEOLA 14 20
SSDM 4 5
SOP 5 6
SFANA 10 20
6-50


)
(55
(W)
SPWA 28 55
PWE 10 11
SNP 10 12
SOSCB 17 18
SCC 10 12
TIS 15 20
ETI 11.5 12
EIC 10 8
SEIA 5 6
TST3 90 117
VMUX 30 36
VMUXB 30 36
WBU 15 18
WSU 15 18
WBM 29 35
RPU 45 75
XCA 96 106
Fan plug-in box - 52 100
6.12.2 Dimensions and Weight

For the dimensions and weight of each ZXWM M920 system component, refer to Table
6-70 and Table 6-71.
Table 6-70 Dimensions and Weight of ZXWM M920 Components
Component Dimensions (mm) Weight (kg)
CX20 subrack 447 (H) 535 (W) 275 (D) 16.00
CX21 subrack 447 (H) 535 (W) 275 (D) 16.00
CX30 subrack 897 (H) 535 (W) 275 (D) 26.00
CX31 subrack 897 (H) 535 (W) 275 (D) 26.00
CX50 subrack 1347 (H) 535 (W) 275 (D) 35.00
NX4 subrack 422 (H) 533 (W) 286 (D) 12.50
6-51

Component Dimensions (mm) Weight (kg)
NX5 subrack 422 (H) 473 (W) 286 (D) 11.00
CX4 subrack 577 (H) 482.6 (W) 269.5 (D) 12.00
DX41 subrack 447 (H) 535 (W) 275 (D) 16.00
CX51 subrack 1347 (H) 535 (W) 275 (D) 35.00
Power distribution box 88.10 (H) 535 (W) 240.10 (D) 6.50
DCM plug-in box 42.40 (H) 495 (W) 261.20 (D) 5.60
Conversion bracket 29.60 (H) 345.60 (W) 0.30
Fan unit 30 (H) 122.90 (W) 276.80 (D) 0.68
42 (H) 492 (W) 250 (D) 3.50
SPWA board 235.20 (H) 43.30 (W) 212.50 (D) 1.80
SEIA board Front panel: 95.20 (H) 87.10 (W) 210 (D) 0.45
The subrack dimensions include the dimensions of mounting flanges and the front door of the subrack. The subrack
weight is that of an empty subrack.
Table 6-71 Board Weights
Board Code Weight (kg)
SNP 0.60
SCC 0.47
SOTU2.5G 0.60
SOTU10G 0.70
SOGMD 0.60
SOAD4 0.60
SOP 0.60
SOPCS 0.60
SOPMS 0.60
DSAF 1.40
SRM42 1.25
SRM41 1.25
SSDM 0.60
SAUC 0.60
SMUBC 1.30
SMUBL 1.30
SPWA 1.80
6-52

SEIA 0.45
SFANA 0.68
TST3 (with DPSK) 3.50
TST3 (with RZ-DQPSK) 3.30
EOTU10G 1.65
EOTU10GB 1.65
EOWM 0.90
EOPM 0.96
EQG2 1.80
ASMA 0.60
SRM42 1.25
SRM41 1.25
FCA 1.50
MQT3 (with DPSK) 3.25
MQT3 (with RZ-DQPSK) 3.005
SEOBA 0.60
SEOPA 0.60
SEOLA 0.60
EOBAH 0.60
EONA 2.00
LAC 1.10
OMU 1.60
ODU 1.60
OCI 1.95
VMUX 2.10
VMUXB 2.10
PDU 1.40
RPU 2.50
WBU 2.60
WSU 2.60
WBM 2.10
OMCP 1.25
OPM 1.15
6-53

OWM 1.10
FCAG 1.45
COM 1.31
COMB 1.31
CCP 0.70
CLK 0.70
XCA 1.85
FCC 0.20
PWD 0.80
CO2 2.0075
LO2 2.0075
LD2B 1.95
CQ2 1.259
EHG1 2.10
LQ2 1.259
CH1 1.10
TD2C 0.60
TS2C 0.60
CS3 1.40
CD3 2.33
LS3 3.25 (occupying two slots)

2.23 (occupying one slot)
CS4 2.20
LS4 2.20
TS4 5.50
TS4R 5.00
MQA1 0.50
MQA2 0.50
MJA 0.60
MOM2 1.50
MX2 3.50
SFANA 0.68
6-54

PWE 0.80
SOSCB 0.50
TIS 0.50
ETI 0.66
EIC 0.50
6-55

6-56

Appendix A
Standards and
Recommendations
For standards and recommendations with which the ZXWM M920 system complies, refer
to Table A-1.
Table A-1 Standards and Recommendations with Which the ZXWM M920 Complies
Standard/Recom- Description
mendation
ITU-T G.661 Definition and test methods for the relevant generic parameters of optical fibre
amplifiers
ITU-T G.662 Generic characteristics of optical fiber amplifier devices and subsystems
ITU-T G.663 Application related aspects of optical fibre amplifier devices and subsystems
ITU-T G.652 Characteristics of a single-mode optical fibre and cable
ITU-T G.653 Characteristics of a dispersion-shifted single-mode optical fibre and cable
ITU-T G.655 Characteristics of a non-zero dispersion-shifted single-mode optical fibre and

cable
ITU-T G.825 The control of jitter and wander within digital networks which are based on the
synchronous digital hierarchy (SDH)
ITU-T G.783 Characteristics of Synchronous Digital Hierarchy (SDH) equipment functional

blocks
ITU-T G.664 Optical safety procedures and requirements for optical transport systems
ITU-T G.665 Definitions and Test Methods for Generic Characteristics of Raman Amplifiers
and Raman Amplified Subsystems
ITU-T G.691 Optical interfaces for single channel STM-64 and other SDH systems with
optical amplifiers
ITU-T G.693 Optical interfaces for intra-office systems
ITU-T G.694.1 Spectral grids for WDM applications: Dense Wavelength Division Multiplexing
(DWDM) frequency grid
ITU-T G.694.2 Spectral Grids for WDM Applications: Coarse Wavelength Division Multiplexing
(CWDM) wavelength Grid
ITU-T G.696.1 Optical transport network physical layer interfaces
ITU-T G.697 Optical monitoring for DWDM systems
A-1

mendation
ITU-T G.709 Interfaces for the Optical Transport Network
ITU-T G.798 Characteristics of optical transport network hierarchy equipment functional

blocks
ITU-T G.8201 Error performance parameters and objectives for multi-operator international
paths within the Optical Transport Network (OTN)
ITU-T G.8251 The control of jitter and wander within the Optical Transport Network (OTN)
ITU-T G.873.1 The Automatic Protection Switching (APS) protocol and protection switching
operation for the linear protection schemes for the Optical Transport Network at
the Optical Channel Data Unit (ODUk) level
ITU-T G.874 Management aspects of the Optical Transport Network Element containing
transport functions of one or more of the layer networks of the optical transport
network
ITU-T G.957 Optical interfaces of equipments and systems relating to the synchronous
digital hierarchy
ITU-T G.959.1 Optical transport network physical layer interfaces specifications for optical
networks which may use Wavelength Division Multiplexing (WDM)
ITU-T G.975 Forward error correction for submarine systems
ITU-T G.975.1 Forward error correction for high bit rate DWDM submarine systems
IEEE Std 802.3 Carrier Sense Multiple Access with Collision Detection (CSMA/CD) access
method and physical layer specification
IEC 60825-1 Safety of laser productsPart 1: equipment classification, requirements and

users guide
IEC 60825-2 Safety of laser productsPart 2: Safety of optical fiber communication systems
YD/T 1273-2003 Technical specification for terminal equipments of optical Wavelength Division
Multiplexing (WDM)1610 Gb/s and 3210gb/s parts
YD/T 1274-2003 Technical specification for optical wavelength Division Multiplexing (WDM)
system16010gb/s and 8010gb/s parts
YD/T 1159-2001 Test methods of optical Wavelength Division Multiplexing (WDM) system
GB/T 2423.1-2001 Environmental testing for electric and electronic productsPart 2: Test
methodsTests A: Cold
methodsTests B: Hot
GB/T 2423.22- Environmental testing for electric and electronic productsPart 2: Test
2002 methodsTest N: Change of temperature
methodsTest Cb: Damp heat, steady state, primarily for equipment
A-2

Appendix A Standards and Recommendations
mendation
1997 methodsTest Fc and guidance: Vibration (Sinusoidal)
1997 methodsTest Fd: Random vibration wide bandGeneral requirements
GB/T 17618-1998 Information technology equipmentImmunity characteristicsLimits and

methods of measurement
GB 9254-1998 Information technology equipmentRadio disturbance characteristicsLimits

and methods of measurement
GB 4943-2001 Safety of information technology equipment
GB 7247.1-2001 Safety of laser productsPart 1: Equipment classification, requirements and

users guide
GB/Z 18461-2001 Safety of laser productsManufacturers checklist for radiation safety of laser
products
A-3

A-4

Figures
Figure 1-1 ZTE WDM Product Family ....................................................................... 1-1
Figure 1-2 Point-to-Point Network Application ........................................................... 1-2
Figure 1-3 Chain Network Application ....................................................................... 1-2
Figure 1-4 Ring Network Application ......................................................................... 1-3
Figure 1-5 Ring-chain Network Application ............................................................... 1-3
Figure 1-6 Tangent Ring Network Application............................................................ 1-3
Figure 1-7 CROSS NETWORK APPLICATION ......................................................... 1-4
Figure 1-8 OTM Equipment Operating Principle Diagram......................................... 1-5
Figure 1-9 OTM Equipment Configuration (96-Channel SOTU10G Cabinet 1) ........... 1-6
Figure 1-10 OTM Equipment Configuration (96-Channel SOTU10G Cabinet
2) ............................................................................................................ 1-7
Figure 1-11 OTM Equipment Configuration (96-Channel EOTU10G Cabinet
1) ............................................................................................................ 1-8
2) ............................................................................................................ 1-9
3) .......................................................................................................... 1-10
Figure 1-14 Optical Connections in OTM Equipment (96-Channel) ......................... 1-11
Figure 1-15 FOADM Equipment Operating Principle Diagram ................................ 1-12
Figure 1-16 FOADM Equipment Configuration (SOTU10G) ................................... 1-13
Figure 1-17 FOADM Equipment Configuration (EOTU10G) ................................... 1-14
Figure 1-18 FOADM Equipment Fiber Connections (Unidirectional Add/Drop of
Eight Wavelengths)............................................................................... 1-15
Figure 1-19 FOADM Equipment Fiber Connections (Configured with SOGMD
Boards)................................................................................................. 1-15
Figure 1-20 Fiber Connections in ROADM Equipment (Configured with WBM
Boards)................................................................................................. 1-17
Figure 1-21 Fiber Connections in ROADM Equipment (Configured with WBU
Boards)................................................................................................. 1-17
Figure 1-22 Fiber Connections in ROADM Equipment (Configured with WSU
Boards)................................................................................................. 1-18
Figure 1-23 Fiber Connections in ROADM Equipment (Three Dimensions)............. 1-18
Figure 1-24 Fiber Connections in ROADM Equipment (Nine Dimensions)............... 1-19
Figure 1-25 Direction Relevance and Wavelength Relevance ................................ 1-21

Figure 1-26 Direction Irrelevance and Wavelength Relevance ............................... 1-22

Figure 1-27 Direction Irrelevance and Wavelength Irrelevance ............................... 1-23
Figure 1-28 Direction Relevance and Wavelength Irrelevance ............................... 1-24
Figure 1-29 Function Diagram of OLA Equipment (Without DCMs) ......................... 1-25
Figure 1-30 Function Diagram of OLA Equipment (With DCMs) .............................. 1-25
Figure 1-31 OLA Equipment Configuration (2.5 Gbit/s) ........................................... 1-26
Figure 1-32 OLA Equipment Configuration (10 Gbit/s) ............................................ 1-26
Figure 1-33 OLA Equipment Fiber Connections (2.5 Gbit/s).................................... 1-26
Figure 1-34 OLA Equipment Fiber Connection (10 Gbit/s) ..................................... 1-27
Figure 3-1 OMS 1+1 Protection (Amplification Board Shared Configuration
Mode) ................................................................................................... 3-15
Figure 3-2 OMS 1+1 Protection (Amplification Board Redundancy Configuration
Mode) ................................................................................................... 3-15
Figure 3-3 OCH 1+1 Protection (Chain Network) .................................................... 3-16
Figure 3-4 Schematic Diagram of Two-Fiber Bidirectional OCH Shared
Protection ............................................................................................. 3-17
Figure 3-5 Electrical Layer 1+1 Wavelength Protection Configuration at Line
Side ...................................................................................................... 3-18
Figure 3-6 Electrical Layer Two-Fiber Bidirectional Channel Shared Ring Network
Protection Configuration ....................................................................... 3-19
Figure 4-1 ZXWM M920 Cabinet............................................................................... 4-1
Figure 4-2 ZXWM M920 System Architecture ........................................................... 4-3
Figure 5-1 ZXWM M920 Software Architecture ......................................................... 5-1
Figure 5-2 EMS Structure ......................................................................................... 5-2
Figure 5-3 Structure of the NE Control and Processing Software .............................. 5-3
Figure 6-1 Allocation of Uncontinuous Wavelengths................................................. 6-6
II

Tables
Table 1-1 Configuration Description ........................................................................ 1-11
Table 1-3 Direction/Wavelength Correlation ............................................................ 1-20
Table 2-1 FEC List .................................................................................................... 2-1
Table 2-2 Maximum Number of Slave Subracks for a Single Master Subrack............ 2-5
Table 3-1 Transmission System at 102.5 Gbit/s ...................................................... 3-2
Table 3-2 Transmission Codes Supported by the 40/4810 Gbit/s System................ 3-3
Table 3-6 Transmission Codes Supported by the 80100 Gbit/s System (G.652 +
DCM) ....................................................................................................... 3-4
Table 3-7 Transmission Codes Supported by the 80100 Gbit/s System (G.652 -
DCM) ....................................................................................................... 3-4
Table 3-8 Transmission Codes Supported by the 80100 Gbit/s System (G.655 +
DCM) ....................................................................................................... 3-5
Table 3-9 Transmission Codes Supported by the 80100 Gbit/s System (G.655 -
DCM) ....................................................................................................... 3-5
Table 3-10 Boards Supporting the Wavelength Tunable Function.............................. 3-7
Table 3-11 Services Admittable by the ZXWM M920 System .................................... 3-8
Table 3-12 ZXWM M920 Service Aggregation Functions........................................... 3-9
Table 3-13 ZXWM M920 Optical Supervisory Channel ............................................ 3-10
Table 3-14 ZXWM M920 Electrical Supervisory Channel........................................ 3-10
Table 3-15 Communication Functions of the ZXWM M920 System ......................... 3-11
Table 3-16 Alarm List .............................................................................................. 3-12
Table 3-17 ZXWM M920 Cross-Connect Board Protection ...................................... 3-14
Table 3-18 Description of Electrical Layer 1+1 Wavelength Protection
Configuration ......................................................................................... 3-18
Table 3-19 .......................................................................... 3-21
Table 4-1 ZXWM M920 Cabinet Configuration .......................................................... 4-2
Table 4-2 Subsystem Configurations......................................................................... 4-3
Table 5-1 NE Control and Processing Software Functions ........................................ 5-3
III

Table 5-2 Functional Modules of the NE Control and Processing Software................ 5-3
Table 5-3 ZXWM M920 Software System Interfaces ................................................. 5-4
Table 6-1 Wavelength Allocation (40 Channels in C Band with Spacing at 100
GHz) ....................................................................................................... 6-1
................................................................................................................ 6-2
Table 6-3 Wavelength Allocation (48/96 Channels in Extended C Band with
Spacing at 100 Ghz/50 Ghz) ................................................................... 6-4
Table 6-4 Uncontinuous Wavelengths and Corresponding Central
Frequencies ............................................................................................. 6-6
Table 6-5 Board Types .............................................................................................. 6-7
Table 6-6 Line-Side Interface Specifications of the 2.5 G Board ................................ 6-7
Table 6-7 Line-Side Interface Specifications of the 10 G Board ................................. 6-8
Table 6-8 Line-Side Interface Specifications of the 40 G Board ................................. 6-9
Table 6-9 Line-Side Interface Specifications of the 100 G Board ............................. 6-10
Table 6-10 Technical Specifications of the SOAD2 Board ....................................... 6-11
Table 6-11 Technical Specifications of the SOAD4 Board ........................................ 6-12
Table 6-12 Technical Specifications the OMU Board (8/16/32-Channel) .................. 6-13
Table 6-13 Technical Specifications of the OMU Board (40/48/80-Channel) ............ 6-13
Table 6-14 Technical Specifications of the ODU Board ........................................... 6-14
Table 6-15 Technical Specifications of the ODUB Board ........................................ 6-15
Table 6-16 Technical Specifications of the OCI Board (50 GHz to 100 GHz) ........... 6-15
Table 6-17 Technical Specifications of the VMUX Board ........................................ 6-16
Table 6-18 Technical Specifications of the VMUXB Board ...................................... 6-16
Table 6-19 Technical Specifications of the SSDMT Board ...................................... 6-17
Table 6-20 Technical Specifications of the SSDMR Board ...................................... 6-18
Table 6-21 Technical Specifications of the SOGMD Board ..................................... 6-18
Table 6-22 Technical Specifications of the WBU Board .......................................... 6-19
Table 6-23 Technical Specifications of the WSUD Board ........................................ 6-19
Table 6-24 Technical Specifications of the WSUA Board ........................................ 6-20
Table 6-25 Technical Specifications of the WBM Board .......................................... 6-21
Table 6-26 Technical Specifications for the PDU-4-x Board ..................................... 6-22
Table 6-30 Technical Specifications for the PDU-16-x Board ................................... 6-23
IV

Tables
Table 6-31 Technical Specifications of the 40/80-Channel C-Band SEOBA

Board ..................................................................................................... 6-23
Table 6-32 Technical Specifications of the 40/80-Channel C-Band SEOPA
Board ..................................................................................................... 6-24
Table 6-33 Technical Specifications of the 40/80-Channel C-Band SEOLA
Board ..................................................................................................... 6-25
Table 6-34 Technical Specifications of the 40/80-Channel C-Band EOBAH
Board ..................................................................................................... 6-26
Table 6-35 Technical Specifications of the 48/96-Channel CE-Band EOBAH
Board ..................................................................................................... 6-28
Table 6-36 Technical Specifications of the 40/80-Channel C-Band EONA
Board ..................................................................................................... 6-29
Table 6-37 Technical Specifications of the 48/96-Channel CE-Band EONA
Board ..................................................................................................... 6-30
Table 6-38 Technical Specifications of the DRA Board ............................................ 6-31
Table 6-39 Technical Specifications of the EOA and DRA Board Combination ........... 6-32
Table 6-40 Technical Specifications of the LAC Board............................................. 6-33
Table 6-41 Technical Specifications of the OPM Board (50 GHz) ............................ 6-33
Table 6-42 Technical Specifications of the OPM Board (100 GHz) .......................... 6-33
Table 6-43 Technical Specifications of the EOPM Board (50 GHz) .......................... 6-34
Table 6-44 Technical Specifications of the EOPM Board (100 GHz) ........................ 6-34
Table 6-45 Technical Specifications of the OWM Board .......................................... 6-35
Table 6-46 Technical Specifications of the EOWM Board ....................................... 6-35
Table 6-47 Technical Specifications of the SOP Board ........................................... 6-36
Table 6-48 Technical Specifications of the SOPCS Board ....................................... 6-36
Table 6-49 .............................................................................................................. 6-37
Table 6-50 Technical Specifications of the SOPMS Board....................................... 6-37
Table 6-51 Technical Specifications for the SOSCB Board ...................................... 6-38
Table 6-52 CCP Board Technical Specifications...................................................... 6-39
Table 6-53 Transmission Codes Supported by the RPOA Subsystem (over a
Single Span) .......................................................................................... 6-39
Table 6-54 RPOA Subsystem Optical Specifications ............................................... 6-40
Table 6-55 DCM Technical Specifications (G.652 Optical Fiber) .............................. 6-41
Table 6-56 DCM Technical Specifications (G.655 LEAF Optical Fiber) .................... 6-41
Table 6-57 Power Supply Requirements ................................................................. 6-43
Table 6-58 Climate Requirements (Storage Environment) ....................................... 6-43

Table 6-59 Concentrations of Mechanical Activity Materials (Storage

Environment) ......................................................................................... 6-44
Table 6-60 Concentrations of Chemical Activity Materials (Storage
Environment) ......................................................................................... 6-44
Table 6-61 Climate Requirements ........................................................................... 6-44
Table 6-62 Concentrations of Mechanical Activity Materials (Transportation
Environment) ......................................................................................... 6-45
Table 6-63 Concentrations of Chemical Activity Materials (Transportation
Environment) ......................................................................................... 6-45
Table 6-64 Requirements for Temperature and Humidity (Operational
Environment) ......................................................................................... 6-46
Table 6-65 Requirements for Other Climate Factors (Operational
Environment) ......................................................................................... 6-46
Table 6-66 Concentrations of Mechanical Activity Materials (Operational
Environment) ......................................................................................... 6-47
Table 6-67 Concentrations of Chemical Activity Materials (Operational
Environment) ......................................................................................... 6-47
Table 6-68 EMC Specifications ............................................................................... 6-47
Table 6-69 Boards and Unit Power Consumption .................................................... 6-48
Table 6-70 Dimensions and Weight of ZXWM M920 Components........................... 6-51
Table 6-71 Board Weights....................................................................................... 6-52
Table A-1 Standards and Recommendations with Which the ZXWM M920
Complies..................................................................................................A-1
VI

Glossary
AFEC
- Advanced Forward Error Correction
APC
- Automatic Power Control
APO
- Automatic Power Optimization
APR
- Automatic Power Reduction
APS
- Automatic Protection Switching
APSD
- Automatic Power Shutdown
ATM
- Asynchronous Transfer Mode
AWG
- Array Waveguide Grating
BC
- Boundary Clock
BITS
- Building Integrated Timing Supply
BMC
- Best Master Clock
CWDM
- Coarse Wavelength Division Multiplexing
DCF
- Dispersion Compensation Fiber
DCM
- Dispersion Compensation Module
DRA
- Distributed RAMAN fiber Amplifier
DVB
- Digital Video Broadcasting
DWDM
- Dense Wavelength Division Multiplexing
VII

ECC
- Embedded Control Channel
ECC
- Error Check and Correction
EDF
- Erbium Doped Fiber
EDFA
- Erbium Doped Fiber Amplifier
EMC
- Electro Magnetic Compatibility
EMI
- Electromagnetic Interference
EMS
- Element Management System
ESCON
- Enterprise System Connection
FEC
- Forward Error Correction
FICON
- Fiber Connection
FOADM
- Fixed Optical Add/Drop Multiplexer
GCC
- General Communication Channel
GFP
- Generic Framing Procedure
GUI
- Graphical User Interface
HD-FEC
- Hard Decision Forward Error Correction
HDTV
- High Definition Television
IP
- Internet Protocol
ITU-T
- International Telecommunication Union - Telecommunication Standardization
Sector
IWF
- Integrated Wavelength Feedback
VIII

Glossary
LAN
- Local Area Network
LOF
- Loss of Frame
MAN
- Metropolitan Area Network
NE
- Network Element
OC
- Ordinary Clock
OCH
- Optical Channel
OLA
- Optical Line Amplifier
OMS
- Optical Multiplex Section
OSC
- Optical Supervision Channel
OSNR
- Optical Signal-to-Noise Ratio
OSPF
- Open Shortest Path First
OTM
- Optical Terminal Multiplexer
OTN
- Optical Transport Network
PDH
- Plesiochronous Digital Hierarchy
PDL
- Polarization Dependent Loss
PMD
- Polarization Mode Dispersion
POS
- Packet Over SONET/SDH
ROADM
- Reconfigurable Optical Add/Drop Multiplexer
RPOA
- Remotely Pumped Optical Amplifier
IX

SD-FEC
- Soft Decision Forward Error Correction
SDH
- Synchronous Digital Hierarchy
SFP
- Small Form-factor Pluggable
SNR
- Signal to Noise Ratio
SONET
- Synchronous Optical Network
SSM
- Synchronization Status Message
TC
- Transparent Clock
TCP
- Transmission Control Protocol
TFF
- Thin Film Filter
TIM
- Trace Identifier Mismatch
TTI
- Trail Trace Identifier
VOA
- Variable Optical Attenuator
WDM
- Wavelength Division Multiplexing
XFP
- 10-Gigabit Small Form-Factor Pluggable

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ZXWM M920

Backbone DWDM Equipment

Revision No. Revision Date Revision Reason

R1.0 2012-12-15 First release

Serial Number: SJ-20130318152421-001

Publishing Date: 2013-12-20(R1.1)

SJ-20130318152421-001|2013-12-20(R1.1) ZTE Proprietary and Confidential

Chapter 2 Product Characteristics ........................................................... 2-1

Chapter 3 System Functions ..................................................................... 3-1

SJ-20130318152421-001|2013-12-20(R1.1) ZTE Proprietary and Confidential

Chapter 4 Hardware Architecture ............................................................. 4-1

Chapter 5 Software Architecture............................................................... 5-1

SJ-20130318152421-001|2013-12-20(R1.1) ZTE Proprietary and Confidential

SJ-20130318152421-001|2013-12-20(R1.1) ZTE Proprietary and Confidential

Appendix A Standards and Recommendations ..................................... A-1

SJ-20130318152421-001|2013-12-20(R1.1) ZTE Proprietary and Confidential

The ZXWM M920 system is designed for long-haul transmission in backbone-networks

What is in This Manual

3, System Functions Describes system configuration, networking modes, and configuration

5, Software Architecture Describes the software architecture, including board software, NE

6, Technical Specifications Describes system operating wavelength, technical specifications of

SJ-20130318152421-001|2013-12-20(R1.1) ZTE Proprietary and Confidential

| Separates individual parameters in a series of parameters.

Danger: indicates an imminently hazardous situation. Failure to comply can result in

Warning: indicates a potentially hazardous situation. Failure to comply can result in

Caution: indicates a potentially hazardous situation. Failure to comply can result in

Note: provides additional information about a particular topic.

SJ-20130318152421-001|2013-12-20(R1.1) ZTE Proprietary and Confidential

1.1 ZTE WDM Product Family

Figure 1-1 ZTE WDM Product Family

l ZXWM M920 is a new-generation optical network product. It combines advanced

SJ-20130318152421-001|2013-12-20(R1.1) ZTE Proprietary and Confidential

1.2 Networking Application

Figure 1-2 Point-to-Point Network Application

1.2.2 Chain Network

Figure 1-3 Chain Network Application

1.2.3 Ring Network

SJ-20130318152421-001|2013-12-20(R1.1) ZTE Proprietary and Confidential

Figure 1-4 Ring Network Application

1.2.4 Ring-Chain Network

Figure 1-5 Ring-chain Network Application

1.2.5 Tangent Ring Network

Figure 1-6 Tangent Ring Network Application

SJ-20130318152421-001|2013-12-20(R1.1) ZTE Proprietary and Confidential

1.2.6 Cross Network

Figure 1-7 CROSS NETWORK APPLICATION

1.2.7 Mesh Network

1.3 Network Element Type

SJ-20130318152421-001|2013-12-20(R1.1) ZTE Proprietary and Confidential

Figure 1-8 OTM Equipment Operating Principle Diagram

SJ-20130318152421-001|2013-12-20(R1.1) ZTE Proprietary and Confidential

Figure 1-9 OTM Equipment Configuration (96-Channel SOTU10G Cabinet 1)

SJ-20130318152421-001|2013-12-20(R1.1) ZTE Proprietary and Confidential

Figure 1-10 OTM Equipment Configuration (96-Channel SOTU10G Cabinet 2)

SJ-20130318152421-001|2013-12-20(R1.1) ZTE Proprietary and Confidential

Figure 1-11 OTM Equipment Configuration (96-Channel EOTU10G Cabinet 1)

SJ-20130318152421-001|2013-12-20(R1.1) ZTE Proprietary and Confidential

Figure 1-12 OTM Equipment Configuration (96-Channel EOTU10G Cabinet 2)

SJ-20130318152421-001|2013-12-20(R1.1) ZTE Proprietary and Confidential

Figure 1-13 OTM Equipment Configuration (96-Channel EOTU10G Cabinet 3)

SJ-20130318152421-001|2013-12-20(R1.1) ZTE Proprietary and Confidential

Figure 1-14 Optical Connections in OTM Equipment (96-Channel)

Table 1-1 Configuration Description